CN114112045A - Infrared temperature measurement module, terminal equipment and temperature measurement method - Google Patents
Infrared temperature measurement module, terminal equipment and temperature measurement method Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
- G01J5/0025—Living bodies
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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Abstract
本发明涉及一种红外测温模组、一种具有该红外测温模组的终端设备以及一种应用于该终端设备的温度测量方法。所述红外测温模组包括外壳、红外镜头、红外传感芯片、电路板和处理器。所述红外传感芯片和所述处理器与所述电路板电连接。所述红外镜头将红外辐射光线聚焦于所述红外传感芯片上，所述红外镜头和所述红外传感芯片容纳在所述外壳内。所述红外测温模组还包括可透红外光的用于封装所述红外传感芯片的封装体。通过本发明能够实现较远距离的温度测量，解决现有终端设备在测温时需要贴近被测物体才能测温的问题，从而大大提高了用户体验。
The invention relates to an infrared temperature measurement module, a terminal device having the infrared temperature measurement module, and a temperature measurement method applied to the terminal device. The infrared temperature measurement module includes a casing, an infrared lens, an infrared sensor chip, a circuit board and a processor. The infrared sensor chip and the processor are electrically connected to the circuit board. The infrared lens focuses infrared radiation on the infrared sensor chip, and the infrared lens and the infrared sensor chip are accommodated in the casing. The infrared temperature measurement module further includes a package body that is transparent to infrared light and used to package the infrared sensor chip. The invention can realize temperature measurement at a relatively long distance, solve the problem that the existing terminal equipment needs to be close to the measured object to measure the temperature when measuring temperature, thereby greatly improving the user experience.
Description
Technical Field
The invention relates to the field of infrared temperature measurement, in particular to an infrared temperature measurement module, terminal equipment and a temperature measurement method.
Background
With the development of the technology, the functions of the electronic terminal equipment are more and more. For example, some electronic terminal devices have a temperature measuring function, such as an infrared temperature sensor. However, in the current terminal device with the infrared temperature sensor, when measuring the temperature, the temperature is measured only by approaching or approaching the terminal device to the skin, the distance is usually not more than several centimeters, once the distance is a little far away, the temperature cannot be measured accurately, and the experience is not good for the user.
Disclosure of Invention
Therefore, the invention aims to provide an infrared temperature measurement module, a terminal device with the infrared temperature measurement module and a temperature measurement method applied to the terminal device, which can realize remote temperature measurement and solve the problem that the existing terminal device needs to be close to a measured object to measure temperature during temperature measurement, thereby greatly improving user experience.
In order to achieve the purpose of the present invention, a first aspect of the present invention provides an infrared temperature measurement module, which includes a housing, an infrared lens, an infrared sensing chip, a circuit board, and a processor. The infrared sensing chip and the processor are electrically connected with the circuit board. The infrared lens focuses infrared radiation on the infrared sensing chip, and the infrared lens and the infrared sensing chip are accommodated in the shell. The infrared temperature measurement module also comprises an infrared light transmitting packaging body used for packaging the infrared sensing chip.
According to the first aspect of the invention, the infrared lens focuses infrared radiation light generated by a measured object on the infrared sensing chip, the infrared sensing chip receives the infrared radiation light through a photosensitive area of the infrared sensing chip and converts a received optical signal into an electrical signal, and the processor receives the electrical signal of the infrared sensing chip through the circuit board and processes the electrical signal, so that a temperature value of the measured object can be obtained. According to the invention, on one hand, the infrared temperature measurement module with smaller size can be realized; on the other hand, the infrared temperature measurement at a longer distance can be reliably realized, and especially the temperature measurement distance up to 15-25 cm can be realized.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared sensing chip is disposed right below the infrared lens, so that an optical axis of the infrared sensing chip coincides with or substantially coincides with an optical axis of the infrared lens. This ensures that the infrared radiation focused by the infrared lens can be received by the infrared sensor chip as far as possible. Here, "substantially coincide" means that a certain error, such as a manufacturing error or an assembly error, is allowed.
In some embodiments of the infrared thermometry module of the present invention, the infrared lens is located at the top end of the housing such that the top surface of the infrared lens is exposed to the outside and flush with the top of the housing. This ensures that sufficient infrared radiation can enter the infrared lens without being blocked by the housing. In these embodiments, a plurality of, for example, two, protrusions are provided on the inner side wall of the housing, for example, for supporting the infrared lens and fixing the infrared lens directly on the top end of the housing on the inner side wall of the housing, thereby simply realizing the fixing of the infrared lens in the housing without increasing the lateral dimension of the infrared thermometry module.
In some embodiments of the infrared thermometry module of the present invention, the package may be made of silicon. Of course, the material of the package body may be other light-permeable materials, which is not limited in the present invention.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared sensor chip may include a photosensitive region and a non-photosensitive region surrounding the photosensitive region and located around the photosensitive region. Here, the package may encapsulate only the photosensitive region of the infrared sensor chip. Of course, the package body may also package the infrared sensor chip integrally, that is, the package body surrounds the photosensitive area and the non-photosensitive area of the infrared sensor chip.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared sensor chip, especially the photosensitive region of the infrared sensor chip, may be encapsulated in an inert gas by the encapsulant. The light sensing area of the infrared sensing chip is packaged in the inert gas environment, so that the infrared sensing chip can be prevented from being reduced in precision due to energy loss in work, and the infrared sensing chip can be protected from being polluted by external dust. Here, the inert gas may be nitrogen or other inert gases, but the present invention is not limited thereto.
In some embodiments of the infrared temperature measurement module of the present invention, the package body may have a groove on a side facing the light sensing area, the groove of the package body is filled with an inert gas, and the package body is configured to encapsulate at least the light sensing area of the infrared sensor chip in an inert gas environment by using the groove of the package body. Therefore, the photosensitive area of the infrared sensing chip can be simply packaged in the inert gas by the mode of arranging the groove.
In some embodiments of the infrared temperature measuring module of the present invention, the surface of the non-photosensitive region may be coated with an opaque material or a light-shielding material to prevent infrared radiation from contacting the non-photosensitive region.
In some embodiments of the infrared temperature measurement module of the present invention, a cavity is disposed on a side of the infrared sensor chip facing away from the photosensitive area, and an opening of the cavity faces the circuit board. When infrared temperature measurement module during operation, the temperature can rise when infrared irradiation is received to the photosensitive area of infrared sensing chip, and the heat of production can be because the non-photosensitive area of heat-conduction arrival infrared sensing chip, and the precision of chip can be influenced to the non-photosensitive area temperature rise, consequently, through set up the cavity in one side of infrared sensing chip that deviates from with the photosensitive area, avoided non-photosensitive area to receive thermal influence, and then avoided influencing the precision of infrared sensing chip because heat conduction.
In some embodiments of the infrared temperature measurement module of the present invention, when viewed along the optical axis direction, or the optical axis direction of the infrared lens or the infrared sensing chip, the area of the cavity may be larger than the area of the photosensitive region and smaller than the area of the infrared sensing chip. Further, the ratio of the area of the cavity to the area of the infrared sensing chip may be in the range of 0.1 to 1; and/or the ratio of the area of the cavity to the area of the photosensitive region may be in the range of 4 to 6.
In some embodiments of the infrared temperature measurement module of the present invention, a ratio of a thickness of the cavity to a thickness of the infrared sensing chip may be in a range of 0.7 to 0.9 along an optical axis direction or along an optical axis direction of the infrared lens or the infrared sensing chip.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared lens may be a silicon infrared lens.
In some embodiments of the infrared thermometry module of the present invention, the field angle of the infrared lens may be between 6 ° and 8 °. Therefore, the temperature of the object to be measured can be measured more accurately while long-distance temperature measurement is realized.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared sensor chip may be packaged on the circuit board by Ball Grid Array (BGA) packaging technology. At this time, the infrared sensing chip can be completely packaged by the packaging body, and the temperature measurement precision is improved.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared temperature measurement module further includes a thermistor accommodated in the housing, and the thermistor is disposed on the circuit board and electrically connected to the circuit board. Here, the temperature of the circuit board can be compensated by using the thermistor, so that the measurement result is more accurate.
In some embodiments of the infrared thermometry module of the present invention, the processor may be disposed on the circuit board and housed within the housing. Alternatively, the processor can be arranged outside the shell and electrically connected with the circuit board through a connector, so that the size of the infrared temperature measurement module can be reduced.
In some embodiments of the infrared temperature measurement module of the present invention, the circuit board may have a slot or a through hole, and the infrared sensing chip is disposed in the slot or the through hole and electrically connected to the circuit board through a wire. From this, guarantee infrared sensing chip with can reduce when infrared camera lens's distance satisfies camera lens back focal length demand the shared spatial position of infrared sensing chip reduces the whole height of infrared temperature measurement module, and then makes infrared temperature measurement module can be arranged in small-size terminal equipment, for example the cell-phone.
In some embodiments of the infrared temperature measurement module of the present invention, the infrared temperature measurement module may further include a reinforcing plate attached to the bottom of the circuit board, so as to guide out heat generated by the circuit board during operation. Therefore, the temperature in the infrared temperature measurement module can be prevented from rising to influence the precision of the infrared sensing chip; in addition, the circuit board can be prevented from being deformed due to overhigh temperature, and the flatness of the infrared sensing chip and the good electrical property of the circuit board are further guaranteed.
In order to achieve the purpose of the present invention, a second aspect of the present invention provides a terminal device, which includes the infrared temperature measurement module according to the first aspect of the present invention, an input module, and a display module, wherein the input module and the display module are connected to the infrared temperature measurement module. The input module is configured to input a temperature measurement instruction and transmit the temperature measurement instruction to the infrared temperature measurement module; the infrared temperature measurement module is configured to receive the temperature measurement instruction, perform temperature measurement in response to the temperature measurement instruction, and transmit the measured temperature value to the display module; the display module is configured to receive and display the temperature value.
In some embodiments of the terminal device of the present invention, the terminal device may be a mobile terminal device, such as a mobile phone.
The infrared temperature measuring module provided by the first aspect of the invention has a small size or volume and a long temperature measuring distance, so that the infrared temperature measuring module can be advantageously integrated in terminal equipment, especially a mobile terminal, without excessively increasing the size or volume of the terminal equipment, thereby facilitating temperature measurement for a user.
In order to achieve the object of the present invention, the third aspect of the present invention also provides a temperature measurement method applied to the terminal device according to the second aspect of the present invention. The temperature measuring method comprises the following steps:
receiving a temperature measuring instruction on an input module;
the infrared temperature measurement module responds to the temperature measurement instruction to measure the temperature and transmits the measured temperature value to the display module;
and displaying the temperature value on a display module.
The features and advantages of the infrared thermometry module according to the first aspect of the present invention are equally applicable to the terminal device according to the second aspect of the present invention and the temperature measuring method according to the third aspect of the present invention, and vice versa.
Drawings
Various embodiments of the present invention will be described in more detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic block diagram of a first embodiment of an infrared temperature measurement module according to the present invention;
FIG. 2 is a schematic block diagram of an infrared sensor chip according to the present invention;
FIG. 3 is a schematic top view of the infrared sensor chip shown in FIG. 2, viewed along the optical axis;
FIG. 4 is a schematic diagram of a packaging manner of the package according to the present invention;
FIG. 5 is a schematic view of another packaging of a package according to the present invention;
fig. 6 is a schematic structural view of another package according to the present invention;
FIG. 7 is a schematic block diagram of a second embodiment of an infrared temperature measurement module according to the present invention;
FIG. 8 is a schematic block diagram of a third embodiment of an infrared temperature measurement module in accordance with the present invention;
FIG. 9 is a schematic block diagram of a fourth embodiment of an infrared temperature measurement module in accordance with the present invention;
fig. 10 is a block diagram of a terminal device according to the present invention;
FIG. 11 is a schematic flow chart of a method of temperature measurement in accordance with the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Throughout the specification, unless otherwise specifically noted, terms used herein should be understood as having meanings as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a conflict, the present specification will control.
Fig. 1 shows a schematic block diagram of a first embodiment of an infrared thermometry module 100 according to the present invention. The infrared temperature measurement module 100 includes a housing 110, an infrared lens 120, an infrared sensing chip 130, a circuit board 140, and a processor (MCU) 150. The infrared sensor chip 130 and the processor 150 are connected to the circuit board 140. Infrared lens 120 focuses infrared radiation onto infrared sensor chip 130, and at least infrared lens 120 and infrared sensor chip 130 are housed within housing 110. The infrared temperature measurement module 100 further includes an infrared-transparent package 160 for packaging the infrared sensor chip 130. Here, the MCU processor 150 is configured to receive the voltage signal transmitted from the infrared sensor chip 130, convert the voltage signal into a digital signal, and transmit the digital signal to a display module of a mobile phone. A pin is disposed at the bottom of the MCU processor 150, and the MCU processor 150 is electrically connected to the circuit board 140 through the pin to realize conduction.
According to the infrared temperature measurement module 100, infrared radiation light generated by a measured object can penetrate through the infrared lens 120, the infrared radiation light is focused on the infrared sensing chip 130 through the convergence effect of the infrared lens 120, the infrared sensing chip 130 can detect the infrared radiation light focused on the infrared sensing chip and generate corresponding voltage signals to be transmitted to the MCU processor 150 for processing, the MCU processor 150 receives the voltage signals and converts the voltage signals into digital signals to be transmitted out, so that the temperature of the object at a longer distance can be measured, the distance can reach 15-25 cm, a user does not need to be close to the measured object when measuring the temperature, and the user experience is greatly improved.
In the embodiment shown in fig. 1, MCU processor 150 is disposed directly on circuit board 140 and electrically connected to circuit board 140. Here, the infrared lens 120, the infrared sensing chip 130 and the MCU processor 150 are all disposed in the housing 110, so as to protect the components of the infrared temperature measurement module 100 from contamination and ensure that the infrared temperature measurement module 100 is not damaged during transportation.
The housing 110 shown in fig. 1 is "L" shaped and has a first arm segment 111 and a second arm segment 112 perpendicular to each other. Wherein the infrared lens 120 is accommodated in the first arm segment 111 and the circuit board 140 is accommodated in the second arm segment 112. The L-shaped shell can particularly favorably reduce the occupied volume of the infrared temperature measurement module. Of course, the housing 110 may have other shapes to accommodate the components of the infrared temperature measurement module 100, which is not limited in the present invention.
Here, the infrared lens 120 is disposed on the top of the infrared temperature measurement module 100, and is used for focusing the infrared radiation of the object to be measured. As shown in FIG. 1, infrared lens 120 is positioned at top end 113 of housing 110 such that a top surface 121 of infrared lens 120 is exposed to the exterior and is flush with top end 113 of housing 110 to ensure that sufficient infrared radiation rays can enter the infrared lens without being obscured by the housing. Here, two projections 115 and 116 are provided on the inner side wall 114 of the housing, for example directly below the ir lens 120, to provide support for the ir lens 120, facilitating the fixing of said ir lens 120 to the top end 113 of the housing 110.
In some embodiments, infrared lens 120 may be a glass lens, without temperature drift. In particular, the infrared lens 120 may be a silicon infrared lens, which has a high refractive index and a small dispersion, and is opaque in a visible light band, but has a good transmittance in an infrared light band, so that the infrared radiation generated by the object to be measured can pass through the infrared lens 120 and be focused on the infrared sensor chip 130.
Since the infrared temperature measurement module 100 of the present invention is used for measuring temperature at a long distance, in order to make temperature measurement of an object to be measured more accurate, an infrared lens with a field angle of 6 ° to 8 ° may be used in some embodiments. For example, the field angle of the infrared lens may be 7.6 °.
In the invention, infrared radiation rays generated by the measured object are converged into the photosensitive area of the infrared sensing chip through the infrared lens, so that the temperature measurement at a longer distance can be realized. According to the formula, FOV is a field angle, H is a phase plane, and EFL is a focal length, and since the photosensitive area of the infrared sensor chip is fixed, the focal length of the infrared lens needs to be increased to reduce the field angle of the infrared lens. In order to enable the infrared sensor chip 130 to receive the infrared radiation, the distance from the infrared lens 120 to the infrared sensor chip 130 needs to satisfy the requirement of the focal length of the infrared lens. Preferably, the distance from the infrared lens 120 to the infrared sensing chip 130 is not greater than 2.94 mm. Since the height of the infrared temperature measurement module 100 mainly depends on the distance from the infrared lens 120 to the infrared sensor chip 130, the height of the infrared temperature measurement module 100 is not higher than 4.55 mm. Therefore, the infrared temperature measurement module 100 is particularly beneficial to being arranged in small-sized terminal equipment such as mobile phones.
The infrared sensor chip 130 may be, for example, a thermopile sensor chip, and is capable of converting a received optical signal into an electrical signal in a fast response, and is mainly used for receiving infrared radiation generated by the temperature of a measured object. As shown in fig. 1, infrared sensor chip 130 is disposed directly below infrared lens 120, i.e., optical axis X1 of infrared sensor chip 130 is maintained substantially coincident with optical axis X2 of infrared lens 120, so as to ensure that infrared radiation focused by infrared lens 120 is maximally received by infrared sensor chip 130.
In the embodiment shown in fig. 1, the infrared sensor chip 130 is electrically connected to the circuit board 140 through a wire 141.
In some embodiments, as shown in fig. 2 and 3, infrared sensor chip 130 has a first surface 131 facing infrared lens 120 on a near-object side and a second surface 132 facing circuit board 140 on a near-image side. In addition, the infrared sensor chip 130 includes a photosensitive region 133 and a non-photosensitive region 134 surrounding the photosensitive region 133 and located around the photosensitive region 133, i.e., the non-photosensitive region 134 is an annular region surrounding the photosensitive region 133. Here, photosensitive region 133 and non-photosensitive region 134 are located on first surface 131 of infrared sensor chip 130 and opposite to infrared lens 120.
When the infrared temperature measurement module operates, the temperature of the photosensitive region 133 of the infrared sensor chip 130 rises when receiving the infrared light, and the generated heat is conducted to the non-photosensitive region 134, so that the temperature of the non-photosensitive region 134 rises, thereby affecting the accuracy of the infrared sensor chip 130. Therefore, in the embodiment shown in fig. 2 and 3, in order to avoid affecting the accuracy of the infrared sensor chip 130 due to heat conduction, a cavity 135 is provided at a lower portion of the infrared sensor chip 130, i.e., the cavity 135 is located at the second surface (i.e., the side facing away from the photosensitive area 133) 132 of the infrared sensor chip 130 and is disposed opposite to the circuit board 140, and the cavity 135 has an opening at a side facing the circuit board 140. In particular, a vacuum is maintained in the cavity 135 such that heat generated by the photosensitive region 133 is conducted into the cavity 135 and not further conducted into the non-photosensitive region 134.
Further, as shown in the top view of fig. 3, an area S1 of the cavity 135 is larger than an area S2 of the photosensitive region 133 and smaller than an area S3 of the infrared sensor chip 130, as viewed along the optical axis X1 of the infrared sensor chip 130. In some embodiments, the ratio of the area S1 of the cavity 135 to the area S3 of the infrared sensor chip 130 may be in the range of 0.1 to 1. In some embodiments, the ratio of the area S1 of cavity 135 to the area S2 of photosensitive region 133 may be in the range of 4 to 6. In a specific example, the ratio of the area S1 of the cavity 135 to the area S3 of the infrared sensor chip 130 is 0.37, and the ratio of the area S1 of the cavity 135 to the area S2 of the photosensitive region 133 is 5.4.
Further, as shown in fig. 2, the ratio H1/H2 of the thickness H1 of the cavity 135 along the optical axis X1 to the thickness H2 of the infrared sensor chip 130 along the optical axis X1 may be in the range of 0.7-0.9. In a specific example, the ratio of the thickness H1 of the cavity 135 along the optical axis X1 to the thickness H2 of the infrared sensor chip 130 along the optical axis X1, H1/H2, is 0.88.
In addition, the surface of the non-photosensitive region 134 may be coated with an opaque material or a light-shielding material, such as a black body, to prevent the non-photosensitive region 134 from contacting the infrared radiation.
Further, as shown in fig. 2, a substrate 170 is disposed between the second surface 132 of the infrared sensor chip 130 and the circuit board 140, and the infrared sensor chip 130 is disposed on the circuit board 140 through the substrate 170, so as to prevent the infrared sensor chip 130 from directly contacting the circuit board 140, and further prevent heat generated by the circuit board 140 during operation from affecting the precision of the infrared sensor chip 130.
Further, as shown in fig. 4, the infrared sensor chip 130 is packaged in an inert gas environment by the light-permeable package 160, that is, the infrared sensor chip 130 is packaged in an inert gas through the package 160, so that the accuracy of the infrared sensor chip 130 can be prevented from being reduced due to energy loss during operation. For example, in a simple implementation, the package body 160 may be provided with a groove 161 on a side facing the photosensitive area 133, the groove 161 is filled with an inert gas, and the package body 160 encapsulates at least the photosensitive area 133 of the infrared sensor chip 130 in an inert gas environment by using the groove 161.
The material of the package body 160 may be silicon or other light-permeable material, which is not limited in the present invention. The gas in the package body 160 may be nitrogen or other inert gas, which is not limited in the present invention.
In some embodiments, as shown in fig. 4, the package body 160 encapsulates only the photosensitive area 133 of the infrared sensor chip 130 in an inert gas environment, and the package body 160 is disposed on the non-photosensitive area 134 of the infrared sensor chip 130. In other embodiments, as shown in fig. 5, the package 160 may also encapsulate the entire infrared sensor chip 130, that is, the package 160 surrounds the photosensitive region 133 and the non-photosensitive region 134 of the infrared sensor chip 130, so that the entire infrared sensor chip 130 is encapsulated in the inert gas environment.
Here, by encapsulating the infrared sensor chip 130 with the encapsulant 160, the infrared sensor chip can be placed in an inert gas environment to avoid affecting the accuracy thereof, and can be protected from external dust contamination.
In other embodiments, as shown in FIG. 6, the thickness H3 from the first surface 131 of the IR sensor chip 130 to the bottom surface of the BGA ball 162 is not greater than 0.39mm in order to further reduce the height of the entire IR temperature measurement module after determining the distance between the first surface 131 of the IR sensor chip 130 and the IR lens 120.
In addition, the infrared temperature measurement module 100 may further include a thermistor 180 accommodated in the housing 110, the thermistor being disposed on the circuit board 140 and electrically connected to the circuit board 140. The thermistor is used for temperature compensation of the circuit board, so that the measuring result is more accurate. The bottom of the thermistor 180 is provided with a pin through which the thermistor 180 is electrically connected to the circuit board 140. Further, the thermistor is a thermistor that is manufactured by utilizing the characteristic that the resistance value of a semiconductor significantly changes with temperature, and the temperature change of the medium to be measured can be known from the change in the resistance value of the thermistor measured within a certain temperature range. Therefore, the circuit board can generate heat when in work, and the thermistor reflects the temperature value of the circuit board when in work through the resistance value, so that the error interference of the temperature value of the circuit board to the temperature value of the object to be measured is avoided.
Further, the infrared temperature measurement module 100 may further include a reinforcing plate 190 attached to the bottom of the circuit board 140, so as to conduct away heat generated by the circuit board during operation, thereby preventing the temperature of the infrared temperature measurement module 100 from rising and affecting the accuracy of the infrared sensing chip 130. In addition, the circuit board 140 is not deformed due to an excessive temperature, and the flatness of the infrared sensor chip 130 and the good electrical property of the circuit board are ensured. The material of the reinforcing plate 190 may be a metal material, and the present invention is not limited thereto.
Fig. 7 shows a schematic structural diagram of a second embodiment of the infrared thermometry module 100 according to the present invention. Unlike the first embodiment shown in fig. 1, the MCU processor 150 is disposed outside the housing 110 and electrically connected to the circuit board 140 through a connector. For example, a flexible board or an adapter board extending from the circuit board 140 toward the housing 110 is used as a connector, and the flexible board or the adapter board is electrically connected to the display module. The MCU processor 150 is disposed on the adapter plate outside the infrared temperature measurement module 100 and is connected to the circuit board 140, so as to display the measured temperature on the display module. The MCU processor 150 with large size is arranged outside the shell 110, so that the size of the infrared temperature measurement module 110 can be reduced, and the infrared temperature measurement module is convenient to integrate in small-sized terminal equipment.
Fig. 8 shows a schematic structural diagram of a third embodiment of the infrared temperature measuring module 100 according to the present invention. Different from the embodiment shown in fig. 1 and 2, the circuit board 140 is provided with the slot 142, and the infrared sensing chip 130 is disposed in the slot 142 and is conducted with the circuit board 140 through the wire 141, so that the distance between the infrared sensing chip and the infrared lens is ensured to meet the requirement of the back focal length of the lens, the space occupied by the infrared sensing chip is further reduced, and the overall height of the infrared temperature measurement module is reduced, thereby being more beneficial to integrating the infrared temperature measurement module in the small terminal device. In addition, since the slot 142 of the circuit board 140 is still connected to the circuit board, that is, the slot 142 is a blind hole, the infrared sensor chip 130 can be attached to the circuit board 140, which is beneficial to maintaining the flatness of the infrared sensor chip and the circuit board.
Fig. 9 shows a schematic structural diagram of a fourth embodiment of the infrared temperature measuring module 100 according to the present invention. Unlike the embodiment shown in fig. 8, the circuit board 140 is provided with an opening 143 penetrating through the circuit board, and the infrared sensor chip 130 is embedded in the opening 143 and is electrically connected to the circuit board 140 through the conductive line 141. It is particularly advantageous to provide a reinforcing plate 190 here in order to support the infrared sensor chip 130 in the opening 143. The reinforcing plate 190 is disposed at the bottom of the circuit board and the infrared sensing chip for supporting the infrared temperature measurement module. Preferably, the reinforcing plate 190 is made of a metal material, so that heat generated by the circuit board and the infrared sensing chip can be transferred to the outside of the infrared temperature measurement module.
Compared with the embodiment shown in fig. 8, in the embodiment shown in fig. 9, under the condition that the distance between the infrared sensing chip 130 and the infrared lens 120 satisfies the requirement of the back focal length of the lens, since the back focal length of the infrared lens is not changed, that is, the distance between the infrared lens and the infrared sensing chip is not changed, the infrared sensing chip 130 is disposed in the opening 143 of the circuit board 140, so that the infrared sensing chip 130 further sinks and is attached to the reinforcing plate 190, the height of the infrared temperature measurement module can be further reduced, and the structure of the infrared temperature measurement module can be simplified.
The invention further relates to a terminal device 1000, as shown in fig. 10, the terminal device includes the infrared temperature measurement module 100, the input module 200, and the display module 300. The input module 200 and the display module 300 are in communication connection with the infrared temperature measuring module 100. The input module 200 is configured to input a temperature measurement command and transmit the temperature measurement command to the infrared temperature measurement module 100. The infrared temperature measurement module 100 is configured to receive a temperature measurement command, perform temperature measurement in response to the temperature measurement command, and transmit a measured temperature value to the display module 300. Here, the infrared temperature measurement module 100 obtains a digital signal through internal measurement and conversion, and the digital signal is transmitted to the display module to obtain the temperature measured by the object to be measured. The display module 300 is configured to receive and display the temperature value.
The terminal device can be a mobile terminal device, in particular a small terminal device, such as a mobile telephone.
The infrared temperature measurement module is small in size and can realize the temperature measurement distance of 15-25 cm, so that the infrared temperature measurement module is particularly favorable for being integrated into small-sized terminal equipment such as a mobile phone. For example, can carry out temperature measurement through the leading module of making a video recording of cell-phone cooperation infrared temperature measurement module, promptly, leading camera module is used for assistance-localization real-time people face position, then makes infrared temperature measurement module further confirm the forehead position that carries out the temperature measurement through the algorithm to the temperature measurement part that realizes the determinand is located the imaging area of infrared temperature measurement module, guarantees the temperature measurement accuracy.
The present invention also relates to a temperature measuring method applied to the terminal device 1000 shown in fig. 10, as shown in fig. 11, the temperature measuring method including the steps of:
in step S1100, a temperature measurement command is received at the input module 200. In this step, a user inputs a temperature measurement instruction on an input module 200, for example, a touch display screen of a mobile phone, and then the temperature measurement instruction is transmitted from the input module 200 to the infrared temperature measurement module 100, for example, the MCU processor 150 of the infrared temperature measurement module 100.
In step S1200, the infrared temperature measurement module 100 measures the temperature in response to the temperature measurement command and transmits the measured temperature value to the display module 300. In this step, the MCU processor 150 receives the temperature measurement command and transmits the temperature measurement command to the infrared sensing chip 130; the infrared sensing chip 130 starts to receive the infrared radiation light focused to the infrared sensing chip through the infrared lens 120 after receiving the temperature measurement instruction, and generates a corresponding voltage signal to transmit to the MCU processor for processing; the MCU processor 150 receives the voltage signal transmitted from the infrared sensor chip, converts the voltage signal into a digital signal, and transmits the digital signal to the display module 300.
In step S1300, the temperature value is displayed on the display module 300. The display module 300 is, for example, a touch display screen of a mobile phone.
Other embodiments and advantages of the terminal device and the temperature measuring method provided by the present invention can refer to the related description of the infrared temperature measuring module provided by the present invention, and are not described herein again.
The features or combinations of features mentioned above in the description, in the drawings and in the claims can be used in any combination with one another or alone, provided that they are meaningful and not mutually contradictory within the scope of the invention.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (23)
1. The infrared temperature measurement module is characterized by comprising a shell, an infrared lens, an infrared sensing chip, a circuit board and a processor, wherein the infrared sensing chip and the processor are electrically connected with the circuit board;
the infrared lens focuses infrared radiation on the infrared sensing chip, and the infrared lens and the infrared sensing chip are accommodated in the shell;
the infrared temperature measurement module also comprises an infrared light transmitting packaging body used for packaging the infrared sensing chip.
2. The infrared temperature measurement module of claim 1, wherein the infrared sensor chip is disposed directly below the infrared lens such that an optical axis of the infrared sensor chip substantially coincides with an optical axis of the infrared lens.
3. The infrared thermometry module of claim 2 wherein the infrared lens is located at the top end of the housing such that the top surface of the infrared lens is exposed externally and flush with the top of the housing.
4. The infrared thermometry module of claim 1, wherein the package is made of silicon.
5. The infrared temperature measurement module of claim 1, wherein the infrared sensor chip comprises a photosensitive area and a non-photosensitive area surrounding the photosensitive area and located around the photosensitive area;
the packaging body only packages the photosensitive area of the infrared sensing chip, or the packaging body integrally packages the infrared sensing chip.
6. The infrared temperature measurement module of claim 1, wherein the infrared sensing chip is encapsulated in an inert gas by the encapsulation body.
7. The infrared temperature measurement module of claim 6, wherein the inert gas is nitrogen.
8. The infrared temperature measurement module of claim 6, wherein the package body has a recess on a side facing the light sensing region, the recess of the package body is filled with an inert gas, and the package body is configured to encapsulate at least the light sensing region of the infrared sensor chip in an inert gas environment by using the recess of the package body.
9. The infrared temperature measurement module of claim 5, wherein a surface of the non-photosensitive region is coated with an opaque material.
10. The infrared temperature measurement module of claim 5, wherein a cavity is disposed on a side of the infrared sensor chip facing away from the photosensitive region, and an opening of the cavity faces the circuit board.
11. The infrared temperature measurement module of claim 10, wherein an area of the cavity is larger than an area of the photosensitive region and smaller than an area of the infrared sensor chip, as viewed along the optical axis.
12. The infrared temperature measurement module of claim 11, wherein the ratio of the area of the cavity to the area of the infrared sensing chip is in the range of 0.1 to 1; and/or the ratio of the area of the cavity to the area of the photosensitive region is in the range of 4 to 6.
13. The infrared temperature measurement module of claim 10, wherein a ratio of a thickness of the cavity to a thickness of the infrared sensor chip along the optical axis is in a range of 0.7-0.9.
14. The infrared temperature measurement module of claim 3, wherein the infrared lens is a silicon infrared lens.
15. The infrared thermometry module of claim 14 wherein the field angle of the infrared lens is between 6 ° and 8 °.
16. The infrared temperature measurement module of claim 1, wherein the infrared sensor chip is packaged on the circuit board by a ball grid array packaging process.
17. The infrared temperature measurement module of any one of claims 1 to 16, further comprising a thermistor housed within the housing, the thermistor being disposed on and electrically connected to the circuit board.
18. The infrared temperature measurement module of any one of claims 1 to 16, wherein the processor is disposed on the circuit board and housed in the housing; alternatively, the processor is disposed outside the housing and electrically connected to the circuit board through a connector.
19. The infrared temperature measurement module of any one of claims 1 to 16, wherein a slot is formed on the circuit board, and the infrared sensing chip is disposed in the slot and electrically connected to the circuit board through a wire.
20. The infrared temperature measurement module of any one of claims 1 to 16, wherein the circuit board is provided with a through opening, and the infrared sensor chip is disposed in the opening and electrically connected to the circuit board through a wire.
21. The infrared temperature measurement module of any one of claims 1 to 16, further comprising a reinforcing plate attached to the bottom of the circuit board, so as to conduct heat generated by the circuit board during operation.
22. A terminal device, characterized in that the terminal device comprises the infrared temperature measurement module according to any one of claims 1 to 21, an input module and a display module, wherein the input module and the display module are connected with the infrared temperature measurement module;
the input module is configured to input a temperature measurement instruction and transmit the temperature measurement instruction to the infrared temperature measurement module;
the infrared temperature measurement module is configured to receive the temperature measurement instruction, perform temperature measurement in response to the temperature measurement instruction, and transmit the measured temperature value to the display module;
the display module is configured to receive and display the temperature value.
23. A temperature measurement method applied to the terminal device according to claim 22, wherein the temperature measurement method comprises:
receiving a temperature measuring instruction on an input module;
the infrared temperature measurement module responds to the temperature measurement instruction to measure the temperature and transmits the measured temperature value to the display module;
and displaying the temperature value on a display module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010883152.6A CN114112045A (en) | 2020-08-28 | 2020-08-28 | Infrared temperature measurement module, terminal equipment and temperature measurement method |
| CN202180055581.7A CN116113812A (en) | 2020-08-28 | 2021-08-20 | Infrared temperature measurement module, terminal equipment and temperature measurement method |
| PCT/CN2021/113785 WO2022042442A1 (en) | 2020-08-28 | 2021-08-20 | Infrared temperature measurement module, terminal device, and temperature measurement method |
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| CN202010883152.6A CN114112045A (en) | 2020-08-28 | 2020-08-28 | Infrared temperature measurement module, terminal equipment and temperature measurement method |
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| CN202180055581.7A Pending CN116113812A (en) | 2020-08-28 | 2021-08-20 | Infrared temperature measurement module, terminal equipment and temperature measurement method |
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| CN115752746A (en) * | 2022-12-30 | 2023-03-07 | 苏州摩比信通智能系统有限公司 | Intelligent terminal with infrared temperature measurement function and assembly method thereof |
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| CN116113812A8 (en) | 2024-05-21 |
| CN116113812A (en) | 2023-05-12 |
| WO2022042442A1 (en) | 2022-03-03 |
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