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CN114009155A - Method for manufacturing electronic device - Google Patents

Method for manufacturing electronic device Download PDF

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Publication number
CN114009155A
CN114009155A CN202080047174.7A CN202080047174A CN114009155A CN 114009155 A CN114009155 A CN 114009155A CN 202080047174 A CN202080047174 A CN 202080047174A CN 114009155 A CN114009155 A CN 114009155A
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Prior art keywords
carrier substrate
forming
metallization
areas
metal
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CN202080047174.7A
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Chinese (zh)
Inventor
M.索博尔
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Giesecke and Devrient GmbH
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Giesecke and Devrient GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/162—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using laser ablation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Printing Methods (AREA)

Abstract

The invention relates to a method for manufacturing an electronic device (1, 2, 9), comprising providing a carrier substrate (3); sequentially applying aqueous cleaning ink droplets (4) to a carrier substrate (3) in first regions (5) forming a first pattern by means of a printing technique; applying a metallization (7, 8) to the carrier substrate, so that in the second regions (6) forming the second pattern, outside the first regions (5) forming the first pattern, metal (8) is deposited on the carrier substrate (3) in the form of a regular, continuous network of metal, wherein the first regions (5) forming the first pattern with the washing ink droplets (4) form regular islands inside the regular, continuous network of metal; depositing metal (7) over the washing drops (4) in a first zone (5) forming a first pattern; removing the rinsing ink droplets (4) in the first areas (5) and the metal (7) present on the first areas (5), so that the carrier substrate (3) obtained has the property that it has no metallization in the first areas (5) forming the first motif and has a transparent, conductive metallization in the second areas (6) forming the second motif, said metallization being in the form of a regular continuous network.

Description

Method for manufacturing electronic device
The present invention relates to a method for manufacturing an electronic device.
Electronic devices, in particular semiconductors, solar cells or electrodes, are obtained, for example, by means of lift-off methods known in the field of semiconductor manufacture. Structuring of the soluble coating is usually achieved in a lift-off process by exposing the soluble coating regionally and subsequently structuring the soluble coating in a further step. Methods for fine structuring of vapor-deposited materials are known in the literature, see for example the literature K.D.M.Rao, C.Hunger, R.Gupta, G.U.Kulkarni, M.Thelakkat, "A sheared polymer patterned metal network as a transmissive conductor for ITO-free organic substrates", Phys.chem.chem.Phys., 2014, Vol.16, p.15107-.
According to the above document, a coating is first applied to the film, which coating forms a large number of cracks when dried. These cracks form a dense, mesh-like, continuous network. In the subsequent vapor-diffusion of the material, the material is stored both on the coating (i.e. above) and in the cracks. In removing the coating, the vapor-infiltrated material above the coating is also removed, for example, by washing with a suitable solvent. Only the vapor-deposited material present in the crack lines is generally retained.
The article "Towards low-cost transformation electrodes" in Current opinion in Chemical Engineering,8:60-68 by Kulkarni et al, 5.2015, mentions an alternative for manufacturing transparent electrodes.
WO 2016/192858 a1 describes a further developed method for producing an electronic device, which is based on the idea of using the techniques known in the field of producing security elements for value documents for fine structuring of metallizations to provide electronic devices. The techniques mainly consist of the use of (photo) resist lacquers, the use of etching media and the use of washing inks (or inks capable of washing). According to the method described in WO 2016/192858 a1, a crack-forming coating is applied to a carrier substrate, the crack-forming coating is dried, wherein the coating, when dried, forms a multiplicity of cracks in the form of a dense, meshed, continuous network, and a metallization is applied to the carrier substrate, so that the metallic material is deposited on the carrier substrate within the cracks of the coating provided with cracks.
In the production described in WO 2016/192858 a1, the formation of cracks is effected statistically or randomly in the crack-forming coating applied before metallization, so that a metal network structure with a random metal wire profile and with a random network geometry is obtained depending on the material properties of the crack-forming coating, the drying parameters and the layer thickness of the crack-forming coating. A targeted metal wire profile cannot be achieved in the production method described in WO 2016/192858 a 1.
The object of the invention is to improve the production methods known from the prior art.
This object is achieved according to the invention by the combination of features defined in the independent claims. The invention is characterized in that it is provided with a plurality of design elements.
Summary of The Invention
(first aspect of the invention) a method for manufacturing an electronic device (1, 2, 9), comprising the steps of:
A) providing a carrier substrate (3);
B) sequentially applying aqueous cleaning ink droplets (4) to a carrier substrate (3) in first areas (5) forming a first pattern (or visual object) by a printing technique;
C) applying metallizations (7, 8) on the carrier substrate, thereby
-depositing metal (8) in the form of a regular, continuous network of metal on the carrier substrate (3) in the second areas (6) forming the second pattern, outside the first areas (5) forming the first pattern, wherein the first areas (5) forming the first pattern with the washing droplets (4) form regular islands inside the regular, continuous network of metal;
-depositing metal (7) over the washing drops (4) in a first zone (5) forming a first pattern;
D) removing the rinsing ink droplets (4) and the metal (7) present thereon in the first area (5), so that the carrier substrate (3) obtained has such properties that it:
-no metallisation in the first zones (5) forming the first motif;
-a transparent conductive metallization in the second areas (6) forming the second motif, said metallization being in the form of a regular continuous network.
(preferred embodiment) the method according to item 1, wherein step B) is carried out by means of a printing cylinder with a cell grid or a printing plate with a cell grid, i.e. the aqueous washing ink droplets (4) are applied in an orderly manner by means of a printing technique onto the carrier substrate (3) in the first areas (5) forming the first pattern, wherein the geometry of the metallizations produced in the method in the form of a regular continuous network is determined by appropriately selecting the parameters cell layout, cell geometry with respect to the plane dimensions, cell depth and web width.
(preferred embodiment) the method according to item 2, wherein the printing cylinder or printing plate has a plurality of different cell grid areas, wherein the cell grid areas differ in at least one of cell layout, cell geometry with respect to plane dimensions, cell depth and tab width, so that the metallization produced in the method in the form of a regular continuous network has a plurality of metallization areas corresponding to the plurality of different cell grid areas, said metallization areas having different transparency and/or conductivity.
(preferred embodiment) the method according to one of the items 1 to 3, wherein the aqueous cleaning ink droplets (4) in step B) are based on an aqueous cleaning ink with a binder, wherein the binder is preferably a polymer and the polymer is particularly preferably selected from the group consisting of hydroxyethylcellulose, hydroxypropylcellulose, carboxymethylcellulose, polyvinyl alcohol, in particular having a low molecular weight and a moderate degree of hydrolysis, polyvinylpyrrolidone, polyethylene glycol and casein.
(preferred embodiment) the method according to one of the items 1 to 4, wherein the drying of the aqueous washing ink droplets (4) applied to the carrier substrate (3) is carried out between steps B) and C).
(preferred embodiment) the method according to one of items 1 to 5, wherein, in step a), a film or a multilayer structure is provided as carrier substrate.
(preferred embodiment) the method according to one of items 1 to 6, wherein the carrier substrate provided in step a) is transparent.
(preferred embodiment) the method according to one of items 1 to 7, wherein the metallization in the form of a regular continuous network is subsequently removed in defined regions by means of a laser beam.
(preferred embodiment) the method according to one of items 1 to 8, wherein the line width of the regular continuous metallization network is selected such that the human eye cannot distinguish individual lines in a plane, but for the human eye, a distinction relative to the untreated carrier substrate can be recognized in both reflected light and transmitted light.
Detailed Description
The invention is based on the idea of using a technique known in the field of the production of security elements for value documents, which technique uses a cleaning ink, for the fine structuring of the metallization in order to provide an electronic device.
Security elements having a visually recognizable symbol in transmitted light and, if appropriate, also in reflected light are known. The symbols may have any form, such as numbers, letters, patterns, geometric or graphical views, etc., and are generally referred to as "negative fonts" regardless of their form. The security element is produced, for example, by providing a transparent substrate with a coating, typically a metal coating (or metallization), which is subsequently removed at defined locations. If the security element is directed to light, the areas with the metal or other coating appear dark. Conversely, the areas where the coating was removed appear bright or at least significantly brighter than the areas with the coating, depending on the transparency of the substrate. The more transparent the substrate, i.e. the more light transmissive, the more prominent the contrast between the coated and uncoated areas. In a very transparent substrate, negative fonts can be clearly recognized not only in transmitted light but also in reflected light.
In the evaporation process, the metal coating is formed substantially all over. In the simplest case, the hollow can be provided inside the metal coating by using a spacer or a shielding plate during the evaporation process. This measure only enables a roughly structured metallization. However, visually attractive security elements require a fine structuring. The finely structured metallization can be realized, for example, by a so-called cleaning method. In WO 99/13157 a1, a cleaning method is described in which a carrier film is printed in the form of a symbol with a printing ink having a high pigment content, a thin cover layer (for example made of aluminum) is applied and subsequently the printing ink and the cover layer lying above it are removed by cleaning with a liquid in order to produce a region in the form of a symbol without a coating.
WO 92/11142A 1 (corresponding to EP 0516790A 1) or its German priority application DE 4041025A 1 disclose printing inks which can be activated by the action of heat, for example wax-containing emulsions. On heating, this emulsion softens and thus reduces the adhesion to the carrier film, so that in these regions of poor adhesion, the softened printing ink and the layers lying thereon are removed with the aid of a mechanical treatment, for example ultrasound, brushing off or abrasion. Furthermore, inks with foaming additives, as are customary in the production of foams, are known as activatable printing inks. These blowing agents decompose the gas under the action of heat and produce a foam structure. The volume of the printing ink is thereby increased, the adhesion on the carrier film is thereby reduced and the layers lying above the printing ink bow outwards, so that they provide good points of action for mechanical removal.
WO 97/23357 a1 refers to EP 0516790 a1 and also discloses activatable printing inks which are activated, i.e. rinsed, by treatment with a suitable solvent.
The present invention is based on the recognition that in tests with cleaning ink compositions comprising solvents, the wetting of the carrier substrate which needs to be wetted becomes worse as the water content of the cleaning ink increases. Surprisingly, such a solubility state can be produced by a suitable choice of the water content, wherein the washing ink can be applied to the carrier substrate by printing techniques in the form of a somewhat vertical grid which, owing to the surface energy ratio, does not extend further. The printing cylinder used or the web (step) of the printing plate used separates the washing drops which are printed on the carrier substrate in a geometrically corresponding manner to the cells of the printing cylinder or printing plate. Followed by a metallization step. In a cleaning step, the cleaning ink drops and the metal lying thereon are jointly removed, and after the cleaning step, the printing cylinder or the webs of the printing plate correspond to the metal lines of the metal network.
In the cleaning step, the solubility of the binder, particularly the polymer, contained in the cleaning ink in the cleaning medium is utilized. The metal deposited on the area of the wash ink is removed in conjunction with the binder and other particles that may be contained in the wash ink during the washing process. A carrier substrate remains on which the metal network of the vapor deposition remains largely undamaged in regions that were not previously coated with the cleaning ink.
The geometry of the metal network produced in the process can be controlled by appropriate selection of the cell layout or grid, the cell geometry related to the planar dimensions (i.e. dimensions such as length and width of the respective cell in the plane of the printing plate or printing cylinder), the cell depth, the shape of the cell in depth and the tab width. The metal networks obtained according to the method according to the invention do not have a statistical or random network structure but rather have a defined metal network structure with a defined metal line width and a defined metal line structure. In this way, metal network structures having a freely selectable transparency and a freely selectable conductivity can be produced. Since the printing cylinder used or the printing form used can have a plurality of regions with different cell layouts and/or cell geometries, metal network structures having regions with different network properties, in particular different transparency and/or different conductivity, can be produced without problems.
As regards the adhesive contained in the washing ink, in principle one of the materials used in the prior art cited above in relation to the washing method is suitable. Polymers which have proven particularly advantageous for the process according to the invention have good solubility both in water and in organic solvents, usually alcohols and/or esters. Examples for such binders are hydroxyethyl cellulose, hydroxypropyl cellulose, carboxymethyl cellulose, especially polyvinyl alcohol having a low molecular weight and a moderate degree of hydrolysis, polyvinyl pyrrolidone, polyethylene glycol and casein.
The metal line widths that can be achieved at the end of the production process are preferably in the range from 1 μm to 50 μm, wherein the lines are usually so thin that they can only be recognized as lines when using a magnifying glass. In the plane, the human eye cannot resolve individual lines, but the human can recognize differences in both reflected light (or reflection) and transmitted light (or transmission) relative to an untreated or thicker carrier substrate. By varying island size
Figure BDA0003435590620000051
The reflectance or transmittance can be adjusted in an appropriate manner.
Compared to conventional, comprehensive and very thin metal layers with constant optical reflection and transmission (also referred to below as "translucent metallizations"), the metallized network structure according to the invention is advantageous in terms of a significantly higher chemical stability. The metal is present in the metal wire in a "normal" layer thickness, whereas conventional translucent metallizations are very thin and therefore susceptible to corrosion, in particular in the case of Al and Cu.
The metallizations according to the invention in the form of a regular, dense, meshed, continuous network exhibit an electrical conductivity and an optical transmission comparable to that of the full-surface ITO layer. In this case, the thin metal wires can be used in combination with conventional embossing lacquers, conventional primer compositions and conventional heat sealing lacquers and are used as reflectors here.
According to a preferred embodiment for producing an electronic device, aqueous cleaning ink droplets are applied in a first region of a carrier substrate, for example a glass substrate, a film or a multilayer structure, in a first pattern, in an ordered manner by means of a printing technique. The term "orderly" in this sense means that the individual cleansing ink droplets are regularly spaced. The application by printing technology can preferably be carried out by means of (engraved) intaglio printing plates which have individual cells at regular intervals
Figure BDA0003435590620000061
Alternatively, there may be individual cell groups, for example groups of seven hexagonally arranged cells, wherein the cell groups are regularly spaced from each other. Instead of the printing plate (Druckplatte), a printing cylinder may be used. The application of the metallization is then carried out such that, in the second regions forming the second pattern, outside the first regions forming the first pattern, metal is deposited on the carrier substrate in the form of a regular, continuous network of metal, wherein the first regions forming the first pattern with the washing ink droplets form regular islands inside the regular, continuous network of metal. Metal is deposited over the droplets of cleansing ink in the first areas forming the first pattern. The rinsing ink droplets in the first regions are then removed together with the metal present thereon, so that the carrier substrate obtained has the property that it has no metallization in the first regions forming the first motif and has a transparent, conductive metallization in the second regions forming the second motif, said metallization being in the form of a regular continuous network.
If required, the carrier substrate provided with the metal network structure can be provided in further regions with a continuous metallization, for example for electrical contacting. It is also possible to carry out the over-coating with a metal having a different colour than the metal of the metal network structure. In this case, the viewer may see the mixed color. In further processing, additional primer layers and/or heat seal lacquer layers may be used. Other optical effects, for example fluorescence, can also be achieved without problems by applying additional effect layers, since the reflectors used, i.e. the metal network structures, are present only on a partial surface.
The method for removing the washing ink is advantageously carried out by dissolution with a suitable solvent. For example, water, aqueous solutions, mixtures of solvents and water, optionally with surfactants, optionally with defoamers and further additives are used. Detachment or dissolution may also be assisted by nozzles or also mechanically by brushes, rollers or by felts. The choice of solvent is expediently adapted to the coating. The following solvents can generally be used in addition to water: methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methoxypropyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, methylene chloride, chloroform, toluene, xylene, methanol, ethanol, 2-propanol. In addition, acetals or mixtures of the abovementioned solvents may be used.
General description:
the metallization of the electronic device according to the invention may be based on a separate metal. Suitable metals are, for example, aluminum, silver, copper, nickel, iron, chromium, cobalt, gold, titanium, tin, zinc or alloys of one or more of the aforementioned elements (e.g. iron-silicon alloys). Furthermore, the metallization may be based on a multi-layer metallization, which may be obtained, for example, by stepwise vapor-diffusion plating. An advantageous multilayer metallization is, for example, a Cr layer, followed by an Al layer. The adhesion of the Al layer to the layer structure is improved by the Cr layer.
Furthermore, the conductivity of the metallization in the form of a regular, dense, meshed, continuous network according to the invention is improved by the additional application of a conductive polymer. Suitable as conductive polymers are, for example, conductive polymers based on thiophene, such as poly-3, 4-ethylenedioxythiophene (PEDOT or PEDT). Alternatively, inorganic, transparent and conductive layers, for example metal oxides, such as titanium dioxide, indium tin oxide or fluorine tin oxide, can be applied. These additional layers can also be used to controllably change the electrical properties, such as the work function, of the metallization according to the invention.
The transparent, conductive metallizations obtained in the production method according to the invention in the form of a regular, dense, meshed continuous network can subsequently be removed in defined regions by means of a laser beam (so-called laser demetallization). In this way, the transparent conductive metallization is structured, i.e. a recess or a demetallized region can be provided.
Further embodiments and advantages of the invention are explained below with reference to the drawings, which are not drawn to scale or are presented to scale in the figures of the drawing in order to improve the intuitiveness.
In the drawings:
fig. 1 shows a first electronic device according to the invention in 25 x magnification;
fig. 2 shows a first electronic device according to the invention in 100 x magnification;
fig. 3 shows a second electronic device according to the invention in 25 x magnification;
fig. 4 shows a second electronic device according to the invention in 100 x magnification; and is
Fig. 5 to 8 show the manufacture of an electronic device according to the invention.
Fig. 1 shows a photograph of a first electronic device 1 according to the invention in a 25-fold magnification in a top view. The electronic device is obtained by using a gravure printing plate having cells. The cleaning inks used for the application of aqueous cleaning ink droplets by printing technology are based on the adhesive polyvinylpyrrolidone. After the vapor diffusion of the metallization, for example an Ag layer, a step of rinsing with an aqueous rinsing solution is performed. Transparent, conductive metallizations in the form of a regular, continuous network remain on the carrier substrate, for example polyethylene terephthalate (PET). In fig. 1, an advantageous, targeted metal line profile can be identified, which represents the web of the intaglio printing plate used during production.
Fig. 2 shows a photograph of the first electronic device 1 according to the invention in a top view at 100 times magnification.
Fig. 3 shows a photograph of a second electronic device 2 according to the invention in a 25-fold enlargement in a top view. The electronic device 2 is obtained essentially in the same way as the electronic device 1 described above, wherein, in the case of the second electronic device 2 according to the invention, different intaglio printing plates with a higher web width are used in order to apply aqueous cleaning ink droplets by printing techniques.
Fig. 4 shows a photograph of a second electronic device 2 according to the invention in a top view at 100 times magnification.
Fig. 5 to 8 each illustrate the production according to the invention of an electronic device 9 in a cross-sectional view.
According to fig. 5, a carrier substrate 3, for example a polyethylene terephthalate (PET) film, is provided.
According to fig. 6, aqueous cleaning ink droplets 4 are applied to the carrier substrate 3 in the first regions 5 forming the first pattern in a sequential manner by printing technology. The second regions 6 forming the second motif are considered for the subsequent formation of transparent conductive metallizations in the form of a regular continuous network.
According to fig. 7, the metallizations 7, 8 are applied to the carrier substrate 3 such that in the second regions 6 forming the second motif, outside the first regions 5 forming the first motif, metal 8 is deposited on the carrier substrate 3 in the form of a regular, continuous network of metal, wherein the first regions 5 forming the first motif with the washing ink droplets 4 form regular islands inside the regular, continuous network of metal. In the first areas 5, where the first pattern is formed, metal 7 is deposited over the washing drops 4.
The rinsing ink droplets 4 in the first area 5 are subsequently removed together with the metal 7 present thereon.
Fig. 8 shows a product 9 of a manufacturing method according to the invention. The carrier substrate 3 obtained has the property that it has no metallisation in the first regions 5 forming the first motif and has transparent, conductive metallisation in the form of a regular continuous network in the second regions 6 forming the second motif.

Claims (9)

1. A method for manufacturing an electronic device (1, 2, 9), comprising the steps of:
A) providing a carrier substrate (3);
B) sequentially applying aqueous cleaning ink droplets (4) to a carrier substrate (3) in first regions (5) forming a first pattern by means of a printing technique;
C) applying metallizations (7, 8) on the carrier substrate, thereby
-depositing metal (8) in the form of a regular, continuous network of metal on the carrier substrate (3) in the second areas (6) forming the second pattern, outside the first areas (5) forming the first pattern, wherein the first areas (5) forming the first pattern with the washing droplets (4) form regular islands inside the regular, continuous network of metal;
-depositing metal (7) over the washing drops (4) in a first zone (5) forming a first pattern;
D) removing the rinsing ink droplets (4) and the metal (7) present thereon in the first area (5), so that the carrier substrate (3) obtained has such properties that it:
-no metallisation in the first zones (5) forming the first motif;
-a transparent conductive metallization in the second areas (6) forming the second motif, said metallization being in the form of a regular continuous network.
2. Method according to claim 1, wherein step B) of applying aqueous cleaning ink droplets (4) in a first region (5) forming the first pattern on the carrier substrate (3) by printing techniques in an orderly manner is carried out by means of a printing cylinder with a grid of cells or a printing plate with a grid of cells, wherein the geometry of the metallizations produced in the method in the form of a regular continuous network is determined by appropriately selecting the parameters of cell layout, cell geometry with respect to the planar dimensions, cell depth and web width.
3. A method according to claim 2, wherein the printing cylinder or plate has a plurality of different cell grid areas, wherein the cell grid areas differ in at least one of cell layout, cell geometry with respect to planar dimensions, cell depth and tab width, whereby the metallization produced in said method in the form of a regular continuous network has a plurality of metallization areas corresponding to said plurality of different cell grid areas, said metallization areas having different transparency and/or conductivity.
4. Method according to one of claims 1 to 3, wherein the aqueous cleaning ink droplets (4) in step B) are based on an aqueous cleaning ink having a binder, wherein the binder is preferably a polymer and the polymer is particularly preferably selected from the group consisting of hydroxyethylcellulose, hydroxypropylcellulose, carboxymethylcellulose, polyvinyl alcohol, in particular having a low molecular weight and a moderate degree of hydrolysis, polyvinylpyrrolidone, polyethylene glycol and casein.
5. Method according to one of claims 1 to 4, wherein the drying of the aqueous cleaning ink droplets (4) applied to the carrier substrate (3) is carried out between steps B) and C).
6. The method according to any one of claims 1 to 5, wherein in step A) a film or a multilayer structure is provided as a carrier substrate.
7. The method according to any one of claims 1 to 6, wherein the carrier substrate provided in step A) is transparent.
8. The method according to one of claims 1 to 7, wherein the metallization in the form of a regular continuous network is subsequently removed in defined regions by means of a laser beam.
9. The method according to one of claims 1 to 8, wherein the line width of the regular continuous metallization network is selected such that the human eye cannot distinguish individual lines in a plane, but for the human eye a distinction relative to the untreated carrier substrate is recognizable in both reflected light and transmitted light.
CN202080047174.7A 2019-08-02 2020-07-27 Method for manufacturing electronic device Pending CN114009155A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019005455.5A DE102019005455A1 (en) 2019-08-02 2019-08-02 Method of making an electronic device
DE102019005455.5 2019-08-02
PCT/EP2020/025347 WO2021023394A1 (en) 2019-08-02 2020-07-27 Method for producing an electronic device

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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