CN103996432A - Easy-to-print circuit board silver paste and preparation method thereof - Google Patents
Easy-to-print circuit board silver paste and preparation method thereof Download PDFInfo
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- CN103996432A CN103996432A CN201410167208.2A CN201410167208A CN103996432A CN 103996432 A CN103996432 A CN 103996432A CN 201410167208 A CN201410167208 A CN 201410167208A CN 103996432 A CN103996432 A CN 103996432A
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Abstract
An easy-to-print circuit board silver paste is made of the following raw materials by weight portion: 6-8 parts of saturated polyester resin, 3-5 parts of polyurethane resin, 0.1-0.2 parts of polytetrafluoroethylene wax, 3-5 parts of amyl acetate, 8-12 parts of silver-coated glass powder, 65-70 parts of ultrafine silver powder, 3-5 parts of glass powder, 4-6 parts of graphite, 7-10 parts of dimethylbenzene, 0.2-0.4 parts of rosin acid aluminum soap, 5-8 parts of propylene glycol, 1-2 parts of polyisobutene, 1-2 parts of aminopropyltriethoxysilane, 2-3 parts of dipropylene glycol butyl ether, 2-3 parts of capric acid, and 0.2-0.4 parts of fluorine-containing surfactant. Graphite is added to the silver paste of the invention, which increases the conductivity. The easy-to-print circuit board silver paste has good dispersion performance, good lubricity and good printing performance. Through the adding of the silver-coated glass powder, the silver paste has good wetting property and can be well combined with a circuit board, and the circuit board is durable and firm. An organic carrier of the silver paste is resistant to high temperature, the circuit can be kept in good condition before the glass powder is melt, and the yield of circuit board printing is high.
Description
Technical field
The invention belongs to electric slurry technical field, relate in particular to a kind of easily printed circuit board (PCB) silver slurry and preparation method thereof.
Background technology
In modern microelectronics industry, people require more and more higher to electronic devices and components, produce and adopt procedures, standardization to carry out reducing costs more, printed circuit board (PCB) (PCB) is exactly that this demand that is applicable to microelectronics industry is born, match with regard to the electric slurry such as conductor paste, electrode slurry, dielectric paste and resistance slurry, grout slurry and the printed circuit board (PCB) (PCB) of the new requirement of demand accordingly, the research of carrying out new conductor paste is also just imperative.
In general, the main component of electric slurry includes function mutually as metal, noble metal powder etc., and inorganic binder is as glass powder, oxide powder etc., organic binder bond, other solvent and additive.Conventionally, function in electric slurry plays electric action mutually, have good electric conductivity, is generally served as by metal dust or noble metal powder, conventional metal dust has copper powder, aluminium powder, zinc powder, nickel powder etc., and conventional precious metal powder has bronze, silver powder, platinum powder, palladium powder etc.Inorganic binder plays fixing electric slurry to base material, generally served as by oxide powder and glass powder, but this composition is lower at the proportion of electric slurry, and what have does not even have; Organic binder bond mainly plays a part to make slurry to have certain shape, is easy to printing or coating, mainly containing macromolecule resin, little molecule resin etc. serves as, along with this part effect in electric slurry of the progress of chemical industry technology is more and more outstanding, especially in the time being applied to silk screen printing, the composition that changes organic binder bond just can change the printing of electric slurry, dry, sintering character.
In existing electric slurry field, it is high that silver is that slurry has conductance, and stable performance, with the feature such as substrate bond strength is large, is widely used in the production of the electronic devices and components such as integrated circuit, multi-chip module, thin film switch.But silver is precious metal, cost is higher, and silver powder major part in existing silver paste is micron-sized powder, and thicknesses of layers, the printing performance etc. of its slurry of making has significant limitation for present high-end precision instrument; On the other hand, printed circuit board (PCB) adopted printing conductive copper slurry to make conducting wire more in the past, but it is easily oxidized to exist conductive copper paste, and in the useful life of having reduced printed circuit board (PCB), conductive copper paste can not be printed as meticulousr circuit.Therefore the size, shape, the kind that need to study metal dust in electrocondution slurry reduce costs, improve conductance to realize, improve the object of printing accuracy.
Binding agent in conductive silver paste has a significant impact for the rate of finished products of circuit printing, the such as volatility of viscosity, caking property, adhesive force, levelability, film forming, solvent etc. all can impact the printing performance of circuit, there is pore, the phenomenon such as open circuit, also there will be sometimes organic substance volatilized after glassy phase not yet start melt, the phenomenon that causes conducting wire to come off from stock, scraps conducting wire, and therefore the performance need of organic binder bond improves.
At present a lot of inorganic binders adopt glass dust, glass dust is made up of the material such as metal oxide, silica, if fusing point is too high, also occur organic substance volatilized after glassy phase not yet start melt, the phenomenon that causes the conducting wire being obtained by conductive silver paste to come off from stock, scraps conducting wire; And in current glass dust, much contain the harmful substances such as plumbous, and unfavorable to environment, therefore need to develop the glass dust that performance is more excellent.
Summary of the invention
The object of the present invention is to provide a kind of easily printed circuit board (PCB) silver slurry and preparation method thereof, this silver slurry is dispersed, lubrification is good, good conductivity, and printing performance is good, and circuit board printing rate of finished products is high.
Technical scheme of the present invention is as follows:
An easily printed circuit board (PCB) silver slurry, is characterized in that being made up of the raw material of following weight portion: saturated polyester resin 6-8, polyurethane resin 3-5, polytetrafluoroethylene wax 0.1-0.2, amyl acetate 3-5, silver bag glass dust 8-12, super fine silver powder 65-70, glass dust 3-5, Graphene 4-6, dimethylbenzene 7-10, rosin acid aluminium soap 0.2-0.4, propylene glycol 5-8, polyisobutene 1-2, aminopropyl triethoxysilane 1-2, DPG n-butyl ether 2-3, capric acid 2-3, fluorine-containing surfactant 0.2-0.4;
Described glass dust is made up of the raw material of following weight portion: bismuth telluride 15-17, Si0
216-19, Bi
20
37-9, BaO5-8, Al
20
33-5, B
2o
317-23, V
2o
54-7, Na
2o1-2, nano aluminum nitride powder 1-2; Preparation method is: by bismuth telluride, Si0
2, Bi
20
3, BaO, Al
20
3, B
2o
3, V
2o
5, Na
2o mixes, put into crucible and become liquid 1100-1400 DEG C of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 9-13 μ m powder, to obtain final product.
The preparation method of described easy printed circuit board (PCB) silver slurry, is characterized in that comprising the following steps:
(1) amyl acetate, dimethylbenzene, propylene glycol, polyisobutene, aminopropyl triethoxysilane, DPG n-butyl ether, capric acid are mixed, add saturated polyester resin, polyurethane resin, be heated to 78-82 DEG C, being stirred to resin all dissolves, add again polytetrafluoroethylene wax to stir, with 500 object gauzes filtrations, remove impurity and obtain organic carrier;
(2) silver is wrapped to glass dust, glass dust, fluorine-containing surfactant mixing, under 5000-7000 rev/min of stirring, add Graphene, stir 10-20 minute, add again super fine silver powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 30-40 minute, ultrasonic dispersion 6-8 minute, obtains uniform slurry again;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.06-0.09MPa, and the deaeration time is 6-9 minute, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 10000-20000 centipoise, to obtain final product.
Beneficial effect of the present invention
Silver slurry of the present invention has added Graphene, increase electric conductivity, and dispersed, lubrification is good, printing performance is good, by adding silver bag glass dust, wetability, with the excellent bonding performance of circuit board, circuit board is solid firm, and this glass dust contains nano aluminum nitride powder, and heat conduction is fast, fusing is fast, is easy to circuit curing molding; Organic carrier of the present invention is more high temperature resistant, can be in holding circuit before glass dust fusing intact, circuit board printing rate of finished products is high.
Embodiment
A kind of easily printed circuit board (PCB) silver slurry, by following weight portion (kilogram) raw material make: saturated polyester resin 7, polyurethane resin 4, polytetrafluoroethylene wax 0.1, amyl acetate 4, silver bag glass dust 10, super fine silver powder 67, glass dust 4, Graphene 5, dimethylbenzene 8, rosin acid aluminium soap 0.3, propylene glycol 7, polyisobutene 1.5, aminopropyl triethoxysilane 1.5, DPG n-butyl ether 2.5, capric acid 2.5, fluorine-containing surfactant 0.3;
Described glass dust by following weight portion (kilogram) raw material make: bismuth telluride 16, Si0
217, Bi
20
38, BaO7, Al
20
34, B
2o
320, V
2o
56, Na
2o1.5, nano aluminum nitride powder 1.5; Preparation method is: by bismuth telluride, Si0
2, Bi
20
3, BaO, Al
20
3, B
2o
3, V
2o
5, Na
2o mixes, put into crucible and become liquid 1300 DEG C of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.13MPa, and the deaeration time is 7 minutes, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 11 μ m powder, to obtain final product.
The preparation method of described easy printed circuit board (PCB) silver slurry, comprises the following steps:
(1) amyl acetate, dimethylbenzene, propylene glycol, polyisobutene, aminopropyl triethoxysilane, DPG n-butyl ether, capric acid are mixed, add saturated polyester resin, polyurethane resin, be heated to 80 DEG C, being stirred to resin all dissolves, add again polytetrafluoroethylene wax to stir, with 500 object gauzes filtrations, remove impurity and obtain organic carrier;
(2) silver is wrapped to glass dust, glass dust, fluorine-containing surfactant mixing, under 6000 revs/min of stirrings, add Graphene, stir 15 minutes, add again super fine silver powder, stir 15 minutes, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 35 minutes, ultrasonic dispersion 7 minutes, obtains uniform slurry again;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.07MPa, and the deaeration time is 8 minutes, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 15000 centipoises, to obtain final product.
Test data:
The silver slurry mode of silk screen printing that the present embodiment is obtained is printed onto on PCB circuit board, is then warming up at 630 DEG C and solidifies and form conducting wire in 6 minutes, thereby obtain conducting wire plate.The wiring width that records conducting wire is 0.6mm, average film thickness 5 μ m, and wire distribution distance is 0.9mm, resistivity is 4.4 × 10
-5Ω m.
Producing in the manner described above 1000 of conducting wire plates in batches, is combined well with PCB circuit board in conducting wire, and svelteness continuously, does not have the conducting wire of circuit board to come off from stock, rate of finished products 100%.
Claims (2)
1. an easy printed circuit board (PCB) silver slurry, is characterized in that being made up of the raw material of following weight portion: saturated polyester resin 6-8, polyurethane resin 3-5, polytetrafluoroethylene wax 0.1-0.2, amyl acetate 3-5, silver bag glass dust 8-12, super fine silver powder 65-70, glass dust 3-5, Graphene 4-6, dimethylbenzene 7-10, rosin acid aluminium soap 0.2-0.4, propylene glycol 5-8, polyisobutene 1-2, aminopropyl triethoxysilane 1-2, DPG n-butyl ether 2-3, capric acid 2-3, fluorine-containing surfactant 0.2-0.4;
Described glass dust is made up of the raw material of following weight portion: bismuth telluride 15-17, Si0
216-19, Bi
20
37-9, BaO5-8, Al
20
33-5, B
2o
317-23, V
2o
54-7, Na
2o1-2, nano aluminum nitride powder 1-2; Preparation method is: by bismuth telluride, Si0
2, Bi
20
3, BaO, Al
20
3, B
2o
3, V
2o
5, Na
2o mixes, put into crucible and become liquid 1100-1400 DEG C of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 9-13 μ m powder, to obtain final product.
2. the preparation method of easy printed circuit board (PCB) silver slurry according to claim 1, is characterized in that comprising the following steps:
(1) amyl acetate, dimethylbenzene, propylene glycol, polyisobutene, aminopropyl triethoxysilane, DPG n-butyl ether, capric acid are mixed, add saturated polyester resin, polyurethane resin, be heated to 78-82 DEG C, being stirred to resin all dissolves, add again polytetrafluoroethylene wax to stir, with 500 object gauzes filtrations, remove impurity and obtain organic carrier;
(2) silver is wrapped to glass dust, glass dust, fluorine-containing surfactant mixing, under 5000-7000 rev/min of stirring, add Graphene, stir 10-20 minute, add again super fine silver powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 30-40 minute, ultrasonic dispersion 6-8 minute, obtains uniform slurry again;
(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.06-0.09MPa, and the deaeration time is 6-9 minute, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 10000-20000 centipoise, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410167208.2A CN103996432B (en) | 2014-04-24 | 2014-04-24 | A kind of easily printed circuit board (PCB) silver slurry and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410167208.2A CN103996432B (en) | 2014-04-24 | 2014-04-24 | A kind of easily printed circuit board (PCB) silver slurry and preparation method thereof |
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| CN103996432A true CN103996432A (en) | 2014-08-20 |
| CN103996432B CN103996432B (en) | 2016-11-16 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104200875A (en) * | 2014-09-11 | 2014-12-10 | 宁波市加一新材料有限公司 | Low-silver-content graphene composite conductive silver paste and preparation method thereof |
| CN104538085A (en) * | 2015-01-08 | 2015-04-22 | 安徽凤阳德诚科技有限公司 | Environment-friendly conductive silver paste |
| CN104934093A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Nano silver powder PCB conductive silver paste and preparation method thereof |
| CN104934099A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Printed circuit board silver paste with low silver content and preparation method thereof |
| CN105976893A (en) * | 2016-06-22 | 2016-09-28 | 中国科学院宁波材料技术与工程研究所 | Lead-free graphene/nano-silver composite electronic silver paste and preparation method thereof |
| CN106486210A (en) * | 2016-10-17 | 2017-03-08 | 浙江凯盈新材料有限公司 | A kind of method improving the linear depth-width ratio of electrocondution slurry silk screen printing |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN113636869A (en) * | 2021-09-08 | 2021-11-12 | 合肥邦诺科技有限公司 | Screen printing slurry of aluminum nitride ceramic substrate and metallization method |
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| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN102262918A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| KR20130123848A (en) * | 2012-05-04 | 2013-11-13 | 삼성전기주식회사 | Conductive resin composition, multi layer ceramic capacitor having the same and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101937737A (en) * | 2010-09-27 | 2011-01-05 | 彩虹集团公司 | Low-temperature curing conductive slurry and preparation method thereof |
| CN102262918A (en) * | 2011-07-19 | 2011-11-30 | 彩虹集团公司 | Grout silver paste used in PCB and preparation method thereof |
| KR20130123848A (en) * | 2012-05-04 | 2013-11-13 | 삼성전기주식회사 | Conductive resin composition, multi layer ceramic capacitor having the same and manufacturing method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104200875A (en) * | 2014-09-11 | 2014-12-10 | 宁波市加一新材料有限公司 | Low-silver-content graphene composite conductive silver paste and preparation method thereof |
| CN104538085A (en) * | 2015-01-08 | 2015-04-22 | 安徽凤阳德诚科技有限公司 | Environment-friendly conductive silver paste |
| CN104934093A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Nano silver powder PCB conductive silver paste and preparation method thereof |
| CN104934099A (en) * | 2015-05-25 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Printed circuit board silver paste with low silver content and preparation method thereof |
| CN105976893A (en) * | 2016-06-22 | 2016-09-28 | 中国科学院宁波材料技术与工程研究所 | Lead-free graphene/nano-silver composite electronic silver paste and preparation method thereof |
| CN106486210A (en) * | 2016-10-17 | 2017-03-08 | 浙江凯盈新材料有限公司 | A kind of method improving the linear depth-width ratio of electrocondution slurry silk screen printing |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
| CN113636869A (en) * | 2021-09-08 | 2021-11-12 | 合肥邦诺科技有限公司 | Screen printing slurry of aluminum nitride ceramic substrate and metallization method |
| CN113636869B (en) * | 2021-09-08 | 2022-11-29 | 合肥邦诺科技有限公司 | Screen printing slurry of aluminum nitride ceramic substrate and metallization method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103996432B (en) | 2016-11-16 |
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Effective date of registration: 20210525 Address after: No.18-91, Gongye Road, South Taihu high tech Industrial Park, Wuxing District, Huzhou City, Zhejiang Province Patentee after: Zhejiang julibao Textile Technology Co., Ltd Address before: 242800 Matang Industrial Park, Dingqiao Town, Qingyang County, Chizhou City, Anhui Province Patentee before: ANHUI WEIMIN MAGNETIC TECHNOLOGY Co.,Ltd. |
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