CN114170993A - Sound absorption structure and sound absorption device - Google Patents
Sound absorption structure and sound absorption device Download PDFInfo
- Publication number
- CN114170993A CN114170993A CN202111575471.1A CN202111575471A CN114170993A CN 114170993 A CN114170993 A CN 114170993A CN 202111575471 A CN202111575471 A CN 202111575471A CN 114170993 A CN114170993 A CN 114170993A
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- insulating film
- film body
- electric conductor
- sound absorption
- insulating substrate
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 39
- 239000004020 conductor Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 6
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 claims description 6
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 claims description 6
- 229910001172 neodymium magnet Inorganic materials 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 229910000828 alnico Inorganic materials 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004697 Polyetherimide Substances 0.000 claims description 4
- 229920001601 polyetherimide Polymers 0.000 claims description 4
- -1 polyethylene naphthalate Polymers 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 230000005415 magnetization Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 238000013016 damping Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 4
- 230000005389 magnetism Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/172—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using resonance effects
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/162—Selection of materials
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
Abstract
The invention discloses a sound absorption structure and a sound absorption device, wherein the sound absorption structure comprises an insulating substrate, a first insulating film body, a first magnetic part and a conductor; the insulating substrate is provided with a through hole, the first insulating film body is attached to one side face of the insulating substrate, the first insulating film body is suspended in the through hole, the first magnetic part is fixed on the first insulating film body and located in the through hole, the electric conductor is fixed on one side face, opposite to the first insulating film body, of the insulating substrate, and the electric conductor is in a closed ring shape and surrounds the through hole. The sound absorption structure disclosed by the invention can solve the technical problems of large application limitation and poor sound absorption effect of the existing film resonance sound absorption structure.
Description
Technical Field
The invention belongs to the technical field of silencers, and particularly relates to a sound absorption structure and a sound absorption device.
Background
Film resonance sound absorbing structures are widely used in noise damping and reducing devices. In a traditional film resonance sound absorption structure, a film is usually attached to an opening of a closed cavity, so that the film and air in the closed cavity form a resonance system, when the frequency of incident sound waves is equal to the resonance frequency of the system, resonance is generated, the incident sound waves excite the film to generate vibration, the vibration causes the loss of sound wave energy, and the purpose of sound absorption is achieved.
However, the structure has a narrow sound absorption band and has good sound absorption performance only in the vicinity of the resonant frequency. The resonant frequency of the structure is determined by the density and tension of the film and the depth of the closed cavity, and if the sound absorption frequency band is adjusted, the film needs to be replaced or the depth of the closed cavity needs to be changed. This is inconvenient and in practice is often limited by the space within the apparatus, and the above-mentioned adjustment is not possible, so that the practical application of the sound absorbing structure is limited.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, the present invention aims to provide a sound absorption structure, which aims to solve the technical problems of large application limitation and poor sound absorption effect of the existing film resonance sound absorption structure.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a sound absorbing structure includes an insulating substrate, a first insulating film body, a first magnetic member, and an electric conductor; wherein:
the insulating substrate is provided with a through hole, the first insulating film body is attached to one side face of the insulating substrate, the part of the first insulating film body in the through hole is suspended, the first magnetic part is fixed on the first insulating film body and located in the through hole, the electric conductor is fixed on one side face, back to the first insulating film body, of the insulating substrate, and the electric conductor is in a closed ring shape and surrounds the through hole.
Further, the sound absorbing structure further comprises a second insulating film body and a second magnetic member; wherein:
the second insulating film body and the electric conductor are arranged at intervals, one side face of the second insulating film body is opposite to one side, back to the insulating substrate, of the electric conductor, and the second magnetic piece is fixed on one side face, back to the electric conductor, of the second insulating film body.
Further, the sound absorption structure further comprises a fixing frame, and the edge of the second insulating film body is connected to the inner side wall of the fixing frame.
Further, the edge of the insulating substrate is connected to the inner side wall of the fixing frame.
Further, the magnetizing direction of the first magnetic part and the axial direction of the electric conductor are parallel to each other.
Further, the magnetizing direction of the second magnetic part is parallel to the axial direction of the conductor.
Further, the second magnetic member is sheet-shaped and covers the inner ring of the conductor.
Further, the thickness of the second insulating film body is greater than the thickness of the first insulating film body.
Further, the material of first magnetism spare is any one of neodymium iron boron, samarium cobalt, alnico.
Further, the material of second magnetism spare is any one of neodymium iron boron, samarium cobalt, alnico.
Further, the material of the insulating substrate is any one of polyimide, polyether ether ketone, polyetherimide and polyethylene naphthalate.
Further, the material of the conductor is any one of copper and soft iron material.
Furthermore, the through holes are multiple, and the first magnetic pieces and the electric conductors are multiple and correspond to the through holes one to one.
Correspondingly, the invention also provides a sound absorption device, which comprises the sound absorption structure.
Compared with the prior art, the invention has the beneficial effects that:
according to the sound absorption structure provided by the invention, the electric conductors and the first magnetic parts which vibrate along with the first insulating film body are respectively arranged on the two side surfaces of the insulating substrate provided with the through hole, when the suspended part of the first insulating film body in the through hole vibrates due to the sound wave energy of external noise, the first magnetic parts are driven to do reciprocating movement of cutting magnetic induction lines relative to the electric conductors in the through hole, so that annular induction currents are generated on the electric conductors, new magnetic fields are generated by the annular induction currents, the new magnetic fields are always opposite to the movement of the first magnetic parts according to the Lenz law, the damping effect formed by the opposite is used for consuming the sound wave energy of the external noise, and the sound absorption effect is achieved. This sound absorption mode has introduced the effect of electromagnetism, compares and only relies on film resonance to consume the traditional structure of sound energy, no longer is subject to resonant frequency, and the sound-absorbing capacity is showing and is promoted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of one embodiment of a sound absorbing structure of the present invention;
FIG. 2 is a schematic cross-sectional view of another embodiment of the sound absorbing structure of the present invention;
fig. 3 is an exploded view of another embodiment of the sound absorbing structure of the present invention.
Description of reference numerals:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
5 | Second insulating film body |
| 2 | A first |
6 | Second |
| 3 | First |
7 | Fixing |
| 4 | |
11 | Through hole |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a sound absorbing structure including an insulating substrate 1, a first insulating film 2, a first magnetic member 3, and an electric conductor 4; wherein:
the insulating substrate 1 is provided with a through hole 11, the first insulating film body 2 is attached to one side surface of the insulating substrate 1, the part of the first insulating film body 2 in the through hole 11 is suspended, the first magnetic part 3 is fixed on the first insulating film body 2 and is positioned in the through hole 11, the electric conductor 4 is fixed on one side surface of the insulating substrate 1, which is back to the first insulating film body 2, and the electric conductor 4 is in a closed ring shape and surrounds the through hole 11.
In the present embodiment, the first insulating film 2 is a film having a predetermined tension, specifically, the first insulating film 2 can be attached to the insulating substrate 1 after being tensioned by a film stretching tool, and the specific tension can be adjusted by measuring the relationship between the resonance frequency of the first insulating film 2 and the tension. Illustratively, the through hole 11 may be a circular hole, the first magnetic member 3 may be cylindrical and disposed at the center of the circular hole, and the electric conductor 4 may be annular; preferably, the diameter of the inner circle of the conductive body 4 is equal to the aperture of the through hole 11, and the conductive body 4 is coaxially fitted with the through hole 11.
When noise exists outside, the sound wave energy of the noise causes the suspended part of the first insulating film body 2 in the through hole 11 to vibrate, so as to drive the first magnetic part 3 to reciprocate in the through hole 11 relative to the electric conductor 4, the reciprocating movement is equivalent to that the electric conductor 4 cuts a magnetic induction line, so that induced current is generated on the electric conductor 4 due to electromagnetic induction, and the direction of the induced current is clockwise or anticlockwise around the electric conductor 4; the circular induced current will generate a new magnetic field (hereinafter, the new magnetic field is referred to as the magnetic field), and according to lenz's law, the magnetic field of the induced current always hinders the change of the magnetic flux causing the induced current, so that the new magnetic field will always oppose the motion of the first magnetic member 3, and the damping effect formed by the opposition will consume the sound wave energy, thereby achieving the sound absorption effect.
Therefore, in the sound absorption structure provided by this embodiment, the electric conductor 4 and the first magnetic member 3 vibrating along with the first insulating film body 2 are respectively disposed on the two side surfaces of the insulating substrate 1 provided with the through hole 11, when the sound wave energy of the external noise causes the suspended portion of the first insulating film body 2 located in the through hole 11 to vibrate, the first magnetic member 3 is driven to reciprocate relative to the electric conductor 4 in the through hole 11 to generate the annular induced current on the electric conductor 4, and the annular induced current generates a new magnetic field, and according to lenz's law, the new magnetic field always opposes to the motion of the first magnetic member 3, and the damping effect formed by the opposition consumes the sound wave energy of the external noise, thereby achieving the sound absorption effect. This sound absorption mode has introduced the effect of electromagnetism, compares and only relies on film resonance to consume the traditional structure of sound energy, no longer is subject to resonant frequency, and the sound-absorbing capacity is showing and is promoted.
Further, referring to fig. 1, in an exemplary embodiment, the sound absorbing structure further includes a second insulating film body 5 and a second magnetic member 6; wherein:
the second insulating film 5 is provided at a distance from the conductor 4, and one side surface of the second insulating film 5 is opposed to the side of the conductor 4 facing away from the insulating substrate 1, and the second magnetic member 6 is fixed to the side surface of the second insulating film 5 facing away from the conductor 4.
In this embodiment, the second insulating film 5 is tensioned in the same manner as the first insulating film 2 and fixed at its edge to the support base. Illustratively, the second insulating film body 5 may be located below the insulating substrate 1 and opposite to the electric conductor 4, and the second magnetic member 6 may be located directly below the electric conductor 4. When the annular induced current on the conductor 4 generates a new magnetic field, the new magnetic field interacts with the second magnetic part 6 below, so that the second magnetic part 6 drives the second insulating film body 5 to reciprocate (or vibrate) together, thereby further consuming the sound wave energy of the external noise and enhancing the sound absorption effect.
Further, referring to fig. 2, in an exemplary embodiment, the sound absorbing structure further includes a fixing frame 7, and the edge of the second insulating film body 5 is attached to an inner sidewall of the fixing frame 7.
Specifically, referring to fig. 2, the edge of the insulating substrate 1 is attached to the inner sidewall of the fixing frame 7.
Illustratively, the insulating substrate 1, the first insulating film 2, the first magnetic member 3, the conductor 4, the second insulating film 5 and the second magnetic member 6 constitute a complete sound absorbing unit by the connecting action of the fixing frame 7.
Specifically, the magnetizing direction of the first magnetic member 3 and the axial direction of the electric conductor 4 are parallel to each other.
Specifically, the magnetizing direction of the second magnetic member 6 and the axial direction of the electric conductor 4 are parallel to each other.
When the magnetizing directions of the first magnetic member 3 and the second magnetic member 6 are parallel to the axial direction of the electric conductor 4, if the first magnetic member 3 reciprocates along the axial direction of the electric conductor 4 under the vibration of the first insulating film body 2, the damping effect generated between the new magnetic field and the first magnetic member 3 and the second magnetic member 6 is maximized, and at this time, the sound wave energy of the external noise can be consumed to the maximum extent.
Specifically, referring to fig. 1 and 2, the second magnetic member 6 is sheet-shaped and covers the inner ring of the electric conductor 4.
When the second magnetic member 6 is in a sheet shape and covers the inner ring of the electric conductor 4 (the covering means that the inner ring of the electric conductor 4 is completely within the range covered by the second magnetic member 6 when viewed from the vertical direction in the figure), the acting force generated by the new magnetic field will deform the second magnetic member 6 to some extent, and the deformation can further consume the sound wave energy of the external noise. Preferably, the second magnetic member 6 is circular and has a center located on the central axis of the conductive body 4, so as to maximize the stressed area (i.e. the force generated by the new magnetic field) of the second magnetic member 6.
Specifically, the thickness of the second insulating film body 5 is larger than the thickness of the first insulating film body 2.
The greater the thickness of the film body, the better the performance of absorbing low frequency sound waves. The first insulating film body 2 and the second insulating film body 5 are matched with each other, so that the sound absorption frequency band of the sound absorption structure can be widened.
Specifically, the material of first magnetism spare 3 is any one of neodymium iron boron, samarium cobalt, alnico.
Specifically, the material of second magnetism spare 6 is any one of neodymium iron boron, samarium cobalt, alnico.
Specifically, the material of the conductor 4 is any one of copper and soft iron.
Specifically, the material of the insulating substrate 1 is any one of polyimide, polyether ether ketone, polyetherimide, and polyethylene naphthalate.
Polyimide (Polyimide), polyether ether ketone (PEEK), Polyetherimide (polyetheretherketone) and polyethylene naphthalate (PEN) are all high polymer materials and have the characteristics of high temperature resistance and good acoustic performance, and can be selected as required in practical application, specifically, a film can be firstly made, then a plurality of layers of films are adhered to form a composite film in an adhesive mode, and finally the insulating substrate 1 is made, so that the acoustic performance can be improved.
Further, referring to fig. 2 and 3, in an exemplary embodiment, the through holes 11 are plural, and the first magnetic member 3 and the conductive body 4 are plural and correspond to the through holes 11 one by one.
As shown in fig. 3, the plurality of first magnetic members 3 and the plurality of conductors 4 form an array of a plurality of noise cancellation units on the insulating substrate 1, and the noise cancellation effect can be greatly improved. Preferably, the second magnetic members 6 may also be disposed in a plurality corresponding to each other as shown in the figure.
Correspondingly, the embodiment of the invention also provides a sound absorption device, and the sound absorption device comprises the sound absorption structure in any embodiment.
In the present embodiment, the sound absorbing device may be a muffler applied to a sound-proof wall, an acoustic apparatus, or a machine that generates a large noise during operation. Because the sound absorption device adopts all technical schemes of all embodiments of the sound absorption structure, at least all beneficial effects brought by the technical schemes of the embodiments are achieved, and repeated description is omitted.
It should be noted that other contents of the sound absorbing structure and the sound absorbing device disclosed in the present invention can be referred to in the prior art, and are not described herein again.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A sound absorption structure is characterized by comprising an insulating substrate, a first insulating film body, a first magnetic part and an electric conductor; wherein:
the insulating substrate is provided with a through hole, the first insulating film body is attached to one side face of the insulating substrate, the part of the first insulating film body in the through hole is suspended, the first magnetic part is fixed on the first insulating film body and located in the through hole, the electric conductor is fixed on one side face, back to the first insulating film body, of the insulating substrate, and the electric conductor is in a closed ring shape and surrounds the through hole.
2. The sound absorbing structure of claim 1 further comprising a second insulating film body and a second magnetic member; wherein:
the second insulating film body and the electric conductor are arranged at intervals, one side face of the second insulating film body is opposite to one side, back to the insulating substrate, of the electric conductor, and the second magnetic piece is fixed on one side face, back to the electric conductor, of the second insulating film body.
3. The sound absorbing structure according to claim 2, further comprising a fixing frame, wherein an edge of the second insulating film body is connected to an inner sidewall of the fixing frame;
and/or, the edge of the insulating substrate is connected to the inner side wall of the fixing frame.
4. The sound absorbing structure of claim 2, wherein the direction of magnetization of the first magnetic member and the axial direction of the electrical conductor are parallel to each other;
and/or the magnetizing direction of the second magnetic part is parallel to the axial direction of the electric conductor.
5. The sound absorbing structure of claim 2, wherein the second magnetic member is sheet-like and covers the inner ring of electrical conductors.
6. The sound absorbing structure of claim 2, wherein the thickness of the second insulating film body is greater than the thickness of the first insulating film body.
7. The sound absorbing structure of claim 2, wherein the second magnetic member is made of any one of neodymium iron boron, samarium cobalt, and alnico.
8. The sound absorbing structure according to any one of claims 1 to 7, wherein the through holes are plural, and the first magnetic member and the electric conductor are plural and correspond to the through holes one to one.
9. The sound absorbing structure according to any one of claims 1 to 7, wherein the insulating substrate is made of any one of polyimide, polyetheretherketone, polyetherimide and polyethylene naphthalate;
the first magnetic part is made of any one of neodymium iron boron, samarium cobalt and aluminum nickel cobalt;
the conductor is made of any one of copper and soft iron materials.
10. A sound-absorbing device, characterized in that it comprises a sound-absorbing structure as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111575471.1A CN114170993A (en) | 2021-12-21 | 2021-12-21 | Sound absorption structure and sound absorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111575471.1A CN114170993A (en) | 2021-12-21 | 2021-12-21 | Sound absorption structure and sound absorption device |
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| CN114170993A true CN114170993A (en) | 2022-03-11 |
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| CN202111575471.1A Pending CN114170993A (en) | 2021-12-21 | 2021-12-21 | Sound absorption structure and sound absorption device |
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| Country | Link |
|---|---|
| CN (1) | CN114170993A (en) |
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| WO2015007221A1 (en) * | 2013-07-18 | 2015-01-22 | The Hong Kong University Of Science And Technology | Extraordinary acoustic absorption induced by hybrid resonance and electrical energy generation from sound by hybrid resonant metasurface |
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2021
- 2021-12-21 CN CN202111575471.1A patent/CN114170993A/en active Pending
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