CN114161328B - CVD diamond fine grinding tool and preparation method thereof - Google Patents
CVD diamond fine grinding tool and preparation method thereof Download PDFInfo
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- CN114161328B CN114161328B CN202111349481.3A CN202111349481A CN114161328B CN 114161328 B CN114161328 B CN 114161328B CN 202111349481 A CN202111349481 A CN 202111349481A CN 114161328 B CN114161328 B CN 114161328B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
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Abstract
The invention provides a CVD diamond fine grinding tool and a preparation method thereof, wherein the tool comprises a substrate, a CVD diamond coating, A-type microgrooves on the surface of the CVD diamond coating on the circumferential surface of a grinding tool, B-type microgrooves on the surface of the CVD diamond coating on the circumferential surface of the grinding tool and C-type microgrooves on the surface of the CVD diamond coating on the bottom surface of the grinding tool; compared with other fine grinding tools, the tool can effectively reduce grinding abrasion by increasing the grooves and improve the processing efficiency. Compared with other micro-fine milling tools, the surface roughness of the machined surface can be effectively reduced through the CVD coating on the surface of the tool, the service life of the micro-fine grinding tool is obviously prolonged, meanwhile, the micro grooves on the circumferential surface of the micro-fine grinding tool can discharge grinding fluid and abrasive dust in time, and secondary abrasion of the machined surface and the micro-fine grinding tool caused by accumulation of the grinding fluid and the abrasive dust is avoided.
Description
Technical Field
The invention belongs to the technical field of precision micromachining, and particularly relates to a CVD diamond micro-grinding tool and a preparation method thereof.
Background
The micro grinding technology has important application value and wide application prospect in the fields of aerospace, mechanical electronics, optics and optoelectronics, and the used grinding tools are more and more emphasized. Such as a micro flow channel device having a titanium alloy or glass surface, in order to obtain a surface roughness having a nano-scale and a surface shape accuracy having a micro-scale, it is required to perform a micro-grinding process using a diamond micro-abrasive having a micro-scale size. However, with the increasing demand for precision fine machining, the following main limiting factors are increasingly highlighted by the existing fine grinding tools:
1. the micro grinding processing area is always in a closed state, and grinding fluid is difficult to reach the grinding area in the processing process, so that the grinding temperature is high, the workpiece material is seriously processed and hardened, and the micro grinding tool with a micro diameter is easy to wear in processing, so that the processing precision of the micro channel is reduced.
2. The abrasive dust in the grinding process is not easy to be led out and is easy to remain in the grinding tool and the workpiece, so that the surface of the fine grinding tool is easy to block, and the tool fails.
Disclosure of Invention
The invention provides a CVD diamond micro grinding tool and a preparation method thereof, aiming at solving the problems that grinding fluid is difficult to reach a grinding area in the existing precision micro grinding processing, and a micro grinding tool is easy to block and wear, so that the grinding processing precision and efficiency are low.
The invention is realized by the following technical scheme, and provides a CVD diamond fine grinding tool which is a pen-shaped grinding tool and comprises a substrate, wherein the substrate consists of a cylindrical clamping part, a conical transition part and a micro-cylindrical grinding part, and the three parts are sequentially connected; the conical transition part and the micro-cylindrical grinding part are completely covered with the CVD diamond coating, and the micro-cylindrical grinding part comprises three types of micro grooves, namely an A type micro groove on the CVD diamond coating surface of the peripheral surface of the grinding tool, a B type micro groove on the CVD diamond coating surface of the peripheral surface of the grinding tool and a C type micro groove on the CVD diamond coating surface of the bottom surface of the grinding tool; the C-type micro grooves are uniformly distributed and crossed in 360 degrees by taking the center of the bottom surface as a cross point, the number of cross points formed by the C-type micro grooves, the A-type micro grooves and the B-type micro grooves on the edge of the bottom surface of the grinding tool is equal to the sum of the number of the A-type micro grooves and the number of the B-type micro grooves, and two cross points formed by each C-type micro groove are connected with the A-type micro grooves or the B-type micro grooves of the same type.
Furthermore, the cylindrical clamping part is determined according to actual clamping requirements, the length of the conical transition part is 2-10mm, and the taper range is 1:1-1:2; the diameter of the micro-cylindrical grinding part is 0.1-1mm, and the length of the micro-cylindrical grinding part is 0.2-2mm; the conical transition part and the micro-cylindrical grinding part are in arc transition directly, and the radius of the transition arc is 0.3-0.5mm; the thickness of the CVD diamond coating is 10-20 mu m, the CVD diamond coating is polycrystalline diamond with a regular polyhedron structure, and the grain size is 2-5 mu m.
Furthermore, the A-type micro-groove on the surface of the CVD diamond coating of the circumferential surface of the grinding tool is a grinding fluid leading-in groove, the section is U-shaped, the A-type micro-groove is a spiral line, the spiral direction is opposite to the direction of the tool during grinding, the helix angle is 15-45 degrees, the spiral height is 120 percent of the grinding depth, the width of the A-type micro-groove is 15-20 mu m, and the groove depth is in the range of 5-10 mu m;
depth r of A-type micro-groove A ：
Where Q is the flow, η is the fluid viscosity, L is the trench length, and Δ p is the pressure differential across the micro-trench.
Furthermore, the B-type micro-grooves on the surface of the CVD diamond coating of the circumferential surface of the grinding tool are abrasive dust guide grooves, the section of each B-type micro-groove is U-shaped, the B-type micro-grooves are spiral lines, the spiral direction is the same as the turning direction of a tool during grinding, the helix angle is 45-60 degrees, the spiral height is 120 percent of the grinding depth, the width of the B-type micro-grooves is 15-20 mu m, and the depth of the grooves is within the range of 10-15 mu m;
depth r of B-type micro-groove B ：
Wherein ρ is the density of the solid-liquid two-phase flow, R e Is the Reynolds number of the micro-groove, tau is the shear stress between the fluid and the wall of the micro-groove, deltaF is the additional resistance of the solid-liquid two-phase flow, F m Is the resistance coefficient of the solid-liquid two-phase flow, and V is the average flow velocity in the micro-groove.
Furthermore, the section of the C-type micro groove on the CVD diamond coating surface of the bottom surface of the grinding tool is U-shaped, 2-4 grooves are arranged, the width of the groove is 10-15 mu m, and the depth of the groove is 5-10 mu m.
The invention provides a preparation method of a CVD diamond fine grinding tool, which comprises the following steps:
carrying out strong acid cobalt removal treatment on a conical transition part and a micro-cylindrical grinding part of a micro grinding tool substrate before CVD diamond coating, and generating polycrystalline diamond coatings with the thickness of 10-20 microns on the conical transition part and the micro-cylindrical grinding part of the micro grinding tool substrate by using a CVD chemical vapor deposition method;
horizontally mounting a micro-fine grinding tool to be processed on a rotary table, fixing the rotary table on a vertically-placed precise inclined table, vertically mounting a laser head of a laser, adjusting the relative position of the laser head to enable a laser focus to be focused on the outer circle surface of the micro-fine grinding tool, adjusting the spatial position of the laser and the micro-fine grinding tool to enable the axes of the laser and the micro-fine grinding tool to be perpendicular to each other, and enabling the angle between the rotary table and the inclined table to be changed;
thirdly, the rotating micro-fine grinding tool makes relative motion with a vertically installed laser head according to a reciprocating linear motion track in the horizontal and vertical directions, and the laser head is utilized to machine the micro-groove on the surface of the outer circle of the micro-fine grinding tool according to the width and the angle of the micro-groove to be machined;
and step four, adjusting the micro grinding tool to be in a vertical state, and processing a micro groove on the bottom surface of the micro grinding tool by using a laser.
Further, the rotating speed of the fine grinding tool in the second step is 0.15rpm-0.5rpm.
Further, the laser in the second step is a picosecond laser, the power is 0.3-1.3w, the repetition frequency is 5kHz, the pulse width is 15-200ps, the laser wavelength is 532nm, positive defocusing processing is adopted, and the defocusing amount is 0-0.8mm.
Further, in the third step,
according to the determined depth r of the A-type or B-type micro-groove AB Determining the defocusing amount Z:
Wherein, ω is 0 The diameter of the laser spot at the narrowest part of the beam, Z R Is the rayleigh length of the laser;
according to the determined width d of the A-type or B-type micro-groove AB Determining the feeding amount R in the width direction of the micro-groove during the laser processing:
then determining the length of the spiral line and the transverse feeding length, wherein the length of the spiral line and the transverse feeding length can be determined according to the longitudinal processing length, namely the length of the micro-cylindrical grinding part of the micro-grinding tool;
transverse feed length L:
wherein H is the length of the micro-cylindrical grinding part of the micro-grinding tool to be processed, namely the longitudinal feeding length; alpha is a helix lead angle;
processing the length l of the groove:
in order to ensure the surface roughness and precision of the processed micro-groove, an included angle between the precise inclined table and the vertical direction is set to be an angle alpha which is the same as the helix lead angle;
the transverse feeding speed of the micro grinding tool is 0.05-0.2mm/min, and the longitudinal feeding speed is 0.05-0.2mm/min;
adjust the distance between laser head and the fine grinding tool, at the fine grinding tool excircle surface at every turn the little groove of fixed angle processing of rotation, angle theta:
wherein n is the number of micro grooves of the micro cylindrical grinding part.
Further, in the fourth step,
width d of micro groove at bottom of micro grinding tool C ：
Depth h of micro groove at bottom of micro grinding tool C
h C ＝kNln(I 0 /I th )
Wherein k represents the optical penetration depth coefficient of the material, N represents the number of effective pulses, I 0 Represents the laser energy density, I th Representing the ablation threshold.
The invention has the beneficial effects that:
1) Compared with other micro grinding tools, the novel CVD diamond micro grinding tool provided by the invention can effectively reduce grinding abrasion by adding the grooves and improve the processing efficiency. Compared with other micro-milling tools, the surface roughness of the processed surface can be effectively reduced through the CVD coating on the surface of the tool, and the service life of the micro-milling tool is obviously prolonged. The invention can effectively avoid the zero speed point through the groove at the bottom of the fine grinding tool, thereby reducing the overall abrasion condition of the fine grinding tool, meanwhile, the micro groove on the circumferential surface of the fine grinding tool can discharge the grinding fluid and the abrasive dust in time, and avoiding the accumulation of the grinding fluid and the abrasive dust from causing secondary abrasion to the processing surface and the fine grinding tool, and the service life of the fine grinding tool can be prolonged by more than 20 percent according to the software simulation and experimental results.
2) According to the preparation method of the novel CVD diamond fine grinding tool, after the laser processing precision is effectively controlled, the surface roughness of the nano-scale groove side wall and the size precision of the groove width in the micron scale can be obtained, so that the processing precision is high, the surface roughness of a microstructure processed by the novel CVD diamond fine grinding tool can reach 50nm according to software simulation and experimental results, and the size deviation can be superior to 5 mu m (TC 4).
3) The invention has stronger universality. The method can be used for processing grooves of micro grinding tools with various sizes, and can realize the processing of the micro grinding tool with the grinding edge diameter of 0.1-1mm, the grinding edge length of 0.2-2mm, the coating thickness of 10-20 mu m and the grain diameter of 2-5 mu m.
Drawings
Fig. 1 is a structural view of a CVD diamond fine grinding tool according to the present invention;
FIG. 2 is a schematic diagram of the results of finite element simulation calculations for CVD diamond coating thickness;
FIG. 3 is a schematic diagram of a finite element simulation calculation result of the width of a micro-groove;
FIG. 4 is a schematic diagram of a finite element simulation calculation result of the depth of the micro-groove;
FIG. 5 is a schematic diagram of a finite element simulation calculation result of a microgroove lead angle;
FIG. 6 is a simplified schematic diagram of a CVD diamond micro-abrasive tool preparation platform; in the figure, 1 is a base, 2 is an X axis, 3 is a Y axis, 4 is a Z axis, 5 is a precision tilt table, 6 is a turntable, 7 is a fine grinding tool, and 8 is a laser head.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
With reference to fig. 1-6, the invention provides a CVD diamond fine grinding tool, which is a pen-shaped grinding tool, and the tool comprises a substrate made of YG6 hard alloy, wherein the substrate consists of a cylindrical clamping part, a conical transition part and a micro-cylindrical grinding part, and the three parts are connected in sequence; the conical transition part and the micro-cylindrical grinding part are completely covered with the CVD diamond coating so as to improve the integral strength of the grinding tool, and the micro-cylindrical grinding part comprises three types of micro-grooves, namely an A type micro-groove on the CVD diamond coating surface of the grinding tool circumferential surface, a B type micro-groove on the CVD diamond coating surface of the grinding tool circumferential surface and a C type micro-groove on the CVD diamond coating surface of the grinding tool bottom surface; the C-type micro grooves are uniformly distributed and crossed in 360 degrees by taking the center of the bottom surface as a cross point, the number of cross points formed by the C-type micro grooves, the A-type micro grooves and the B-type micro grooves on the edge of the bottom surface of the grinding tool is equal to the sum of the number of the A-type micro grooves and the number of the B-type micro grooves, and two cross points formed by each C-type micro groove are connected with the A-type micro grooves or the B-type micro grooves of the same type.
The cylindrical clamping part is determined according to actual clamping requirements, the length of the conical transition part is 2-10mm, and the taper range is 1:1-1:2; the diameter of the micro-cylindrical grinding part is 0.1-1mm, and the length of the micro-cylindrical grinding part is 0.2-2mm; the conical transition part and the micro-cylindrical grinding part are directly in circular arc transition, the radius of the transition circular arc is 0.3-0.5mm through finite element simulation, so that the strength of the tool is improved, and the comparison result of finite element simulation calculation of the transition part is shown in table 1; and calculating the thickness of the CVD diamond coating to be 10-20 mu m according to finite element simulation, wherein the CVD diamond coating is polycrystalline diamond with a regular polyhedron structure, and the grain size is 2-5 mu m.
TABLE 1 comparison of finite element simulation calculations for transition section
A-type micro grooves on the surface of the CVD diamond coating on the circumferential surface of the grinding tool are grinding fluid leading-in grooves, the section of each A-type micro groove is U-shaped, the A-type micro grooves are spiral lines, the spiral direction is opposite to the direction of a tool during grinding, the helix angle is 15-45 degrees, the spiral height is 120 percent of the grinding depth, the width of the A-type micro grooves is 15-20 mu m, and the groove depth is in the range of 5-10 mu m (smaller than the thickness of the CVD diamond coating);
depth r of A-type micro-groove A ：
Where Q is the flow, η is the fluid viscosity, L is the trench length, and Δ p is the pressure differential across the micro-trench.
The B-type micro-groove on the surface of the CVD diamond coating on the circumferential surface of the grinding tool is an abrasive dust guide-out groove, the section of the B-type micro-groove is U-shaped, the B-type micro-groove is a spiral line, the spiral direction is the same as the direction of a tool during grinding, the helix angle is 45-60 degrees, the spiral height is 120 percent of the grinding depth, the width of the B-type micro-groove is 15-20 mu m, and the groove depth is within the range of 10-15 mu m (smaller than the thickness of the CVD diamond coating);
depth r of B-type micro-groove B ：
Where ρ is the density of the solid-liquid two-phase flow, R e Is the Reynolds number of the micro-groove, tau is the shear stress between the fluid and the wall of the micro-groove, deltaF is the additional resistance of the solid-liquid two-phase flow, F m Is the resistance coefficient of the solid-liquid two-phase flow, and V is the average flow velocity in the micro-groove.
The width and depth of different A-type micro-grooves and B-type micro-grooves are simulated through finite element simulation calculation, and the results are shown in figures 3 and 4. The stress levels of different helix angles were simulated by finite element simulation calculation, and the results are shown in fig. 5.
The section of the C-type micro groove on the CVD diamond coating surface of the bottom surface of the grinding tool is U-shaped, 2-4 grooves are arranged, the width of the groove is 10-15 mu m, and the depth of the groove is within the range of 5-10 mu m (smaller than the thickness of the CVD diamond coating).
The invention provides a preparation method of a CVD diamond fine grinding tool, which comprises the following steps:
carrying out strong acid cobalt removal treatment on a conical transition part and a micro-cylindrical grinding part of a micro grinding tool substrate before CVD diamond coating, and generating polycrystalline diamond coatings with the thickness of 10-20 microns on the conical transition part and the micro-cylindrical grinding part of the micro grinding tool substrate by using a CVD chemical vapor deposition method; thickness deviation is less than 10% of thickness;
horizontally mounting a micro-grinding tool to be processed on a rotary table, fixing the rotary table on a vertically-placed precise inclined table, vertically mounting a laser head of a laser, adjusting the relative position of the laser head to enable a laser focus to be focused on the outer circle surface of the micro-grinding tool, adjusting the spatial position of the laser and the micro-grinding tool to enable the axes of the laser and the micro-grinding tool to be perpendicular to each other, and changing the angle between the rotary table and the inclined table; as shown in fig. 6;
thirdly, the rotating micro-fine grinding tool makes relative motion with a vertically installed laser head according to a reciprocating linear motion track in the horizontal and vertical directions, and the laser head is utilized to machine the micro-groove on the surface of the outer circle of the micro-fine grinding tool according to the width and the angle of the micro-groove to be machined;
and step four, adjusting the micro grinding tool to be in a vertical state, and processing a micro groove on the bottom surface of the micro grinding tool by using a laser.
And the rotating speed of the fine grinding tool in the step two is 0.15rpm-0.5rpm.
The laser in the second step is a picosecond laser, the power is 0.3-1.3w, the repetition frequency is 5kHz, the pulse width is 15-200ps, the laser wavelength is 532nm, positive defocusing processing is adopted, and the defocusing amount is 0-0.8mm.
In the third step, the first step is carried out,
according to the determined depth r of the A-type or B-type micro-groove AB Determining the defocusing amount Z:
Wherein, ω is 0 The diameter of the laser spot at the narrowest part of the beam, Z R Is the rayleigh length of the laser;
according to the determined width d of the A-type or B-type micro-groove AB Determining the width direction of the micro-groove during laser processingThe feed amount of (c):
then determining the length of the spiral line and the transverse feeding length, wherein the length of the spiral line and the transverse feeding length can be determined according to the longitudinal processing length, namely the length of the micro-cylindrical grinding part of the micro-grinding tool;
transverse feed length L:
wherein H is the length of the micro-cylindrical grinding part of the micro-grinding tool to be processed, namely the longitudinal feeding length; alpha is a helix lead angle;
processing the length l of the groove:
in order to ensure the surface roughness and precision of the processed micro-groove, an included angle between the precise inclined table and the vertical direction is set to be an angle alpha which is the same as the helix lead angle;
the transverse feeding speed of the micro grinding tool is 0.05-0.2mm/min, and the longitudinal feeding speed is 0.05-0.2mm/min;
adjust the distance between laser head and the fine grinding tool, at the fine grinding tool excircle surface at every turn the little groove of fixed angle processing of rotation, angle theta:
wherein n is the number of micro grooves of the micro cylindrical grinding part.
In the fourth step of the method, the first step of the method,
width d of micro groove at bottom of micro grinding tool C ：
Depth h of micro groove at bottom of micro grinding tool C
h C ＝kNln(I 0 /I th )
Wherein k represents the optical penetration depth coefficient of the material, N represents the number of effective pulses, I 0 Represents the laser energy density, I th Representing the ablation threshold.
The CVD diamond fine grinding tool and the method for manufacturing the same proposed by the present invention are described in detail above, and the principle and the embodiment of the present invention are explained herein by using specific examples, and the description of the above examples is only for helping to understand the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. A CVD diamond fine grinding tool is characterized in that: the CVD diamond micro-fine grinding tool is a pen-shaped grinding tool, the tool comprises a substrate, the substrate consists of a cylindrical clamping part, a conical transition part and a micro-cylindrical grinding part, and the three parts are connected in sequence; the conical transition part and the micro-cylindrical grinding part are completely covered with the CVD diamond coating, and the micro-cylindrical grinding part comprises three types of micro-grooves, namely an A type micro-groove on the surface of the CVD diamond coating on the circumferential surface of the grinding tool, a B type micro-groove on the surface of the CVD diamond coating on the circumferential surface of the grinding tool and a C type micro-groove on the surface of the CVD diamond coating on the bottom surface of the grinding tool; the C-type micro grooves are uniformly distributed and crossed in 360 degrees by taking the center of the bottom surface as a cross point, the number of cross points formed by the C-type micro grooves, the A-type micro grooves and the B-type micro grooves on the edge of the bottom surface of the grinding tool is equal to the sum of the number of the A-type micro grooves and the number of the B-type micro grooves, and two cross points formed by each C-type micro groove are connected with the A-type micro grooves or the B-type micro grooves of the same type;
a-type micro grooves on the surface of the CVD diamond coating on the circumferential surface of the grinding tool are grinding fluid leading-in grooves, the section of each A-type micro groove is U-shaped, the A-type micro grooves are spiral lines, the spiral direction is opposite to the direction of a tool during grinding, the helix angle is 15-45 degrees, the spiral height is 120 percent of the grinding depth, the width of the A-type micro grooves is 15-20 mu m, and the groove depth is 5-10 mu m;
depth r of A-type micro-groove A ：
Wherein Q is the flow, η is the fluid viscosity, l is the length of the groove, and Δ p is the pressure difference across the micro-groove.
2. The grinding tool of claim 1 wherein: the cylindrical clamping part is determined according to actual clamping requirements, the length of the conical transition part is 2-10mm, and the taper range is 1:1-1:2; the diameter of the micro-cylindrical grinding part is 0.1-1mm, and the length of the micro-cylindrical grinding part is 0.2-2mm; the conical transition part and the micro-cylindrical grinding part are in arc transition directly, and the radius of the transition arc is 0.3-0.5mm; the thickness of the CVD diamond coating is 10-20 mu m, the CVD diamond coating is polycrystalline diamond with a regular polyhedron structure, and the grain size is 2-5 mu m.
3. The grinding tool of claim 1 wherein: the B-type micro-grooves on the surface of the CVD diamond coating on the circumferential surface of the grinding tool are abrasive dust guide grooves, the section of each B-type micro-groove is U-shaped, the B-type micro-grooves are spiral lines, the spiral direction is the same as the direction of a tool during grinding, the helix angle is 45-60 degrees, the spiral height is 120% of the grinding depth, the width of the B-type micro-grooves is 15-20 mu m, and the depth of the grooves is within the range of 10-15 mu m;
depth r of B-type micro-groove B ：
Where ρ is the density of the solid-liquid two-phase flow, R e Is the Reynolds number of the micro-groove, tau is the shear stress between the fluid and the wall of the micro-groove, deltaF is the additional resistance of the solid-liquid two-phase flow, F m Is the resistance coefficient of the solid-liquid two-phase flow, and V is the average flow velocity in the micro-groove.
4. The grinding tool of claim 1 wherein: the section of the C-type micro groove on the CVD diamond coating surface of the bottom surface of the grinding tool is U-shaped, 2-4 grooves are arranged, the width of the groove is 10-15 mu m, and the depth of the groove is in the range of 5-10 mu m.
5. A preparation method of a CVD diamond fine grinding tool is characterized by comprising the following steps: the preparation method specifically comprises the following steps:
carrying out strong acid cobalt removal treatment on a conical transition part and a micro-cylindrical grinding part of a micro grinding tool substrate before CVD diamond coating, and generating polycrystalline diamond coatings with the thickness of 10-20 microns on the conical transition part and the micro-cylindrical grinding part of the micro grinding tool substrate by using a CVD chemical vapor deposition method;
horizontally mounting a micro-fine grinding tool to be processed on a rotary table, fixing the rotary table on a vertically-placed precise inclined table, vertically mounting a laser head of a laser, adjusting the relative position of the laser head to enable a laser focus to be focused on the outer circle surface of the micro-fine grinding tool, adjusting the spatial position of the laser and the micro-fine grinding tool to enable the axes of the laser and the micro-fine grinding tool to be perpendicular to each other, and enabling the angle between the rotary table and the inclined table to be changed;
thirdly, the rotating micro-fine grinding tool makes relative motion with a vertically installed laser head according to a reciprocating linear motion track in the horizontal and vertical directions, and the laser head is utilized to machine the micro-groove on the surface of the outer circle of the micro-fine grinding tool according to the width and the angle of the micro-groove to be machined;
step four, adjusting the micro grinding tool to be in a vertical state, and processing a micro groove on the bottom surface of the micro grinding tool by using a laser;
in the third step, the first step is carried out,
according to the determined depth r of the A-type or B-type micro-groove AB Determining the defocusing amount Z:
Wherein, ω is 0 The diameter of the laser spot at the narrowest part of the beam, Z R Is the rayleigh length of the laser;
according to the determined width d of the A-type or B-type micro-groove AB Determining the feeding amount R in the width direction of the micro-groove during the laser processing:
then determining the length of the spiral line and the transverse feeding length, wherein the length of the spiral line and the transverse feeding length can be determined according to the longitudinal processing length, namely the length of the micro-cylindrical grinding part of the micro-grinding tool;
transverse feed length L:
wherein H is the length of the micro-cylindrical grinding part of the micro-grinding tool to be processed, namely the longitudinal feeding length; alpha is a helix lead angle;
processing the length l of the groove:
in order to ensure the surface roughness and precision of the processed micro-groove, an included angle between the precise inclined table and the vertical direction is set to be an angle alpha which is the same as the helix lead angle;
the transverse feeding speed of the micro grinding tool is 0.05-0.2mm/min, and the longitudinal feeding speed is 0.05-0.2mm/min;
adjust the distance between laser head and the fine grinding tool, at the fine grinding tool excircle surface at every turn the little groove of fixed angle processing of rotation, angle theta:
wherein n is the number of micro grooves of the micro cylindrical grinding part.
6. The method of claim 5, wherein: and the rotating speed of the fine grinding tool in the step two is 0.15rpm-0.5rpm.
7. The production method according to claim 5, characterized in that: the laser in the second step is a picosecond laser, the power is 0.3-1.3w, the repetition frequency is 5kHz, the pulse width is 15-200ps, the laser wavelength is 532nm, positive defocusing processing is adopted, and the defocusing amount is 0-0.8mm.
8. The method of claim 5, wherein: in the fourth step of the method, the first step of the method,
width d of micro-groove at bottom of micro-fine grinding tool C ：
Depth h of micro groove at bottom of micro grinding tool C
h C ＝kNln(I 0 /I th )
Wherein k represents the optical penetration depth coefficient of the material, N represents the number of effective pulses, I 0 Represents the laser energy density, I th Representing the ablation threshold.
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| CN114778699A (en) * | 2022-03-29 | 2022-07-22 | 哈尔滨工业大学 | Micro-grinding online nondestructive monitoring method based on acoustic emission technology |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000354969A (en) * | 1999-06-15 | 2000-12-26 | Katagiri Seisakusho:Kk | Super abrasive grain grinding wheel |
| JP2002066933A (en) * | 2000-08-28 | 2002-03-05 | Okamoto Machine Tool Works Ltd | Grinding wheel for grooving, method of manufacturing the same and method of grinding workpiece |
| JP3161422U (en) * | 2010-05-19 | 2010-07-29 | 有限会社三井刻印 | Grinding tool |
| CN103707206A (en) * | 2013-02-24 | 2014-04-09 | 长沙理工大学 | Spiral grinding wheel with composite material fiber micro blade |
| CN204076043U (en) * | 2014-08-13 | 2015-01-07 | 济南金麒麟刹车系统有限公司 | A kind of automobile brake sheet high-speed, high precision rough grinding wheel |
| JP2015085419A (en) * | 2013-10-29 | 2015-05-07 | 株式会社タテノ | Lapping reamer and manufacturing method of lapping reamer |
| CN109333385A (en) * | 2018-11-15 | 2019-02-15 | 哈尔滨工业大学 | A kind of skive and preparation method thereof with micro-structure |
| CN213381084U (en) * | 2020-09-30 | 2021-06-08 | 河南正鑫钻石科技有限公司 | Grinding wheel is stabilized to easy chip removal |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108747822A (en) * | 2018-06-04 | 2018-11-06 | 哈尔滨工业大学 | A kind of preparation method of novel diamond wheel and the efficient ultraprecise processing method of micro structure array |
-
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000354969A (en) * | 1999-06-15 | 2000-12-26 | Katagiri Seisakusho:Kk | Super abrasive grain grinding wheel |
| JP2002066933A (en) * | 2000-08-28 | 2002-03-05 | Okamoto Machine Tool Works Ltd | Grinding wheel for grooving, method of manufacturing the same and method of grinding workpiece |
| JP3161422U (en) * | 2010-05-19 | 2010-07-29 | 有限会社三井刻印 | Grinding tool |
| CN103707206A (en) * | 2013-02-24 | 2014-04-09 | 长沙理工大学 | Spiral grinding wheel with composite material fiber micro blade |
| JP2015085419A (en) * | 2013-10-29 | 2015-05-07 | 株式会社タテノ | Lapping reamer and manufacturing method of lapping reamer |
| CN204076043U (en) * | 2014-08-13 | 2015-01-07 | 济南金麒麟刹车系统有限公司 | A kind of automobile brake sheet high-speed, high precision rough grinding wheel |
| CN109333385A (en) * | 2018-11-15 | 2019-02-15 | 哈尔滨工业大学 | A kind of skive and preparation method thereof with micro-structure |
| CN213381084U (en) * | 2020-09-30 | 2021-06-08 | 河南正鑫钻石科技有限公司 | Grinding wheel is stabilized to easy chip removal |
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