CN114171432B - Heating conveying mechanism for welding semiconductor chips - Google Patents
Heating conveying mechanism for welding semiconductor chips Download PDFInfo
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- CN114171432B CN114171432B CN202111318634.8A CN202111318634A CN114171432B CN 114171432 B CN114171432 B CN 114171432B CN 202111318634 A CN202111318634 A CN 202111318634A CN 114171432 B CN114171432 B CN 114171432B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 86
- 238000010438 heat treatment Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000003466 welding Methods 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 239000000428 dust Substances 0.000 claims description 44
- 238000009434 installation Methods 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 21
- 238000009423 ventilation Methods 0.000 claims description 14
- 230000001360 synchronised effect Effects 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000009467 reduction Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 10
- 230000005496 eutectics Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a heating conveying mechanism for welding a semiconductor chip, which relates to the field of semiconductor chips and aims at solving the problem that the chip is easy to damage due to too fast temperature rise in the prior art. According to the invention, automatic feeding of the chip and the shell is realized, meanwhile, solder paste can be smeared on the bottom of the chip, the degree of automation is improved, meanwhile, damage to the chip during picking up the chip can be avoided, the safety is improved, the shell and the chip can be dedusted, meanwhile, the position of the shell and the chip can be adjusted, the practicability is improved, the chip can be preheated while conveying, the temperature can be controlled in a partitioning way, the temperature is improved smoothly, and the damage to the chip is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductor chips, in particular to a heating and conveying mechanism for welding semiconductor chips.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices made of semiconductors, integrated circuits or microcircuits, microchips, wafers/chips, and in electronics, a way to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.), and are often manufactured on the surface of semiconductor wafers.
In the production process of semiconductor chips, the semiconductor chips are required to be welded with a shell, and generally eutectic welding, which is also called low-melting-point alloy welding, is adopted, and has the basic characteristics that two different metals can form alloy according to a certain weight proportion at the temperature far lower than the respective melting point, the eutectic welding technology has wide application in the electronic packaging industry, and compared with the traditional epoxy conductive adhesive bonding, the eutectic welding has the advantages of high heat conductivity, low heat resistance, high heat transfer speed, high reliability and high strength after bonding, and is suitable for interconnection of wafers, substrates and tube shells in high-frequency and high-power devices, and the eutectic solder is tin-lead alloy solder which contains a certain component.
When the soldering paste is used for soldering the semiconductor chip, the chip and the shell are generally required to be preheated firstly, so that the chip and the shell are prevented from being damaged due to the fact that the temperature rising speed is too high, the operation flow is used for directly preheating and then carrying out soldering treatment, and the chip is easy to damage due to the fact that the temperature rising speed is too high.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a heating and conveying mechanism for welding a semiconductor chip.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a semiconductor chip welds and uses heating conveying mechanism, including conveying mechanism, drive mechanism, fixed establishment, pick up mechanism, dust removal mechanism, place box and three heating mechanism, conveying mechanism includes two baffles, two rotation axis that are connected respectively on two baffle opposite side outer walls through the bearing, two conveying rollers that cup joint respectively on two rotation axis outer walls, both sides overlap joint respectively on two conveying roller outer walls, a plurality of support column that welds respectively on two baffle bottom outer walls, first connecting plate that both ends cup joint respectively on the support column outer wall and both sides weld respectively on the mount pad on two first connecting plate opposite side outer walls, the reducing gear box that passes through bolted connection on mount pad top outer wall, first servo motor that passes through bolted connection on one of them first connecting plate top outer wall;
the transmission mechanism comprises a first installation block connected to the outer walls of the tops of the two partition boards through bolts, two rotating rods connected to the outer walls of one side of the first installation block through bearings respectively, two synchronous wheels sleeved on the outer walls of the middle of the rotating rods respectively, synchronous belts with two sides respectively overlapped on the outer walls of the two synchronous wheels, two first connecting rods sleeved on the outer walls of one ends of the two rotating rods respectively, two first fixing rods connected to the outer walls of the tops of the two first connecting rods through bearings respectively, two first connecting blocks connected to the outer walls of one ends of the two first fixing rods through bearings respectively, and a second servo motor connected to the outer walls of the tops of the first installation blocks through bolts;
the fixing mechanism comprises a second installation block of an L-shaped structure, two installation rods, two second connecting rods, two second fixing rods and a second connecting block, wherein the second installation block is connected to the outer walls of the tops of the two partition boards through bolts, the two installation rods are respectively connected to the outer walls of one side of the second installation block through bearings, the two second connecting rods are respectively sleeved on the outer walls of one ends of the two installation rods, the two second fixing rods are respectively connected to the outer walls of the tops of the two second connecting rods through bearings, and the two ends of the second fixing rods are respectively connected to the outer walls of one ends of the two second fixing rods through bearings;
the picking mechanism comprises a mounting plate, a fixing frame, a ventilating pipe, a limiting ring, a communicating pipe, a slip ring, a connecting seat, a vacuum chuck, a fixed plate, an electric push rod, a miniature vacuum pump and a connecting pipe, wherein the two ends of the mounting plate are respectively welded on the outer wall of one side of the first connecting block opposite to the second connecting block, the fixing frame is welded on the outer wall of the bottom of the mounting plate, the ventilating pipe is sleeved on the outer wall of the top of the mounting plate, the limiting ring is sleeved on the inner wall of the bottom end of the ventilating pipe, the communicating pipe is slidably installed in the limiting ring, the slip ring is sleeved on the outer wall of the top end of the communicating pipe, the connecting seat is sleeved on the outer wall of the bottom of the communicating pipe, the vacuum chuck is connected on the outer wall of the bottom of the connecting seat through bolts, the fixed plate is sleeved on the outer wall of the lower part of the communicating pipe, the electric push rod is connected on the outer wall of the bottom of the mounting plate through bolts, the miniature vacuum pump is connected on the outer wall of the top of the mounting plate through bolts, and the connecting pipe is sleeved on the outer wall of the air inlet end of the miniature vacuum pump;
the dust removing mechanism comprises two second connecting plates, two fixing seats, a dust collecting box, a dust screen, a suction fan, an air conveying pipe, a prismatic dust removing cover, a baffle plate and two limiting plates, wherein the two ends of the second connecting plates are respectively sleeved on the outer walls of the lower parts of the two supporting columns, the two sides of the fixing seats are respectively welded on the outer walls of the opposite sides of the two second connecting plates, the dust collecting box is connected to the outer walls of the tops of the fixing seats through bolts, the dust screen is connected to the inner walls of one ends of the bottoms of the dust collecting boxes through bolts, the suction fan is connected to the outer walls of the tops of the second connecting plates through bolts, the air conveying pipe is sleeved on the inner walls of one side of the dust collecting boxes, the prismatic dust removing cover is sleeved on the outer walls of one ends of the air conveying pipe, the baffle plate is welded on one side of the dust removing cover, and the limiting plates are respectively welded on the outer walls of one side of the baffle plate;
the heating mechanism comprises a mounting frame, a temperature sensor, an insulating plate and a plurality of infrared heaters, wherein the two sides of the mounting frame are respectively connected to the outer wall of one side of the two partition plates through bolts, the temperature sensor is connected to the inner wall of one side of the mounting frame through bolts, the two ends of the insulating plate are respectively welded to the inner walls of the two sides of the mounting frame, and the two ends of the bottom of the insulating plate are respectively connected to the outer wall of the top of the insulating plate through bolts.
Preferably, the outer wall of the bottom end of the supporting column is welded with a supporting seat, one end of the rotating shaft is connected to the outer wall of one side of the partition plate through a bearing, the outer wall of one end of the rotating shaft is sleeved with a driven belt pulley, one end of the output shaft of the first servo motor is connected with the reduction gearbox through a coupler, one end of the output shaft of the reduction gearbox is sleeved with a belt pulley, and the belt pulley and the driven belt pulley form transmission fit through a belt.
Preferably, a through hole is formed in the outer wall of one side of the first mounting block, and the output shaft of the second servo motor penetrates through the through hole and is connected with one of the rotating rods through a coupler.
Preferably, the center department outer wall of mount bottom is opened there is the installing port, and the ventilation pipe cup joints in the installing port, sliding ring slidable mounting is in the ventilation pipe, communicating pipe and vacuum chuck inside are linked together, electric putter middle part cup joints on mount bottom outer wall, and electric putter output shaft bottom cup joints on fixed plate bottom outer wall, the connecting pipe is linked together with the ventilation pipe is inside.
Preferably, the air inlet end of the suction fan is sleeved with an air inlet pipe, the air inlet pipe is sleeved on the inner wall of one side of the dust collection box, and ventilation openings distributed at equal distances are formed in the outer wall of one side of the baffle, which is positioned in the dust hood.
Preferably, a placing box is connected to the outer wall of the partition board, which is close to the first mounting block, through bolts, and solder paste is arranged in the placing box.
Preferably, the outer wall of one side of the partition plate is connected with a control host through a bolt, the control host comprises a controller, a display screen and a processor, and the first servo motor, the second servo motor, the electric push rod, the micro vacuum pump, the suction fan and the infrared heaters are respectively connected with the control host through wires.
The beneficial effects of the invention are as follows:
1. the device is provided with a transmission mechanism, a fixing mechanism and a pickup mechanism, wherein the output shaft of the second servo motor drives one rotary rod to rotate, the other rotary rod is driven to rotate through a synchronous belt, the first connecting block drives the mounting plate, the second connecting block and the two second connecting rods to rotate, so that the vacuum chuck can swing left and right, the output shaft of the electric push rod moves to drive the vacuum chuck to move, the miniature vacuum pump pumps air in the ventilation pipe and the vacuum chuck, the vacuum chuck adsorbs a chip and a shell, when the chip is adsorbed, the output shaft of the electric push rod descends, the chip descends into the placing box, the bottom of the chip is contacted with solder paste, the automatic feeding of the chip and the shell is realized, meanwhile, the bottom of the chip is smeared with the solder paste, the degree of automation is improved, the chip is prevented from being damaged when the chip is picked up, and the safety is improved;
2. the dust removing mechanism is arranged, when the shell and the chip are combined together, the baffle and the two limiting plates block the shell and the chip, the suction fan is started, the dust on the shell and the chip is sucked away by the suction fan through the air conveying pipe, and meanwhile, the shell and the chip can move under the suction force of the suction fan and then are attached to one side of the baffle, under the blocking effect of the vacuum chuck, the shell and the chip are prevented from being overturned, the shell and the chip can be removed, meanwhile, the position of the shell and the chip can be adjusted, and the practicability is improved;
3. be provided with three heating mechanism, shell and chip when conveying on the conveyer belt, can pass through three heating mechanism in proper order, set up three heating mechanism's temperature respectively through the control host computer for three heating mechanism's temperature improves step by step, can preheat when carrying, can carry out subregion control to the temperature, and the temperature promotes comparatively smoothly, avoids the chip impaired.
Drawings
Fig. 1 is a schematic diagram of a front view of a heating and conveying mechanism for soldering a semiconductor chip according to the present invention;
fig. 2 is a schematic bottom perspective view of a heating and conveying mechanism for soldering a semiconductor chip according to the present invention;
fig. 3 is a schematic view of a back perspective structure of a heating and conveying mechanism for soldering a semiconductor chip according to the present invention;
fig. 4 is a schematic cross-sectional perspective view of a conveying mechanism of a heating conveying mechanism for semiconductor chip soldering according to the present invention;
fig. 5 is a schematic diagram of a front perspective view of a driving mechanism and a fixing mechanism of a heating and conveying mechanism for welding semiconductor chips;
fig. 6 is a schematic diagram of a bottom perspective structure of a transmission mechanism and a fixing mechanism of a heating and conveying mechanism for welding semiconductor chips;
fig. 7 is a schematic cross-sectional view of a pick-up mechanism of a heating and transporting mechanism for soldering a semiconductor chip according to the present invention;
FIG. 8 is an enlarged schematic view of the structure of FIG. 7A according to the present invention;
fig. 9 is a schematic side view of a dust removing mechanism of a heating and conveying mechanism for welding semiconductor chips according to the present invention;
fig. 10 is a schematic cross-sectional perspective view of a dust removing mechanism of a heating and conveying mechanism for soldering a semiconductor chip according to the present invention;
fig. 11 is a schematic bottom perspective view of a heating mechanism of a heating and conveying mechanism for semiconductor chip soldering according to the present invention.
In the figure: 1 conveying mechanism, 101 partition board, 102 rotation shaft, 103 conveying roller, 104 conveyor belt, 105 support column, 106 first connecting plate, 107 mount pad, 108 reduction gearbox, 109 first servo motor;
2 a transmission mechanism, a first mounting block 201, a 202 rotating rod, a 203 synchronous wheel, a 204 synchronous belt, a 205 first connecting rod, a 206 first fixed rod, a 207 first connecting block and a 208 second servo motor;
3 fixing mechanism, 301 second mounting block, 302 mounting rod, 303 second connecting rod, 304 second fixing rod, 305 second connecting block;
4 pick-up mechanism, 401 mounting plate, 402 fixing frame, 403 ventilation pipe, 404 spacing ring, 405 communication pipe, 406 slip ring, 407 connecting seat, 408 vacuum chuck, 409 fixing plate, 410 electric push rod, 411 micro vacuum pump, 412 connecting pipe;
the dust removing device comprises a dust removing mechanism 5, a second connecting plate 501, a fixed seat 502, a dust collecting box 503, a dust screen 504, a suction fan 505, an air conveying pipe 506, a dust removing cover 507, a baffle 508 and a limiting plate 509;
6. placing a box;
7 heating mechanism, 701 mounting frame, 702 temperature sensor, 703 insulating board, 704 infrared heater;
8, controlling a host.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
1, referring to fig. 1-8, a heating and conveying mechanism for welding semiconductor chips, comprising a conveying mechanism 1, a transmission mechanism 2, a fixing mechanism 3, a pick-up mechanism 4, a dust removing mechanism 5, a placing box 6 and three heating mechanisms 7, wherein the conveying mechanism 1 comprises two partition boards 101, two rotating shafts 102 connected to the outer walls of opposite sides of the two partition boards 101 through bearings respectively, two conveying rollers 103 sleeved on the outer walls of the two rotating shafts 102 respectively, two conveyor belts 104 with two sides respectively overlapped on the outer walls of the two conveying rollers 103, a plurality of support columns 105 welded on the outer walls of the bottoms of the two partition boards 101 respectively, first connecting plates 106 with two ends respectively sleeved on the outer walls of the support columns 105 respectively, a reduction gearbox 108 with two sides respectively welded on the outer walls of opposite sides of the two first connecting plates 106, a first servo motor 109 connected to the top outer wall of the installation gearbox 107 through bolts, one end of the rotating shafts 102 is sleeved on one side of the outer walls of the partition boards 101 through bearings, one end of the output shafts 102 is sleeved on one end of the driven pulleys 108, and the driven pulleys 108 are sleeved on one end of the output shafts through a coupling, and the driven pulleys 108 are connected with one end of the driven pulleys 108 through a coupling, and the driven end is formed by the coupling;
the transmission mechanism 2 comprises a first installation block 201 connected to the outer walls of the tops of the two partition boards 101 through bolts, two rotating rods 202 respectively connected to the outer walls of one side of the first installation block 201 through bearings, two synchronous wheels 203 respectively sleeved on the outer walls of the middle parts of the rotating rods 202, two synchronous belts 204 respectively overlapped on the outer walls of the two synchronous wheels 203, two first connecting rods 205 respectively sleeved on the outer walls of one ends of the two rotating rods 202, two first fixing rods 206 respectively connected to the outer walls of the tops of the two first connecting rods 205 through bearings, two first connecting blocks 207 respectively connected to the outer walls of one ends of the two first fixing rods 206 through bearings, and a second servo motor 208 connected to the outer walls of the tops of the first installation block 201 through bolts, wherein a through hole is formed in the outer wall of one side of the first installation block 201, and the output shaft of the second servo motor 208 penetrates through the through hole and is connected with one rotating rod 202 through a coupling;
the fixing mechanism 3 comprises a second installation block 301 which is connected to the outer walls of the tops of the two partition boards 101 through bolts and is of an L-shaped structure, two installation rods 302 which are respectively connected to the outer walls of one side of the second installation block 301 through bearings, two second connecting rods 303 which are respectively sleeved on the outer walls of one ends of the two installation rods 302, two second fixing rods 304 which are respectively connected to the outer walls of the tops of the two second connecting rods 303 through bearings, and two second connecting blocks 305 which are respectively connected to the outer walls of one ends of the two second fixing rods 304 through bearings;
the picking mechanism 4 comprises a mounting plate 401 with two ends respectively welded on the outer wall of one side opposite to the first connecting block 207 and the second connecting block 305, a fixing frame 402 with a U-shaped structure welded on the outer wall of the bottom of the mounting plate 401, a vent pipe 403 sleeved on the outer wall of the top of the mounting plate 401, a limiting ring 404 sleeved on the inner wall of the bottom end of the vent pipe 403, a communicating pipe 405 slidably mounted in the limiting ring 404, a slip ring 406 sleeved on the outer wall of the top end of the communicating pipe 405, a connecting seat 407 sleeved on the outer wall of the bottom of the communicating pipe 405, a vacuum chuck 408 connected on the outer wall of the bottom of the connecting seat 407 through bolts, a fixing plate 409 sleeved on the outer wall of the lower part of the communicating pipe 405, an electric push rod 410 connected on the outer wall of the bottom of the mounting plate 401 through bolts, a micro vacuum pump 411 connected on the outer wall of the top of the mounting plate 401 and a connecting pipe 412 sleeved on the outer wall of the air inlet end of the micro vacuum pump 411, a mounting port is formed in the outer wall of the center of the bottom of the fixing frame 402, the vent pipe 403 is sleeved in the sliding mounting port, the slip ring 406 is slidably mounted in the vent pipe 403, the slip ring is connected with the inside the vacuum chuck 408, the middle of the electric push rod 410 is sleeved on the outer wall of the bottom of the fixing frame 402, the fixing plate 409 is fixedly connected with the inner wall of the connecting pipe 410 through a connecting pipe 410, the inner side of the connecting box is placed near the inner side of the fixing box 6, and the inner side is placed near the inner wall of the fixing box 6 through a connecting box 6.
Realize the automatic feeding of chip and shell, can paint the solder paste with the chip bottom simultaneously, improved degree of automation, cause the damage to the chip when can avoiding picking up the chip simultaneously, improved the security.
Referring to fig. 1-3 and fig. 9-10, a heating and conveying mechanism for welding semiconductor chips is disclosed, the dust removing mechanism 5 comprises two second connecting plates 501 with two ends respectively sleeved on the outer walls of the lower parts of two supporting columns 105, two fixing seats 502 with two sides respectively welded on the outer walls of opposite sides of the two second connecting plates 501, a dust collecting box 503 connected on the outer walls of the top of the fixing seats 502 through bolts, a dust screen 504 connected on the inner wall of one end of the bottom of the dust collecting box 503 through bolts, a suction fan 505 connected on the outer walls of the top of the second connecting plates 501 through bolts, an air conveying pipe 506 sleeved on one side inner wall of the dust collecting box 503, a prismatic dust removing cover 507 sleeved on one side outer wall of the air conveying pipe 506, a baffle 508 welded on one side outer wall of the dust removing cover 507 and two limiting plates 509 welded on one side outer wall of the baffle 508 respectively, the air inlet ends of the suction fan 505 are sleeved with an air inlet pipe, the air inlet pipe is sleeved on one side inner wall of the dust collecting box 503, and ventilation openings distributed equidistantly on the outer wall of the baffle 508 side located in the dust removing cover 507.
Can remove dust shell and chip, can carry out position control to shell and chip simultaneously, improve the practicality.
Embodiment 3 referring to fig. 1 to 3 and 11, a heating and conveying mechanism for semiconductor chip bonding, the heating mechanism 7 comprises a mounting frame 701 with two sides respectively connected to one side outer wall of two partition boards 101 through bolts, a temperature sensor 702 connected to one side inner wall of the mounting frame 701 through bolts, an insulating plate 703 with two ends respectively welded to two side inner walls of the mounting frame 701, and a plurality of infrared heaters 704 with a U-shaped structure with two ends respectively connected to the top outer wall of the insulating plate 703 through bolts.
Can preheat when carrying, can carry out subregion control to the temperature, the temperature promotes comparatively smoothly, avoids the chip impaired.
Example 4, this example was optimized on the basis of examples 1-3, specifically:
the outer wall of one side of the partition board 101 is connected with a control host 8 through bolts, the control host 8 comprises a controller, a display screen and a processor, and the first servo motor 109, the second servo motor 208, the electric push rod 410, the micro vacuum pump 411, the suction fan 505 and the infrared heaters 704 are respectively connected with the control host 8 through wires.
The output shaft of the second servo motor 208 drives one rotating rod 202 to rotate, and then drives the other rotating rod 202 to rotate through the synchronous belt 204, the first connecting block 207 drives the mounting plate 401, the second connecting block 305 and the two second connecting rods 303 to rotate, and then the vacuum chuck 408 can swing left and right, the output shaft of the electric putter 410 moves to drive the vacuum chuck 408 to move, the micro vacuum pump 411 pumps air in the ventilation pipe 403 and the vacuum chuck 408, and then the vacuum chuck 408 adsorbs the chip and the shell, when the chip is adsorbed, the vacuum chuck 408 moves to the position right above the placing box 6, the output shaft of the electric putter 410 descends, the chip descends to the position inside the placing box 6, the bottom of the chip is enabled to be contacted with solder paste, when the shell and the chip are combined together, the baffle 508 and the two limiting plates 509 block the shell and the chip, the suction fan 505 is started, the suction fan 505 sucks dust on the shell and the chip through the air conveying pipe 506, and the shell and the chip can move under the suction effect of the suction fan 505, and then one side of the baffle 508 is stuck on the baffle 508, and the shell and the chip are prevented from being overturned under the blocking effect of the vacuum chuck, when the shell and the chip are carried out, the conveying belt 104, the shell and the chip are conveyed on the conveying belt, the three infrared heater 7 and the three infrared heater 7 are sequentially arranged, the heating mechanism 7 and the temperature is controlled, the three heating mechanism 7 are respectively, the temperature heater mechanism 7 are arranged, and the host is respectively, and the temperature is increased.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor chip welds and uses heating conveying mechanism, includes conveying mechanism (1), drive mechanism (2), fixed establishment (3), pick-up mechanism (4), dust removal mechanism (5), place box (6) and three heating mechanism (7), its characterized in that, conveying mechanism (1) include two baffle (101), two rotation axis (102) on the outer wall of two opposite sides that are connected respectively through the bearing in two baffle (101), two conveying rollers (103) that cup joint respectively on two rotation axis (102) outer walls, conveyer belt (104) that both sides overlap respectively on two conveying rollers (103) outer walls, a plurality of support column (105) that weld respectively on two baffle (101) bottom outer walls, first connecting plate (106) that cup joint respectively on support column (105) outer walls in both ends and both sides weld respectively on mount pad (107) on two opposite sides outer walls of first connecting plate (106), reduction box (108) on the top outer wall of mount pad (107) through bolted connection, first servo motor (109) on the top outer wall of one of first connecting plate (106);
the transmission mechanism (2) comprises a first mounting block (201) connected to the outer walls of the tops of the two partition boards (101) through bolts, two rotating rods (202) connected to the outer walls of one side of the first mounting block (201) through bearings respectively, two synchronous wheels (203) sleeved on the outer walls of the middle parts of the rotating rods (202) respectively, synchronous belts (204) with two sides respectively overlapped on the outer walls of the two synchronous wheels (203), two first connecting rods (205) sleeved on the outer walls of one ends of the two rotating rods (202) respectively, two first fixing rods (206) connected to the outer walls of the tops of the two first connecting rods (205) through bearings respectively, two first connecting blocks (207) connected to the outer walls of one ends of the two first fixing rods (206) through bearings respectively, and a second servo motor (208) connected to the outer walls of the tops of the first mounting block (201) through bolts;
the fixing mechanism (3) comprises a second installation block (301) which is connected to the outer walls of the tops of the two partition boards (101) through bolts and is of an L-shaped structure, two installation rods (302) which are respectively connected to the outer walls of one side of the second installation block (301) through bearings, two second connecting rods (303) which are respectively sleeved on the outer walls of one ends of the two installation rods (302), two second fixing rods (304) which are respectively connected to the outer walls of the tops of the two second connecting rods (303) through bearings, and two second connecting blocks (305) which are respectively connected to the outer walls of one ends of the two second fixing rods (304) through bearings;
the picking mechanism (4) comprises a mounting plate (401) with two ends respectively welded on the outer wall of one side opposite to the first connecting block (207) and the second connecting block (305), a fixing frame (402) with a U-shaped structure welded on the outer wall of the bottom of the mounting plate (401), a ventilation pipe (403) sleeved on the outer wall of the top of the mounting plate (401), a limiting ring (404) sleeved on the inner wall of the bottom end of the ventilation pipe (403), a communication pipe (405) installed in the limiting ring (404) in a sliding manner, a slip ring (406) sleeved on the outer wall of the top end of the communication pipe (405), a connecting seat (407) sleeved on the outer wall of the bottom of the communication pipe (405), a vacuum chuck (408) connected on the outer wall of the bottom of the connecting seat (407) through bolts, an electric push rod (410) sleeved on the outer wall of the bottom of the mounting plate (401) through bolts, a micro vacuum pump (411) connected on the outer wall of the top of the mounting plate (401) through bolts and a connecting pipe (412) sleeved on the outer wall of the air inlet end of the micro vacuum pump (411);
the dust removing mechanism (5) comprises two second connecting plates (501) with two ends respectively sleeved on the outer walls of the lower parts of the two supporting columns (105), fixing seats (502) with two sides respectively welded on the outer walls of one side opposite to the two second connecting plates (501), a dust collecting box (503) connected on the outer walls of the tops of the fixing seats (502) through bolts, a dust screen (504) connected on the inner wall of one end of the bottom of the dust collecting box (503) through bolts, a suction fan (505) connected on the outer wall of the top of the second connecting plates (501) through bolts, an air conveying pipe (506) sleeved on the inner wall of one side of the dust collecting box (503), a prismatic dust removing cover (507) sleeved on the outer wall of one end of the air conveying pipe (506), a baffle (508) welded on the outer wall of one side of the dust removing cover (507) and two limiting plates (509) respectively welded on the outer wall of one side of the baffle (508);
the heating mechanism (7) comprises a mounting frame (701) with two sides respectively connected to one side outer wall of the two partition plates (101) through bolts, a temperature sensor (702) connected to one side inner wall of the mounting frame (701) through bolts, an insulating plate (703) with two ends respectively welded to the inner walls of two sides of the mounting frame (701) and a plurality of infrared heaters (704) with bottom two ends respectively connected to the U-shaped structures on the top outer wall of the insulating plate (703) through bolts.
2. The heating and conveying mechanism for semiconductor chip welding according to claim 1, wherein a supporting seat is welded on the outer wall of the bottom end of the supporting column (105), one end of the rotating shaft (102) is connected to the outer wall of one side of the partition board (101) through a bearing, a driven belt pulley is sleeved on the outer wall of one end of the rotating shaft (102), one end of an output shaft of the first servo motor (109) is connected with the reduction gearbox (108) through a coupling, a belt pulley is sleeved on one end of the output shaft of the reduction gearbox (108), and the belt pulley is in transmission fit with the driven belt pulley through a belt.
3. The heating and conveying mechanism for semiconductor chip bonding according to claim 1, wherein a through hole is formed in an outer wall of one side of the first mounting block (201), and an output shaft of the second servo motor (208) penetrates through the through hole and is connected with one of the rotating rods (202) through a coupling.
4. The heating and conveying mechanism for welding semiconductor chips according to claim 1, wherein an installation opening is formed in the outer wall of the center of the bottom of the fixing frame (402), the ventilation pipe (403) is sleeved in the installation opening, the sliding ring (406) is slidably installed in the ventilation pipe (403), the communication pipe (405) is communicated with the inside of the vacuum chuck (408), the middle part of the electric push rod (410) is sleeved on the outer wall of the bottom of the fixing frame (402), the bottom end of the output shaft of the electric push rod (410) is sleeved on the outer wall of the bottom of the fixing plate (409), and the connecting pipe (412) is communicated with the inside of the ventilation pipe (403).
5. The heating and conveying mechanism for welding semiconductor chips according to claim 1, wherein an air inlet end of the suction fan (505) is sleeved with an air inlet pipe, the air inlet pipe is sleeved on the inner wall of one side of the dust collection box (503), and ventilation openings distributed equidistantly are formed in the outer wall of one side of the baffle (508) located in the dust removal cover (507).
6. The heating and conveying mechanism for semiconductor chip bonding according to claim 1, wherein a placement box (6) is connected to the outer wall of the partition board (101) close to the first mounting block (201) through bolts, and solder paste is arranged in the placement box (6).
7. The heating and conveying mechanism for welding semiconductor chips according to claim 1, wherein a control host machine (8) is connected to one side outer wall of the partition board (101) through bolts, the control host machine (8) comprises a controller, a display screen and a processor, and the first servo motor (109), the second servo motor (208), the electric push rod (410), the micro vacuum pump (411), the suction fan (505) and the plurality of infrared heaters (704) are respectively connected with the control host machine (8) through wires.
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| CN202111318634.8A CN114171432B (en) | 2021-11-09 | 2021-11-09 | Heating conveying mechanism for welding semiconductor chips |
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| CN202111318634.8A CN114171432B (en) | 2021-11-09 | 2021-11-09 | Heating conveying mechanism for welding semiconductor chips |
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| CN115910865B (en) * | 2022-11-29 | 2023-11-24 | 江苏盐芯微电子有限公司 | Packaging device and packaging method for packaging fingerprint identification chip |
| CN116351750B (en) * | 2023-04-07 | 2023-10-31 | 江苏金韦尔机械有限公司 | PVB diaphragm heating forming device |
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| CN114171432A (en) | 2022-03-11 |
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Address after: 214000 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Patentee after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Country or region after: China Address before: 214000 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Patentee before: ENERGY INTELLIGENT TECHNOLOGY WUXI CO.,LTD. Country or region before: China |