CN114089604B - Array graph drawing method and system - Google Patents
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- CN114089604B CN114089604B CN202111286402.9A CN202111286402A CN114089604B CN 114089604 B CN114089604 B CN 114089604B CN 202111286402 A CN202111286402 A CN 202111286402A CN 114089604 B CN114089604 B CN 114089604B
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- 238000010586 diagram Methods 0.000 claims abstract description 25
- 238000012544 monitoring process Methods 0.000 claims description 9
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- 238000000605 extraction Methods 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims 2
- 238000001259 photo etching Methods 0.000 abstract description 9
- 238000013519 translation Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 8
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003909 pattern recognition Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- 238000005553 drilling Methods 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to an array graph drawing method, belongs to the technical field of photoetching, and solves the problem of low graph drawing speed in the prior art. The method for drawing the array graph comprises the following steps of S1; reading a vector diagram file; s2, binarizing the vector image file; s3, extracting the outline in the graph; s4, matching the extracted contour with the contour in the template library; s5, grouping the matched templates into units and recording the positions of the units; s6, carrying out fine drawing on the unit grouping graph; and S7, filling the unit grouping graph after the fine drawing to the corresponding position recorded in the step S5. The invention processes the vector image to extract the cell array image in the vector image, and after finely drawing the cell group image, the cell group image is restored into the bitmap which can be identified by the photoetching machine in a translation filling mode for exposure of the photoetching machine, and the drawing time can be greatly saved by using the method.
Description
Technical Field
The invention belongs to the technical field of lithography, relates to a pattern recognition and positioning method and system based on lithography positioning, and particularly relates to a high-precision defocusing pattern recognition and positioning method and system.
Background
Laser direct imaging (LASER DIRECT IMAGING, LDI) is a technique that uses the data output from the CAM workstation to directly drive a laser direct imaging device and image a pattern on a photoresist-coated circuit board substrate (similar to the image of a laser printer on a polyester substrate sheet), then, the pattern is developed to obtain a desired pattern, and then etching and stripping (removing the remaining photoresist) are performed to obtain a copper conductor pattern required for a circuit board. Obviously, LDI not only reduces the problems of numerous procedures such as film manufacture, application, preservation and maintenance, and the like, and simplifies the process, but also more importantly, eliminates the problems of PCB dimensional accuracy and errors caused by film pattern transfer.
In circuit board manufacturing, alignment problems include single-sided alignment, double-sided alignment (side-to-side), and interlayer alignment. An alignment device and method for double-sided alignment of an inner layer plate is disclosed in China patent (publication No. CN 102262358A), which discloses an alignment method for an inner layer plate, and the double-sided alignment is realized in a manner of collecting alignment points by a graph collecting device during alignment.
In the technical field of PCB character printers, the Gerber file is a two-dimensional vector graphics file format, which is a standard format used in printed wiring board industry software to describe printed wiring board graphics, for example: a circuit layer, a solder mask layer, a character layer, a drilling layer and the like. The first step of the digital printer to realize the Gerber file of the printing vector is to analyze and convert the file format of the vector diagram into the bitmap file format of the dot matrix. In the prior art, the conversion time of converting the Gerber file into the bitmap file is long, the conversion efficiency is low, and the like, so that the working efficiency of the printer is seriously affected. And because the alignment data among different layers needs to be acquired in multi-layer printing, the printing precision is in the micron level, so that any position and angle deviation can influence the printing precision when the PCB is installed, alignment is needed before each piece of board is printed, namely, a vector image is required to be converted into a bitmap in each printing, and therefore, how to quickly and effectively convert a Gerber file into a bitmap file is a problem which needs to be solved by a person skilled in the art.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a high-efficiency drawing method for an array graph.
The aim of the invention can be achieved by the following technical scheme: an array pattern drawing method, comprising the steps of:
S1, performing S1; reading a vector diagram file;
s2, binarizing the vector image file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
S5, grouping the matched templates into units and recording the positions of the units;
s6, carrying out fine drawing on the unit grouping graph;
and S7, filling the unit grouping graph after the fine drawing to the corresponding position recorded in the step S5.
Because a large number of repeated patterns exist on the circuit on the PCB board and a plurality of patterns have obvious array characteristics, the patterns are formed by a plurality of units which do not pass through, clear boundaries are formed between the units, and the units are not overlapped with each other, by adopting the method, the vector patterns can be firstly binarized and then the contours are extracted, the contours are matched by using templates, the grouping among the contours is realized, after the grouping is finished, only the fine drawing is needed for the single units in the group, and after the drawing of the single units is finished, only the patterns of the units are copied into the units corresponding to other positions, so that the drawing speed of the patterns can be greatly improved.
In the above method for drawing an array pattern, in the step S1, the read vector image is a Gerber file.
The drawing method further comprises a step S8 of finely drawing the graphics which are not grouped in the step S4 to form a complete bitmap file.
And (3) for the graph to be drawn on the PCB, if the contour extracted in the steps S3 and S4 is a non-template contour, judging the contour to be a non-conventional array graph, wherein the part of the graph is not subjected to unit grouping at the moment, so that only the part of the graph can be subjected to independent fine drawing during drawing, and a complete drawing file is formed for printing by a photoetching machine.
The graphic drawing method further comprises a step S9 of acquiring alignment data, wherein the step S9 can be synchronously performed with the steps S1-S8 or positioned between any steps S1-S8. The aim of obtaining the alignment data is to accurately draw a circuit diagram on the PCB, and because the PCB is positioned by adopting a sucker during assembly, and deviations such as position, angle and even distortion exist, the alignment data is needed to be printed by a method after the printing position is determined during printing, and the alignment data can be determined by identifying a plurality of positioning points on the PCB through a camera.
The graphic drawing method further comprises real-time alignment monitoring, wherein in the graphic drawing process, a clock module is arranged, an exposure graphic is regularly identified through a camera and is transmitted to a drawing module for comparison, so that the drawing process synchronization is ensured, if the identified exposure graphic is matched with a drawing template, exposure is continued, and if the identified exposure graphic is not matched with the drawing template, an exposure abnormal signal is sent out.
Another object of the present invention is to provide an array graphics rendering system, comprising:
the vector diagram reading module is used for identifying the vector diagram;
The binarization module is used for converting the vector image into a graph with higher contrast ratio, so that the outline can be conveniently extracted;
The contour extraction module is used for extracting clear contours after identifying the binarized patterns, so that contour grouping is convenient;
The profile matching module is used for comparing the extracted profile with the profile in the template library, identifying the profile which can be grouped, and recording the coordinates of the grouped units so as to facilitate the subsequent filling;
the drawing module is used for carrying out fine drawing on the specific units which are grouped by the units;
and the graph filling module is used for filling the unit after the fine drawing to a specific position according to the recorded coordinates and quantity, so as to realize the array filling of the fine drawing graph.
The system also comprises a graph verification module, wherein after the graph filling is completed, the graph verification module is used for verifying, comparing the graph with the graph identified by the vector graph, and drawing the graph which is not identified as the unit group and is subjected to the array filling so as to form a complete drawing graph.
The system also comprises an alignment module, wherein the alignment data is identified through the camera, and the alignment data is used as a reference to draw the graph.
The system also comprises a real-time monitoring module for identifying whether the exposed graph is consistent with the set drawing graph.
In the above-mentioned array pattern drawing system, the real-time monitoring module includes a camera acquisition unit, a clock unit, a comparison unit, wherein the camera acquisition unit is used for acquiring exposed patterns, the clock unit is used for regularly acquiring camera data, the comparison unit is used for comparing the exposed patterns acquired by the camera with a set drawing pattern, if the identified exposure patterns are matched with the set drawing pattern, exposure is continued, and if the identified exposure patterns are not matched with the set drawing pattern, an exposure abnormal signal is sent.
Compared with the prior art, the method has the advantages that the extraction of the unit array patterns in the vector patterns is realized by processing the vector patterns, the unit grouping patterns are finely drawn, and then the unit grouping patterns are restored into the bitmap which can be identified by the photoetching machine in a translation filling mode for exposure of the photoetching machine.
Drawings
FIG. 1 is a schematic illustration of a vector diagram of the present invention;
FIG. 2 is a schematic representation of a vector diagram of the present invention;
FIG. 3 is a schematic workflow diagram of the present invention;
fig. 4 is a system schematic block diagram of the present invention.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 and 2, which are circuit diagrams on a conventional PCB, the present invention provides a high-efficiency drawing method for array patterns, because there are a large number of repeated patterns (as shown in the red boxes of fig. 1 and 2) on the circuit on the PCB, and many patterns have obvious array characteristics, the patterns are composed of a plurality of non-passing cells, and the cells have clear boundaries, and the cells do not overlap with each other.
As shown in fig. 3, the method comprises the steps of:
S1, performing S1; reading a vector diagram file;
s2, binarizing the vector image file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
S5, grouping the matched templates into units and recording the positions of the units;
s6, carrying out fine drawing on the unit grouping graph;
and S7, filling the unit grouping graph after the fine drawing to the corresponding position recorded in the step S5.
By adopting the method, the vector image can be firstly binarized and then the contours are extracted, then the contours are matched by using the template to realize grouping among the contours, after grouping, only the single unit in the group is required to be subjected to fine drawing, and after drawing of the single unit is completed, the graph of the unit is required to be copied into the corresponding unit at other positions, so that the graph drawing speed can be greatly improved.
In the step S1, the read vector image is a Gerber file.
The drawing method further comprises a step S8 of finely drawing the graphics which are not grouped in the step S4 to form a complete bitmap file, and if the contours extracted in the steps S3 and S4 are non-template contours, judging the graphics to be drawn on the PCB as non-conventional array graphics, wherein the partial graphics are not grouped in units at the moment, so that only the partial graphics can be individually finely drawn during drawing to form the complete bitmap file for printing by a photoetching machine.
The graphic drawing method further comprises a step S9 of acquiring alignment data, wherein the step S9 can be synchronously performed with the steps S1-S8 or positioned between any steps S1-S8. The aim of obtaining the alignment data is to accurately draw a circuit diagram on the PCB, and because the PCB is positioned by adopting a sucker during assembly, and deviations such as position, angle and even distortion exist, the alignment data is needed to be printed by a method after the printing position is determined during printing, and the alignment data can be determined by identifying a plurality of positioning points on the PCB through a camera.
In order to improve the drawing precision of the pattern, the drawing method also comprises real-time alignment monitoring, wherein in the drawing process of the pattern, the clock module is arranged, the exposure pattern is regularly identified through the camera and is transmitted to the drawing module for comparison so as to ensure the synchronous drawing process, if the identified exposure pattern is matched with the drawing template, the exposure is continued, and if the identified exposure pattern is not matched with the drawing template, an exposure abnormal signal is sent out.
Fig. 4 shows an array graphics rendering system according to the present invention, including:
the vector diagram reading module is used for identifying the vector diagram;
The binarization module is used for converting the vector image into a graph with higher contrast ratio, so that the outline can be conveniently extracted;
The contour extraction module is used for extracting clear contours after identifying the binarized patterns, so that contour grouping is convenient;
The profile matching module is used for comparing the extracted profile with the profile in the template library, identifying the profile which can be grouped, and recording the coordinates of the grouped units so as to facilitate the subsequent filling;
the drawing module is used for carrying out fine drawing on the specific units which are grouped by the units;
and the graph filling module is used for filling the unit after the fine drawing to a specific position according to the recorded coordinates and quantity, so as to realize the array filling of the fine drawing graph.
The system also comprises a graph verification module, wherein after the graph filling is completed, the graph verification module is used for verifying, comparing the graph with the graph identified by the vector graph, and drawing the graph which is not identified as the unit group and is subjected to the array filling so as to form a complete drawing graph.
The system also comprises an alignment module, wherein the alignment data is identified through the camera, and the alignment data is used as a reference to draw the graph.
The system also comprises a real-time monitoring module for identifying whether the exposed graph is consistent with the set drawing graph.
The real-time monitoring module comprises a camera acquisition unit, a clock unit and a comparison unit, wherein the camera acquisition unit is used for acquiring exposed patterns, the clock unit is used for acquiring camera data at regular time, the comparison unit is used for comparing the exposed patterns acquired by the camera with set drawing patterns, if the identified exposure patterns are matched with the set drawing patterns, exposure is continued, and if the identified exposure patterns are not matched with the set drawing patterns, an exposure abnormal signal is sent.
The invention processes the vector diagram to extract the cell array diagram in the vector diagram, and finely draws the cell grouping diagram, and then restores the cell grouping diagram to a bitmap which can be identified by the photoetching machine in a translation filling mode for the photoetching machine to expose.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (8)
1. An array pattern drawing method, comprising the steps of:
S1, performing S1; reading a vector diagram file;
s2, binarizing the vector image file;
s3, extracting the outline in the graph;
s4, matching the extracted contour with the contour in the template library;
S5, grouping the matched templates into units and recording the positions of the units;
s6, carrying out fine drawing on the unit grouping graph;
S7, filling the unit grouping graph after the fine drawing to the corresponding position recorded in the step S5;
In the step S1, the read vector diagram is a Gerber file;
the drawing method further comprises a step S8 of finely drawing the graphics which are not grouped in the step S4 to form a complete bitmap file.
2. The method of claim 1, further comprising the step of obtaining alignment data in step S9, wherein step S9 may be performed synchronously with steps S1-S8 or between any of steps S1-S8.
3. The method for drawing an array pattern according to claim 1 or 2, further comprising real-time alignment monitoring, wherein during drawing the pattern, a clock module is provided to periodically identify an exposure pattern by a camera and transmit the exposure pattern to a drawing module for comparison, so as to ensure synchronization of the drawing process, if the identified exposure pattern matches with a drawing template, exposure is continued, and if the identified exposure pattern does not match with the drawing template, an exposure abnormality signal is sent.
4. An array graphics rendering system, comprising:
The vector diagram reading module is used for identifying the vector diagram; the vector diagram is a Gerber file;
The binarization module is used for converting the vector image into a graph with higher contrast ratio, so that the outline can be conveniently extracted;
The contour extraction module is used for extracting clear contours after identifying the binarized patterns, so that contour grouping is convenient;
The profile matching module is used for comparing the extracted profile with the profile in the template library, identifying the profile which can be grouped, and recording the coordinates of the grouped units so as to facilitate the subsequent filling; the ungrouped graph is drawn in a refined mode, and a complete bitmap file is formed;
the drawing module is used for carrying out fine drawing on the specific units which are grouped by the units;
and the graph filling module is used for filling the unit after the fine drawing to a specific position according to the recorded coordinates and quantity, so as to realize the array filling of the fine drawing graph.
5. The system of claim 4, further comprising a pattern verification module for verifying the pattern after filling, comparing the pattern with the pattern identified by the vector pattern, and drawing the pattern which is not identified as the unit group and is filled by the array to form a complete drawing pattern.
6. An array graphics rendering system as claimed in claim 4 or 5, further comprising an alignment module for identifying alignment data by the camera, and performing graphics rendering using the alignment data as a reference.
7. An array pattern drawing system according to claim 4 or 5, further comprising a real-time monitoring module for identifying whether the exposed pattern is consistent with the set drawing pattern.
8. The system of claim 7, wherein the real-time monitoring module comprises a camera acquisition unit, a clock unit, and a comparison unit, wherein the camera acquisition unit is used for acquiring exposed patterns, the clock unit is used for periodically acquiring camera data, the comparison unit is used for comparing the exposed patterns acquired by the camera with a set drawing pattern, if the identified exposure pattern is matched with the set drawing pattern, exposure is continued, and if the identified exposure pattern is not matched with the set drawing pattern, an exposure abnormality signal is sent.
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CN104240245B (en) * | 2014-09-10 | 2017-06-27 | 中国科学院光电技术研究所 | Method for converting vector graphics into bitmap and performing self-adaptive segmentation |
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