CN114122903A - Laser module - Google Patents
Laser module Download PDFInfo
- Publication number
- CN114122903A CN114122903A CN202111541074.2A CN202111541074A CN114122903A CN 114122903 A CN114122903 A CN 114122903A CN 202111541074 A CN202111541074 A CN 202111541074A CN 114122903 A CN114122903 A CN 114122903A
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- China
- Prior art keywords
- transparent substrate
- laser
- layer
- circuit layer
- laser array
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The embodiment of the invention provides a laser module, which comprises: the circuit comprises a transparent substrate, a circuit layer, a laser array, a heat dissipation layer and a metal shell; the circuit layer is positioned on one side of the transparent substrate and comprises a plurality of through holes; the laser array is positioned on one side, far away from the transparent substrate, of the circuit layer, the laser array is electrically connected with the circuit layer, and light emitted by the laser array passes through the through hole and is transmitted through the transparent substrate; the heat dissipation layer is positioned on one side of the laser array, which is far away from the circuit layer; the metal shell is located on one side, far away from the laser array, of the heat dissipation layer, and the metal shell is electrically connected with the circuit layer. The laser module that this embodiment provided both was favorable to the laser module to develop to miniaturized direction, also has stronger heat dispersion.
Description
Technical Field
The invention relates to the field of lasers, in particular to a laser module.
Background
The main packaging form of semiconductor laser chips such as vertical cavity surface emitting lasers and edge emitting lasers at present is that the chip is located on a silicon substrate or the chip is located on a ceramic substrate, and the substrate material usually selected is ceramic, aluminum nitride, aluminum oxide, copper or copper-tungsten alloy and the like.
The existing laser module is packaged through semi-finished product integration, so that the overall size of a product is overlarge, and the packaging trend of miniaturization integration is not facilitated. The substrate material of the semiconductor laser is generally gallium arsenide or indium phosphide, when a normal-mounted patch is adopted, the active layer is close to the light emitting surface, and at the moment, heat generated by the active layer of the semiconductor laser chip needs to be transmitted to a heat sink through the semiconductor substrate, so that the heat dissipation performance is poor.
Disclosure of Invention
The laser module that this embodiment provided both was favorable to the laser module to develop to miniaturized direction, also has stronger heat dispersion.
The embodiment of the invention provides a laser module, which comprises: the circuit comprises a transparent substrate, a circuit layer, a laser array, a heat dissipation layer and a metal shell;
the circuit layer is positioned on one side of the transparent substrate and comprises a plurality of through holes;
the laser array is positioned on one side, far away from the transparent substrate, of the circuit layer, the laser array is electrically connected with the circuit layer, and light emitted by the laser array passes through the through hole and is transmitted through the transparent substrate;
the heat dissipation layer is positioned on one side of the laser array, which is far away from the circuit layer;
the metal shell is located on one side, far away from the laser array, of the heat dissipation layer, and the metal shell is electrically connected with the circuit layer.
Optionally, the laser module provided in the embodiment of the present invention further includes a device layer;
the device layer is positioned on one side, far away from the transparent substrate, of the circuit layer and is electrically connected with the circuit layer;
the device layer comprises a driving chip, and the driving chip is used for controlling the laser array to emit light.
Optionally, the laser module provided in the embodiment of the present invention further includes an adhesive layer;
the glue film is located the circuit layer is kept away from one side of transparent substrate, the device layer with the laser array is located the glue film is kept away from one side of circuit layer, the glue film is filled the through-hole, the glue film partly surrounds the device layer with the laser array.
Optionally, the laser array includes at least two vertical cavity surface emitting lasers or edge emitting lasers arranged in an array.
Optionally, when the laser array includes at least two edge-emitting lasers arranged in an array, the laser module further includes a plurality of prisms;
the prism is positioned in the through hole;
the number of the prisms is equal to the number of the edge-emitting lasers;
the prisms correspond to the edge emitting lasers one to one;
the prism is used for refracting the light emitted by the edge-emitting laser and enabling the refracted light to penetrate through the transparent substrate.
Optionally, the laser module provided in the embodiment of the present invention further includes a lens unit;
the lens unit is located on one side, far away from the circuit layer, of the transparent substrate and used for shaping light emitted by the transparent substrate.
Optionally, the first surface of the transparent substrate includes a groove;
the second surface of the transparent substrate comprises protrusions;
the first surface of the transparent substrate is close to the circuit layer;
the grooves and the bulges are in one-to-one correspondence and are arranged oppositely.
Optionally, the perpendicular projection of the metal shell on the transparent substrate covers the perpendicular projection of the heat dissipation layer on the transparent substrate.
Optionally, the material of the heat dissipation layer includes heat conductive silicone grease, graphite, or liquid metal.
Optionally, the material of the transparent substrate includes glass, resin, or sapphire.
The embodiment of the invention provides a laser module, wherein a circuit layer in the laser module is positioned on one side of a transparent substrate, a laser array is electrically connected with the circuit layer, light emitted by the laser array can directly penetrate through the transparent substrate through a through hole in the circuit layer, the circuit layer has the functions of transmitting electric signals and dissipating heat, a heat dissipation layer on one side, away from the circuit layer, of the laser array also has the function of dissipating heat, and a metal shell can transmit heat in the heat dissipation layer and also can protect the laser array. The laser module that this embodiment provided both was favorable to the laser module to develop to miniaturized direction, also has stronger heat dispersion.
Drawings
Fig. 1 is a schematic structural diagram of a laser module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another laser module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another laser module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another laser module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another laser module according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another laser module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another laser module according to an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad invention. It should be further noted that, for convenience of description, only some structures, not all structures, relating to the embodiments of the present invention are shown in the drawings.
Fig. 1 is a schematic structural diagram of a laser module according to an embodiment of the present invention, referring to fig. 1, the laser module includes a transparent substrate 110, a circuit layer 120, a laser array 130, a heat dissipation layer 140, and a metal housing 150; the circuit layer 120 is located on one side of the transparent substrate 110, and the circuit layer 120 includes a plurality of through holes; the laser array 130 is located on one side of the circuit layer 120 far away from the transparent substrate 110, the laser array 130 is electrically connected with the circuit layer 120, and light emitted by the laser array 130 passes through the through hole and propagates through the transparent substrate 110; the heat dissipation layer 140 is located on the side of the laser array 130 away from the circuit layer 120; the metal housing 150 is located on a side of the heat dissipation layer 140 away from the laser array 130, and the metal housing 150 is electrically connected to the circuit layer 120.
Specifically, the laser array 130 may be directly electrically connected to the circuit layer 120, and the laser array 130 is not electrically connected to the circuit layer 120 by a gold wire, so that the process steps for manufacturing the laser module are simplified, the path for transmitting signals from the circuit layer 120 to the laser array 130 is reduced, and the response speed of the laser array 130 is increased. Laser array 130 can directly set up the one side of keeping away from transparent substrate 110 at circuit layer 120, and the light that laser array 130 sent can directly pass through the through-hole in circuit layer 120 and see through transparent substrate 110 and propagate to reduce laser module's size, be favorable to the laser module to the direction development that the miniaturization integrates. When laser array 130 worked, can produce too much heat, heat dissipation layer 140 has the effect of heat conduction, can transmit the heat that laser array 130 produced to metal casing 150, the rethread metal casing 150 transmits away, thereby reduce laser array 130's temperature fast, prevent that the heat gathering in laser array 130 is in laser module, cause laser module normal work, in addition, circuit layer 120 also has the effect of transmission heat, laser array 130's in the laser module that this embodiment provided front and back all can dispel the heat. The material of the circuit layer 120 may include copper, which has both a function of transmitting an electrical signal and a function of good heat conduction. The metal housing 150 has both the function of protecting the laser array 130 and the function of dissipating heat, and the material of the metal housing 150 may also be copper. The metal shell 150 is electrically connected to the circuit layer 120 through a solder joint 160, and other electronic devices may be disposed on the metal shell 150, and when the other electronic devices are disposed on the metal shell 150, signal interaction may be performed between the metal shell 150 and the circuit layer 120.
The embodiment of the invention provides a laser module, wherein a circuit layer in the laser module is positioned on one side of a transparent substrate, a laser array is electrically connected with the circuit layer, light emitted by the laser array can directly penetrate through the transparent substrate through a through hole in the circuit layer, the circuit layer has the functions of transmitting electric signals and dissipating heat, a heat dissipation layer on one side, away from the circuit layer, of the laser array also has the function of dissipating heat, and a metal shell can transmit heat in the heat dissipation layer and also can protect the laser array. The laser module that this embodiment provided both was favorable to the laser module to develop to miniaturized direction, also has stronger heat dispersion.
Optionally, fig. 2 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 2, the laser module further includes a device layer 170; the device layer 170 is located on one side of the circuit layer 120 far away from the transparent substrate 110, and the device layer 170 is electrically connected with the circuit layer 120; the device layer 170 includes a driver chip for controlling the laser array 130 to emit light.
Specifically, the device layer 170 further includes electronic devices such as a resistor and a capacitor. The driving chip is used for controlling the light emitting time, the light emitting brightness, and the like of the laser array 130. The device layer 170 communicates signals with the laser array 130 through the wiring layer 120.
Optionally, fig. 3 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 3, the laser module further includes a glue layer 180; the adhesive layer 180 is located on one side of the circuit layer 120 far away from the transparent substrate 110, the device layer 170 and the laser array 130 are located on one side of the adhesive layer 180 far away from the circuit layer 120, the adhesive layer 180 fills the through hole, and the adhesive layer 180 semi-surrounds the device layer 170 and the laser array 130.
Specifically, the distance from the surface of the adhesive layer 180 away from the circuit layer 120 to the circuit layer 120 is less than or equal to the distance from the surface of the device layer 170 away from the circuit layer 120 to the circuit layer 120. The adhesive layer 180 has strong light transmittance. The refractive index of the adhesive layer 180 is matched with the refractive index of the transparent substrate 110, so that the adhesive layer 180 does not excessively affect the propagation direction of the light output by the laser array 130, and the adhesive layer 180 does not absorb the light output by the laser array 130. The glue layer 180 may serve as a mechanical support for the driver chips and the laser array 130 in the device layer 170. The glue layer 180 may promote a semi-hermetic package of the laser array 130 and the device layer 170. In addition, the adhesive layer 180 can also play a role in assisting heat dissipation, so that the temperature in the laser array 130 is reduced, and the heat dissipation performance of the laser module is further improved.
Optionally, the laser array includes at least two vertical cavity surface emitting lasers or edge emitting lasers arranged in an array.
Specifically, the laser module including the vertical cavity surface emitting laser or the edge emitting laser can be manufactured into a laser radar, and can also be used for fingerprint identification, face identification, gesture identification and the like of a screen of an electronic product.
Optionally, fig. 4 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 4, when the laser array 130 includes at least two edge-emitting lasers 131 arranged in an array, the laser module further includes a plurality of prisms 190; the prism 190 is positioned in the through hole; the number of prisms 190 is equal to the number of edge-emitting lasers 131; the prisms 190 correspond one-to-one to the edge-emitting lasers 131; the prism 190 serves to refract light emitted from the edge-emitting laser 131 and transmit the refracted light through the transparent substrate 110.
Specifically, the light emitting surface of the edge-emitting laser 131 may be parallel to the transparent substrate 110, or may be perpendicular to the transparent substrate 110, and when the light emitting surface of the edge-emitting laser 131 is parallel to the transparent substrate 110, the prism 190 is required to refract the light emitted by the edge-emitting laser 131 and transmit the light through the transparent substrate 110. Fig. 5 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 5, the laser module shown in fig. 5 shows a schematic structural diagram in which a light emitting surface of an edge emitting laser is perpendicular to a transparent substrate 110.
Fig. 6 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 6, the laser module according to the embodiment further includes a lens unit 200; the lens unit 200 is located on a side of the transparent substrate 110 away from the circuit layer 120, and the lens unit 200 is used for shaping light emitted from the transparent substrate 110.
Specifically, the lens unit 200 may be set according to actual requirements, the lens unit 200 may be a convex lens, or may be a concave lens, and the lens unit 200 may change the angle of the divergence angle of the light emitted by the laser array 130.
Optionally, fig. 7 is a schematic structural diagram of another laser module according to an embodiment of the present invention, and referring to fig. 7, the first surface of the transparent substrate 110 includes a groove; the second surface of the transparent substrate 110 includes protrusions; the first surface of the transparent substrate 110 is close to the circuit layer 120; the grooves and the bulges are in one-to-one correspondence and are arranged oppositely.
Specifically, the groove in the first surface and the protrusion in the second surface of the transparent substrate 110 may change the propagation direction of the light emitted from the laser array 130, thereby controlling the irradiation area of the laser array 130. The groove in the first surface and the protrusion in the second surface of the transparent substrate 110 may form a lens, that is, the lens is integrated in the glass substrate 110, and a laser chip may be directly mounted on one side of the glass substrate 110 integrated with the lens through high position precision, thereby omitting the process of optical alignment, simplifying the process steps, and further improving the manufacturing efficiency of the laser module.
Optionally, the vertical projection of the metal shell on the transparent substrate covers the vertical projection of the heat dissipation layer on the transparent substrate.
Specifically, the metal shell is used for protecting the heat dissipation layer, the laser array and the device layer, the vertical projection of the metal shell on the transparent substrate covers the vertical projection of the heat dissipation layer on the transparent substrate, and heat in all areas of the heat dissipation layer can be transferred out through the metal shell, so that the reduction of the temperature in the laser array is accelerated.
Optionally, the material of the heat dissipation layer includes heat conductive silicone grease, graphite, or liquid metal.
The laser module comprises a laser array, a heat conducting silicone grease, graphite and liquid metal, wherein the heat conducting performance of the heat conducting silicone grease, the graphite and the liquid metal is very good, heat generated by the laser array can be conducted out quickly, the temperature in the laser array can be reduced quickly, in addition, the cost of the heat conducting silicone grease, the graphite and the liquid metal is low, the heat conducting silicone grease, the graphite or the liquid metal is used for manufacturing a heat radiating layer, the heat radiating performance of the laser module can be improved, and the manufacturing cost of the laser module can be reduced.
Alternatively, the material of the transparent substrate includes glass, resin, or sapphire.
Specifically, the light transmission performance of the glass, the resin and the sapphire is good, the insulating performance of the glass, the resin and the sapphire is good, and the circuit layer made on the glass, the resin or the sapphire can not enable signals transmitted in the circuit layer to be transmitted out through the glass, the resin or the sapphire. In addition, glass is easy to obtain, low in cost and easy to process, and the cost of the laser module can be reduced by manufacturing the transparent substrate by using the glass. The resin has the characteristic of light weight, and the transparent substrate made of the resin can reduce the weight of the laser module.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will appreciate that the embodiments of the present invention are not limited to the specific embodiments described herein, and that various obvious changes, adaptations, and substitutions are possible, without departing from the scope of the embodiments of the present invention. Therefore, although the embodiments of the present invention have been described in more detail through the above embodiments, the embodiments of the present invention are not limited to the above embodiments, and many other equivalent embodiments may be included without departing from the concept of the embodiments of the present invention, and the scope of the embodiments of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A laser module, comprising: the circuit comprises a transparent substrate, a circuit layer, a laser array, a heat dissipation layer and a metal shell;
the circuit layer is positioned on one side of the transparent substrate and comprises a plurality of through holes;
the laser array is positioned on one side, far away from the transparent substrate, of the circuit layer, the laser array is electrically connected with the circuit layer, and light emitted by the laser array passes through the through hole and is transmitted through the transparent substrate;
the heat dissipation layer is positioned on one side of the laser array, which is far away from the circuit layer;
the metal shell is located on one side, far away from the laser array, of the heat dissipation layer, and the metal shell is electrically connected with the circuit layer.
2. The laser module of claim 1, further comprising a device layer;
the device layer is positioned on one side, far away from the transparent substrate, of the circuit layer and is electrically connected with the circuit layer;
the device layer comprises a driving chip, and the driving chip is used for controlling the laser array to emit light.
3. The laser module of claim 2, further comprising a glue layer;
the glue film is located the circuit layer is kept away from one side of transparent substrate, the device layer with the laser array is located the glue film is kept away from one side of circuit layer, the glue film is filled the through-hole, the glue film partly surrounds the device layer with the laser array.
4. The laser module as claimed in claim 1, wherein the laser array comprises at least two vertical cavity surface emitting lasers or edge emitting lasers arranged in an array.
5. The laser module of claim 4, wherein when the laser array comprises at least two edge-emitting lasers arranged in an array, the laser module further comprises a plurality of prisms;
the prism is positioned in the through hole;
the number of the prisms is equal to the number of the edge-emitting lasers;
the prisms correspond to the edge emitting lasers one to one;
the prism is used for refracting the light emitted by the edge-emitting laser and enabling the refracted light to penetrate through the transparent substrate.
6. The laser module of claim 1, further comprising a lens unit;
the lens unit is located on one side, far away from the circuit layer, of the transparent substrate and used for shaping light emitted by the transparent substrate.
7. The laser module of claim 1, wherein the first surface of the transparent substrate comprises a groove;
the second surface of the transparent substrate comprises protrusions;
the first surface of the transparent substrate is close to the circuit layer;
the grooves and the bulges are in one-to-one correspondence and are arranged oppositely.
8. The laser module of claim 1, wherein a perpendicular projection of the metal housing on the transparent substrate covers a perpendicular projection of the heat dissipation layer on the transparent substrate.
9. The laser module of claim 1, wherein the material of the heat dissipation layer comprises thermally conductive silicone grease, graphite, or liquid metal.
10. The laser module of claim 1, wherein the material of the transparent substrate comprises glass, resin, or sapphire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111541074.2A CN114122903A (en) | 2021-12-16 | 2021-12-16 | Laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111541074.2A CN114122903A (en) | 2021-12-16 | 2021-12-16 | Laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114122903A true CN114122903A (en) | 2022-03-01 |
Family
ID=80365064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111541074.2A Withdrawn CN114122903A (en) | 2021-12-16 | 2021-12-16 | Laser module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114122903A (en) |
-
2021
- 2021-12-16 CN CN202111541074.2A patent/CN114122903A/en not_active Withdrawn
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Application publication date: 20220301 |
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