CN103984062A - Photoelectric module and packaging technology for photoelectric module - Google Patents
Photoelectric module and packaging technology for photoelectric module Download PDFInfo
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- CN103984062A CN103984062A CN201310050110.4A CN201310050110A CN103984062A CN 103984062 A CN103984062 A CN 103984062A CN 201310050110 A CN201310050110 A CN 201310050110A CN 103984062 A CN103984062 A CN 103984062A
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Abstract
Disclosed are a photoelectric module and a packaging technology for the photoelectric module. The photoelectric module includes a first substrate, a photoelectric conversion element, an optical waveguide layer and a light guiding element. The first substrate is provided with at least one ladder groove structure. Each ladder groove structure includes a first groove, a second groove and a reflecting face. Each first groove has a first depth. Each second groove has a second depth which is larger than the first depth. Each reflecting face is located at one end of a corresponding first groove. The photoelectric conversion element is used for transmitting a light signal to a corresponding reflecting face or receiving a light signal via the reflecting face. The light waveguide layer is arranged in a corresponding first groove. The light guiding element is configured in a corresponding second groove. The light waveguide layer and the light guiding element are used for transmitting light signals and the center position of the light waveguide layer is mutually corresponding to the center position of the light guiding element.
Description
Technical field
The present invention relates to a kind of optical-electric module, and be particularly related to a kind of packaging technology of optical-electric module and optical-electric module for optical communication.
Background technology
Optical communication is to utilize the conversion of light/electricity and the effect that reaches transmission of signal.Conventionally, be provided with an optical-electric module (being called light active member) at transmitting terminal, to transfer electric signal to light signal, and light signal transmits between transmitting terminal and receiving end by optical fiber (being called light passive device) or other light-guide devices, and be provided with another optical-electric module at receiving end, to transfer light signal to electric signal.
At transmitting terminal, the light intensity that optical-electric module provides and coupling efficiency determine transmission quality and the distance of light signal at optical fiber, therefore select the photo-electric conversion element that luminous intensity is strong, the light angle of divergence is less, can reach the light intensity and the coupling efficiency that promote optical-electric module.
But optical-electric module, in capping process, is only merely fixed on optical fiber on substrate with cover plate, conventionally cannot confirms whether optical fiber is aimed at photo-electric conversion element really, thereby affect intensity and the coupling efficiency of optical signal transmission.Therefore, keeping the intensity of light signal, and maintain the correctness of light signal in the process how to transmit at light signal, is important topic quite deeply concerned in optical communication industry.
Summary of the invention
The object of the present invention is to provide the packaging technology of a kind of optical-electric module and optical-electric module, can improve the quality of optical communication.
According to an aspect of the present invention, propose a kind of optical-electric module, comprise a first substrate, a photo-electric conversion element, a light waveguide-layer and a light-guide device.First substrate has at least one step groove structure, and each step groove structure comprises one first groove, one second groove and a reflecting surface.The first groove has one first degree of depth.The second groove has second degree of depth that is greater than first degree of depth.Reflecting surface is positioned at one end of the first groove.Photo-electric conversion element receives a light signal in order to launch a light signal to reflecting surface or via reflecting surface.Light waveguide-layer is arranged in the first groove, in order to transmitting optical signal.Light-guide device is disposed in the second groove, and wherein light waveguide-layer and light-guide device be in order to transmitting optical signal, and the center of light waveguide-layer and the center of light-guide device mutually corresponding.
According to an aspect of the present invention, propose a kind of packaging technology of optical-electric module, comprise the following steps.One first substrate of etching for the first time, to form one first groove in first substrate, the first groove has one first degree of depth.Etching first substrate for the second time, to form the second groove on the position in second etch, the second groove has second degree of depth that is greater than first degree of depth.Form a light waveguide-layer in the first groove.One light-guide device is arranged in the second groove.One photo-electric conversion element is provided, and in order to transmitting or receive a light signal, wherein light waveguide-layer and light-guide device be in order to transmit this light signal, and the center of light waveguide-layer and the center of light-guide device mutually corresponding.
According to an aspect of the present invention, propose a kind of packaging technology of optical-electric module, comprise the following steps.Etching one first substrate, to form a groove in first substrate.Form a coating layer in groove, so that groove has stepped profile, and trench area is divided into one first groove and one second groove that the degree of depth is different.Form a light waveguide-layer on coating layer, and be arranged in the first groove.One light-guide device is arranged in the second groove.One photo-electric conversion element is provided, and in order to transmitting or receive a light signal, wherein light waveguide-layer and light-guide device be in order to transmitting optical signal, and the center of light waveguide-layer and the center of light-guide device mutually corresponding.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Brief description of the drawings
Fig. 1 illustrates the schematic diagram according to the step groove structure of an embodiment;
Fig. 2 A～Fig. 2 C illustrates the cross-sectional schematic of the second groove;
Fig. 3 A～Fig. 3 E illustrates the cross-sectional schematic of the first groove;
Fig. 4 A and Fig. 4 B illustrate respectively the cross-sectional schematic according to the optical-electric module of an embodiment;
Fig. 5 A and Fig. 5 B illustrate the schematic diagram according to the optical-electric module of another embodiment of the present invention;
Fig. 6 illustrates the schematic diagram according to the optical-electric module of another embodiment of the present invention;
Fig. 7 illustrates the schematic diagram according to the optical-electric module of another embodiment of the present invention;
Fig. 8 A～Fig. 8 F illustrates the process flow diagram of the packaging technology of optical-electric module in the first embodiment;
Fig. 9 A～Fig. 9 F illustrates the process flow diagram of the packaging technology of optical-electric module in the first embodiment;
Figure 10 A～Figure 10 E illustrates the process flow diagram of the packaging technology of optical-electric module in the 3rd embodiment.
Wherein, Reference numeral
100～103: optical-electric module
109: depression
110: first substrate
111: step groove structure
111 ': groove
112: reflecting surface
113: the first grooves
114: the first surface levels
115: the second grooves
116: vertical plane
116 ': inclined-plane
117: stepped profile
118: the second surface levels
120: photo-electric conversion element
121,122: electrode
123: wire
130: light waveguide-layer
131: the first end faces
132: glue-line
133: dielectric materials layer
134: coating layer
140: light-guide device
141: core
142: big envelope portion
143: the second end faces
150: second substrate
152: storage tank
W1: width
W2: width
L: light signal
H: highly
θ: angle
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are described in detail:
The optical-electric module of the present embodiment and packaging technology thereof, be on first substrate, to form at least single order ladder groove structure, and in step groove structure, be formed with a light waveguide-layer.Each step groove structure has the first groove and second groove of predetermined depth, be greater than the degree of depth of the first groove by the degree of depth of the second groove, the second groove can be as the supporting part of optical fiber or other light-guide devices or blocking part, and the contraposition part that the first groove can be used as light waveguide-layer and light-guide device contraposition, so that the center of light waveguide-layer and the center of light-guide device are mutually corresponding.
Please also refer to Fig. 1, it illustrates the schematic diagram according to the step groove structure 111 of an embodiment.The step groove structure 111 of multiple strips is formed on first substrate 110, and is arranged in parallel with each other along X-direction.In each step groove structure 111, a configurable optical fiber or other light-guide devices 140(are referring to Fig. 2 A～Fig. 2 C), the quantity of optical fiber is more, and port number and the transmission quantity of light signal L are more, relatively increase frequency range and the speed of signal transmission.In step groove structure 111, supporting part with darker the second groove 115 of the degree of depth as optical fiber or other light-guide devices 140, the second groove 115 is for example dovetail groove (as shown in Figure 2 A), V-shaped groove (as shown in Figure 2 B) or deep-slotted chip breaker (as shown in Figure 2 C), but not as limit.In principle, the size of the second groove 115 must can receiving optical fiber or other light-guide devices 140, for example 60～80 microns of its degree of depth, be preferably be greater than light-guide device 140 diameter 1/2 or 2/3, but not as limit.
In addition, in Fig. 1, in Z-direction, though illustrate the width W 2 that the width W 1 of the first groove 113 is less than the second groove 115 relatively, not as limit.In another embodiment, the width W 1 of the first groove 113 can equal the width W 2 of the second groove 115.
Then, as shown in Fig. 3 A～Fig. 3 D, the contraposition part of using as light waveguide-layer 130 and above-mentioned light-guide device 140 contrapositions with the first more shallow groove 113 of the degree of depth, its degree of depth is for example 20～40 microns.The first groove 113 is for example dovetail groove (as shown in Figure 3A), V-shaped groove (as shown in Figure 3 B), deep-slotted chip breaker (as shown in Figure 3 C) or rectangular channel (as shown in Figure 3 D), but not as limit.Light waveguide-layer 130 is for example formed in the first groove 113 in the mode of vapour deposition, coating, wire mark or spray printing, and its material can be the dielectric material (for example silicon dioxide, silicon nitride) of macromolecular material (for example polymer or polyimide) or high index of refraction.The cross sectional shape of light waveguide-layer 130 can be square (as shown in Figure 3A), rectangle, triangle (as shown in Figure 3 B), cheese (as shown in Figure 3 C) or trapezoid (as shown in Figure 3 D) etc., but the present invention is not as limit.
In addition, as shown in Fig. 3 E, more can form the dielectric materials layer 133 of a low-refraction in the first groove 113, and dielectric materials layer 133 inserts and fill up in the space between light waveguide-layer 130 and first substrate 110, its material is for example silicon dioxide or silicon nitride.For instance: the refractive index of dielectric materials layer 133 is 1.45, the refractive index of light waveguide-layer 130 is 1.58, and the refractive index of air is 1, and the refractive index of dielectric materials layer 133 is less than the refractive index of light waveguide-layer 130, but is greater than the refractive index of air.
Below propose the optical-electric module 100～103 of various embodiment, and be elaborated, embodiment, in order to as example explanation, is not only the scope in order to limit wish protection of the present invention.
The first embodiment
Please refer to Fig. 4 A and Fig. 4 B, it illustrates respectively the cross-sectional schematic according to the optical-electric module 100 of an embodiment.Optical-electric module 100 comprises a first substrate 110, a photo-electric conversion element 120, a light waveguide-layer 130 and a light-guide device 140.Photo-electric conversion element 120 is for example arranged to cover brilliant mode on the electrode 121 of first substrate 110, and relative with reflecting surface 112, in order to transmitting or reception one light signal L.Wherein, reflecting surface 112 is a dip plane, the light signal L of transmitting terminal can be reflexed to light-guide device 140 via reflecting surface 112, to carry out transmitting optical signal L to receiving end by light waveguide-layer 130 and light-guide device 140.Equally, at the optical-electric module of receiving end, also can utilize above-mentioned reflecting surface, light signal L be reflexed to the photo-electric conversion element of receiving end, with receiving optical signals L.
The first groove 113 and the second groove 115 that utilize the step groove structure 111 of above-mentioned introduction to have, can make the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding.As shown in Fig. 4 A and Fig. 4 B, step groove structure 111 has a reflecting surface 112 and a stepped profile 117.Stepped profile 117 comprises the first surface level 114, one second surface level 118 and the vertical plane 116(Fig. 4 A between the first surface level 114 and the second surface level 118 of a connection reflecting surface 112) or an inclined-plane 116 ' (Fig. 4 B).The position of the first surface level 114 is corresponding to the first groove 113 of Fig. 1, and the position of the second surface level 118 is corresponding to the second groove 115 of Fig. 1, and the first surface level 114 is higher than the second surface level 118, to form the first groove 113 and second groove 115 of different depth.
Reflecting surface 112 correspondences are positioned at one end of the first groove 113, and and the first surface level 114 between there is an angle theta, this angle theta for example 15～75 degree.In one embodiment, for example, if form the semiconductor substrate (silicon substrate) of reflecting surface 112 with wet etching, the angle theta between reflecting surface 112 and the first surface level 114 can be 45 degree or 54.7 degree, but not as limit.
In Fig. 4 A and Fig. 4 B, light-guide device 140 is for example glass optical fiber, fiber optic fibers, plastic or homologue, the big envelope portion 142 that it has a core 141 and is coated on core 141 peripheries, and the refractive index of big envelope portion 142 is lower than the refractive index of core 141.The present embodiment is by step groove structure 111, light waveguide-layer 130 is alignd with the core 141 at light-guide device 140 centers, light signal L the center of light waveguide-layer 130 equated haply, so that can directly transfer to core 141 by light waveguide-layer 130 with the height H of the center of light-guide device 140.Therefore, in the process transmitting at light signal L, energy loss reduces, thus can keep the intensity of light signal L, and can increase coupling efficiency, and then improve the quality of optical communication.
In addition, light waveguide-layer 130 has one first end face 131, and the core 141 of light-guide device 140 has one second end face 143, and the first end face 131 is adjacent to the second end face 143.Therefore, almost enter the second end face 143 completely by the light signal L of the first end face 131, therefore can increase coupling efficiency.In the present embodiment, the area of the first end face 131 can be less than or equal to the area of the second end face 143.For example: the area of the first end face 131 is about 90%～80% left and right of the area of the second end face 143, but not as limit.
Fig. 4 A and Fig. 4 B difference are: in Fig. 4 B, inclined-plane 116 ' is between the first surface level 114 and the second surface level 118, distance between the first end face 131 and the second end face 143 is strengthened, but because light waveguide-layer 130 aligns with the core 141 at light-guide device 140 centers or mutually mates, therefore can not affect coupling efficiency.In addition, optical-electric module 100 more comprises a glue-line 132, it is for example epoxy resin, it fills in the space between light waveguide-layer 130 and light-guide device 140, this glue-line 132 can be in the process of capping, be engaged between first substrate 110 and cover plate (not illustrating), so that light-guide device 140 is fixed on first substrate 110.In addition, the refractive index of glue-line 132 is greater than the refractive index of air, can make the refractive index between light waveguide-layer 130 and surrounding medium reduce, to avoid light signal loss.
The second embodiment
Then, please refer to Fig. 5 A and Fig. 5 B, it illustrates the schematic diagram according to the optical-electric module 101 of another embodiment of the present invention.Similarly, the first groove 113 and the second groove 115 that the present embodiment utilizes the step groove structure 111 of above-mentioned introduction to have, make the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding, that is to say, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 centers or mutually mates, so that the center of light waveguide-layer 130 equates haply with the height H of the center of light-guide device 140.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment is only with above-described embodiment difference: photo-electric conversion element 120 is arranged on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112.Photo-electric conversion element 120 is for example electrically connected with the electrode 122 being arranged on first substrate 150 in the mode of wire bonds.As shown in Fig. 5 A and Fig. 5 B, second substrate 150 has a storage tank 152, and first substrate 110 is selectively provided with a depression 109 corresponding to storage tank 152.The position of depression 109 is corresponding with the position of the wire of wire bonds 123.Depression 109 can increase the routing height between storage tank 152 and first substrate 110, to admit of the wire 123 of larger elastic space for wire bonds.In addition, the routing height increasing by depression 109, first substrate 110 can shorten relatively with the distance between second substrate 150, and then shortens the vertical light path of light signal L, reduces light signal L loss.
The 3rd embodiment
Then, please refer to Fig. 6, it illustrates the schematic diagram according to the optical-electric module 102 of another embodiment of the present invention.The first groove 113 and the second groove 115 that the present embodiment utilizes the step groove structure 111 of above-mentioned introduction to have equally, make the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding, that is to say, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 centers or mutually mates, and the center of light waveguide-layer 130 is equated haply with the height H of the center of light-guide device 140.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment and above-described embodiment difference are: optical-electric module 102 comprises a coating layer 134, it is formed in the groove 111 ' (please refer to Figure 10 A) of a predetermined depth of first substrate 110, so that groove 111 ' has stepped profile, and different the first surface level 114 and the second surface levels 118 of height of formation, namely form as the above-mentioned step groove structure 111 with the first groove 113 and the second groove 115 of introducing.
Coating layer 134 is for example the dielectric material of low-refraction, and its material can be silicon dioxide or silicon nitride.For instance: the refractive index of coating layer 134 is 1.45, the refractive index of light waveguide-layer 130 is 1.58, and the refractive index of coating layer 134 is less than the refractive index of light waveguide-layer 130, but is greater than the refractive index of air.
The 4th embodiment
Then, please refer to Fig. 7, it illustrates the schematic diagram according to the optical-electric module 103 of another embodiment of the present invention.The present embodiment is identical with the configuration mode of the second embodiment, and photo-electric conversion element 120 is arranged on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment and the second embodiment difference are: optical-electric module 103 comprises a coating layer 134, it is formed in the groove of a predetermined depth of first substrate 110, so that groove has stepped profile, and different the first surface level 114 and the second surface levels 118 of height of formation, namely form as the above-mentioned step groove structure 111 with the first groove 113 and the second groove 115 of introducing, make the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding, that is to say, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 centers or mutually mates, the center of light waveguide-layer 130 is equated haply with the height H of the center of light-guide device 140.
For the packaging technology of the optical-electric module of different embodiment, be elaborated below, embodiment is only in order to as example explanation, not in order to the scope of limit wish protection of the present invention.
Please refer to Fig. 8 A～Fig. 8 F and Fig. 9 A～Fig. 9 F, it illustrates the process flow diagram of the packaging technology of optical-electric module 100 in the first embodiment.First, in Fig. 8 A and Fig. 9 A, providing a first substrate 110, for example, is silicon substrate or other semiconductor substrates.Then,, in Fig. 8 B and Fig. 9 B, for example, in the mode of wet etching, form the first groove 113 of a predetermined depth in first substrate 110, and the reflecting surface 112 that forms an inclination is in one end of the first groove 113.The degree of depth of the first groove 113 is for example 20～40 microns.Then, in Fig. 8 C and Fig. 9 C, form the second groove 115 of a predetermined depth in first substrate 110, namely on the position of second etch, form the second darker groove 115 of the degree of depth.The degree of depth of the second groove 115 is for example 60～80 microns.Therefore, can form a ladder groove structure 111 in first substrate 110.
In Fig. 8 C, for example, in the mode of dry ecthing, form a vertical plane 116 between the first surface level 114 and the second surface level 118.Or, in Fig. 9 C, for example, in the mode of wet etching, form an inclined-plane 116 ' between the first surface level 114 and the second surface level 118.
Then,, in Fig. 8 D and Fig. 9 D, form a light waveguide-layer 130 in the first groove 113.In Fig. 8 E and Fig. 9 E, a photo-electric conversion element 120 is arranged on first substrate 110, and relative with reflecting surface 112.Or, in another embodiment, photo-electric conversion element 120 can be disposed on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112, the optical-electric module 101 as described in the second embodiment.
Then, in Fig. 8 F and Fig. 9 F, a light-guide device 140 is arranged in the second groove 115, wherein the center of light waveguide-layer 130 is mutually corresponding with the center of light-guide device 140.
In addition, in Fig. 9 F, more can form in the space of a glue-line 132 between light waveguide-layer 130 and light-guide device 140.
Then, please refer to Figure 10 A～Figure 10 E, it illustrates the process flow diagram of the packaging technology of optical-electric module 102 in the 3rd embodiment.First,, in Figure 10 A, for example, in the mode of wet etching, form the groove 111 ' of a predetermined depth in first substrate 110, and form a reflecting surface 112 in one end of groove 111 '.The degree of depth of groove 111 ' is for example 60～80 microns.Then, in Figure 10 B, form a coating layer 134 in groove 111 ', so that groove 111 ' has stepped profile, and groove 111 ' is divided into one first groove 113 and one second groove 115 that the degree of depth is different.The degree of depth of the first groove 113 is for example 20～40 microns, and the degree of depth of the second groove 115 is for example 60～80 microns.Therefore, can form step groove structure 111 in first substrate 110.
Then,, in Figure 10 C, form a light waveguide-layer 130 on coating layer 134.In Figure 10 E, a light-guide device 140 is arranged in the second groove 115, wherein the center of light waveguide-layer 130 is mutually corresponding with the center of light-guide device 140.
In addition, in Figure 10 D, a photo-electric conversion element 120 is arranged on first substrate 110, and relative with reflecting surface 112.Or, in another embodiment, photo-electric conversion element 120 can be disposed on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112, optical-electric module 103 as described in the fourth embodiment.
The disclosed optical-electric module of the above embodiment of the present invention and packaging technology thereof, be the first groove and the second groove that utilizes step groove structure to have, and light waveguide-layer is equated with the height of the center of light-guide device.Therefore, in the process transmitting at light signal, can keep the intensity of light signal, improve coupling efficiency, and maintain the correctness of light signal, and then improve the quality of optical communication.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (15)
1. an optical-electric module, is characterized in that, comprising:
One first substrate, has at least one step groove structure, and this step groove structure comprises:
One first groove, has one first degree of depth;
One second groove, has second degree of depth that is greater than this first degree of depth; And
One reflecting surface, is positioned at one end of this first groove;
One photo-electric conversion element, receives a light signal in order to launch a light signal to this reflecting surface or via this reflecting surface;
One light waveguide-layer, is arranged in this first groove; And
One light-guide device, is disposed in this second groove, and wherein this light waveguide-layer and this light-guide device be in order to transmit this light signal, and the center of this light waveguide-layer and the center of this light-guide device mutually corresponding.
2. optical-electric module according to claim 1, is characterized in that, the center of this light waveguide-layer equates with the height of the center of this light-guide device.
3. optical-electric module according to claim 1, is characterized in that, this photo-electric conversion element is arranged on this first substrate or on a second substrate relative with this first substrate, and this photo-electric conversion element is relative with this reflecting surface.
4. optical-electric module according to claim 3, it is characterized in that, this photo-electric conversion element is disposed in a storage tank of this second substrate, and this first substrate is provided with a depression with respect to this storage tank, and the position of this depression is corresponding with the position of a wire of this photo-electric conversion element of wire bonds.
5. optical-electric module according to claim 1, is characterized in that, this light waveguide-layer has one first end face, and the center of this light-guide device has a core, and this core has one second end face, and this first end face is adjacent to this second end face.
6. optical-electric module according to claim 5, is characterized in that, the area of this first end face is less than or equal to the area of this second end face.
7. optical-electric module according to claim 1, it is characterized in that, this step groove structure has a stepped profile, this stepped profile comprises the first surface level, one second surface level and a vertical plane or an inclined-plane between this first surface level and this second surface level of this reflecting surface of connection, and this first surface level is higher than this second surface level.
8. optical-electric module according to claim 1, is characterized in that, more comprises a coating layer, is formed in a groove of this first substrate, so that this groove has a stepped profile, and this groove area is divided into this first groove and this second groove that the degree of depth is different.
9. optical-electric module according to claim 1, is characterized in that, this first groove and this second groove are dovetail groove, V-shaped groove, deep-slotted chip breaker or rectangular channel.
10. optical-electric module according to claim 1, is characterized in that, the step groove structure of multiple strips is formed on this first substrate, and is arranged in parallel with each other.
11. optical-electric modules according to claim 11, is characterized in that, the width of this first groove is less than or equal to the width of this second groove relatively.
12. optical-electric modules according to claim 1, is characterized in that, more comprise a dielectric materials layer, are formed at this first groove, and insert in the space between this first substrate and this light waveguide-layer.
13. optical-electric modules according to claim 1, is characterized in that, more comprise a glue-line, fill in the space between this light waveguide-layer and this light-guide device.
The packaging technology of 14. 1 kinds of optical-electric modules, is characterized in that, comprising:
One first substrate of etching for the first time, to form one first groove in this first substrate, this first groove has one first degree of depth;
This first substrate of etching for the second time, to form the second groove on the position in second etch, this second groove has second degree of depth that is greater than this first degree of depth;
Form a light waveguide-layer in this first groove;
One light-guide device is arranged in this second groove; And
One photo-electric conversion element is provided, and in order to transmitting or receive a light signal, wherein this light waveguide-layer and this light-guide device be in order to transmit this light signal, and the center of this light waveguide-layer and the center of this light-guide device mutually corresponding.
The packaging technology of 15. 1 kinds of optical-electric modules, is characterized in that, comprising:
Etching one first substrate, to form a groove in this first substrate;
Form a coating layer in this groove, so that this groove has a stepped profile, and this groove area is divided into one first groove and one second groove that the degree of depth is different;
Form a light waveguide-layer on this coating layer, and be arranged in this first groove;
One light-guide device is arranged in this second groove; And
One photo-electric conversion element is provided, and in order to transmitting or receive a light signal, wherein this light waveguide-layer and this light-guide device be in order to transmit this light signal, and the center of this light waveguide-layer and the center of this light-guide device mutually corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050110.4A CN103984062B (en) | 2013-02-08 | 2013-02-08 | The packaging technology of optical-electric module and optical-electric module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050110.4A CN103984062B (en) | 2013-02-08 | 2013-02-08 | The packaging technology of optical-electric module and optical-electric module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103984062A true CN103984062A (en) | 2014-08-13 |
| CN103984062B CN103984062B (en) | 2015-10-14 |
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Cited By (5)
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| JP2016161843A (en) * | 2015-03-04 | 2016-09-05 | 住友ベークライト株式会社 | Optical waveguide with connector and electronic apparatus |
| CN107850729A (en) * | 2015-06-25 | 2018-03-27 | Ntt 电子股份有限公司 | Optical waveguide device |
| WO2018076308A1 (en) * | 2016-10-29 | 2018-05-03 | Huawei Technologies Co., Ltd. | Optical device and method for fabricating the same |
| CN111522102A (en) * | 2019-02-01 | 2020-08-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114660721A (en) * | 2020-12-23 | 2022-06-24 | 联合微电子中心有限责任公司 | End face coupling packaging structure of silicon-based optoelectronic chip and forming method thereof |
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| JP2016161843A (en) * | 2015-03-04 | 2016-09-05 | 住友ベークライト株式会社 | Optical waveguide with connector and electronic apparatus |
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| CN114660721B (en) * | 2020-12-23 | 2024-04-12 | 联合微电子中心有限责任公司 | End face coupling packaging structure of silicon-based photoelectronic chip and forming method thereof |
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| CN103984062B (en) | 2015-10-14 |
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