CN103978314A - Air film cooling hole preparation technology based on picosecond laser auxiliary processing - Google Patents
Air film cooling hole preparation technology based on picosecond laser auxiliary processing Download PDFInfo
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- CN103978314A CN103978314A CN201410213528.7A CN201410213528A CN103978314A CN 103978314 A CN103978314 A CN 103978314A CN 201410213528 A CN201410213528 A CN 201410213528A CN 103978314 A CN103978314 A CN 103978314A
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- laser
- film cooling
- cooling holes
- millisecond
- picosecond laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses an air film cooling hole preparation technology based on picosecond laser auxiliary processing. A small hole which is opposite to an air film cooling hole in the inclined direction and forms a certain included angle with the air film cooling hole is formed in a ceramic layer by ultrafast laser in advance, the air film cooling hole is processed by millisecond laser, a small hole is formed in the ceramic layer of a turbine blade by picosecond laser in advance, the sharp shape of the front edge of the hole is changed by the small hole which is processed by the picosecond laser, the small hole becomes smooth, and the occurrence of a bulge phenomenon is avoided; in the turbine blade matrix machining process, the fusion and the ejection of liquid metal are more facilitated, and the defects that the ceramic layer and a turbine blade matrix are layered and cracked and the like cannot be caused.
Description
Technical field
The invention belongs to technical field of laser processing, be specifically related to a kind of film cooling holes preparation technology based on picosecond laser secondary process, be mainly used in the preparation with thermal barrier coating turbine blade air film Cooling Holes.
Background technology
For the Laser Processing of the turbine blade air film Cooling Holes with thermal barrier coating, delamination splitting (delamination) is between layers the subject matter that laser punches on band coating matrix." delamination splitting " phenomenon mainly results from tack coat and basal body interface (BC/substrate) is located, ceramic layer and tie-layer interface (TC/BC) are located.Under arms time, this " delamination splitting " easily spreads to other positions, will cause the premature failure of coating, and delamination splitting becomes the major obstacle that laser is processed film cooling holes on thermal barrier coating turbo blade.The appearance of delamination splitting phenomenon is that many factors causes, first, the fusing point of ceramic material is much larger than the fusing point of metallic matrix, in addition the coefficient of heat conduction of pottery is lower, therefore, for the larger aperture processing in angle of inclination, in laser time processing pottery and matrix process, the aperture of ceramic segment is removed less material and is formed protruding phenomenon (undercutting) compared with the aperture of turbo blade body portion, projection phenomenon is extremely unfavorable for the injection of deposite metal, can make deposite metal produce very large impact stress and act on ceramic layer, make its avulsion produce delamination splitting phenomenon, secondly, turbine blade air film Cooling Holes generally has certain angle with surface, the angle of inclination of film cooling holes is larger, the exit, forward position (leading edge) of film cooling holes is more sharp-pointed, in addition the asymmetry of inclined hole shape, most of HTHP motlten metal ejects from here, high temperature, at a high speed, motlten metal acts on hole inwall and produces very large mechanical stress.Mechanical stress is divided into again direct stress and shear stress, and direct stress acts on the front interface place of inclined hole with the form of moment, makes protruding ceramic layer have the trend of torsion, finally occurs delamination splitting phenomenon.Shear stress directly acts on ceramic layer and the turbo blade matrix of hole wall, because ceramic material elastic modelling quantity is less, while being subject to identical shear stress, there is less distortion, now owing to being out of shape the inconsistent delamination splitting phenomenon that also easily produces between ceramic layer and turbo blade matrix and tack coat.When laser is processed film cooling holes on band thermal barrier coating turbo blade, the mechanical stress that how effectively to reduce melting injection generation is technological difficulties in space flight drilling field.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, the object of the present invention is to provide a kind of film cooling holes preparation technology based on picosecond laser secondary process, effectively prevent the generation of projection phenomenon when millisecond laser is processed film cooling holes on thermal barrier coating turbo blade, reduce the impact stress of fusing metal injection to aperture forward position, ensure crudy, improve working (machining) efficiency, and can on band thermal barrier coating turbo blade, process the above film cooling holes of diameter 0.2mm.
For achieving the above object, the technical solution used in the present invention is:
A film cooling holes preparation technology based on picosecond laser secondary process, comprises the following steps:
1) on turbo blade ceramic layer, process in advance the also aperture of in 90 °~100 ° angle contrary to film cooling holes incline direction with picosecond laser, to remove film cooling holes forward position sharp parts, be specially:
1. will be fixed on the turbo blade of thermal barrier coating on the common bed of picosecond laser and millisecond laser equipment, regulate picosecond laser light path to make the focus of its picosecond laser be positioned at the pre-punch position of turbo blade place, adjust the angle of inclination of picosecond laser bundle according to the angle of inclination of film cooling holes, make the angle of the aperture 7 that processes and film cooling holes 8 opposite directions in 90 °~100 °;
2. regulate picosecond laser parameter to be: the pulse frequency of picosecond laser is 40~50KHz, the pulse width of picosecond laser is 10ps~20ps, and the mean power 1.5~2J of picosecond laser, opens picosecond laser, machining small on turbo blade ceramic layer;
2) with millisecond Laser Processing air film Cooling Holes, be specially;
1. keep the invariant position of turbo blade, using millisecond laser instead processes, the spot location of millisecond laser is arrived to preprocessing film cooling holes position, the angle of inclination that regulates millisecond laser head according to the angle of inclination of film cooling holes, makes the angle of inclination of millisecond laser head identical with the angle of inclination of film cooling holes;
2. regulate millisecond laser parameter: the peak power of millisecond laser is 14~16KW, the pulse width of millisecond laser is 0.3~0.6ms, the repetition rate of millisecond laser is 20~30HZ, applying assist gas and regulating pressure is 0.3~0.5MPa, uses millisecond laser Washdown type drilling method processing film cooling holes until hole forming.
Beneficial effect of the present invention: process an aperture with picosecond laser on turbo blade ceramic layer, aperture after processing with picosecond laser has changed the sharp-pointed shape in forward position, hole, make aperture become round and smooth polishing, avoid the generation of protruding phenomenon, in turbine blades matrix process, the fusing that is more conducive to liquid metal ejects and does not cause the defects such as the delamination splitting between ceramic layer and turbo blade matrix like this.
Brief description of the drawings
Fig. 1 is picosecond laser machining small structural representation in advance on turbo blade ceramic layer.
Fig. 2 is millisecond Laser Processing air film Cooling Holes structural representation.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.
See figures.1.and.2, processing diameter on thermal barrier coating nickel base superalloy turbo blade 1 is that 0.3mm, angle of inclination are the film cooling holes 8 of 40 °, turbo blade 1 matrix thickness 2mm, turbine blade surface scribbles thermal barrier coating, thermal barrier coating is made up of ceramic layer 3 and tack coat 2, and the thickness of ceramic layer 3 is about 0.3mm, and tack coat 2 thickness are about 0.1mm, tack coat 2 materials are NiCoCrAlY, and ceramic layer 3 materials are 6%-8%Y
2o
3zrO
2, turbo blade 1 matrix material is nickel base superalloy, model is Inconel718.
A film cooling holes preparation technology based on picosecond laser secondary process, comprises the following steps:
1) on turbo blade ceramic layer, process in advance the also aperture of in 90 °~100 ° angle contrary to film cooling holes incline direction with ultrafast laser, to remove film cooling holes forward position sharp parts, be specially:
1. the turbo blade with thermal barrier coating 1 is fixed on the common bed of picosecond laser 4 and millisecond laser 9 equipment, regulate picosecond laser light path to make the focus of its picosecond laser be positioned at turbo blade 1 pre-punch position place, regulate the angle of inclination of picosecond laser 4 according to the angle of inclination of film cooling holes 8, the angle of the aperture 7 that makes to process and film cooling holes 8 opposite directions in 90 °~100 °, like this, the comparatively rounding of film cooling holes 8 forward positions processing, without sharp shape, can avoid the generation of protruding phenomenon, be conducive to the ejection of motlten metal;
2. in order to improve as much as possible working (machining) efficiency, should make picosecond laser 4 have large as far as possible energy density, therefore regulate picosecond laser parameter: picosecond laser pulse frequency is 50KHz, the pulse width of picosecond laser is 10ps, the mean power 2J of picosecond laser, opens picosecond laser machining small 7 on ceramic layer 3;
2) with millisecond Laser Processing air film Cooling Holes, be specially:
1. keep the invariant position of turbo blade 1, using millisecond laser 9 instead processes, the spot location of millisecond laser 9 is arrived to preprocessing film cooling holes 8 positions, the angle of inclination that regulates millisecond laser head according to the angle of inclination of film cooling holes 8, makes the angle of inclination of millisecond laser head 9 identical with the angle of inclination of film cooling holes 8;
2. consider crudy and working (machining) efficiency, regulate best millisecond laser 9 machined parameters to be: the peak power of millisecond laser 9 is 15KW, the pulse width of millisecond laser 9 is 0.3ms, the repetition rate of millisecond laser 9 is 20HZ, applying assist gas 6 and regulating pressure is 0.5MPa, uses millisecond laser Washdown type drilling method processing film cooling holes 8 until hole forming.
Aperture after processing around coating surface is good, and tack coat and basal body interface (BC/substrate) are located, ceramic layer and tie-layer interface (TC/BC) are located, without delamination splitting phenomenon, to meet technical requirement.
Claims (1)
1. the film cooling holes preparation technology based on picosecond laser secondary process, is characterized in that, comprises the following steps:
1) on turbo blade ceramic layer, process in advance the also aperture of in 90 °~100 ° angle contrary to film cooling holes incline direction with picosecond laser, to remove film cooling holes forward position sharp parts, be specially:
1. will be fixed on the turbo blade of thermal barrier coating on the common bed of picosecond laser and millisecond laser equipment, regulate picosecond laser light path to make the focus of its picosecond laser be positioned at the pre-punch position of turbo blade place, adjust the angle of inclination of picosecond laser bundle according to the angle of inclination of film cooling holes, make the angle of the aperture (7) that processes and film cooling holes (8) opposite direction in 90 °~100 °;
2. regulate picosecond laser parameter to be: the pulse frequency of picosecond laser is 40~50KHz, the pulse width of picosecond laser is 10ps~20ps, and the mean power 1.5~2J of picosecond laser, opens picosecond laser, machining small on turbo blade ceramic layer;
2) with millisecond Laser Processing air film Cooling Holes, be specially;
1. keep the invariant position of turbo blade, using millisecond laser instead processes, the spot location of millisecond laser is arrived to preprocessing film cooling holes position, the angle of inclination that regulates millisecond laser head according to the angle of inclination of film cooling holes, makes the angle of inclination of millisecond laser head identical with the angle of inclination of film cooling holes;
2. regulate millisecond laser parameter: the peak power of millisecond laser is 14~16KW, the pulse width of millisecond laser is 0.3~0.6ms, the repetition rate of millisecond laser is 20~30HZ, applying assist gas and regulating pressure is 0.3~0.5MPa, uses millisecond laser Washdown type drilling method processing film cooling holes until hole forming.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269158A (en) * | 2015-11-20 | 2016-01-27 | 西安交通大学 | High-energy laser step-by-step machining method for cooling hole of turbine blade with thermal barrier coating |
CN106583949A (en) * | 2016-11-29 | 2017-04-26 | 沈阳黎明航空发动机(集团)有限责任公司 | Low-damage processing method of film holes in single crystal high-pressure-turbine hollow blade of aircraft engine |
CN109108485A (en) * | 2018-07-24 | 2019-01-01 | 西安交通大学 | A method of labyrinth alumina ceramic core is repaired using picosecond laser |
CN109158776A (en) * | 2018-11-14 | 2019-01-08 | 中国航发动力股份有限公司 | A kind of guide vane of high pressure turbine air film hole laser processing |
CN111331263A (en) * | 2020-03-28 | 2020-06-26 | 北京工业大学 | Device and method for accurately preparing turbine blade cooling hole by picosecond laser |
CN113146053A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
CN113146054A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269158A (en) * | 2015-11-20 | 2016-01-27 | 西安交通大学 | High-energy laser step-by-step machining method for cooling hole of turbine blade with thermal barrier coating |
CN105269158B (en) * | 2015-11-20 | 2017-04-19 | 西安交通大学 | High-energy laser step-by-step machining method for cooling hole of turbine blade with thermal barrier coating |
CN106583949A (en) * | 2016-11-29 | 2017-04-26 | 沈阳黎明航空发动机(集团)有限责任公司 | Low-damage processing method of film holes in single crystal high-pressure-turbine hollow blade of aircraft engine |
CN106583949B (en) * | 2016-11-29 | 2018-09-07 | 沈阳黎明航空发动机(集团)有限责任公司 | The processing method of the low damage of the high whirlpool hollow blade air film hole of aero-engine monocrystalline |
CN109108485A (en) * | 2018-07-24 | 2019-01-01 | 西安交通大学 | A method of labyrinth alumina ceramic core is repaired using picosecond laser |
CN109158776A (en) * | 2018-11-14 | 2019-01-08 | 中国航发动力股份有限公司 | A kind of guide vane of high pressure turbine air film hole laser processing |
CN109158776B (en) * | 2018-11-14 | 2020-07-28 | 中国航发动力股份有限公司 | Laser processing method for high-pressure turbine guide vane air film hole |
CN113146053A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
CN113146054A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
CN111331263A (en) * | 2020-03-28 | 2020-06-26 | 北京工业大学 | Device and method for accurately preparing turbine blade cooling hole by picosecond laser |
CN111331263B (en) * | 2020-03-28 | 2022-03-29 | 北京工业大学 | Device and method for accurately preparing turbine blade cooling hole by picosecond laser |
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Application publication date: 20140813 |