CN114141932B - A substrate assembly - Google Patents
A substrate assembly Download PDFInfo
- Publication number
- CN114141932B CN114141932B CN202111652677.XA CN202111652677A CN114141932B CN 114141932 B CN114141932 B CN 114141932B CN 202111652677 A CN202111652677 A CN 202111652677A CN 114141932 B CN114141932 B CN 114141932B
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipation
- substrate
- heat
- substrate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 143
- 230000017525 heat dissipation Effects 0.000 claims abstract description 142
- 239000011810 insulating material Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 220
- 239000012790 adhesive layer Substances 0.000 description 27
- 238000004806 packaging method and process Methods 0.000 description 23
- 239000000047 product Substances 0.000 description 23
- 238000005538 encapsulation Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a substrate assembly, which further comprises a first heat dissipation layer arranged on the back surface of the substrate main body, wherein the first heat dissipation layer is made of an insulating material and covers the positive electrode circuit layer and the negative electrode circuit layer. Through setting up first heat dissipation layer at the base plate main part back and covering each positive pole circuit layer and negative pole circuit layer, first heat dissipation layer is insulating material, can avoid positive pole circuit layer and negative pole circuit layer short circuit, can form the protection to positive pole circuit layer and negative pole circuit layer again, promotes its reliability, simultaneously can be with the heat transfer to positive pole circuit layer with the heat of negative pole circuit layer is outwards dissipated through first heat dissipation layer is quick, can further promote radiating efficiency.
Description
Technical Field
The invention relates to the field of display, in particular to a substrate assembly.
Background
The Micro LED technology and the Mini LED technology can support higher brightness, high dynamic range and wide color gamut with ultrahigh display quality and stability, and have low power consumption and energy conservation, so that the Micro LED technology and the Mini LED technology are widely applied to mobile phones, pens, TVs, vehicle-mounted display screens, indoor lectures, outdoor large-scale display screens and the like, and attach importance to various manufacturers and researchers, and are put into research and development in a dispute.
However, for the current products, a mode of arranging the circuit layer on the front surface of the substrate is basically adopted, and the main heat dissipation way is to dissipate heat from the front packaging adhesive layer, so that the problem of poor combination of the circuit layer and the packaging adhesive layer on the surface layer and poor heat dissipation are caused, a large amount of heat generated by the LED chip cannot be effectively dissipated, and the service life and quality of the products are affected. Therefore, how to effectively dissipate heat of the product and improve the bonding property between the product and the packaging adhesive layer is a problem to be solved.
Disclosure of Invention
In view of the above-mentioned drawbacks of the related art, an objective of the present invention is to provide a substrate assembly, which is designed to solve the problem of how to effectively dissipate heat of a product and how to improve the bonding property between the product and a packaging adhesive layer in the existing packaging product.
In order to solve the above technical problems, the present invention provides a substrate assembly for a display module, including:
A substrate body, the substrate body being an insulating substrate body;
A plurality of bonding pad groups arranged on the front surface of the substrate main body, wherein one bonding pad group comprises two bonding pads respectively corresponding to the positive electrode and the negative electrode of the LED chip;
a positive electrode wiring layer and a negative electrode wiring layer provided on the back surface of the substrate main body;
the first through holes are formed in the substrate main body, and the conductive pieces are arranged in the first through holes, and two bonding pads in the bonding pad group are respectively and electrically connected with the positive electrode circuit layer and the negative electrode circuit layer through the corresponding conductive pieces;
And a first heat conductive layer provided on the front surface of the substrate body, the first heat conductive layer having an opening for exposing the pad group and being insulated from the pads in the pad group.
It should be noted that, in the substrate assembly provided by the invention, each bonding pad on the front surface of the substrate main body corresponds to one first through hole, the front surface of the substrate main body is changed into the back surface of the substrate main body from the conventional one, and the bonding pad on the front surface is electrically connected with the corresponding positive electrode line layer and negative electrode line layer on the back surface through the conductive member of the first through hole. Therefore, part of heat in the heat generated during the working of the LED chip can be directly transferred to the first through hole and the conductive piece through the bonding pad, and part of heat can be quickly transferred to the first through hole and the conductive piece through the first heat conduction layer and is quickly transferred to the back of the substrate main body through the first through hole and the conductive piece to be emitted, so that the heat dissipation efficiency of the LED chip can be improved on one hand, and on the other hand, the situation that the combination of the packaging adhesive layer and the substrate main body is reduced due to the fact that most of the heat generated during the working of the LED chip is emitted from the front of the substrate main body is avoided. Therefore, the problems of poor heat dissipation and poor combination of the substrate and the packaging adhesive layer in the existing packaging product are solved, the combination of the substrate main body and the packaging adhesive layer is improved, the heat dissipation efficiency and the heat dissipation effect are improved, and meanwhile, the quality and the service life of the product are improved.
In some embodiments, the substrate assembly further includes a first heat dissipation layer disposed on a back surface of the substrate body, the first heat dissipation layer is made of an insulating material, and the first heat dissipation layer covers the positive electrode circuit layer and the negative electrode circuit layer. Through setting up first heat dissipation layer at the base plate main part back and covering each positive pole circuit layer and negative pole circuit layer, first heat dissipation layer is insulating material, can avoid positive pole circuit layer and negative pole circuit layer short circuit, can form the protection to positive pole circuit layer and negative pole circuit layer again, promotes its reliability, simultaneously can be with the heat transfer to positive pole circuit layer with the heat of negative pole circuit layer is outwards dissipated through first heat dissipation layer is quick, can further promote radiating efficiency.
In some embodiments, the substrate assembly further includes a second heat dissipation layer disposed on the back surface of the substrate body and covering the first heat dissipation layer, wherein a thermal conductivity of the second heat dissipation layer is greater than a thermal conductivity of the first heat dissipation layer. The second heat dissipation layer with larger heat conductivity is covered on the first heat dissipation layer, so that the second heat dissipation layer with better heat dissipation performance can further conduct rapid and effective heat dissipation, and the heat dissipation efficiency is further improved.
In some embodiments, a region of the back surface of the substrate body between the positive electrode line layer and the negative electrode line layer is exposed to the first heat dissipation layer and covered by the second heat dissipation layer. The heat transferred to the back of the substrate main body in the area between the positive electrode circuit layer and the negative electrode circuit layer can be directly transferred to the second heat dissipation layer, the heat is rapidly emitted outwards through the second heat dissipation layer, and the second heat dissipation layer can form protection on the area coverage, so that the reliability of a product is further improved.
In some embodiments, the substrate assembly further includes a plurality of second through holes penetrating the substrate body, one second through hole being located between two of the bonding pads in one of the bonding pad groups and communicating the corresponding LED chip with the second heat dissipation layer. Therefore, heat between two bonding pads transferred to the bottom of the LED chip during operation can be quickly transferred to the second heat conduction layer through the second through holes, and the heat dissipation efficiency of the LED chip is further improved through the quick outward dissipation of the second heat dissipation layer.
In some embodiments, the substrate assembly further includes a heat conducting member disposed in the second through hole, the heat conducting member contacts the second heat dissipation layer, and heat between two bonding pads transferred to the bottom of the LED chip during operation is transferred to the second heat conduction layer more rapidly through the heat conducting member in the second through hole, so that heat dissipation efficiency of the LED chip is further improved.
In some embodiments, the first heat conducting layer includes an insulating layer and a metal layer covering the insulating layer, where the insulating layer is flush with or higher than the adjacent bonding pad, so as to ensure that the metal layer covering the insulating layer is isolated from the bonding pad in an insulating manner, and one surface of the metal layer, far away from the front surface of the substrate main body, is a mirror surface, so that light rays on the front surface of the substrate main body, where the LED chip is arranged, are reflected better, and the light-emitting efficiency is improved, so that the display brightness and the display effect of the LED chip are improved.
In some embodiments, the size of the opening is greater than the size of the LED chip. When the packaging adhesive layer is arranged on the front surface of the substrate main body in the follow-up mode, the colloid of the packaging adhesive layer can permeate into a gap between the LED chip and the first heat conduction layer, and the bonding strength of the packaging adhesive layer can be improved.
In some embodiments, a distance between the set of pads closest to an edge of the front side of the substrate body and the edge of the front side of the substrate body is less than or equal to one-half a pitch between adjacent sets of pads. Therefore, when the display module manufactured by the substrate assembly is required to be spliced, the distance between two adjacent rows of LED chips at the splicing position of the substrate main bodies of the two substrate assemblies is basically consistent with the distance between two adjacent rows of LEDs in other areas, so that dark marks with brightness lower than that of other areas are prevented from occurring at the splicing position, and the display effect is further improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a substrate assembly according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of another substrate assembly according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a substrate assembly according to a first embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure of a first heat conductive layer according to a first embodiment of the present invention;
Fig. 5 is a schematic cross-sectional structure of another first heat conductive layer according to the first embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of another bonding pad according to a first embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a substrate assembly according to a first embodiment of the present invention;
Fig. 8 is a schematic cross-sectional structure of a display module according to a second embodiment of the invention;
Fig. 9 is a schematic cross-sectional structure of a display module according to a third embodiment of the invention.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
How to effectively dissipate heat of the product in the existing packaging product and improve the combination of the product and the packaging adhesive layer are problems to be solved urgently.
Based on this, the present invention is intended to provide a solution to the above technical problem, the details of which will be described in the following examples.
Embodiment one:
In order to solve the problem of poor heat dissipation in the conventional package product and poor bonding property with the package adhesive layer, the present embodiment provides a substrate assembly, for example, as shown in fig. 1, which is a schematic cross-sectional structure of the substrate assembly. The substrate assembly of the embodiment comprises a substrate body 1, a light-emitting area 2 arranged on the front surface of the substrate body 1, a plurality of bonding pad groups 3 arranged in the light-emitting area 2, and one bonding pad group 3 comprising two bonding pads 4 respectively corresponding to the positive electrode and the negative electrode of the LED chip. The substrate assembly further comprises a circuit layer 5 arranged on the back surface of the substrate main body 1, a plurality of positive electrode circuit layers 6 and negative electrode circuit layers 7 are arranged in the areas of the circuit layer 5 corresponding to the light-emitting areas 2, and a pair of positive electrode circuit layers 6 and negative electrode circuit layers 7 correspond to two bonding pads 4 in one bonding pad group 3. In this embodiment, the substrate assembly further includes a plurality of first through holes 8 disposed on the substrate body 1 and conductive members (not shown in the drawings) disposed in the first through holes 8, one first through hole 8 communicates one bonding pad 4 with the positive electrode circuit layer 6 or the negative electrode circuit layer 7 corresponding to the bonding pad 4, and the bonding pad 4 is electrically connected with the corresponding positive electrode circuit layer 6 or negative electrode circuit layer 7 through the conductive members in the first through holes 8. Therefore, heat generated during the operation of the LED chip can be transferred to the bonding pad 4 connected with the electrode through the electrode, and is transferred to the first through hole 8 and the conductive piece in the first through hole 8 through the bonding pad 4, and then is transferred to the back of the substrate main body 1 through the conductive piece, and is dispersed from the back of the substrate main body, see the L1 heat dissipation path in FIG. 1, so that on one hand, the heat dissipation efficiency of the LED chip can be improved, and on the other hand, the problem that the heat generated during the operation of the LED chip is concentrated and dispersed from the front of the substrate main body to reduce the bonding property of the packaging adhesive layer and the substrate main body is avoided. Therefore, the problem of poor heat dissipation in the existing packaging product and poor combination of the substrate and the packaging adhesive layer are solved, and the quality and the service life of the product are improved.
It should be understood that the substrate body 1 in this embodiment may be made of various insulating materials, for example, but not limited to, a glass substrate, a ceramic substrate, a plastic substrate, etc. The conductive member in this embodiment may be, but not limited to, a conductive layer disposed on a sidewall of the first through hole 8, or may be a conductive column disposed in the first through hole 8 and filled with the first through hole 8, and the conductive layer and the conductive column in this embodiment may be made of metal, for example, may include, but not limited to, at least one of gold, silver, copper, iron, and aluminum, and the metal material has good electrical conductivity and good thermal conductivity, so that the heat dissipation efficiency can be further improved while the bonding pad 4 is electrically connected with the positive electrode circuit layer 6 or the negative electrode circuit layer 7. Of course, in this embodiment, the conductive layer or the conductive post may be replaced by a conductive adhesive with better heat conductivity, which is not described herein.
In some embodiments, for example, as shown in fig. 2, the cross-sectional structure of another substrate assembly is shown, and the substrate assembly further includes a first heat dissipation layer 10 disposed on the back surface of the substrate body 1, where the first heat dissipation layer 10 is made of an insulating material and covers each of the positive electrode circuit layer 6 or the negative electrode circuit layer 7. It should be noted that, the first heat dissipation layer 10 is made of an insulating material, so that the short circuit of the positive electrode circuit layer 6 or the negative electrode circuit layer 7 can be avoided, and the protective performance of the positive electrode circuit layer 6 or the negative electrode circuit layer 7 can be improved by covering the positive electrode circuit layer 6 or the negative electrode circuit layer 7 to protect the positive electrode circuit layer 6 or the negative electrode circuit layer 7. Meanwhile, heat transferred to the positive electrode circuit layer 6 or the negative electrode circuit layer 7 through the first through hole 8 and the conductive piece therein can be rapidly dissipated through the first heat dissipation layer 10, so that the heat dissipation efficiency is further improved. In some examples, it should be understood that the first heat dissipation layer 10 in this embodiment may be made of various insulating materials with better thermal conductivity, for example, the first heat dissipation layer 10 may be an inorganic layer with better heat dissipation performance, and the thickness may be, but is not limited to, 5um-10um. The arrangement of the first heat dissipation layer 10 in this embodiment may include, but is not limited to, arrangement by molding or hot pressing, and those skilled in the art may perform the arrangement according to actual situations and requirements, which is not limited in this embodiment. And it should be understood that in the present embodiment, the first heat dissipation layer 10 may be provided on the back surface of the substrate body 1, covering only the positive electrode wiring layer 6 and the negative electrode wiring layer 7, and the region of the back surface of the substrate body 1 between the positive electrode wiring layer 6 and the negative electrode wiring layer 7 is exposed to the first heat dissipation layer 10, for example, see the example shown in fig. 2. In other application scenarios of this embodiment, the first heat dissipation layer 10 may also be disposed on the back surface of the substrate body 1, so that all or a part of other areas except the positive electrode circuit layer 6 and the negative electrode circuit layer 7, and the positive electrode circuit layer 6 and the negative electrode circuit layer 7 are covered, which may be specifically and flexibly set according to application requirements, and will not be described in detail herein.
In some embodiments, referring to fig. 3, to further improve the heat dissipation efficiency, the substrate assembly further includes a second heat dissipation layer 11 disposed on the back surface of the substrate body 1 and covering the first heat dissipation layer 10, and the heat conduction efficiency of the second heat dissipation layer 11 is higher than that of the first heat dissipation layer 10. In this example, the second heat dissipation layer 11 with a larger heat conductivity is covered on the first heat dissipation layer 10, so that the heat dissipation speed is further increased through the second heat dissipation layer 11 with a better heat dissipation performance, so as to further increase the heat dissipation efficiency.
And it should be understood that in the present embodiment, the second heat dissipation layer 11 may be disposed on the back surface of the substrate body 1, covering only the first heat dissipation layer 10, and the area of the back surface of the substrate body 1 outside the first heat dissipation layer 10 is exposed to the second heat dissipation layer 11. In other application scenarios of the present embodiment, the second heat dissipation layer 11 may also be disposed on the back surface of the substrate main body 1, so that all other areas or a part of the areas except the first heat dissipation layer 10 and the positive electrode first heat dissipation layer 10 are covered, and therefore, the heat in the areas is directly transferred to the second heat dissipation layer 11, and is rapidly dissipated outwards through the second heat dissipation layer 11, so as to further improve the heat dissipation efficiency. For example, referring to fig. 3, in the present example, a region S1 of the back surface of the substrate body 1 between the positive electrode wiring layer 6 and the negative electrode wiring layer 7 is exposed to the first heat dissipation layer 10 and is covered with the second heat dissipation layer 11. The heat thus transferred to the region S1 of the back surface of the substrate body 1 between the positive electrode wiring layer 6 and the negative electrode wiring layer 7 can be directly transferred to the second heat dissipation layer 11. In this example, the area S2 between the adjacent pairs of the positive electrode circuit layer 6 and the negative electrode circuit layer 7 is also exposed out of the first heat dissipation layer 10 and covered by the second heat dissipation layer 11, so that the heat transferred to the areas S1 and S2 is rapidly dissipated outwards through the second heat dissipation layer 11, and the area coverage of the second heat dissipation layer 11 can form protection, so that the reliability of the product is further improved. It should be noted that, the arrangement manner of the second heat dissipation layer 11 may include, but is not limited to, arrangement by molding, hot pressing, etc., so long as it can be correctly arranged, and those skilled in the art can perform arrangement according to actual situations and requirements, and the present embodiment is not limited thereto. In order to realize rapid and effective heat dissipation, in practical application, the thermal conductivity of the second heat dissipation layer 11 needs to be better than that of the first heat dissipation layer 10, and is better, the first heat dissipation layer 10 may include, but is not limited to, inorganic insulating materials such as plastics and plastics, and the second heat dissipation layer 11 may include, but is not limited to, materials such as graphite or graphene, and the graphite or graphene has good thermal conductivity and high universality, and can further improve heat dissipation efficiency.
In this embodiment, in addition to the heat dissipation path L1 for dissipating heat to the back surface of the substrate main body shown in the above examples, in order to further improve the heat dissipation efficiency and the heat dissipation effect, the present embodiment may further increase the heat dissipation path for dissipating heat to the back surface of the substrate main body on the basis of this. Referring to fig. 4, for example, the substrate assembly further includes a first heat conductive layer 12 disposed on the front surface of the substrate body 1, the first heat conductive layer 12 having an opening for exposing the pad group 3 and being insulated from the pads 4 within the pad group 3. It is also understood that the first heat conductive layer 12 is disposed on the front surface of the substrate body 1 in the region between the adjacent pad groups 3. In this embodiment, the manner of insulating and isolating the first heat conductive layer 12 from the bonding pads 4 in the adjacent bonding pad group 3 may include, but is not limited to, not contacting the bonding pads 4, or the area where the first heat conductive layer 12 contacts the bonding pads 4 is provided with an insulating material. It should be noted that, the first heat conducting layer 12 may be disposed by, but not limited to, molding, etching, etc., so long as it can be properly disposed, and those skilled in the art can perform the disposing according to the actual situation and requirements, which is not limited in this embodiment. In this example, the first heat conductive layer 12 and the pads 4 within the adjacent pad group 3 are not in contact with each other, so that the first heat conductive layer 12 is insulated from the pads 4. As shown in fig. 5, for example, the cross-sectional structure of the first heat conducting layer 12 includes an insulating layer 121 disposed on the front surface of the substrate body 1, and a metal layer 122 disposed on the insulating layer 121, where the insulating layer 121 is flush with or higher than the bonding pad 4 in the bonding pad group 3 adjacent to the insulating layer 121 on the front surface of the substrate body 1, so as to ensure that the metal layer 122 disposed on the insulating layer 121 is insulated from the bonding pad 4. It should be noted that, the insulating layer 121 may be disposed by, but not limited to, molding, hot pressing, etc., and those skilled in the art may be disposed according to actual situations and requirements, which is not limited in this embodiment. It should be noted that, the insulating layer 121 may include, but is not limited to, inorganic insulating materials such as PI, low-reflectivity ink, etc., and in practical applications, the thickness of the insulating layer 121 may be set to 1-5um. It should be noted that, no matter what material the insulating layer 121 is made of, it cannot cover or pollute the bonding pad 4, so that the problem that the insulating layer covers the bonding pad 4 and then the LED chip cannot be normally mounted or the mounted LED chip has poor contact is avoided.
It should be noted that the pads 4 in this embodiment may include, but are not limited to, being provided embedded within the substrate body 1 and being provided flush with the front surface of the substrate body 1, for example as shown in fig. 5. For example, as shown in fig. 6, a schematic cross-sectional structure of another pad may be provided, where a part of the area of the pad 4 is higher than the front surface of the substrate body 1, and of course, the pad 4 may be all higher than the front surface of the substrate body 1, and a specific setting manner may be set by a person skilled in the art according to actual situations and requirements.
In this embodiment, by the arrangement of the first heat conducting layer 12, the heat generated by the LED chip can be transferred from the lateral direction of the LED chip to the first heat conducting layer 12, and transferred to the bonding pad 4 adjacent thereto by the first heat conducting layer, and then transferred to the corresponding first through hole 8 and the conductive piece in the first through hole 8 by the bonding pad 4, and then transferred to the circuit layer and the first heat dissipation layer 10 on the back of the corresponding substrate main body 1 by the through hole 8 and the conductive piece in the first through hole 8, and dissipated outwards by the second heat dissipation layer 11, and the heat dissipation path is shown in L2 in fig. 4 to 6.
In the examples shown in fig. 5 and 6, the side of the metal layer 122 away from the front surface of the substrate body 1 may be provided as a mirror surface, and in some examples, the metal layer 122 may include, but is not limited to, a bright nickel layer, the thickness of which may be set to 10um-20um, and the reflective efficiency may be further improved by providing the bright nickel layer as a mirror surface on the side thereof away from the front surface of the substrate body 1 due to the high reflectivity, thereby further improving the brightness and display effect thereof. It should be noted that, no matter what material the metal layer is, it cannot cover or contaminate the pad 4, so as to avoid the problems of short circuit and the like caused by the metal layer. In this embodiment, the surface of the metal layer 122 away from the front surface of the substrate body 1 may be a rough surface or a concave-convex surface, so as to further enrich the angle of the reflected light.
When the LED chip is in operation, heat generated by the LED chip is mainly concentrated in a projection area of the LED chip on the front surface of the substrate body 1. Therefore, in order to further improve the heat dissipation efficiency of the LED chip, referring to fig. 7, the substrate assembly further includes a plurality of second through holes 14 penetrating through the substrate body 1, wherein the second through holes 14 are located between the two bonding pads 4 in one bonding pad group 3, that is, the second through holes 14 are located below the LED chip 15, and communicate the corresponding LED chip with the second heat dissipation layer 11. Thus, heat transferred to the bottom of the LED chip during operation can be quickly transferred to the second heat conduction layer 11 through the second through holes 14, and can be quickly and outwards emitted through the second heat dissipation layer 11, so that the heat dissipation efficiency of the LED chip is further improved. The problem of poor bonding property of the packaging adhesive layer caused by heat aggregation can be further avoided.
Optionally, the substrate assembly further includes a heat conducting member (not shown in the figure) with better heat conducting performance disposed in the second through hole 14, and the heat conducting member 14 contacts the second heat dissipation layer 11, so that the heat transferred between the two bonding pads at the bottom of the LED chip during operation is more quickly transferred to the second heat dissipation layer through the heat conducting member in the second through hole 8, as shown in L3 in fig. 7, so as to further improve the heat dissipation efficiency of the LED chip. In this embodiment, the heat conducting member may be, but is not limited to, a second heat conducting layer disposed in the second through hole 8 and surrounding the inner wall thereof, and a heat conducting post filled in the second through hole 8 may be disposed at two ends of the heat conducting member, where the second heat dissipating layer 11 and the LED chip may be respectively contacted, and of course, the second heat conducting layer or the heat conducting post may be only contacted with the second heat dissipating layer and not contacted with the LED chip. The diameter of the heat conducting post may be the same as that of the second through hole 14, or may be smaller than that of the second through hole 14, and the specific setting mode may be set by those skilled in the art according to actual situations and requirements, which is not limited in this embodiment.
In some examples of the present embodiment, the size of the opening C shown in fig. 4 to 7 may be set to be larger than the size of the LED chip. When the packaging adhesive layer is arranged on the front surface of the substrate main body 1, the adhesive of the packaging adhesive layer can permeate into the gap between the LED chip and the first heat conduction layer 12, so that the bonding strength of the packaging adhesive layer can be further improved.
In still other examples of the present embodiment, referring to fig. 7, the distance h1 between the pad group 3 closest to the edge of the front surface of the substrate body 1 and the edge of the front surface of the substrate body 1 is equal to or less than half the pitch h2 between adjacent pad groups 3. Therefore, when the display module manufactured by the substrate assembly in the embodiment is required to be spliced, the distance between two adjacent rows of LED chips at the splicing position of the substrate main bodies of the two substrate assemblies is basically consistent with the distance between two adjacent rows of LEDs in other areas, so that dark marks with brightness lower than that of other areas are prevented from occurring at the splicing position, and the display effect is further improved.
It can be seen that, the substrate assembly provided in this embodiment is through setting up first through-hole and second through-hole on the substrate main part, the both ends of first through-hole respectively with pad and circuit layer contact, the second through-hole respectively with LED chip and second heat dissipation layer intercommunication, and set up first heat dissipation layer and second heat dissipation layer in the back of substrate main part, so that the heat around the pad and the heat around the LED chip can dispel the heat through first through-hole and second through-hole fast effectual, the radiating efficiency of it has been improved, the problem that it leads to poor with the packaging glue layer associativity because of the heat gathering has also been solved simultaneously, and set up insulating layer and first heat conduction layer in the front of substrate main part, further improved its radiating efficiency and the associativity with the packaging glue layer, and still promoted its reflection efficiency, the display brightness and the display effect of product have been improved, thereby the quality of product, life-span and user use satisfaction have further promoted.
Example two
The present embodiment provides a display module, for example, as shown in fig. 8, which is a schematic cross-sectional structure of the display module. Wherein the encapsulation glue layer is transparent in order to more clearly show the structure of the display screen.
In some embodiments, the display module includes the LED chip 15 and the substrate assembly described above, it should be noted that the display module further includes the encapsulation adhesive layer 16, for example, as shown in fig. 8, where the encapsulation adhesive layer 16 is disposed on the front surface of the substrate body 1 and covers the LED chip 15 completely, and the positive electrode and the negative electrode of the LED chip 15 are electrically connected to the corresponding bonding pads 4 respectively, and it should be noted that the present invention is not limited thereto, and may include, but not limited to, electrical connection using solder paste, conductive adhesive, etc., so long as the two can be properly connected, and those skilled in the art can set the same according to the actual situation and requirements.
It should be noted that the encapsulation layer 16 may include, but is not limited to, silicone, epoxy, acrylic, etc., and may be transparent. The encapsulation adhesive layer 16 may be formed on the substrate by means including, but not limited to, injection molding, dispensing, die pressing, etc. so that it is tightly bonded with the substrate body 1, the LED chip 15. In some examples, the encapsulation adhesive layer 16 may cover only the LED chips 15 on the front surface of the substrate body 1, or may cover the LED chips 15 on the front surface of the substrate body 1 and cover all other areas on the front surface of the substrate body 1, where it should be noted that the encapsulation adhesive layer 16 may include, but is not limited to, at least one of a transparent adhesive layer, a fluorescent adhesive layer, and a quantum dot adhesive layer, and may further add a proportion of diffusion particles as required to improve the light-emitting effect thereof.
It should be noted that in some embodiments, the LED chip 15 may be at least one including, but not limited to, a red light chip, a green light chip, a blue light chip, and the like. For example, in some examples, the LED chips 15 include blue LED chips, red LED chips, green LED chips. For example, the blue and green LED chips may be gallium nitride-based LED chips, and the red LED chip may be gallium arsenide-based LED chips. In other examples, all the LED chips may be blue LED chips, and in order to make a part of the LED chips emit green light and red light, a corresponding light conversion layer may be disposed on the light emitting surfaces of the LED chips, where the light conversion layer may include, but is not limited to, a phosphor layer, a quantum film layer, and the like. It should be appreciated that in some examples, the LED chip may emit cyan or white or yellow light in addition to red, green, and blue light. Preferably, the LED chip 15 emits white light in this embodiment.
The display module of this embodiment is through setting up LED chip and encapsulation glue film on the base plate subassembly for the display module has prevented the invasion of steam and has LED the risk that the LED chip became invalid, adopts foretell base plate subassembly effectual to give off the heat that the LED chip produced simultaneously, makes its and encapsulation glue film's combination promote greatly, has solved the LED chip poor heat dissipation in the current encapsulation product, with the poor problem of encapsulation glue film combination, has prolonged its life-span of use, has improved the quality of product and user's use satisfaction.
Example III
The present embodiment provides a display module, for example, as shown in fig. 9, which is a schematic cross-sectional structure of the display module. Wherein the encapsulation glue layer is transparent in order to more clearly show the structure of the display screen.
As shown in fig. 9, the first heat dissipation layer 10 covers the entire back surface of the substrate body 1 in the display module, which may include, but is not limited to, molding, hot pressing, etc. the heat dissipation layer 10 should have a smaller thermal conductivity than the second heat dissipation layer 11, so that heat cannot be accumulated in the display module to cause poor heat dissipation. In this embodiment, preferably, the first heat dissipation layer 10 is made of ceramic, the second heat dissipation layer 11 is made of graphene, so as to increase the heat dissipation speed, it should be noted that, as long as the heat conductivity coefficient of the second heat dissipation layer 11 is greater than that of the first heat dissipation layer 10 and the first heat dissipation layer 10 is made of an insulating material, those skilled in the art can set the material according to practical situations and requirements, and meanwhile, preferably, the insulating layer 121 is set to be a low reflection ink layer, so as to prevent the metal layer from being in contact with the bonding pad to cause short circuit, and the metal layer 12 is set to be a bright nickel layer, so as to improve the reflection efficiency, thereby improving the display brightness and the display effect.
It should be noted that, the effect of heat dissipation can be improved by covering the first heat dissipation layer 10 on the back surface of the substrate main body 1, and the heat dissipation can be performed on the substrate main body 1 while the heat dissipation is performed on the circuit layer 5, so that the heat dissipation efficiency of the display module is greatly improved, and the layering problem caused by poor combination of the encapsulation adhesive layer 16 and the substrate main body 1 is avoided.
The display module of this embodiment sets up the first heat dissipation layer that covers its back and electrically conductive district through the back at the base plate main part, set up the second heat dissipation layer simultaneously on first heat dissipation layer, and the coefficient of heat conductivity of second heat dissipation layer is big than the coefficient of heat conductivity of first heat dissipation layer for it can dispel the heat to the base plate main part, avoided the base plate main part simultaneously and packaged glue layer to combine bad condition, dispel the heat of display module from the back through the heat dissipation of many heat dissipation paths, the problem of LED chip poor heat dissipation in the current packaged product, poor with packaged glue layer associativity has been solved, the life of its use has been prolonged, the quality of product and user's use satisfaction have been improved.
The substrate assembly provided in the foregoing embodiments may be applied to various light-emitting and display fields, for example, it may be manufactured into a display module applied to a display field (may be a display module of a terminal such as a television, a display, a mobile phone, etc.). At this time, the display backlight module can be applied to the display backlight module. The display device can be applied to the field of display backlight, key backlight, shooting, household illumination, medical illumination, decoration, automobile, traffic and the like. The LED backlight module can be used as a key backlight light source of a mobile phone, a calculator, a keyboard and other key equipment when applied to the field of key backlight, can be manufactured into a flash lamp of a camera when applied to the field of shooting, can be manufactured into a floor lamp, a desk lamp, a lighting lamp, a ceiling lamp, a down lamp, a projection lamp and the like when applied to the field of household lighting, can be manufactured into an operating lamp, a low electromagnetic lighting lamp and the like when applied to the field of medical lighting, can be manufactured into various decorative lamps such as various colored lamps, landscape lighting lamps and advertisement lamps when applied to the field of decoration, can be manufactured into automobile lamps, automobile indicating lamps and the like when applied to the field of transportation, and can be manufactured into various traffic lamps and also be manufactured into various street lamps when applied to the field of transportation. The above-described applications are only a few applications of the example shown in the present embodiment, and it should be understood that the application of the display module in the present embodiment is not limited to the fields of the above-described examples.
It should be noted that the number, shape, and size relationships of the elements in the drawings are not meant to be actual examples of the elements, but are merely schematic diagrams for ease of understanding. The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111652677.XA CN114141932B (en) | 2021-12-30 | 2021-12-30 | A substrate assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111652677.XA CN114141932B (en) | 2021-12-30 | 2021-12-30 | A substrate assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114141932A CN114141932A (en) | 2022-03-04 |
| CN114141932B true CN114141932B (en) | 2025-01-17 |
Family
ID=80384082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111652677.XA Active CN114141932B (en) | 2021-12-30 | 2021-12-30 | A substrate assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114141932B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216698411U (en) * | 2021-12-30 | 2022-06-07 | 芜湖聚飞光电科技有限公司 | Base plate assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI343233B (en) * | 2007-10-19 | 2011-06-01 | Au Optronics Corp | Circuit board assembly and backlight module comprising the same |
| JP6230777B2 (en) * | 2012-01-30 | 2017-11-15 | 新光電気工業株式会社 | WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND LIGHT EMITTING DEVICE |
| CN208240668U (en) * | 2017-11-22 | 2018-12-14 | 东莞市国瓷新材料科技有限公司 | Ceramic module is used in a kind of encapsulation of power semiconductor integrated form |
| CN213546315U (en) * | 2020-09-28 | 2021-06-25 | 惠州市聚飞光电有限公司 | Light-emitting unit |
| CN212851202U (en) * | 2020-09-28 | 2021-03-30 | 深圳容为技术有限公司 | Novel LED drive circuit board |
-
2021
- 2021-12-30 CN CN202111652677.XA patent/CN114141932B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216698411U (en) * | 2021-12-30 | 2022-06-07 | 芜湖聚飞光电科技有限公司 | Base plate assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114141932A (en) | 2022-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10325887B2 (en) | Light emitting device and display device having same | |
| US8911110B2 (en) | Lighting device | |
| CN102484195B (en) | Luminescent device and use the light unit of this luminescent device | |
| US8604679B2 (en) | LED light source lamp having drive circuit arranged in outer periphery of led light source | |
| JP4802304B2 (en) | Semiconductor light emitting module and manufacturing method thereof | |
| US20060001361A1 (en) | Light-emitting diode | |
| KR102024291B1 (en) | Lamp unit and vehicle lamp apparatus for using the same | |
| WO2009119461A1 (en) | Semiconductor light emitting module and method for manufacturing the same | |
| JP2011146709A (en) | Light-emitting device and illumination system | |
| CN102800789A (en) | Light-emitting module and lighting apparatus | |
| WO2011024861A1 (en) | Light-emitting device and illuminating device | |
| TW201003991A (en) | Package structure of LED and light bar using the same | |
| JP2014082481A (en) | Light-emitting device | |
| US8791482B2 (en) | Light emitting device package | |
| CN216698411U (en) | Base plate assembly | |
| KR20170043126A (en) | High power led package and method of the same improved color coordinates and thermal conductivity | |
| CN114141932B (en) | A substrate assembly | |
| KR20130017464A (en) | Light emitting device package and lighting system having the same | |
| TW201403870A (en) | Light emitting diode element and manufacturing mathod thereof | |
| KR101924014B1 (en) | Light emitting device package and lighting system having the same | |
| KR20130072993A (en) | Light emitting device package and lighting system having the same | |
| TW200535371A (en) | Light-emitting diode lighting tube featuring high heat dissipation capability | |
| JP2008211157A (en) | Semiconductor light-emitting module, and apparatus | |
| KR20130079869A (en) | Light emitting device package and lighting system including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |