CN103957681B - A kind of electronic device cooling apparatus waiting fluid distribution - Google Patents
A kind of electronic device cooling apparatus waiting fluid distribution Download PDFInfo
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- CN103957681B CN103957681B CN201410176001.1A CN201410176001A CN103957681B CN 103957681 B CN103957681 B CN 103957681B CN 201410176001 A CN201410176001 A CN 201410176001A CN 103957681 B CN103957681 B CN 103957681B
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Abstract
The present invention relates to a kind of electronic device cooling apparatus waiting fluid distribution, including being located at the water-cooled motherboard supported in framework and the multiple water-cooled plug-in units being plugged on water-cooled motherboard, each water-cooled plug-in unit is provided with mean for coolant and enters, the fluid plug gone out, water-cooled motherboard is provided with the many convection cell socket corresponding with the fluid plug of water-cooled plug-in unit, it is characterized in that: the pair of horns of water-cooled motherboard is respectively provided with total water inlet, total outlet, in water-cooled motherboard, one end arranges the water inlet main communicated with total water inlet, the other end arranges and goes out water conduit tube with total outlet communicates, be arranged in parallel the many water inlet pipes communicated with water inlet main in water-cooled motherboard, water inlet pipe is substantially vertical with water inlet main, be arranged in parallel in water-cooled motherboard many with go out the exit branch that water conduit tube communicates, exit branch is with to go out water conduit tube substantially vertical, enter, go out aqueous fluid socket be respectively provided at into, on exit branch。The electronic device cooling apparatus of the present invention, processing is simple, and flow resistance is little, fluid distributed uniform, good heat dissipation effect。
Description
Technical field
The invention belongs to technical field of electronic equipment, particularly a kind of electronic device cooling apparatus waiting fluid distribution。
Background technology
Along with improving constantly of Electronic Encapsulating Technology level, the overall dimensions of electronic product is more and more less, and unit heat flow density also increases rapidly。Liquid is cold to be widely used in the electronic device with its higher radiating efficiency。When multiple water-cooled plug-in units in parallel are worked simultaneously, liquid distribution be it is also proposed higher requirement。
Fig. 1 is existing electronic device cooling apparatus water-cooled motherboard structure schematic diagram。In existing electronic device cooling apparatus, being limited by the installation site requirement of electronic equipment, the layout of runner is sufficiently complex, it is difficult to processing。Runner bending is more, increases the flow resistance of system, and the distribution of fluid such as is not easily accomplished。
Summary of the invention
It is an object of the invention to provide a kind of electronic device cooling apparatus waiting fluid distribution, it is easy to processing, flow resistance is little, fluid distributed uniform。
The technical scheme realizing the object of the invention is: a kind of electronic device cooling apparatus waiting fluid distribution, including being located at the water-cooled motherboard supported in framework and the multiple water-cooled plug-in units being plugged on water-cooled motherboard, each water-cooled plug-in unit is provided with mean for coolant and enters, the fluid plug gone out, water-cooled motherboard is provided with the many convection cell socket corresponding with the fluid plug of water-cooled plug-in unit, it is characterized in that: the pair of horns of water-cooled motherboard is respectively provided with total water inlet, total outlet, in water-cooled motherboard, one end arranges the water inlet main communicated with total water inlet, the other end arranges and goes out water conduit tube with total outlet communicates, be arranged in parallel the many water inlet pipes communicated with water inlet main in water-cooled motherboard, water inlet pipe is substantially vertical with water inlet main, be arranged in parallel in water-cooled motherboard many with go out the exit branch that water conduit tube communicates, exit branch is with to go out water conduit tube substantially vertical, feed water flow body socket is located on water inlet pipe, go out aqueous fluid socket to be located on exit branch。
Compared with prior art, its remarkable advantage is the present invention:
1, fluid distributed uniform: runner is evenly distributed, by the approximate equipressure of the flow resistance of each water-cooled plug-in unit, this ensures that theres the uniform distribution of fluid；
2, flow resistance is little: runner is divided into main and arm, decreases various curved channel, reduces flow resistance；
3, it is prone to processing: installation frame is spliced, and water-cooled motherboard runner is regular shape, it is easy to machine-shaping。
Below in conjunction with accompanying drawing, the present invention is described in further detail。
Accompanying drawing explanation
Fig. 1 is prior art water-cooled motherboard structure schematic diagram。
Fig. 2 is the electronic device cooling apparatus outline drawing of the fluid distribution such as the present invention。
Fig. 3 is water-cooled motherboard structure schematic diagram in Fig. 2。
Fig. 4 is support frame structure schematic diagram in Fig. 2。
Fig. 5 is water-cooled dongle configuration schematic diagram in Fig. 2。
Fig. 6 is water-cooled motherboard runner schematic diagram in Fig. 2。
Fig. 7 is water-cooled plug-in unit runner schematic diagram in Fig. 2。
Fig. 8 is that in Fig. 2, water-cooled motherboard and water-cooled plug-in unit patch relation schematic diagram。
In figure, 1 water-cooled motherboard, 2 support framework, 3 water-cooled plug-in units, 4 fluid sockets, 5 fluid plugs, total water inlet 61, total outlet 62, and main 71 of intaking goes out water conduit tube 72, water inlet pipe 81, exit branch 82, alignment pin 9, positions hole 10。
Detailed description of the invention
If Fig. 2 is to shown in 8, the electronic device cooling apparatus of the fluid distribution such as the present invention, including being located at the water-cooled motherboard 1 supported in framework 2 and the multiple water-cooled plug-in units 3 being plugged on water-cooled motherboard 1, each water-cooled plug-in unit 3 is provided with mean for coolant and enters, the fluid plug 51 gone out, 52, water-cooled motherboard 1 is provided with the fluid plug 51 with water-cooled plug-in unit 3, 52 corresponding many convection cells sockets 41, 42, the pair of horns of water-cooled motherboard 1 is respectively provided with total water inlet 61, total outlet 62, in water-cooled motherboard 1, one end arranges the water inlet main 71 communicated with total water inlet 61, the other end arranges and goes out water conduit tube 72 with total outlet 62 communicates, be arranged in parallel the many water inlet pipes 81 communicated with water inlet main 71 in water-cooled motherboard 1, water inlet pipe 81 is substantially vertical with water inlet main 71, be arranged in parallel in water-cooled motherboard 1 many with go out the exit branch 82 that water conduit tube 72 communicates, exit branch 82 is substantially vertical with going out water conduit tube 72, feed water flow body socket 41 is located on water inlet pipe 81, go out aqueous fluid socket 42 to be located on exit branch 82。
So ensure that each plug-in unit has identical flow resistance, is assigned to identical pressure reduction, it is achieved that the uniform distribution of flow。Runner is evenly distributed, and by the approximate equipressure of the flow resistance of each water-cooled plug-in unit, this ensures that theres the uniform distribution of fluid；Runner is divided into main and arm, decreases various curved channel, reduces flow resistance；Installation frame is spliced, and water-cooled motherboard runner is regular shape, it is easy to machine-shaping。
Described fluid socket 41,42 is self sealss fluid connector body。After water-cooled plug-in unit 3 is connected and disconnected from water-cooled motherboard 1 being connected, it is ensured that fluid will not be revealed。
Described fluid plug 51,52 is self sealss fluid connector plug。After water-cooled plug-in unit 3 is connected and disconnected from water-cooled motherboard 1 being connected, it is ensured that fluid will not be revealed。
Being provided with guiding water-cooled plug-in unit 3 in described support framework 2 along patching the guide-track groove that direction is moved, water-cooled plug-in unit 3 is provided with alignment pin 9 with fluid plug 51,52 homonymy, water-cooled motherboard 1 is provided with the location hole 10 corresponding with water-cooled plug-in unit alignment pin 9 position and quantity。Water-cooled plug-in unit 3 docks with water-cooled motherboard 1 by supporting the guide-track groove on framework 2 and the alignment pin on water-cooled plug-in unit 3, it is ensured that water connector and electric connector put in place simultaneously。Fluid plug 5 on water-cooled plug-in unit 3 docks with the fluid socket 4 on water-cooled motherboard 1 after putting in place, it is achieved the conducting of fluid, and electronic equipment is dispelled the heat。
Water-cooled motherboard 1: water-cooled motherboard provides input and the output of coolant for the module in chiller, it is achieved the cooling of module；Also it is the supporting construction of chiller, provides protection and cabling to install for module, fluid connector socket, electrical cnnector socket etc. are installed simultaneously。In the design process of water-cooled motherboard 1, consider when multiple plug-in unit patches simultaneously, it is ensured that the flow of each plug-in unit distribution is impartial。
Support framework 2: be fixed together by screw and alignment pin with water-cooled motherboard 1, be the installation frame of whole device。
Water-cooled plug-in unit 3: heating electronic device is provided mounting platform, and realizes heat transmission。
Fluid socket 4: when the fluid connector plug of water-cooled plug-in unit is connected with it, the conducting of fluid can be realized。
Fluid plug 5: when connecting with the fluid connector socket of water-cooled motherboard 1, the conducting of fluid can be realized。
Alignment pin 9: be installed on water-cooled plug-in unit 3, when adapter connects, for the location between plugs and sockets。
Hole 10, location: be positioned on water-cooled motherboard 1, when adapter connects, for the location between plugs and sockets。
Claims (4)
1. the electronic device cooling apparatus waiting fluid distribution, including being located at the water-cooled motherboard (1) supported in framework (2) and the multiple water-cooled plug-in units (3) being plugged on water-cooled motherboard (1), each water-cooled plug-in unit (3) is provided with mean for coolant and enters, the fluid plug (51 gone out, 52), water-cooled motherboard (1) is provided with and the fluid plug (51 of water-cooled plug-in unit (3), 52) corresponding many convection cells socket (41, 42), it is characterized in that: the pair of horns of water-cooled motherboard (1) is respectively provided with total water inlet (61), total outlet (62), in water-cooled motherboard (1), one end arranges the water inlet main (71) communicated with total water inlet (61), what other end setting communicated with total outlet (62) goes out water conduit tube (72), be arranged in parallel the many water inlet pipes (81) communicated with water inlet main (71) in water-cooled motherboard (1), water inlet pipe (81) is substantially vertical with water inlet main (71), be arranged in parallel in water-cooled motherboard (1) many with go out the exit branch (82) that water conduit tube (72) communicates, exit branch (82) is substantially vertical with going out water conduit tube (72), every water inlet pipe (81) is provided with multiple feed water flow body socket (41), every exit branch (82) be provided with multiple go out aqueous fluid socket (42)。
2. the electronic device cooling apparatus waiting fluid distribution according to claim 1, it is characterised in that: described fluid socket (41,42) is self sealss fluid connector body。
3. the electronic device cooling apparatus waiting fluid distribution according to claim 1, it is characterised in that: described fluid plug (51,52) is self sealss fluid connector plug。
4. the electronic device cooling apparatus waiting fluid distribution according to claim 1, it is characterized in that: be provided with guiding water-cooled plug-in unit (3) in described support framework (2) along patching the guide-track groove that direction is moved, water-cooled plug-in unit (3) is gone up and fluid plug (51,52) homonymy is provided with alignment pin (9), and water-cooled motherboard (1) is provided with the location hole (10) corresponding with water-cooled plug-in unit alignment pin (9) position and quantity。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176001.1A CN103957681B (en) | 2014-04-28 | 2014-04-28 | A kind of electronic device cooling apparatus waiting fluid distribution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176001.1A CN103957681B (en) | 2014-04-28 | 2014-04-28 | A kind of electronic device cooling apparatus waiting fluid distribution |
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| Publication Number | Publication Date |
|---|---|
| CN103957681A CN103957681A (en) | 2014-07-30 |
| CN103957681B true CN103957681B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410176001.1A Active CN103957681B (en) | 2014-04-28 | 2014-04-28 | A kind of electronic device cooling apparatus waiting fluid distribution |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204887839U (en) * | 2015-07-23 | 2015-12-16 | 中兴通讯股份有限公司 | Veneer module level water cooling system |
| EP3824697B1 (en) | 2018-05-25 | 2022-10-12 | Miba Energy Holding GmbH | Power module with defined recharging path and production method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1815514B1 (en) * | 2004-11-24 | 2008-04-23 | Danfoss Silicon Power GmbH | A flow distribution module and a stack of flow distribution modules |
| CN201663783U (en) * | 2010-01-25 | 2010-12-01 | 中兴通讯股份有限公司 | Cabinet cooling plug-in box and cabinet |
| CN103222354A (en) * | 2010-10-22 | 2013-07-24 | 固利吉股份有限公司 | Improved flow balancing scheme for two-hase refrigerant cooled rack |
-
2014
- 2014-04-28 CN CN201410176001.1A patent/CN103957681B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1815514B1 (en) * | 2004-11-24 | 2008-04-23 | Danfoss Silicon Power GmbH | A flow distribution module and a stack of flow distribution modules |
| CN201663783U (en) * | 2010-01-25 | 2010-12-01 | 中兴通讯股份有限公司 | Cabinet cooling plug-in box and cabinet |
| CN103222354A (en) * | 2010-10-22 | 2013-07-24 | 固利吉股份有限公司 | Improved flow balancing scheme for two-hase refrigerant cooled rack |
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| CN103957681A (en) | 2014-07-30 |
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