CN103923577B - It is applicable to high temperature resistant protective membrane and its preparation method of non-ITO conducting film - Google Patents
It is applicable to high temperature resistant protective membrane and its preparation method of non-ITO conducting film Download PDFInfo
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- CN103923577B CN103923577B CN201410197272.5A CN201410197272A CN103923577B CN 103923577 B CN103923577 B CN 103923577B CN 201410197272 A CN201410197272 A CN 201410197272A CN 103923577 B CN103923577 B CN 103923577B
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Abstract
The present invention discloses a kind of high temperature resistant protective membrane being applicable to non-ITO conducting film; comprise and being cascading: substrate layer, high-temperature plastic adhensive layer, release rete; high-temperature plastic adhensive layer is made up of acrylic acid or the like sizing agent; the thickness of substrate layer is 0.038-0.188mm; when 180 DEG C/60min; longitudinal percent thermal shrinkage of protective membrane is 0.75-1.0%, and horizontal percent thermal shrinkage is 0.40-0.65%, also discloses the preparation method of this high temperature resistant protective membrane simultaneously. The high temperature resistant protective membrane of the present invention, it is possible to the full processing procedure of non-ITO conducting film is protected, it is ensured that quality product, it is to increase product yield, and preparation process be simple and easy to realize; When 180 DEG C/60min without residual glue, without particle, the surface quality of product can not be impacted, also solve the problem that pyroprocess causes non-ITO conducting film warpage and distortion well.
Description
Technical field
The present invention relates to a kind of high temperature resistant protective membrane, it is specifically related to a kind of high temperature resistant protective membrane and its preparation method that are applicable to non-ITO conducting film.
Background technology
Conducting film is divided into ITO conductive glass, ITO conducting film and non-ITO conducting film three major types, and wherein, non-ITO conducting film belongs to the emerging industry in flexible screen, and market outlook are fine. In manufacture craft, the main body substrate surface of non-ITO conducting film not damage resistant, vulnerable to pollution, therefore need when conducting film to play a part to prevent from drawing wound and pollution to its surface by a specific protective membrane making. In addition; because the singularity of non-ITO process for making conducting membrane; processing procedure needs stand pyroprocessing; high-temperature process is an extremely strict test for product; the first, when pyroprocessing, the glue of protective membrane easily produces residual glue and particulate state is bad causes final product quality defective, and the 2nd; high-temperature process very easily causes non-ITO conducting film generation warpage, and seriously affecting quality product even causes defect ware. Given this, non-ITO conducting film to be promoted, overcome the problems referred to above extremely urgent.
Summary of the invention
For solving the deficiencies in the prior art, it is an object of the invention to provide a kind of available protecting non-ITO conducting film, the high temperature resistant protective membrane without residual glue, non-warpage.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
It is applicable to the high temperature resistant protective membrane of non-ITO conducting film; comprise and being cascading: substrate layer, high-temperature plastic adhensive layer, release rete; described high-temperature plastic adhensive layer is made up of acrylic acid or the like sizing agent; the thickness of described substrate layer is 0.038-0.188mm; when 180 DEG C/60min; longitudinal percent thermal shrinkage of protective membrane is 0.75-1.0%, and horizontal percent thermal shrinkage is 0.40-0.65%.
Preferably, aforementioned substrates layer is made up of PET film.
Preferably, aforementioned release rete is made up of the PET material with silicon coating.
Preferably, the thickness of aforementioned substrates layer is 0.05-0.12mm.
Preferably, aforementioned high-temperature plastic adhensive layer is made up of acrylic acid or the like sizing agent, and is added with the isocyanic ester of 5-8wt%.
The present invention also discloses the preparation method of this high temperature resistant protective membrane, comprise the steps:
S1, the material made by PET film are cut to substrate layer desired size and pave;
S2, on substrate layer be coated with one layer of high-temperature plastic adhensive layer, high temperature resistant sizing agent is made up of the acrylic acid or the like sizing agent being doped with 5-8wt%;
S3, will be coated with high temperature resistant sizing agent base material dry;
S4, on high-temperature plastic adhensive layer laminating release layer, rolling obtains high temperature resistant protective membrane finished product.
The usefulness of the present invention is: the high temperature resistant protective membrane of the present invention, it is possible to protected by the full processing procedure of non-ITO conducting film, it is ensured that quality product, it is to increase product yield, and preparation process is simple and easy to realize; The high temperature resistant protective membrane adopted in the present invention when 180 DEG C/60min without residual glue, without particle, the surface quality of product can not be impacted, and protective membrane of the prior art cannot withstand high temperatures, namely can produce a large amount of residual glue and particle when 100 DEG C/60min; And; the pyroprocess that the high temperature resistant protective membrane of the present invention also solves well causes the problem of non-ITO conducting film warpage and distortion; coordinated with specific sizing agent by specific base material; the lateral shrinkage achieving protective membrane is all suitable with non-ITO conducting film with longitudinal shrinking percentage; namely the shrinking percentage of protective membrane keeps mating with the shrinking percentage of product (non-ITO conducting film); the angularity of the finished product is less than 3mm; and adopt protective membrane of the prior art; under equal conditions, angularity is generally all at more than 20mm.
Accompanying drawing explanation
Fig. 1 is the structural representation of a specific embodiment of the high temperature resistant protective membrane being applicable to non-ITO conducting film of the present invention.
The implication of Reference numeral in figure: 1, substrate layer, 2, high-temperature plastic adhensive layer, 3, release rete.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention done concrete introduction.
See Fig. 1, the high temperature resistant protective membrane being applicable to non-ITO conducting film of the present invention, comprises and being cascading: substrate layer 1, high-temperature plastic adhensive layer 2, release rete 3. Wherein, substrate layer 1 is preferably by PET(polyethylene terephthalate) film makes, and thickness is 0.038-0.188mm, more preferably 0.05-0.12mm; High-temperature plastic adhensive layer 2 is made up of acrylic acid or the like sizing agent, preferably wherein also it is added with the isocyanic ester of 5-8wt%, to optimize the performance of sizing agent further, practice confirms, the surface quality of product without residual glue, without particle, can not be impacted by this is high temperature resistant protective membrane after the high bake of experience 180 DEG C/60min; Release rete 3 is made up of the PET material with silicon coating, is separated with adhesive layer to facilitate. The high temperature resistant protective membrane of this structure; when 180 DEG C/60min; longitudinal percent thermal shrinkage of protective membrane is 0.75-1.0%; horizontal percent thermal shrinkage is 0.40-0.65%; the control of shrinking percentage is realized in conjunction with specific base material by the specific high temperature resistant sizing agent of the present invention; and in general; longitudinal percent thermal shrinkage of the non-ITO conducting film on market is 0.75-1.0%; horizontal percent thermal shrinkage is 0.45-0.65%; so; just make the shrinking percentage of protective membrane of the present invention keep mating with the shrinking percentage of product, thus play the effect effectively preventing warpage.
Meanwhile, the present invention also discloses the preparation method of this high temperature resistant protective membrane, comprise the steps:
S1, the material made by PET film are cut to substrate layer 1 desired size and pave;
S2, on substrate layer 1 be coated with one layer of high-temperature plastic adhensive layer 2, high temperature resistant sizing agent is made up of the acrylic acid or the like sizing agent being doped with 5-8wt%;
S3, will be coated with high temperature resistant sizing agent base material dry;
S4, on high-temperature plastic adhensive layer 2 laminating release layer, rolling obtains high temperature resistant protective membrane finished product.
Confirm through simulated experiment; high temperature resistant protective membrane superior performance prepared by aforesaid method; in use, release layer is peelled off, paste the surface at protected non-ITO conducting film; prevent ITO conducting film contaminated; and whole technological process can not be produced any impact, after making end, tear protective membrane off; without residual glue, ITO conducting film is without curling.
More than show and describe the ultimate principle of the present invention, main feature and advantage. The technician of the industry is not it should be understood that above-described embodiment limits the present invention in any form, and all employings are equal to the technical scheme that the mode of replacement or equivalent transformation obtains, and all drop in protection scope of the present invention.
Claims (5)
1. it is applicable to the high temperature resistant protective membrane of non-ITO conducting film, it is characterized in that, comprising and being cascading: substrate layer, high-temperature plastic adhensive layer, release rete, described high-temperature plastic adhensive layer is made up of acrylic acid or the like sizing agent, and be wherein added with the isocyanic ester of 5-8wt%; The thickness of described substrate layer is 0.038-0.188mm, and when 180 DEG C/60min, longitudinal percent thermal shrinkage of protective membrane is 0.75-1.0%, and horizontal percent thermal shrinkage is 0.40-0.65%.
2. the high temperature resistant protective membrane being applicable to non-ITO conducting film according to claim 1, it is characterised in that, described substrate layer is made up of PET film.
3. the high temperature resistant protective membrane being applicable to non-ITO conducting film according to claim 1, it is characterised in that, described release rete is made up of the PET material with silicon coating.
4. the high temperature resistant protective membrane being applicable to non-ITO conducting film according to claim 1, it is characterised in that, the thickness of described substrate layer is 0.05-0.12mm.
5. the preparation method of the high temperature resistant protective membrane being applicable to non-ITO conducting film as described in item as arbitrary in claim 1-4, it is characterised in that, comprise the steps:
S1, the material made by PET film are cut to substrate layer desired size and pave;
S2, on substrate layer be coated with one layer of high-temperature plastic adhensive layer, high temperature resistant sizing agent is made up of the acrylic acid or the like sizing agent being doped with 5-8wt% isocyanic ester;
S3, will be coated with high temperature resistant sizing agent base material dry;
S4, on high-temperature plastic adhensive layer laminating release layer, rolling obtains high temperature resistant protective membrane finished product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410197272.5A CN103923577B (en) | 2014-05-12 | 2014-05-12 | It is applicable to high temperature resistant protective membrane and its preparation method of non-ITO conducting film |
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| CN201410197272.5A CN103923577B (en) | 2014-05-12 | 2014-05-12 | It is applicable to high temperature resistant protective membrane and its preparation method of non-ITO conducting film |
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| CN103923577A CN103923577A (en) | 2014-07-16 |
| CN103923577B true CN103923577B (en) | 2016-06-01 |
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| CN104263268B (en) * | 2014-09-10 | 2016-02-10 | 宁波雅歌新材料科技有限公司 | A kind of preparation method of PET processing procedure protective membrane |
| CN113604167A (en) * | 2021-09-06 | 2021-11-05 | 江苏斯迪克新材料科技股份有限公司 | Non-silicon transfer protective film and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102136432A (en) * | 2010-01-26 | 2011-07-27 | 东丽世韩株式会社 | Method of making semiconductor device through heat-resistant gluing sheet |
| CN102681037A (en) * | 2011-03-18 | 2012-09-19 | 住友化学株式会社 | Polarizer protective film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5313837B2 (en) * | 2009-10-23 | 2013-10-09 | 日東電工株式会社 | Removable adhesive sheet |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102136432A (en) * | 2010-01-26 | 2011-07-27 | 东丽世韩株式会社 | Method of making semiconductor device through heat-resistant gluing sheet |
| CN102681037A (en) * | 2011-03-18 | 2012-09-19 | 住友化学株式会社 | Polarizer protective film |
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