CN114096054B - Flexible circuit board assembly, manufacturing method thereof and display device - Google Patents
Flexible circuit board assembly, manufacturing method thereof and display device Download PDFInfo
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- CN114096054B CN114096054B CN202111403667.2A CN202111403667A CN114096054B CN 114096054 B CN114096054 B CN 114096054B CN 202111403667 A CN202111403667 A CN 202111403667A CN 114096054 B CN114096054 B CN 114096054B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 84
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible circuit board assembly, a manufacturing method thereof and a display device, and belongs to the technical field of display. Wherein, flexible wiring board assembly includes: the substrate comprises a hollowed-out part, and a conductive pattern is arranged in the hollowed-out part; the first wiring is positioned on the first surface of the substrate, the orthographic projection of the first wiring on the substrate and the hollowed-out part are overlapped, and the first wiring is in contact with the conductive pattern. The technical scheme of the invention can reduce the wiring line width of the flexible circuit board assembly.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board assembly, a manufacturing method thereof and a display device.
Background
An OLED (Organic Light-Emitting Diode) display device has been listed as a next-generation display technology with great development prospects due to its advantages of thinness, lightness, wide viewing angle, active Light emission, continuous and adjustable Light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high Light emission efficiency, flexible display, and the like.
A driving integrated circuit chip (driving IC) and a main flexible circuit board (MFPC) are used for circuit driving of the OLED display module, and are generally connected with the OLED display module in a binding manner. With the continuous development of display technology, the resolution of the terminal requirements is higher and higher, the power consumption of the OLED display module is increased, and in order to reduce the wiring resistance, the wiring line width of the MFPC needs to be increased, but the MFPC does not have enough layout area.
Disclosure of Invention
The invention aims to solve the technical problem of providing a flexible circuit board assembly, a manufacturing method thereof and a display device, and the wiring line width of the flexible circuit board assembly can be reduced.
In order to solve the technical problems, the embodiment of the invention provides the following technical scheme:
in one aspect, a flexible circuit board assembly is provided, comprising:
the substrate comprises a hollowed-out part, and a conductive pattern is arranged in the hollowed-out part;
The first wiring is positioned on the first surface of the substrate, the orthographic projection of the first wiring on the substrate and the hollowed-out part are overlapped, and the first wiring is in contact with the conductive pattern.
In some embodiments, the conductive pattern and the first trace are made of the same material.
In some embodiments, an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
In some embodiments, further comprising:
The second surface is a surface opposite to the first surface, the line width of the second wiring is smaller than that of the first wiring, and the orthographic projection of the second wiring on the substrate is not overlapped with the orthographic projection of the first wiring on the substrate.
In some embodiments, the first trace is a power trace.
The embodiment of the invention also provides a display device which comprises the display module and the flexible circuit board assembly, wherein the flexible circuit board assembly is bound in the binding area of the display module.
The embodiment of the invention also provides a manufacturing method of the flexible circuit board assembly, which comprises the following steps:
forming a substrate comprising a hollowed-out part, and forming a conductive pattern in the hollowed-out part;
And forming a first wire on the first surface of the substrate, wherein an overlapping part exists between the orthographic projection of the first wire on the substrate and the hollowed-out part, and the first wire is in contact with the conductive pattern.
In some embodiments, the manufacturing method specifically includes:
Providing a flexible copper clad laminate, wherein the flexible copper clad laminate comprises a substrate, a first copper layer covering a first surface of the substrate and a second copper layer covering a second surface of the substrate;
patterning the first copper layer to form the first wiring;
patterning the second copper layer to expose a second surface of the substrate;
Etching the substrate from one side of the second surface to form the hollowed-out part, wherein at least part of the first wiring is exposed out of the hollowed-out part;
And depositing a conductive material in the hollowed-out part to form the conductive pattern.
In some embodiments, an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
In some embodiments, the method of making further comprises:
Patterning the second copper layer to form a second wiring, wherein the line width of the second wiring is smaller than that of the first wiring, and the orthographic projection of the second wiring on the substrate is not overlapped with the orthographic projection of the first wiring on the substrate
The embodiment of the invention has the following beneficial effects:
In the scheme, the substrate comprises the hollowed-out part, the conductive pattern is arranged in the hollowed-out part and is in contact with the first wiring, the resistance of the conductive structure formed by the conductive pattern and the first wiring is smaller than that of the first wiring, the resistance requirement on the wiring can be met without increasing the line width of the first wiring, the line width of the first wiring can be reduced, and the layout requirement of the flexible circuit board assembly is met. In addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first wiring through the conductive pattern, reduce flexible circuit board subassembly's risk of burning out.
Drawings
FIGS. 1 and 2 are schematic diagrams of wiring of a flexible circuit board assembly;
FIG. 3 is a schematic view of a flexible copper clad laminate;
fig. 4-6 are schematic diagrams illustrating the fabrication of a flexible circuit board assembly according to an embodiment of the present invention.
Reference numerals
1. Power line
2. Second wiring
31. First copper layer
32. Substrate
33. Second copper layer
4. First wiring
5. Conductive pattern
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more apparent, the following detailed description will be given with reference to the accompanying drawings and the specific embodiments.
As shown in fig. 1, 1 is a power line, and as the resolution of the display module increases, the driving current of the display module increases, so that the line width of the power line 1 is larger to meet the resistance requirement of the power line 1, which leads to the expansion of the outline dimension of the MFPC. In addition, as shown in fig. 2, when the MFPC is bound to the display module, the binding area is insufficient, and the width of the power line 1 needs to be sacrificed, so that the MFPC has a potential burning risk.
The embodiment of the invention provides a flexible circuit board assembly, a manufacturing method thereof and a display device, which can reduce the wiring line width of an MFPC.
An embodiment of the present invention provides a flexible wiring board assembly including:
the substrate comprises a hollowed-out part, and a conductive pattern is arranged in the hollowed-out part;
The first wiring is positioned on the first surface of the substrate, the orthographic projection of the first wiring on the substrate and the hollowed-out part are overlapped, and the first wiring is in contact with the conductive pattern.
In the embodiment, the substrate comprises the hollowed-out part, the conductive pattern is arranged in the hollowed-out part and is in contact with the first wiring, the resistance of a conductive structure formed by the conductive pattern and the first wiring is smaller than that of the first wiring, the requirement on the resistance of the wiring can be met without increasing the line width of the first wiring, the line width of the first wiring can be reduced, and the layout requirement of the flexible circuit board assembly can be met; in addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first wiring through the conductive pattern, reduce flexible circuit board subassembly's risk of burning out.
Further, the flexible circuit board assembly further comprises a protective film which is coated on the outermost side of the flexible circuit board assembly, and the first wiring and the conductive pattern can be protected.
In this embodiment, the first trace is in contact with the conductive pattern, so that the first trace and the conductive pattern are connected in parallel to form a new conductive structure, and compared with the original first trace, the resistance of the conductive structure is reduced, so that the resistance requirement on the first trace can be met without increasing the line width and thickness of the first trace.
In this embodiment, the first trace may be a power line, in the related art, the power line needs to transmit a power signal, and along with the increase of the resolution of the display module, the driving current of the display module increases, so as to meet the resistance requirement of the power line 1, the line width of the power line 1 needs to be set larger, but the size of the flexible circuit board assembly is limited, by using the technical scheme of this embodiment, the line width of the power line 1 can be reduced, and the size of the flexible circuit board assembly does not need to be increased. Of course, the first wiring is not limited to a power line, but may be other wirings on the flexible circuit board assembly, and when the layout area of the other wirings needs to be reduced, the technical scheme of the embodiment may be adopted to reduce the line width of the other wirings.
In this embodiment, the first trace and the conductive pattern may be made of the same material, or may be made of different materials. Since copper has excellent conductivity, in this embodiment, both the first trace and the conductive pattern may be made of copper.
In this embodiment, the front projection of the first trace on the substrate may partially overlap the hollowed portion, and preferably, the front projection of the first trace on the substrate overlaps the hollowed portion, so that the contact area between the first trace and the conductive pattern may be increased, and the conductivity of the conductive structure formed by the first trace and the conductive pattern is ensured. Of course, the hollowed-out portion is not limited to coincide with the orthographic projection of the first wiring on the substrate, the area of the hollowed-out portion can be larger than that of the first wiring, the orthographic projection of the first wiring on the substrate is located in the hollowed-out portion, and along with the increase of the area of the hollowed-out portion, the volume of the conductive pattern is also increased, so that the resistance of the conductive structure formed by the first wiring and the conductive pattern can be further reduced.
In this embodiment, as shown in fig. 6, the flexible circuit board assembly further includes:
The second wire 2 is located on the second surface of the substrate, the second surface is opposite to the first surface, the line width of the second wire 2 is smaller than that of the first wire 4, and the orthographic projection of the second wire 2 on the substrate is not overlapped with the orthographic projection of the first wire 4 on the substrate.
In this embodiment, a second trace is further disposed on the second surface of the substrate, so as to ensure normal operation of the flexible circuit board assembly, the orthographic projection of the second trace 2 on the substrate and the orthographic projection of the first trace 4 on the substrate do not overlap, and meanwhile, the orthographic projection of the second trace 2 on the substrate and the hollowed portion do not overlap, so that the setting of the hollowed portion does not affect the normal operation of the second trace.
Of course, in the flexible circuit board assembly of the present embodiment, the second surface of the substrate may not be provided with the traces, that is, only the first surface of the substrate is provided with the first traces.
In addition, the flexible circuit board assembly of the present embodiment may include one substrate, or may include a plurality of substrates, and at least one surface of each substrate is provided with a trace.
In a specific example, as shown in fig. 6, the flexible circuit board assembly includes a flexible copper-clad plate, and the flexible copper-clad plate includes a substrate, a first trace 4 located on a first surface of the substrate, and a second trace 2 located on a second surface of the substrate. The line width of the first wire 4 is larger than that of the second wire 2, a hollowed part is arranged in the area of the substrate corresponding to the first wire 4, a conductive material such as copper is filled in the hollowed part to form a conductive pattern 5, and the conductive pattern 5 and the first wire 4 together form a conductive structure with smaller resistance. Taking copper as an example for the first wire 4 and the conductive pattern 5, the thickness of the first wire is d 1, the thickness of the second wire is d 2, the thickness of the conductive pattern and the substrate is d 3, the line widths of the first wire and the conductive pattern are W, and the impedance calculation formula is used
If the conductive pattern is not arranged, the impedance of the first wiring isΡ is the resistivity of copper; after the conductive pattern is arranged, the impedance of the conductive structure formed by the first wiring and the conductive pattern is
R 1/R2=(d1+d3)/d1, exemplified by d 1 being 8um and d 3 being 12um, R 1/R2 =2.5;
Therefore, after the conductive pattern is designed, the impedance of the conductive structure can be greatly reduced, and the line width of the first wiring can be reduced by at least 1 time under the condition of ensuring the same load, thereby being beneficial to the layout of the flexible circuit board assembly.
The embodiment of the invention also provides a display device which comprises the display module and the flexible circuit board assembly, wherein the flexible circuit board assembly is bound in the binding area of the display module.
The display device includes, but is not limited to: the system comprises a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like. It will be appreciated by those skilled in the art that the structure of the display device described above is not limiting of the display device, and that the display device may include more or less components described above, or may be combined with certain components, or may have different arrangements of components. In an embodiment of the invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: any product or component with display function such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a backboard.
The embodiment of the invention also provides a manufacturing method of the flexible circuit board assembly, which comprises the following steps:
forming a substrate comprising a hollowed-out part, and forming a conductive pattern in the hollowed-out part;
And forming a first wire on the first surface of the substrate, wherein an overlapping part exists between the orthographic projection of the first wire on the substrate and the hollowed-out part, and the first wire is in contact with the conductive pattern.
In the embodiment, the substrate comprises the hollowed-out part, the conductive pattern is arranged in the hollowed-out part and is in contact with the first wiring, the resistance of a conductive structure formed by the conductive pattern and the first wiring is smaller than that of the first wiring, the requirement on the resistance of the wiring can be met without increasing the line width of the first wiring, the line width of the first wiring can be reduced, and the layout requirement of the flexible circuit board assembly can be met; in addition, when flexible circuit board subassembly and display module assembly bind, can guarantee the performance of first wiring through the conductive pattern, reduce flexible circuit board subassembly's risk of burning out.
Further, the flexible circuit board assembly further comprises a protective film which is coated on the outermost side of the flexible circuit board assembly, and the first wiring and the conductive pattern can be protected.
In this embodiment, the first trace is in contact with the conductive pattern, so that the first trace and the conductive pattern are connected in parallel to form a new conductive structure, and compared with the original first trace, the resistance of the conductive structure is reduced, so that the resistance requirement on the first trace can be met without increasing the line width and thickness of the first trace.
In this embodiment, the first trace may be a power line, in the related art, the power line needs to transmit a power signal, and along with the increase of the resolution of the display module, the driving current of the display module increases, so as to meet the resistance requirement of the power line 1, the line width of the power line 1 needs to be set larger, but the size of the flexible circuit board assembly is limited, by using the technical scheme of this embodiment, the line width of the power line 1 can be reduced, and the size of the flexible circuit board assembly does not need to be increased. Of course, the first wiring is not limited to a power line, but may be other wirings on the flexible circuit board assembly, and when the layout area of the other wirings needs to be reduced, the technical scheme of the embodiment may be adopted to reduce the line width of the other wirings.
In this embodiment, the first trace and the conductive pattern may be made of the same material, or may be made of different materials. Since copper has excellent conductivity, in this embodiment, both the first trace and the conductive pattern may be made of copper.
In this embodiment, the front projection of the first trace on the substrate may partially overlap the hollowed portion, and preferably, the front projection of the first trace on the substrate overlaps the hollowed portion, so that the contact area between the first trace and the conductive pattern may be increased, and the conductivity of the conductive structure formed by the first trace and the conductive pattern is ensured. Of course, the hollowed-out portion is not limited to coincide with the orthographic projection of the first wiring on the substrate, the area of the hollowed-out portion can be larger than that of the first wiring, the orthographic projection of the first wiring on the substrate is located in the hollowed-out portion, and along with the increase of the area of the hollowed-out portion, the volume of the conductive pattern is also increased, so that the resistance of the conductive structure formed by the first wiring and the conductive pattern can be further reduced.
In some embodiments, as shown in fig. 3-6, the manufacturing method specifically includes:
Step 1, providing a flexible copper clad laminate, as shown in fig. 3, wherein the flexible copper clad laminate comprises a substrate 32, a first copper layer 31 covering a first surface of the substrate 32, and a second copper layer 33 covering a second surface of the substrate 32; wherein, the substrate 32 can be made of flexible material such as polyimide;
Step 2, as shown in fig. 4, patterning the first copper layer 31 to form a first trace 4; patterning the second copper layer 33 to form a second trace 2, wherein the line width of the second trace 2 is smaller than that of the first trace 4, and the orthographic projection of the second trace 2 on the substrate 32 is not overlapped with the orthographic projection of the first trace 4 on the substrate 32;
step 3, after the second copper layer is patterned, exposing the second surface of the substrate, and etching the substrate 32 from one side of the second surface to form the hollowed-out portion, where at least part of the first trace 4 is exposed by the hollowed-out portion; as shown in fig. 5, the hollowed-out portion exposes all the first wires 4, and the orthographic projection of the first wires on the substrate coincides with the hollowed-out portion;
And 4, as shown in fig. 6, depositing a conductive material in the hollowed-out part to form the conductive pattern 5.
In this embodiment, the line width of the conductive pattern 5 is equal to the line width of the first trace 4. When the conductive material is deposited in the hollowed-out part, the deposition rate and time are controlled, and the conductive pattern 5 with the same thickness as the substrate 32 is obtained.
The conductive pattern 5 and the first trace 4 together form a conductive structure with smaller resistance. Taking copper as an example for the first wire 4 and the conductive pattern 5, the thickness of the first wire is d 1, the thickness of the second wire is d 2, the thickness of the conductive pattern and the substrate is d 3, the line widths of the first wire and the conductive pattern are W, and the impedance calculation formula is used
If the conductive pattern is not arranged, the impedance of the first wiring isΡ is the resistivity of copper; after the conductive pattern is arranged, the impedance of the conductive structure formed by the first wiring and the conductive pattern is
R 1/R2=(d1+d3)/d1, exemplified by d 1 being 8um and d 3 being 12um, R 1/R2 =2.5;
Therefore, after the conductive pattern is designed, the impedance of the conductive structure can be greatly reduced, and the line width of the first wiring can be reduced by at least 1 time under the condition of ensuring the same load, thereby being beneficial to the layout of the flexible circuit board assembly.
In the method embodiments of the present invention, the serial numbers of the steps are not used to define the sequence of the steps, and it is within the scope of the present invention for those skilled in the art to change the sequence of the steps without performing any creative effort.
In this specification, all embodiments are described in a progressive manner, and identical and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in a different way from other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is relatively simple, and the relevant points are found in the section of the product embodiments.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (7)
1. A flexible circuit board assembly, comprising:
the substrate comprises a hollowed-out part, and a conductive pattern is arranged in the hollowed-out part;
The first wiring is positioned on the first surface of the substrate, the orthographic projection of the first wiring on the substrate and the hollowed-out part are overlapped, and the first wiring is in contact with the conductive pattern;
The second surface is a surface opposite to the first surface, the line width of the second wiring is smaller than that of the first wiring, and the orthographic projection of the second wiring on the substrate is not overlapped with the orthographic projection of the first wiring on the substrate.
2. The flexible circuit board assembly of claim 1, wherein the conductive pattern is the same material as the first trace.
3. The flexible circuit board assembly of claim 1, wherein an orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
4. A flexible circuit board assembly according to any of claims 1-3, wherein the first trace is a power trace.
5. A display device comprising a display module and the flexible circuit board assembly of any one of claims 1-4, wherein the flexible circuit board assembly is bound to a binding area of the display module.
6. A method of manufacturing a flexible circuit board assembly, comprising:
forming a substrate comprising a hollowed-out part, and forming a conductive pattern in the hollowed-out part;
forming a first wire on the first surface of the substrate, wherein the orthographic projection of the first wire on the substrate has an overlapping part with the hollowed-out part, and the first wire is in contact with the conductive pattern;
the manufacturing method specifically comprises the following steps:
Providing a flexible copper clad laminate, wherein the flexible copper clad laminate comprises a substrate, a first copper layer covering a first surface of the substrate and a second copper layer covering a second surface of the substrate;
patterning the first copper layer to form the first wiring;
patterning the second copper layer to expose a second surface of the substrate;
Etching the substrate from one side of the second surface to form the hollowed-out part, wherein at least part of the first wiring is exposed out of the hollowed-out part;
depositing a conductive material in the hollowed-out part to form the conductive pattern;
The manufacturing method further comprises the following steps:
Patterning the second copper layer to form a second wiring, wherein the line width of the second wiring is smaller than that of the first wiring, and the orthographic projection of the second wiring on the substrate is not overlapped with the orthographic projection of the first wiring on the substrate.
7. The method of claim 6, wherein the orthographic projection of the first trace on the substrate coincides with the hollowed-out portion.
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CN109994534A (en) * | 2019-04-23 | 2019-07-09 | 武汉华星光电半导体显示技术有限公司 | The peripheral circuit structure and OLED display panel of OLED display panel |
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