CN114226092A - Glue coating device and using method thereof - Google Patents
Glue coating device and using method thereof Download PDFInfo
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- CN114226092A CN114226092A CN202111537549.0A CN202111537549A CN114226092A CN 114226092 A CN114226092 A CN 114226092A CN 202111537549 A CN202111537549 A CN 202111537549A CN 114226092 A CN114226092 A CN 114226092A
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- glue
- shell
- air inlet
- opening
- gasket
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/08—Plant for applying liquids or other fluent materials to objects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/002—Manually-actuated controlling means, e.g. push buttons, levers or triggers
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Abstract
The invention relates to a glue coating device, which comprises a receiving shell, wherein the receiving shell is of a hollow structure, one side inside the receiving shell is provided with a current limiting assembly for controlling glue discharge, the other side inside the receiving shell is provided with a glue discharge assembly, the current limiting assembly is connected and corresponds to the glue discharge assembly, a conductive piece is configured on the glue discharge assembly, one side of the receiving shell is provided with an installation shell for loading a circuit board, and the top of the installation shell is correspondingly provided with a socket hole; according to the glue coating device and the use method thereof, through the containing shell, the current limiting assembly and the glue outlet assembly are arranged inside the containing shell, and the conductive piece is configured on the glue outlet assembly correspondingly.
Description
Technical Field
The invention relates to the technical field of glue coating, in particular to a glue coating device and a use method thereof.
Background
With the continuous development of the times, the glue coating technology has deepened into various fields of the current society, and the glue coating technology has gradually become one of the key directions concerned by the contemporary society.
The glue coating technology is specifically divided into a contact type dispensing technology and a non-contact type dispensing technology, and in the daily work process, the traditional contact type dispensing operation method gradually has some use defects, which are briefly described as follows:
(1) the requirement on the consistency of the dispensing height is relatively high;
(2) the gap dispensing is not easy to operate;
(3) the dispensing efficiency is low, and the high-standard dispensing requirement in the prior art cannot be met;
(4) the glue spreading or wire drawing condition exists at the glue dispensing head;
(5) the dispensing width is larger than the dispensing aperture, which is generally at least 100 and 150 μm.
The non-contact dispensing valves are mainly divided into two categories, namely injection valves and atomization valves;
the disadvantages of the injection valves currently used in the art are as follows:
(1) scatter and bubbles are easily generated;
(2) the glue dispensing width is larger than the glue outlet aperture, and is generally more than 250 μm;
(3) the noise is large in the working process, and the noise pollution is caused to the surrounding working environment;
(4) the glue is complicated to change, and the runner needs to be cleaned when the glue is changed, so that the workload of technicians in the field is increased.
The atomizing valve in the non-contact dispensing valve has the following defects:
(1) moisture curing glue and anaerobic glue cannot be coated;
(2) the glue is complicated to change the shape.
It can be seen that a completely new glue application device designed to solve the above problems is highly desirable in the art.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a glue coating apparatus and a method for using the same, so as to solve the problems of inconvenience in glue dispensing, low working efficiency, noise pollution and other disadvantages of the conventional glue coating method in the prior art.
The invention is realized by the following two technical schemes:
one of the present invention:
the utility model provides a glue coating device, is including accomodating the shell, the inside of accomodating the shell is hollow structure, the inside one side of accomodating the shell is provided with the control and goes out gluey current-limiting component, the inside opposite side of accomodating the shell is provided with out gluey subassembly, current-limiting component is to meet with a gluey subassembly and corresponds the form, it disposes electrically conductive piece to go out gluey subassembly.
Further, go out gluey subassembly including setting up in the inside play gluey pole of accomodating the shell, it is top and the open hollow structure in bottom to go out gluey pole, the uncovered and current-limiting component in top that goes out gluey pole is linked together, the uncovered department in bottom that goes out gluey pole is provided with a little gluey pole, the tip that a gluey pole was kept away from to a little gluey pole runs through the outside that extends to accomodating the shell, the head correspondence of gluing is set up in the uncovered department in bottom of a little gluey pole.
Furthermore, one side of the containing shell is provided with an installation shell for loading the circuit board, and the top of the installation shell is correspondingly provided with a socket hole.
Further, the conductive piece comprises a first elastic conductive part abutted against the outer wall of the glue outlet rod;
the base of the first elastic conductive part extends to the inside of the mounting shell and is connected with the circuit board, and the elastic end of the first elastic conductive part is abutted to the outer wall of the glue outlet rod.
Furthermore, an insulating rubber sleeve is sleeved at the joint of the glue outlet rod and the glue dispensing rod.
Furthermore, the flow limiting assembly comprises a normal air inlet, a control air inlet and a glue inlet, wherein the normal air inlet, the control air inlet and the glue inlet are arranged on the containing shell and communicated with the interior of the containing shell, and airflow control modules are respectively arranged at the normal air inlet and the control air inlet;
the uncovered department in top that goes out the gluey pole is provided with the middle part and is open gasket, the current limiting assembly still including set up in the inside top seal piece that is used for adjusting the shutoff to the gasket of accomodating the shell.
Further, the top sealing piece comprises a thimble arranged in the containing shell and positioned at the top of the gasket, and the bottom end of the thimble vertically corresponds to the opening of the gasket;
the top of the ejector pin is provided with a pressurizing plate, the constant air inlet is oppositely arranged at the top of the pressurizing plate, the control air inlet is oppositely arranged at the bottom of the pressurizing plate, and the edge of the top of the pressurizing plate is provided with a return spring vertically connected with the inner wall of the containing shell;
the top of the storage shell is provided with an opening, and the opening at the top of the storage shell is provided with a micrometer connected with the pressurizing plate.
Further, the top sealing piece comprises a top rod which is arranged in the containing shell and penetrates through the gasket opening, and the bottom of the top rod is provided with a resorption plug which is matched with the gasket opening;
the top of the ejector rod is provided with a partition plate, the constant air inlet is oppositely arranged at the bottom of the partition plate, and the control air inlet is oppositely arranged at the top of the pressurizing plate;
the top of the storage shell is provided with an opening, and a threaded part connected with the partition plate is arranged at the opening at the top of the storage shell.
The second invention is:
the application method of the glue coating device comprises the following steps,
1) preparation work:
I. placing the circuit board in the mounting shell and connecting the circuit board with an external power supply through the socket hole;
II, connecting the coating surface through a grounding wire to form an electric field;
2) spraying glue:
I. the air flow control module is used for carrying out air flow conveying control on the normal air inlet and the control air inlet so that the top sealing piece can seal or dredge the gasket opening;
injecting colloid through the colloid inlet;
and III, the first elastic conductive part receives voltage at the circuit board and transmits the voltage to the glue outlet rod, so that the glue is in an electrofluid jet.
Further, in step 2, a micrometer or a screw can be adjusted as required to control the colloid spraying flow.
The invention has the beneficial effects that:
this glue coating device and application method, through accomodating the shell, and be provided with current-limiting component and play gluey subassembly in accomodating the shell inside, and correspond and dispose electrically conductive piece on going out gluey subassembly, this device is when using, at first control the use of colloid through current-limiting component, rethread play gluey subassembly discharge colloid, electrically conductive piece can carry out voltage to the colloid of going out gluey in-process this moment, make glue after the circular telegram realize spouting and spraying because the principle of electrofluid, traditional contact point gum and non-contact point are glued in this application technical scheme comparison, then effectively solved traditional glue coating method and be not convenient for the point, work efficiency is low, and there are noise pollution and many problems of other unfavorable point glues.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the means of the instrumentalities and combinations particularly pointed out hereinafter.
Drawings
FIG. 1 is a perspective view of a second embodiment of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a front cross-sectional view of a second embodiment of the present invention;
FIG. 4 is a partial exploded view I of a second embodiment of the present invention;
FIG. 5 is a partial exploded view II of a second embodiment of the present invention;
FIG. 6 is a partial perspective view of a first elastic conductive portion according to the present invention;
FIG. 7 is a perspective view of a third embodiment of the present invention;
FIG. 8 is a perspective view of a third embodiment of the present invention, schematically illustrated in FIG. II;
FIG. 9 is a front cross-sectional view of a third embodiment of the present invention.
In the figure: 1. a housing case; 2. a glue discharging assembly; 201. discharging the glue rod; 202. dispensing a glue rod; 203. dispensing a glue head; 3. a socket hole; 4. mounting a shell; 5. a first elastic conductive portion; 501. a base; 502. an elastic end; 6. a second elastic conductive portion; 7. a threaded member; 8. a normal air inlet; 9. controlling an air inlet; 10. a glue inlet; 11. a gasket; 12. a thimble; 13. a pressurizing plate; 14. a return spring; 15. a micrometer; 16. a top rod; 17. and (5) sucking back the plug.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the above description of the present invention, it should be noted that the terms "one side", "the other side" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or the element to which the present invention is directed must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
Further, the term "identical" and the like do not mean that the components are absolutely required to be identical, but may have slight differences. The term "perpendicular" merely means that the positional relationship between the components is more perpendicular than "parallel", and does not mean that the structure must be perfectly perpendicular, but may be slightly inclined.
One of the present invention:
in a first embodiment, please refer to fig. 1-9, the present invention provides a technical solution: a glue coating device comprises a receiving shell 1, wherein the receiving shell 1 is of a hollow structure, one side of the interior of the receiving shell 1 is provided with a current limiting assembly for controlling glue discharging, the other side of the interior of the receiving shell 1 is provided with a glue discharging assembly 2, the current limiting assembly and the glue discharging assembly 2 are connected and correspond to each other, and a conductive piece is arranged on the glue discharging assembly 2;
one side of the containing shell 1 is provided with a mounting shell 4 for loading a circuit board, the top of the mounting shell 4 is correspondingly provided with a socket hole 3, when the device is used, the circuit board is firstly mounted in the mounting shell and debugged in advance, then a power line can be inserted into the socket hole, and the device is powered
The glue outlet assembly 2 comprises a glue outlet rod 201 arranged inside the accommodating shell 1, the glue outlet rod 201 is of a hollow structure with openings at the top and the bottom, the opening at the top of the glue outlet rod 201 is communicated with the flow limiting assembly, a glue dispensing rod 202 is arranged at the opening at the bottom of the glue outlet rod 201, the end part, far away from the glue outlet rod 201, of the glue dispensing rod 202 penetrates and extends to the outside of the accommodating shell 1, and a glue dispensing head 203 is correspondingly arranged at the opening at the bottom of the glue dispensing rod 202;
the flow limiting assembly comprises a normal air inlet 8, a control air inlet 9 and a glue inlet 10, wherein the normal air inlet 8, the control air inlet 9 and the glue inlet 10 are arranged on the containing shell 1 and are communicated with the interior of the containing shell, and air flow control modules are respectively arranged at the normal air inlet 8 and the control air inlet 9;
the top opening of the glue outlet rod 201 is provided with a gasket 11 with an opening in the middle, the flow limiting assembly further comprises a top sealing piece which is arranged inside the containing shell 1 and used for adjusting and sealing the opening of the gasket 11, when the device is in an idle state, the airflow control module at the normal air inlet is in a normal air inlet gas transmission state, the air flow control module for controlling the air inlet does not work, the air inlet is not used for conveying air, air pressure exists at the normal air inlet, so that the top sealing piece is in a sealing shape on the opening of the gasket, the glue is prevented from flowing out, when the device is in a working state, the normal air inlet stops conveying air pressure, the air inlet is controlled to start conveying air (the corresponding air flow control module is in an air flow output state for controlling the air inlet), the top sealing piece does not block the open position of the gasket at the moment, the glue inlet injects glue, and the glue flows to the glue outlet rod. (it should be noted here that the airflow control module is an airflow control assembly composed of a controller, an electromagnetic valve, and a small-sized air pump, which are commonly used in the art, and this is the prior art in this field, and a person skilled in the art can implement and operate the airflow control assembly without creative work and thinking, so this application will not be described again, and the glue inlet mentioned in this application injects glue, this glue injection method is the prior art in this field, so this application will not be described again);
the conductive piece comprises a first elastic conductive part 5 abutted against the outer wall of the glue outlet rod 201, when glue flows to the glue outlet rod, the first elastic conductive part applies voltage to the outer wall of the glue outlet rod, at the moment, a ground wire is connected with a coating part to form an electric field, and when glue is sprayed out through the glue outlet rod, the glue dispensing rod and the glue dispensing head, the glue is drawn and attracted by a point to be coated so as to achieve the effect of spraying and printing electrofluid on a surface to be coated;
referring to fig. 6, the base 501 of the first elastic conductive part 5 extends into the mounting case 4 and is connected to the circuit board, the elastic end 502 of the first elastic conductive part 5 abuts against the outer wall of the glue discharging rod 201, which further defines the structure of the first elastic conductive part, the base extends into the mounting case, connected with the circuit board, one can achieve the purpose of transmitting and receiving control of voltage transmission information, the other can transmit voltage to the glue outlet rod, and the elastic end mentioned here, the purpose is to avoid the phenomenon of blocking with the glue discharging rod, and the elastic end is the end part which is freely stretched and contracted inside the base through the elastic piece, similar to the prior art of 'elastic limit key', the published utility model case 'a BIM-based building construction simulation device' (CN 208281424U), the structural principle of the elastic limit key is disclosed, so repeated description is not repeated in the application;
an insulating rubber sleeve is sleeved at the joint of the glue outlet rod 201 and the glue dispensing rod 202, the insulating rubber sleeve is positioned at the inner part of the containing shell 1, and the outer wall of the insulating rubber sleeve is abutted with a second elastic conductive part 6;
the base of the second elastic conductive part 6 extends to the inside of the mounting shell 4 and is connected with the circuit board, and the elastic end of the second elastic conductive part 6 is abutted against the outer wall of the insulating rubber sleeve;
the structure of the second elastic conductive part is similar to that of the first elastic conductive part, the second elastic conductive part and the insulating rubber sleeve are arranged, the purpose is to avoid accidental electric shock caused by touching the rubber rod by hands of users, at the moment, the second elastic conductive part is electrified, the insulator utilizes the insulation property of the insulator, the conductive part is in an open circuit state, the effectiveness of the insulating rubber sleeve is explained, and then the first elastic conductive part is electrified for use, so that the purpose of electric shock prevention can be achieved;
the electrofluid that this application technical scheme mentioned spouts seal rubber coating has following characteristic: 1) Initially the jets are straight but over a certain height they atomize due to the liquids repelling each other by charge (the atomization principle is the same as the electrostatic spray painting principle.
2) The diameter of the jet is smaller than the dispensing aperture, so that for example, the jet aperture can be < 0.03mm when the dispensing aperture is 0.1 mm.
3) The coating surface needs to be grounded to form an electric field to form a jet.
The technical scheme of the application has the technical advantages that: 1) When the glue is sprayed, no scattered point exists, no bubble exists, the glue dispensing width of the glue can be smaller than the diameter of the nozzle (the minimum size can reach within 30 mu m), the glue can be sprayed into a small gap, no noise exists, the glue is convenient to change the shape, and the valve body does not need to be cleaned.
2) The spraying has the advantages that the glue is convenient to change the shape, the valve body does not need to be cleaned, no noise exists, the glue has a wider application range, and the glue can be sprayed on AB glue, anaerobic glue and moisture curing glue.
A second embodiment;
please refer to fig. 1-5: the top sealing piece comprises a thimble 12 which is arranged in the containing shell 1 and is positioned at the top of the gasket 11, and the bottom end of the thimble 12 vertically corresponds to the opening of the gasket 11;
a pressurizing plate 13 is arranged at the top of the ejector pin 12, the constant air inlet 8 is oppositely arranged at the top of the pressurizing plate 13, the control air inlet 9 is oppositely arranged at the bottom of the pressurizing plate 13, and a return spring 14 vertically connected with the inner wall of the containing shell 1 is arranged at the edge of the top of the pressurizing plate 13;
an opening is formed in the top of the containing shell 1, and a micrometer 15 connected with the pressurizing plate 13 is arranged at the opening in the top of the containing shell 1;
the embodiment is a technical scheme of a thimble valve, when the device is idle and glue is prevented from flowing out, the position of a normal air inlet is relatively high, the corresponding airflow control module works at the moment, airflow is injected from the normal air inlet, downward pressure is applied to a pressurizing plate, and an opening of a gasket is blocked by a thimble;
the micrometer provided by the technical scheme has the advantages that when the ejector pin is subjected to upward airflow pressure of the pressurizing plate, the ejector pin reaches the maximum value of a movement space, and the purpose of adjusting the glue discharging amount can be achieved through upward or downward stretching of the micrometer;
the return spring mentioned in the embodiment aims to control the air flow at the air inlet to be closed when the glue does not need to be discharged, and the air flow is injected into the air inlet frequently, and meanwhile, the return spring drives the pressurizing plate to rapidly move downwards by utilizing the elasticity of the return spring, so that the gasket opening is blocked as soon as possible;
in the embodiment, the quick thimble is closed in the dispensing process, so that the glue is quickly collected, the glue is prevented from dripping, and the glue is suitable for low-viscosity glue with a more suitable viscosity range of 1-10000 cps.
A third embodiment;
please refer to fig. 7-9: the top sealing piece comprises a top rod 16 which is arranged in the containing shell 1 and penetrates through the opening of the gasket 11, and the bottom of the top rod 16 is provided with a resorption choke plug 17 matched with the opening of the gasket 11;
a partition plate is arranged at the top of the ejector rod 16, the constant air inlet 8 is oppositely arranged at the bottom of the partition plate, and the control air inlet 9 is oppositely arranged at the top of the pressurizing plate 13;
an opening is formed in the top of the containing shell 1, and a threaded part 7 connected with the partition plate is arranged at the opening in the top of the containing shell 1;
the embodiment is a technical scheme of a suck-back valve, when the device is idle, a lower normal air inlet is in an air inlet state (the corresponding air flow control module works), a partition plate is driven to move upwards, so that an opening of a gasket is blocked by a suck-back plug, when glue needs to be discharged, the normal air inlet does not admit air, the air inlet is controlled to admit air (the corresponding air flow control module works), the partition plate is driven to move downwards, so that the suck-back plug does not block the opening of the gasket, the opening of the gasket is in a circulating state at the moment, glue is injected at the moment, and can flow to a glue discharging rod smoothly, and subsequent glue coating work is achieved;
the threaded component mentioned in this embodiment is aimed at enabling the baffle to move upward or downward (when the air inlet is controlled to inject air, the baffle moves to the maximum value, and the glue outlet amount is the maximum at this time) by adjusting the screw rod, so as to achieve the purpose of adjusting the glue outlet amount.
The difference from the above embodiment is: through some glue in-process, quick ejector pin is retrieved, realizes that some glue back suction of glue in the twinkling of an eye to receive gluey, prevent to drip gluey, relatively more be fit for high viscosity glue, suitable viscosity range 1-10000 cps.
The second invention is:
the first embodiment: the application method of the glue coating device comprises the following steps,
1. preparation work:
I. placing the circuit board in the installation shell 4 and connecting the circuit board with an external power supply through the socket hole 3;
II, connecting the coating surface through a grounding wire to form an electric field;
2. glue spraying work:
I. the air flow control module is used for carrying out air flow conveying control on the normal air inlet 8 and the control air inlet 9, so that the top sealing piece seals or dredges the opening of the gasket 11, and the air flow control module is a common micro air conveying structure in the field;
injecting colloid through the colloid inlet 10;
and III, the first elastic conductive part 5 receives voltage at the circuit board and transmits the voltage to the glue outlet rod 201, so that the glue is in an electrofluid jet.
Second embodiment: in the step 2, the micrometer 15 or the screw 7 can be adjusted according to the requirement to control the colloid spraying flow;
the amount of colloid used can be selectively adjusted according to the requirement.
Finally, the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered in the claims of the present invention.
Claims (10)
1. The utility model provides a glue coating device which characterized in that: including accomodating shell (1), the inside of accomodating shell (1) is hollow structure, the inside one side of accomodating shell (1) is provided with the control and goes out gluey current-limiting component, the inside opposite side of accomodating shell (1) is provided with out gluey subassembly (2), current-limiting component is to meeting with going out gluey subassembly (2) and corresponds the form, it disposes electrically conductive piece to go out gluey subassembly (2).
2. The glue application device of claim 1, wherein: go out gluey subassembly (2) including setting up in the play gluey pole (201) of accomodating shell (1) inside, it glues pole (201) for top and the open hollow structure in bottom to go out, the uncovered and current-limiting component in top that goes out gluey pole (201) is linked together, the uncovered department in bottom that goes out gluey pole (201) is provided with some gluey pole (202), the tip that goes out gluey pole (201) and keep away from out gluey pole (202) runs through the outside that extends to accomodating shell (1), the head (203) correspondence of gluing sets up in the uncovered department in bottom of some gluey pole (202).
3. The glue application device of claim 2, wherein: one side of the accommodating shell (1) is provided with a mounting shell (4) used for loading a circuit board, and the top of the mounting shell (4) is correspondingly provided with a socket hole (3).
4. The glue application device of claim 3, wherein: the conductive piece comprises a first elastic conductive part (5) abutted against the outer wall of the glue outlet rod (201);
the base (501) of the first elastic conductive part (5) extends to the inside of the mounting shell (4) and is connected with the circuit board, and the elastic end (502) of the first elastic conductive part (5) is abutted against the outer wall of the glue outlet rod (201).
5. The glue application device of claim 4, wherein: and an insulating rubber sleeve is sleeved at the joint of the glue outlet rod (201) and the glue dispensing rod (202).
6. The glue application device of claim 2, wherein: the flow limiting assembly comprises a normal air inlet (8), a control air inlet (9) and a glue inlet (10), wherein the normal air inlet (8) is arranged on the containing shell (1) and communicated with the interior of the containing shell, and air flow control modules are respectively arranged at the normal air inlet (8) and the control air inlet (9);
the uncovered department in the top that goes out gluey pole (201) is provided with middle part for open gasket (11), the current limiting assembly still including set up in storage shell (1) inside be used for adjusting the top seal piece of shutoff to gasket (11) uncovered.
7. The glue application device of claim 6, wherein: the top sealing piece comprises a thimble (12) which is arranged in the containing shell (1) and is positioned at the top of the gasket (11), and the bottom end of the thimble (12) vertically corresponds to the opening of the gasket (11);
a pressurizing plate (13) is arranged at the top of the ejector pin (12), the constant air inlet (8) is oppositely arranged at the top of the pressurizing plate (13), the control air inlet (9) is oppositely arranged at the bottom of the pressurizing plate (13), and a return spring (14) vertically connected with the inner wall of the accommodating shell (1) is arranged at the edge of the top of the pressurizing plate (13);
the top of the storage shell (1) is provided with an opening, and the opening at the top of the storage shell (1) is provided with a micrometer (15) connected with the pressure plate (13).
8. The glue application device of claim 6, wherein: the top sealing piece comprises a push rod (16) which is arranged in the containing shell (1) and penetrates through the opening of the gasket (11), and a suck-back plug (17) matched with the opening of the gasket (11) is arranged at the bottom of the push rod (16);
a partition plate is arranged at the top of the ejector rod (16), the constant air inlet (8) is oppositely arranged at the bottom of the partition plate, and the control air inlet (9) is oppositely arranged at the top of the pressurizing plate (13);
the top of the storage shell (1) is provided with an opening, and the opening at the top of the storage shell (1) is provided with a threaded part (7) connected with the partition plate.
9. Method of use of a glue application device according to any of claims 1-8, characterised in that: the specific steps are as follows,
1) preparation work:
I. the circuit board is placed in the installation shell (4) and is connected with an external power supply through the socket hole (3);
II, connecting the coating surface through a grounding wire to form an electric field;
2) spraying glue:
I. the air flow control module is used for carrying out air flow transmission control on the normal air inlet (8) and the control air inlet (9) so that the top sealing piece can seal or dredge the opening of the gasket (11);
injecting colloid through a colloid inlet (10);
and III, the first elastic conductive part (5) receives voltage at the circuit board and transmits the voltage to the glue outlet rod (201) to enable the glue to be in an electrofluid jet mode.
10. The use method of the glue application device according to claim 9, characterized in that: in the step 2, a micrometer (15) or a screw (7) can be adjusted according to requirements to control the colloid spraying flow.
Priority Applications (1)
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| CN202111537549.0A CN114226092B (en) | 2021-12-16 | 2021-12-16 | Glue coating device and application method thereof |
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| CN202111537549.0A CN114226092B (en) | 2021-12-16 | 2021-12-16 | Glue coating device and application method thereof |
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| CN114226092A true CN114226092A (en) | 2022-03-25 |
| CN114226092B CN114226092B (en) | 2023-04-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114460812A (en) * | 2022-04-11 | 2022-05-10 | 宁波润华全芯微电子设备有限公司 | Structure and method for mounting suck-back valve |
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| CN110976209A (en) * | 2019-12-12 | 2020-04-10 | 江苏合泓通讯技术有限公司 | LED dispensing equipment for manufacturing light-emitting diode |
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| GB1564973A (en) * | 1976-12-30 | 1980-04-16 | Research Corp | Electrostatic spray nozzle system |
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| CN102113934A (en) * | 2010-12-28 | 2011-07-06 | 上海稳健医疗器械有限公司 | Manufacturing method of self adhesive bandage and electrostatic adhesive spray device |
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| JP2016144786A (en) * | 2015-02-09 | 2016-08-12 | アネスト岩田株式会社 | Electrostatic atomizer |
| CN109290134A (en) * | 2018-11-26 | 2019-02-01 | 深圳市博锐自动化设备有限公司 | A kind of ejector pin type glue dispensing valve |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114460812A (en) * | 2022-04-11 | 2022-05-10 | 宁波润华全芯微电子设备有限公司 | Structure and method for mounting suck-back valve |
| CN114460812B (en) * | 2022-04-11 | 2022-08-05 | 宁波润华全芯微电子设备有限公司 | Structure and method for mounting suck-back valve |
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| Publication number | Publication date |
|---|---|
| CN114226092B (en) | 2023-04-25 |
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