CN103972202A - Circuit device and PCB (printed circuit board) - Google Patents
Circuit device and PCB (printed circuit board) Download PDFInfo
- Publication number
- CN103972202A CN103972202A CN201310038622.9A CN201310038622A CN103972202A CN 103972202 A CN103972202 A CN 103972202A CN 201310038622 A CN201310038622 A CN 201310038622A CN 103972202 A CN103972202 A CN 103972202A
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- group
- fixture
- electronic device
- pin
- pcb board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
The invention discloses a circuit device and a PCB (printed circuit board). The circuit device comprises the PCB, a first group of pins, a second group of pins, a first electronic device, and a second electronic device. The first group of pins disposed on the PCB includes M pins, M being an integer not smaller than 2. The second group of pins different from the first group of pins is disposed on the PCB and includes N pins, N being an integer not smaller than 2. The first electronic device is communicated with the first group of pins in a first way. The second electronic device is communicated with the second group of pins in a second way. The first way is different from the second way. The first bottom of the first electronic device is a first distance away from the upper surface of the PCB; the second bottom of the second electronic device is a second distance away from the upper surface of the PCB; the first distance is different from the second distance.
Description
Technical field
The present invention relates to electronic applications, relate in particular to a kind of circuit arrangement and pcb board.
Background technology
Along with electronic device technology development, existing electronic device is all arranged on the surface of pcb board, multiple electronic devices can be formed to a device with 3D layout by stacking mode, make the surface row of pcb board that more electronic device can be set, cause being arranged on the restriction of the surperficial area that is subject to pcb board of the negligible amounts of the electronic device on pcb board, for example SiP/PoP forms 3D layout by chip-stacked mode, make the negligible amounts of chip be subject to the restriction of the surperficial area of pcb board, thereby make can place more chip on the surface of described pcb board, and then be user-friendly to.
Present inventor is realizing in the process of the embodiment of the present application technical scheme, at least finds to exist in prior art following technical problem:
While electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, this is because existing electronic device is all arranged on the surface of pcb board, and the surface area of pcb board is all a definite value, in the time that the first electronic device occupies the first area in the surface area of pcb board, other electronic device can only be arranged on the second area except the first area in the surface area of pcb board; In addition, although multiple electronic devices can be formed to a 3D packaging by stacking mode, due to the complex process of 3D packaging, also there is larger problem in thermal diffusivity, and described 3D packaging is arranged on the surface of described pcb board equally, the quantity that makes to be arranged on the electronic device on the surface area of pcb board still has larger restriction, the quantity that makes to be arranged on the electronic device on pcb board is subject to the problem of the surface area limitation of pcb board, and then causing user to use inconvenience, user's experience is also bad.
Summary of the invention
The embodiment of the present application, by a kind of circuit arrangement and pcb board are provided, while electronic device being set on existing pcb board, exists the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board in order to solve.
The embodiment of the present application provides a kind of circuit arrangement, and described circuit arrangement comprises: pcb board; Be arranged on first group of pin on described pcb board, wherein, in described first group of pin, include M pin, M is not less than 2 integer; Be arranged on the second group pin different from described first group of pin on described pcb board, wherein, in described second group of pin, include N pin, N is not less than 2 integer; The first electronic device, by first method and described first group of pin conducting; The second electronic device, by second method and described second group of pin conducting, wherein, described first method is different with described second method; Wherein, the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device has the first distance, the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has second distance, and described the first distance and described second distance are not identical.
Optionally, described the first electronic device, by first method and described first group of pin conducting; Described the second electronic device, by second method and described second group of pin conducting, be specially: above described first group of pin, be provided with first group of fixture, on described first group of fixture top, described the first electronic device is set, by described first group of fixture by described the first electronic device and described first group of pin conducting; Above described second group of pin, be provided with second group of fixture, on described second group of fixture top, described the second electronic device is set, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
Optionally, described the first electronic device, by first method and described first group of pin conducting; Described the second electronic device, by second method and described second group of pin conducting, be specially: above described first group of pin, be provided with first group of fixture, on described first group of fixture top, described the first electronic device is set, by described first group of fixture by described the first electronic device and described first group of pin conducting; Described the second electronic device is fixed on the upper surface of described pcb board, second group of pin of described the second electronic device is connected with described second group of pin, be used for described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different with the first length of described second group of pin.
Optionally, in the time that described first group of fixture is non-conductive, described by described first group of fixture by described the first electronic device and described first group of pin conducting, specifically comprise: at least two fixtures in described first group of fixture, be provided with at least two the first through holes, first group of pin of described the first electronic device is connected with described first group of pin through described at least two the first through holes, make described the first electronic device and described first group of pin conducting, wherein, described at least two the first through holes be arranged on described in the set of the first through hole on each fixture at least two fixtures.
Optionally, in the time of described first group of fixture conduction, on the outer surface of each fixture in described first group of fixture, be coated with the first insulating barrier.
Optionally, in the time of described the second fixture conduction, on the outer surface of each fixture in described second group of fixture, be coated with the second insulating barrier.
Optionally, in the time that described second group of fixture is non-conductive, described by described second group of fixture by described the second electronic device and described second group of pin conducting, specifically comprise: at least two fixtures in described second group of fixture, be provided with at least two the second through holes, second group of pin of described the second electronic device is connected with described second group of pin through described at least two the second through holes, make described the second electronic device and described second group of pin conducting, wherein, described at least two the second through holes be arranged on described in the set of the second through hole on each fixture at least two fixtures.
The application one embodiment provide a kind of pcb board, comprise: be arranged on first group of pin on described pcb board, for by the first electronic device by first method and described first group of pin conducting, wherein, in described first group of pin, include M pin, M is not less than 2 integer; Be arranged on the second group pin different from described first group of pin on described pcb board, be used for the second electronic device by second method and described second group of pin conducting, wherein, in described second group of pin, include N pin, N is not less than 2 integer, so that the first distance of the upper surface of the described pcb board of the bottom surface of described the first electronic device distance is not identical with the second distance of the upper surface of the described pcb board of bottom surface distance of described the second electronic device.
Optionally, described pcb board comprises: first group of fixture, be arranged on described first group of pin, for described the first electronic device being arranged on to the top of described first group of fixture, for by described first group of fixture by described the first electronic device and described first group of pin conducting; Second group of fixture, be arranged on described the second pin, for described the second electronic device being arranged on to the top of described second group of fixture, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
Optionally, described pcb board comprises: first group of fixture, be arranged on described first group of pin, for described the first electronic device being arranged on to the top of described first group of fixture, for by described first group of fixture by described the first electronic device and described first group of pin conducting; Described the second electronic device is set on the surface of described pcb board, second group of pin of described the second electronic device is connected with described second group of pin, make described the second electronic device and described second group of pin conducting.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
One, because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
Two, because the embodiment of the present application is the top that the first electronic device is arranged on to first group of fixture, the second electronic device is arranged on to the top of second group of fixture, because the first thickness of described first group of fixture is different with the second thickness of described second group of fixture, thereby the first electronic device and the second electronic equipment are all arranged in the upper space of pcb board, thereby the area for electronic device be set corresponding with pcb board increased, the electronic device that makes to be arranged on pcb board increases, thereby be user-friendly to, make user's experience better.
Brief description of the drawings
Fig. 1 is the structural representation of circuit arrangement in the application the first embodiment;
Fig. 2 is the structural representation of the application's first embodiment the first fixture;
Fig. 3 is the structural representation of the second fixture in the application the first embodiment;
Fig. 4 is the structural representation of the 3rd fixture in the application's the first example;
Fig. 5 is the structural representation of the 4th fixture in the application the first embodiment;
Fig. 6 is the structural representation of circuit arrangement in the application the second embodiment;
Fig. 7 is the structural representation of the second electronic device in the application the second embodiment.
Embodiment
The embodiment of the present application, by a kind of circuit arrangement and pcb board are provided, while electronic device being set on existing pcb board, exists the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board in order to solve.
The technical scheme of the embodiment of the present application is the problem that solves above-mentioned technology, and general thought is as follows:
Because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
In order better to understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
Embodiment mono-:
The application one embodiment provide a kind of circuit arrangement, and described circuit arrangement comprises: pcb board; Be arranged on first group of pin on described pcb board, wherein, in described first group of pin, include M pin, M is not less than 2 integer; Be arranged on the second group pin different from described first group of pin on described pcb board, wherein, in described second group of pin, include N pin, N is not less than 2 integer; The first electronic device, by first method and described first group of pin conducting; The second electronic device, by second method and described second group of pin conducting, wherein, described first method is different with described second method; Wherein, the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device has the first distance, the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has second distance, and described the first distance and described second distance are not identical.
In specific implementation process, described the first electronic device, by first method and described first group of pin conducting, be specially: on described first group of pin, be provided with first group of fixture, on described first group of fixture top, described the first electronic device is set, by described first group of fixture by described the first electronic device and described first group of pin conducting.
Specifically, referring to Fig. 1, described circuit arrangement comprises: pcb board 10; Be arranged on first group of pin on pcb board 10, described first group of pin comprises the first pin 20 and the second pin 21; Above described first group of pin, be provided with first group of fixture, described first group of fixture comprises the first fixture 30 and the second fixture 31, wherein, the first fixture 30 is fixed on the top of the first pin 20 by welding or the mode such as bonding, the second fixture 31 is fixed on the top of the second pin 21 by welding or the mode such as bonding, the first electronic device 40 is set on the top of described first group of fixture, the first electronic device 40 is for example the electronic chip such as BGA, SMA, by described first group of fixture by the first electronic device 40 and described first group of pin conducting.
Wherein, because described first group of fixture is arranged on described first group of pin, and described first group of pin at least comprises two pins, thereby make described first group of fixture also at least comprise two fixtures, for be provided with a fixture on each pin of described at least two pins.
In specific implementation process, in the time that described first group of fixture is non-conductive, on at least two fixtures in described first group of fixture, be provided with at least two the first through holes, first group of pin of the first electronic device 40 is connected with described first group of pin through described at least two the first through holes, make the first electronic device 40 and described first group of pin conducting, wherein, described at least two the first through holes be arranged on described in the set of the first through hole on each fixture at least two fixtures.
In actual application, referring to Fig. 1, be fixed on described first group of fixture top for what make that the first electronic device 40 can be more stable, the thickness of each fixture in described first group of fixture is identical, , the thickness of the first fixture 30 is identical with the thickness of the second fixture 31, such as: the thickness of the first fixture 30 is 15 microns, the thickness of the second fixture 31 is also 15 microns, cause the top that is placed on the first fixture 30 and the second fixture 31 that the first electronic device 40 can level, thereby reduce the probability of the first electronic device 40 in heeling condition, the pressure that the first fixture 30 and the second fixture 31 are born is more even, and then cause that the first electronic device 40 can be more stable be fixed on described first group of fixture top.
Referring to Fig. 1, in the time that described first group of fixture is non-conductive, that is, the first fixture 30 and the second fixture 31 are all non-conductive, the first pin 41 that offers the first through hole 32, the first electronic devices 40 in the middle part of the first fixture 30 is connected with the first pin 20 through the first through hole 32; The second pin 42 that offers the first through hole 33, the first electronic devices 40 in the middle part of the second fixture 31 is connected with the second pin 21 through the first through hole 33, and wherein, described first group of pin comprises the first pin 20 and the second pin 21.Because the first pin 41 is connected with the first pin 20 and the second pin 42 is connected with the second pin 21, thus make the first electronic device 40 can with described first group of pin conducting, and then cause the first electronic device 40 to switch on, and normally move.
Wherein, described first group of fixture is made up of at least one material in the materials such as rubber, plastics, glass, pottery, mica, for example the first fixture 30 can be to be made up of rubber material, also can be to be made by glass and ceramic combined material, the second fixture 31 can be made up of identical material with the first fixture, also can be made from a variety of materials, such as: when the first fixture 30 is made up of glass material, the second fixture 31 is made up of rubber material.
In another embodiment, when described first group of fixture conduction, described first group of fixture is made up of at least one electric conducting material in the multiple electric conducting materials such as gold, silver, copper, conductive rubber and conductive plastics, for example the first fixture 30 can be made up of conductive rubber, and the composite material that also can be made up of silver and copper is made.Certainly, because described first group of fixture at least comprises the first fixture and the second fixture, described the first fixture can be made by electric conducting material, and described the second fixture also can be made by electrically non-conductive material.
In specific implementation process, referring to Fig. 2 and Fig. 3, in the time of described first group of fixture conduction, the first fixture 30 is solid spheroid,, on the first fixture 30, do not offer through hole, the first pin 41 of the first electronic device 40 and the first end 302 of the first fixture 30 weld, and the second end 303 of the first pin 20 and the first fixture 30 welds; The second fixture 31 is also solid spheroid,, on the second fixture 31, do not offer through hole yet, the second pin 42 of the upper end 304 of the second fixture 31 and the first electronic device 40 welds, the lower end 305 of the second fixture 31 and the second pin 21 weld, thereby make the first electronic device 40 and described first group of pin conducting.
Wherein, in the time of described first group of fixture conduction, on at least two fixtures in described first group of fixture, be provided with at least two third through-holes, first group of pin of the first electronic device 40 is connected with described first group of pin through described at least two third through-holes, make the first electronic device 40 and described first group of pin conducting, wherein, described at least two third through-holes be arranged on described in the set of third through-hole on each fixture at least two fixtures.In specific implementation process, at least two fixtures in described first group of fixture, exist on a fixture and offer third through-hole, another fixture is solid spheroid.Certainly, each fixture in described first group of fixture can also be arranged to the structures such as cuboid, prismatoid.
In specific implementation process, in the time of described first group of fixture conduction, on the outer surface of each fixture in described first group of fixture, be coated with the first insulating barrier.Specifically,, referring to Fig. 2, on the outer surface of the first fixture 30, be coated with on the outer surface of the first insulating barrier 60, the second fixtures 31 and be coated with the first insulating barrier 61.On outer surface due to each fixture in described first group of fixture, be coated with the first insulating barrier, thereby can reduce the situation that short circuit appears in pcb board 10, and can cause damage to pcb board 10, thereby can effectively improve the operating efficiency of pcb board 10 in the time there is short circuit.
In specific implementation process, described the second electronic device, by second method and described second group of pin conducting, be specially: on described second group of pin, be provided with second group of fixture, on described second group of fixture top, described the second electronic device is set, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
Wherein, when each fixture in described first group of fixture has identical thickness, the first thickness of described first group of fixture only has a numerical value; The thickness of at least two fixtures in described first group of fixture has when not identical, and described the first thickness will have multiple numerical value; In like manner, described the second thickness has one or more numerical value.
Specifically, referring to Fig. 1, described circuit arrangement also comprises the second group of pin being arranged on pcb board 10, and described second group of pin comprises the 3rd pin 22 and the 4th pin 23; Above described second group of pin, be provided with second group of fixture, described second group of fixture comprises the 3rd fixture 34 and the 4th fixture 35, wherein, the 3rd fixture 34 is fixed on the top of the 3rd pin 22 by welding or the mode such as bonding, the 4th fixture 35 is fixed on the top of the 4th pin 23 by welding or the mode such as bonding, the second electronic device 50 is set on the top of described second group of fixture, the second electronic device 50 is for example the electronic chip such as BGA, SMA, by described second group of fixture by the second electronic device 50 and described second group of pin conducting.
Wherein, because described second group of fixture is arranged on described second group of pin, and described second group of pin at least comprises two pins, thereby make described second group of fixture also at least comprise two fixtures, for be provided with a fixture on each pin of described at least two pins.
Referring to Fig. 1,, the 3rd fixture 34 is made up of the first sub-fixture 36 and the second sub-fixture 37, and the first sub-fixture 36 is fixed on the top of the second sub-fixture 37, the 4th fixture 35 is made up of the 3rd sub-fixture 38 and the 4th sub-fixture 39, and the 3rd sub-fixture 38 is fixed on the top of the 4th sub-fixture 39, above the first sub-fixture 36 and the 3rd sub-fixture 38, be provided with the second electronic device 50, in order to make the second electronic device 50 and the first electronic device 40 in released state, the thickness of the 3rd fixture 34 will be not less than the thickness sum of the first fixture 30 and the first electronic device 40, and the thickness of the 4th fixture 35 also will be not less than the thickness sum of the second fixture 31 and the first electronic device 40, thereby the first electronic device 40 and the second electronic device 50 can both normally be worked, can phase mutual interference.
In specific implementation process, can both normally work in order to make the first electronic device 40 and the second electronic device 50, it is 20 microns at the first thickness of the first fixture 30, when the thickness of the first electronic device 40 is 15 microns, because the second thickness of the 3rd fixture 34 is the first thickness sum of the thickness of the first sub-fixture 36 and the thickness of the second sub-fixture 37, make the one-tenth-value thickness 1/10 of described the first thickness sum be not less than 35 microns; In like manner, in the time that the first thickness of the second fixture 31 is 20 microns, because the thickness of the first electronic device 40 is 15 microns, and the second thickness of the 4th fixture 35 is the second thickness sum of the thickness of the 3rd sub-fixture 38 and the thickness of the 4th fixture 39, make the one-tenth-value thickness 1/10 of described the second thickness sum also will be not less than 35 microns.
In actual application, referring to Fig. 1, be fixed on described second group of fixture top for what make that the second electronic device 50 can be more stable, the thickness of each fixture in described second group of fixture is identical, , the thickness of the 3rd fixture 34 is identical with the thickness of the 4th fixture 35, such as: the thickness of the 3rd fixture 34 is 25 microns, the thickness of the 4th fixture 35 is also 25 microns, cause the top that is placed on the 3rd fixture 34 and the 4th fixture 35 that the second electronic device 50 can level, thereby reduce the probability of the second electronic device 50 in heeling condition, the pressure that the 3rd fixture 34 and the 4th fixture 35 are born is more even, and then cause that the second electronic device 50 can be more stable be fixed on described second group of fixture top.
In specific implementation process, in the time that described second group of fixture is non-conductive, on at least two fixtures in described second group of fixture, be provided with at least two the second through holes, second group of pin of described the second electronic device is connected with described second group of pin through described at least two the second through holes, make described the second electronic device and described second group of pin conducting, wherein, described at least two the second through holes be arranged on described in the set of the second through hole on each fixture at least two fixtures.
In actual application, referring to Fig. 1, in the time that described second group of fixture is non-conductive,, the 3rd fixture 34 and the 4th fixture 35 are all non-conductive, because the 3rd fixture 34 comprises the first sub-fixture 36 and the second sub-fixture 37, centre position at the first sub-fixture 36 is provided with third through-hole, centre position at the second sub-fixture 37 is provided with fourth hole, described third through-hole and described fourth hole are mutually corresponding, form the second through hole 300, the three-prong 51 of the second electronic device 50 is connected with the 3rd pin 22 through the second through hole 300; Because the 4th fixture 35 comprises the 3rd sub-fixture 38 and the 4th sub-fixture 39, centre position at the 3rd sub-fixture 38 is provided with fifth hole, be provided with the 6th through hole in the centre position of the 4th sub-fixture 39, described fifth hole and described the 6th through hole are mutually corresponding, form the second through hole 301, the 4th pin 52 of the second electronic device 50 is connected with the 3rd pin 23 through the second through hole 301, and wherein, described second group of pin comprises three-prong 51 and the 4th pin 52.Because three-prong 51 is connected with the 3rd pin 22 and the 4th pin 52 is connected with the 4th pin 23, thus make the second electronic device 50 can with described second group of pin conducting, and then cause the second electronic device 50 to switch on, and normally move.
Wherein, described second group of fixture is made up of at least one material in the materials such as rubber, plastics, glass, pottery, mica, for example the first sub-fixture 36 can be to be made up of rubber material, also can be to be made by glass and ceramic combined material, the second sub-fixture 37 can be made up of identical material with the first sub-fixture 36, also can be made from a variety of materials, such as: when the first sub-fixture 36 is made up of glass material, the second sub-fixture 37 is made up of rubber material; In like manner, the 3rd sub-fixture 38 and the 4th sub-fixture 39 also can be made up of similar and different material.
In another embodiment, in the time of described second group of fixture conduction, in described second group of fixture, each fixture is made up of at least one electric conducting material in the multiple electric conducting materials such as gold, silver, copper, conductive rubber and conductive plastics, for example the 3rd fixture 34 can be made up of conductive rubber, and the composite material that also can be made up of silver and copper is made.Certainly, because described second group of fixture at least comprises the 3rd fixture and the 4th fixture, described the 3rd fixture can be made by electric conducting material, and described the 4th fixture also can be made by electrically non-conductive material.
In specific implementation process, referring to Fig. 4 and Fig. 5, in the time of described second group of fixture conduction, the 3rd fixture 34 comprises the first sub-fixture 36 and the second sub-fixture 37, wherein, the first sub-fixture 36 and the second sub-fixture 37 are all solid spheroid,, on the first sub-fixture 36 and the second sub-fixture 37, all do not offer through hole, weld second three-prong 51 of electronic device 50 and the upper end 306 of the first sub-fixture 36, and weld the lower end 307 of the 3rd pin 22 and the second sub-fixture 37; The 4th fixture 35 comprises the 3rd sub-fixture 38 and the 4th sub-fixture 39, the 3rd sub-fixture 38 and the 4th sub-fixture 39 are all also solid spheroid,, on the 3rd sub-fixture 38 and the 4th sub-fixture 39, all do not offer through hole yet, the 4th pin 52 of the upper end 308 of the 3rd sub-fixture 38 and the second electronic device 50 welds, the lower end 309 of the 4th sub-fixture 39 and the 4th pin 23 weld, thereby make the second electronic device 50 and described second group of pin conducting.
Wherein, in the time of described second group of fixture conduction, on at least two fixtures in described second group of fixture, be provided with at least two fourth holes, second group of pin of the second electronic device 50 is connected with described second group of pin through described at least two fourth holes, make the second electronic device 50 and described second group of pin conducting, wherein, described at least two fourth holes be arranged on described in the set of fourth hole on each fixture at least two fixtures.In specific implementation process, at least two fixtures in described second group of fixture, can exist on a fixture and offer fourth hole, another fixture is solid spheroid.Certainly, each fixture in described second group of fixture can also be arranged to the structures such as cuboid, prismatoid.
In specific implementation process, in the time of described second group of fixture conduction, on the outer surface of each fixture in described second group of fixture, be coated with the second insulating barrier.Specifically, referring to Fig. 2, on the outer surface of the first sub-fixture 36, be coated with the second insulating barrier 70, on the outer surface of the second sub-fixture 37, be coated with the second insulating barrier 71, on the outer surface of the 3rd sub-fixture 38, be coated with on the outer surface of the second insulating barrier 72, the four sub-fixtures 33 and be coated with the second insulating barrier 73.On outer surface due to each fixture in described second group of fixture, be coated with the second insulating barrier, thereby can reduce the situation that short circuit appears in pcb board 10, and can cause damage to pcb board 10, thereby can effectively improve the operating efficiency of pcb board 10 in the time there is short circuit.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
One, because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
Two, because the embodiment of the present application is the top that the first electronic device is arranged on to first group of fixture, the second electronic device is arranged on to the top of second group of fixture, because the first thickness of described first group of fixture is different with the second thickness of described second group of fixture, thereby the first electronic device and the second electronic equipment are all arranged in the upper space of pcb board, thereby the area for electronic device be set corresponding with pcb board increased, the electronic device that makes to be arranged on pcb board increases, thereby be user-friendly to, make user's experience better.
Embodiment bis-:
The present embodiment is that from the difference of implementing one embodiment of described second method is different also different with the position of described second group of pin on described pcb board.Described the second electronic device, by second method and described second group of pin conducting, be specially: described the second electronic device is fixed on the upper surface of described pcb board, second group of pin of described the second electronic device is connected with described second group of pin, for by described the second electronic device and described second group of pin conducting.
In specific implementation process, referring to Fig. 6 and Fig. 7, the second electronic device 50 is arranged on the primary importance between the first pin 20 and second pin 21 of upper surface of pcb board, and the three-prong 51 of the second electronic device 50 and the 3rd pin 22 weld, three-prong 52 and the 4th pin 23 weld, make the second electronic device 50 and described second group of pin conducting, cause the second electronic device normally to work.
In actual application, because the second electronic device 50 is arranged on described primary importance, make the second length of the second electronic device 50 be less than the 3rd length between the first pin 20 to second pins 21, for example, when described the 3rd length is 5 centimetres, described the second length is 4 centimetres, 3 centimetres, 4.5 centimetres of length that grade is less than 5 centimetres; And in Fig. 6, described second group of weight that pin can not bear the second electronic device 50, cause first of the second electronic device 50 to be highly less than the first thickness of described first group of fixture, such as described first while being highly 20 microns, described the first thickness is greater than 20 microns, thereby make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
In another embodiment, referring to Fig. 7, in the time of the stable weight that sustains the second electronic device 50 of described second group of pin, show, in described second group of pin, the intensity of each pin reaches a default value, such as in the time that the second electronic device 50 is 10 grams, the 3rd pin 51 and the 4th pin 52 all there is the first intensity, the weight that sustains 10 grams that can be stable, there will not be the situation of distortion.At this moment, because the length of each pin in described second group of pin is identical, the length of described second group of pin is the 4th length of the 3rd pin 51, the first numerical value of the thickness of described first group of fixture is greater than the second value of described the 4th length and described the first height sum, to make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
In another embodiment, in the time that the intensity of described first group of pin also can sustain the weight of the first electronic device 40, can remove described first group of fixture, the first pin 41 can directly weld with the first pin 20, the second pin 42 directly welds with the second pin 21, make the first electronic device 40 and described first group of pin conducting, the in the situation that of energising, the first electronic device 40 can normally be worked, wherein, the length of the first pin 41 is greater than the first height of the second electronic device 50, the length of the second pin 42 is also greater than described the first height, to make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
One, because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
Two, because the embodiment of the present application is the top that the first electronic device is arranged on to first group of fixture, the second electronic device is arranged on to the top of second group of fixture, because the first thickness of described first group of fixture is different with the second thickness of described second group of fixture, thereby the first electronic device and the second electronic equipment are all arranged in the upper space of pcb board, thereby the area for electronic device be set corresponding with pcb board increased, the electronic device that makes to be arranged on pcb board increases, thereby be user-friendly to, make user's experience better.
The 3rd embodiment:
The application one embodiment also provide a kind of pcb board, comprise: be arranged on first group of pin on described pcb board, for by the first electronic device by first method and described first group of pin conducting, wherein, in described first group of pin, include M pin, M is not less than 2 integer; Be arranged on the second group pin different from described first group of pin on described pcb board, be used for the second electronic device by second method and described second group of pin conducting, wherein, in described second group of pin, include N pin, N is not less than 2 integer, so that the first distance of the upper surface of the described pcb board of the bottom surface of described the first electronic device distance is not identical with the second distance of the upper surface of the described pcb board of bottom surface distance of described the second electronic device.
In specific implementation process, described pcb board comprises: first group of fixture, be arranged on described first group of pin, for described the first electronic device being arranged on to the top of described first group of fixture, for by described first group of fixture by described the first electronic device and described first group of pin conducting; Second group of fixture, be arranged on described the second pin, for described the second electronic device being arranged on to the top of described second group of fixture, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
Specifically, referring to Fig. 1, described pcb board 10 comprises the first group of pin being arranged on pcb board 10, and described first group of pin comprises the first pin 20 and the second pin 21; Above described first group of pin, be provided with first group of fixture, described first group of fixture comprises the first fixture 30 and the second fixture 31, wherein, the first fixture 30 is fixed on the top of the first pin 20 by welding or the mode such as bonding, the second fixture 31 is fixed on the top of the second pin 21 by welding or the mode such as bonding, the first electronic device 40 is set on the top of described first group of fixture, the first electronic device 40 is for example the electronic chip such as BGA, SMA, by described first group of fixture by the first electronic device 40 and described first group of pin conducting.
Referring to Fig. 1, in the time that described first group of fixture is non-conductive, that is, the first fixture 30 and the second fixture 31 are all non-conductive, the first pin 41 that offers the first through hole 32, the first electronic devices 40 in the middle part of the first fixture 30 is connected with the first pin 20 through the first through hole 32; The second pin 42 that offers the first through hole 33, the first electronic devices 40 in the middle part of the second fixture 31 is connected with the second pin 21 through the first through hole 33, and wherein, described first group of pin comprises the first pin 20 and the second pin 21.Because the first pin 41 is connected with the first pin 20 and the second pin 42 is connected with the second pin 21, thus make the first electronic device 40 can with described first group of pin conducting, and then cause the first electronic device 40 to switch on, and normally move.
In another embodiment, when described first group of fixture conduction, described first group of fixture is made up of at least one electric conducting material in the multiple electric conducting materials such as gold, silver, copper, conductive rubber and conductive plastics, for example the first fixture 30 can be made up of conductive rubber, and the composite material that also can be made up of silver and copper is made.Certainly, because described first group of fixture at least comprises the first fixture and the second fixture, described the first fixture can be made by electric conducting material, and described the second fixture also can be made by electrically non-conductive material.
Referring to Fig. 1, described pcb board 10 also comprises the second group of pin being arranged on pcb board 10, and described second group of pin comprises the 3rd pin 22 and the 4th pin 23; Above described second group of pin, be provided with second group of fixture, described second group of fixture comprises the 3rd fixture 34 and the 4th fixture 35, wherein, the 3rd fixture 34 is fixed on the top of the 3rd pin 22 by welding or the mode such as bonding, the 4th fixture 35 is fixed on the top of the 4th pin 23 by welding or the mode such as bonding, the second electronic device 50 is set on the top of described second group of fixture, the second electronic device 50 is for example the electronic chip such as BGA, SMA, by described second group of fixture by the second electronic device 50 and described second group of pin conducting.
In actual application, referring to Fig. 1, in the time that described second group of fixture is non-conductive,, the 3rd fixture 34 and the 4th fixture 35 are all non-conductive, because the 3rd fixture 34 comprises the first sub-fixture 36 and the second sub-fixture 37, centre position at the first sub-fixture 36 is provided with third through-hole, centre position at the second sub-fixture 37 is provided with fourth hole, described third through-hole and described fourth hole are mutually corresponding, form the second through hole 300, the three-prong 51 of the second electronic device 50 is connected with the 3rd pin 22 through the second through hole 300; Because the 4th fixture 35 comprises the 3rd sub-fixture 38 and the 4th sub-fixture 39, centre position at the 3rd sub-fixture 38 is provided with fifth hole, be provided with the 6th through hole in the centre position of the 4th sub-fixture 39, described fifth hole and described the 6th through hole are mutually corresponding, form the second through hole 301, the 4th pin 52 of the second electronic device 50 is connected with the 3rd pin 23 through the second through hole 301, and wherein, described second group of pin comprises three-prong 51 and the 4th pin 52.Because three-prong 51 is connected with the 3rd pin 22 and the 4th pin 52 is connected with the 4th pin 23, thus make the second electronic device 50 can with described second group of pin conducting, and then cause the second electronic device 50 to switch on, and normally move.
In another embodiment, in the time of described second group of fixture conduction, in described second group of fixture, each fixture is made up of at least one electric conducting material in the multiple electric conducting materials such as gold, silver, copper, conductive rubber and conductive plastics, for example the 3rd fixture 34 can be made up of conductive rubber, and the composite material that also can be made up of silver and copper is made.Certainly, because described second group of fixture at least comprises the 3rd fixture and the 4th fixture, described the 3rd fixture can be made by electric conducting material, and described the 4th fixture also can be made by electrically non-conductive material.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
One, because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
Two, because the embodiment of the present application is the top that the first electronic device is arranged on to first group of fixture, the second electronic device is arranged on to the top of second group of fixture, because the first thickness of described first group of fixture is different with the second thickness of described second group of fixture, thereby the first electronic device and the second electronic equipment are all arranged in the upper space of pcb board, thereby the area for electronic device be set corresponding with pcb board increased, the electronic device that makes to be arranged on pcb board increases, thereby be user-friendly to, make user's experience better.
Embodiment tetra-:
The present embodiment is that from the difference of implementing three embodiment of described second method is different also different with the position of described second group of pin on described pcb board.
In specific implementation process, referring to Fig. 6 and Fig. 7, the second electronic device 50 is arranged on the primary importance between the first pin 20 and second pin 21 of upper surface of pcb board, and the three-prong 51 of the second electronic device 50 and the 3rd pin 22 weld, three-prong 52 and the 4th pin 23 weld, make the second electronic device 50 and described second group of pin conducting, cause the second electronic device normally to work.
In actual application, because the second electronic device 50 is arranged on described primary importance, make the second length of the second electronic device 50 be less than the 3rd length between the first pin 20 to second pins 21, for example, when described the 3rd length is 5 centimetres, described the second length is 4 centimetres, 3 centimetres, 4.5 centimetres of length that grade is less than 5 centimetres; And in Fig. 6, described second group of weight that pin can not bear the second electronic device 50, cause first of the second electronic device 50 to be highly less than the first thickness of described first group of fixture, such as described first while being highly 20 microns, described the first thickness is greater than 20 microns, thereby make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
In another embodiment, referring to Fig. 7, in the time of the stable weight that sustains the second electronic device 50 of described second group of pin, show, in described second group of pin, the intensity of each pin reaches a default value, such as in the time that the second electronic device 50 is 10 grams, the 3rd pin 51 and the 4th pin 52 all there is the first intensity, the weight that sustains 10 grams that can be stable, there will not be the situation of distortion.At this moment, because the length of each pin in described second group of pin is identical, the length of described second group of pin is the 4th length of the 3rd pin 51, the first numerical value of the thickness of described first group of fixture is greater than the second value of described the 4th length and described the first height sum, to make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
In another embodiment, in the time that the intensity of described first group of pin also can sustain the weight of the first electronic device 40, can remove described first group of fixture, the first pin 41 can directly weld with the first pin 20, the second pin 42 directly welds with the second pin 21, make the first electronic device 40 and described first group of pin conducting, the in the situation that of energising, the first electronic device 40 can normally be worked, wherein, the length of the first pin 41 is greater than the first height of the second electronic device 50, the length of the second pin 42 is also greater than described the first height, to make the first electronic device 40 and the second electronic device 50 in released state, to prevent that the situation of short circuit from appearring in circuit.
The one or more technical schemes that provide in the embodiment of the present application, at least have following technique effect or advantage:
One, because the first electronic device in the embodiment of the present application is by first method and described first group of pin conducting, the second electronic device is by second method and second group of pin conducting, the first distance that the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device is had is different from the second distance that the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has, make electronic device on pcb board, be 3D stacking, electronic device also can be set in the space relevant to pcb board, thereby solve while electronic device being set on existing pcb board, exist the quantity of electronic device to be subject to the technical problem of the surface area limitation of pcb board, and then the quantity that has realized the electronic device arranging on pcb board can not be subject to the surface area limitation of pcb board, make the more technique effect of the electronic device arranging on pcb board, and then be user-friendly to, make user's experience better.
Two, because the embodiment of the present application is the top that the first electronic device is arranged on to first group of fixture, the second electronic device is arranged on to the top of second group of fixture, because the first thickness of described first group of fixture is different with the second thickness of described second group of fixture, thereby the first electronic device and the second electronic equipment are all arranged in the upper space of pcb board, thereby the area for electronic device be set corresponding with pcb board increased, the electronic device that makes to be arranged on pcb board increases, thereby be user-friendly to, make user's experience better.
Although described the preferred embodiments of the present invention, once those skilled in the art obtain the basic creative concept of cicada, can make other change and amendment to these embodiment.So claims are intended to be interpreted as comprising preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (10)
1. a circuit arrangement, is characterized in that, described circuit arrangement comprises:
Pcb board;
Be arranged on first group of pin on described pcb board, wherein, in described first group of pin, include M pin, M is not less than 2 integer;
Be arranged on the second group pin different from described first group of pin on described pcb board, wherein, in described second group of pin, include N pin, N is not less than 2 integer;
The first electronic device, by first method and described first group of pin conducting;
The second electronic device, by second method and described second group of pin conducting, wherein, described first method is different with described second method;
Wherein, the upper surface of the described pcb board of the first bottom surface distance of described the first electronic device has the first distance, the described upper surface of the described pcb board of the second bottom surface distance of described the second electronic device has second distance, and described the first distance and described second distance are not identical.
2. circuit arrangement as claimed in claim 1, is characterized in that, described the first electronic device, by first method and described first group of pin conducting; Described the second electronic device, by second method and described second group of pin conducting, is specially:
Above described first group of pin, be provided with first group of fixture, on described first group of fixture top, described the first electronic device be set, by described first group of fixture by described the first electronic device and described first group of pin conducting;
Above described second group of pin, be provided with second group of fixture, on described second group of fixture top, described the second electronic device is set, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
3. circuit arrangement as claimed in claim 1, is characterized in that, described the first electronic device, by first method and described first group of pin conducting; Described the second electronic device, by second method and described second group of pin conducting, is specially:
Above described first group of pin, be provided with first group of fixture, on described first group of fixture top, described the first electronic device be set, by described first group of fixture by described the first electronic device and described first group of pin conducting;
Described the second electronic device is fixed on the upper surface of described pcb board, second group of pin of described the second electronic device is connected with described second group of pin, be used for described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different with the first length of described second group of pin.
4. circuit arrangement as claimed in claim 2 or claim 3, is characterized in that, in the time that described first group of fixture is non-conductive, described by described first group of fixture by described the first electronic device and described first group of pin conducting, specifically comprise:
On at least two fixtures in described first group of fixture, be provided with at least two the first through holes, first group of pin of described the first electronic device is connected with described first group of pin through described at least two the first through holes, make described the first electronic device and described first group of pin conducting, wherein, described at least two the first through holes be arranged on described in the set of the first through hole on each fixture at least two fixtures.
5. circuit arrangement as claimed in claim 2 or claim 3, is characterized in that, in the time of described first group of fixture conduction, on the outer surface of each fixture in described first group of fixture, is coated with the first insulating barrier.
6. circuit arrangement as claimed in claim 2, is characterized in that, in the time of described the second fixture conduction, on the outer surface of each fixture in described second group of fixture, is coated with the second insulating barrier.
7. circuit arrangement as claimed in claim 2, is characterized in that, in the time that described second group of fixture is non-conductive, described by described second group of fixture by described the second electronic device and described second group of pin conducting, specifically comprise:
On at least two fixtures in described second group of fixture, be provided with at least two the second through holes, second group of pin of described the second electronic device is connected with described second group of pin through described at least two the second through holes, make described the second electronic device and described second group of pin conducting, wherein, described at least two the second through holes be arranged on described in the set of the second through hole on each fixture at least two fixtures.
8. a pcb board, is characterized in that, comprising:
Be arranged on first group of pin on described pcb board, for by the first electronic device by first method and described first group of pin conducting, wherein, in described first group of pin, include M pin, M is not less than 2 integer;
Be arranged on the second group pin different from described first group of pin on described pcb board, be used for the second electronic device by second method and described second group of pin conducting, wherein, in described second group of pin, include N pin, N is not less than 2 integer, so that the first distance of the upper surface of the described pcb board of the bottom surface of described the first electronic device distance is not identical with the second distance of the upper surface of the described pcb board of bottom surface distance of described the second electronic device.
9. pcb board as claimed in claim 8, is characterized in that, described pcb board comprises:
First group of fixture, is arranged on described first group of pin, for described the first electronic device being arranged on to the top of described first group of fixture, for by described first group of fixture by described the first electronic device and described first group of pin conducting;
Second group of fixture, be arranged on described the second pin, for described the second electronic device being arranged on to the top of described second group of fixture, by described second group of fixture by described the second electronic device and described second group of pin conducting, wherein, the first thickness of described first group of fixture is different from the second thickness of described second group of fixture, makes described the first distance and described second distance not identical.
10. pcb board as claimed in claim 8, is characterized in that, described pcb board comprises:
First group of fixture, is arranged on described first group of pin, for described the first electronic device being arranged on to the top of described first group of fixture, for by described first group of fixture by described the first electronic device and described first group of pin conducting;
Described the second electronic device is set on the surface of described pcb board, second group of pin of described the second electronic device is connected with described second group of pin, make described the second electronic device and described second group of pin conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310038622.9A CN103972202A (en) | 2013-01-31 | 2013-01-31 | Circuit device and PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310038622.9A CN103972202A (en) | 2013-01-31 | 2013-01-31 | Circuit device and PCB (printed circuit board) |
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| CN103972202A true CN103972202A (en) | 2014-08-06 |
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| CN201310038622.9A Pending CN103972202A (en) | 2013-01-31 | 2013-01-31 | Circuit device and PCB (printed circuit board) |
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Application publication date: 20140806 |