CN103915558A - LED module - Google Patents
LED module Download PDFInfo
- Publication number
- CN103915558A CN103915558A CN201410159910.4A CN201410159910A CN103915558A CN 103915558 A CN103915558 A CN 103915558A CN 201410159910 A CN201410159910 A CN 201410159910A CN 103915558 A CN103915558 A CN 103915558A
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- Prior art keywords
- led
- radiator
- lens
- led module
- substrate
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- 238000007789 sealing Methods 0.000 claims abstract description 33
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 55
- 230000000694 effects Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 238000004512 die casting Methods 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000004078 waterproofing Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000010273 cold forging Methods 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract description 21
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 description 17
- 239000010980 sapphire Substances 0.000 description 8
- 229910052594 sapphire Inorganic materials 0.000 description 8
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 208000002925 dental caries Diseases 0.000 description 5
- 239000011049 pearl Substances 0.000 description 5
- 230000006854 communication Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 235000009967 Erodium cicutarium Nutrition 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of lighting lamps and discloses an LED module. The LED module comprises a radiator, a lens and a base plate provided with an LED light-emitting body. The LED light-emitting body is arranged in the lens, the lens is provided with at least one protruding cavity, the LED light-emitting body comprises at least one LED light-emitting body unit, and the protruding cavity can correspond to the LED light-emitting body unit in a one-to-one mode. A sealing waterproof space used for containing the LED light-emitting body is formed between the protruding cavity of the lens and the radiator. In the lens, the protruding cavity between the LED light-emitting body and the lens is filled with index-matching fluid used for improving the light efficiency, and in addition, filling of the index-matching fluid is performed in a glue infusing or glue dispensing mode. The LED module has the advantages of being high in reliability and high in light efficiency; due to filling of the index-matching fluid, the high-sealing waterproof grade is achieved, heat dissipation is assisted, and therefore the high reliability is achieved; and due to the index-matching liquid, light emitting media are changed into colloid from air to achieve the high light efficiency.
Description
Technical field
The present invention relates to the technical field of illuminating lamp, particularly a kind of LED module.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
But there is following defect in current LED module:
First, existing LED module degree of protection is not high enough, and heat-sinking capability is strong not, thereby reliability is poor.
Secondly, the light that the LED chip of existing LED module sends needs through air dielectric in communication process, can cause interface loss, causes LED chip light extraction efficiency low; In existing LED module, non-filler between set of lenses and radiator, will damage LED luminous element once enter steam;
Finally, when existing LED module is applied in street lighting, because the reasons such as existing tail gas cause the easy dust suction of kick structure outside LED module, the utmost point affects the light effect that of LED module.
Summary of the invention
The object of the invention is to provide a kind of LED module, not high enough to solve in prior art LED module reliability, and the lower technical matters of light efficiency.
The object of the invention is achieved through the following technical solutions:
A kind of LED module, comprise radiator, lens, be provided with the substrate of LED luminous element, described LED luminous element is arranged in described lens, described lens are provided with at least one protruding cavity, LED luminous element at least comprises a LED luminous element unit, described protruding cavity can be corresponding one by one with described LED luminous element unit, forms the water-tight space of placing described LED luminous element between the protruding cavity of described lens and radiator, and described substrate is fixed on radiator.
Preferably, in described lens, in the protruding cavity between LED luminous element and described lens, fill the index-matching fluid that is provided with to improve light efficiency.And index-matching fluid, fills by injecting glue or some glue form.
Radiator is to form at interior arbitrary technological forming by comprising cold section, drawing, die casting.
Preferably, the described lens of described LED module are provided with fastener, and described lens are fixed on described radiator by fastener and form described water-tight space.
Preferably, described radiator is set to the non-radiating layout with better radiating effect that flushes.
Preferably, on described water-tight space, be provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
And the outlet of module is water-proof wire or bare wire.
Preferably, radiator is directly connected with substrate and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate, or radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
Preferably, described LED luminous element unit comprises at least one LED lamp pearl or at least one the LED chip containing fluorescent material or COB or is combined or combined by the LED chip containing fluorescent material of multiple different-colour by multiple different-colour LED lamp pearl.
It should be noted that not necessarily buckle of lens radiator fixed form is also played screw; Not necessarily lattice-shaped of sealing clamping ring shape, lattice-shaped is just as preferred.
Compared with prior art, the present invention has following beneficial effect:
1, high reliability: be filled with index-matching fluid in the confined space of radiator and set of lenses in LED module of the present invention, it is coated that substrate and each LED luminous element are refracted rate matching fluid, therefore has good water-tight performance; And the heat that in the present invention, LED luminous element produces not only can be by the bottom surface of cooling stand of self to substrate transmission, and can outwards transmit by index-matching fluid, makes radiating effect better.Fill index-matching fluid and realize high sealing classification of waterproof auxiliary heat dissipation, thus the high reliability of realization;
2, high light efficiency: fill index-matching fluid, bright dipping medium becomes colloid from air;
Compared with prior art, in LED module of the present invention, the light that LED luminous element sends index-matching fluid in communication process has substituted original air dielectric, and the refractive index of index-matching fluid is mated with the lens in set of lenses, improve so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%;
3, LED module of the present invention only arranges multiple lens or lens, and lens are provided with at least one protruding cavity.In this projection cavity, place LED luminous element unit.Lens can be arranged to circle, ellipse, the various shapes such as square, and same can be arranged to LED module various shapes and specification, and is not limited to square or rectangular configuration in the past, has greatly promoted its application places.
If 4 LED luminous elements are wafer level encapsulated LED light source, can carry out the optics proportioning such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can be by adding red-light source, realize aobvious finger and adjust.Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
5, LED module arranges multiple lens, is only provided with a protruding cavity on these lens.These lens are adopted and are difficult for falling dust, and the material that is particularly difficult for sticky tail gas is made, and can improve light efficiency.
Accompanying drawing explanation
Figure 1A, Figure 1B are respectively exploded view and the assembly drawing of the embodiment 1 of LED module;
Fig. 2 A, Fig. 2 B are respectively exploded view and the assembly drawing of the embodiment 2 of LED module.
Fig. 3 A, Fig. 3 B are respectively exploded view and the assembly drawing of the embodiment 3 of LED module;
Fig. 4 A, Fig. 4 B are respectively exploded view and the assembly drawing of the embodiment 4 of LED module;
Fig. 5 is a kind of generalized section of conical surface fastening seal structure.
Embodiment
Embodiment 1
A kind of LED module, comprise: lens 12, wafer level encapsulated LED light source and substrate 14(wafer level encapsulated LED light source are arranged on substrate 14, wafer level encapsulated LED light source is smaller, in figure, do not identify label) and radiator 15, substrate 14 is set on radiator 15, substrate 14 can directly be connected or connect by medium with radiator 15, lens 12 are provided with protruding cavity 121, between the protruding cavity 121 of lens 12 and radiator 15, form the water-tight space of placing LED light source, and substrate 14 is fixed on radiator 15.One waterproof grommet 13 is set between lens 12 and radiator 15, contributes to improve waterproof effect.
LED light source can be welded on substrate 14, and substrate 14 comprises one of them of metal substrate, ceramic substrate.
LED light source can be wafer level encapsulated LED light source, LED light source that also can be common.Wherein, if wafer level encapsulated LED light source, it comprises fluorescent material, sapphire, luminescent layer, pad, and pad is arranged at luminescent layer bottom, and sapphire is arranged on luminescent layer, and fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation; Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
In addition, wafer level encapsulated LED light source can carry out the optics proportioning such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can be by adding red-light source, realize aobvious finger and adjust.In this example, a LED module only arranges lens 12, is only provided with a protruding cavity 121 on these lens 12.The wafer level encapsulated LED light source of placing in this projection cavity can be made up of plurality of LEDs particle.Like this, to whole LED module, the optics proportioning such as colour temperature, aobvious finger is carried out in unification, improves the optical property of whole LED module.
Radiator 15 can form at interior arbitrary technological forming by comprising cold section, drawing, die casting.
On water-tight space, be provided with the wire hole for water-proof wire 18 outlets, and for hole for injecting glue and the steam vent of injecting glue.In lens 12, the interior filling of protruding cavity 121 between wafer level encapsulated LED light source and lens 12 is provided with to improve the index-matching fluid of light efficiency.In airtight waterproof space, fill packing colloid, the confined space that packing colloid is filled with by the technique of injecting glue.In this example, packing colloid is transparence, and its refractive index is 1.3 ~ 1.7, and the refractive index of the lens 12 in refractive index and the set of lenses of packing colloid approaches.In LED module of the present invention, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens 12 in set of lenses, improve so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%.In LED module of the present invention, in the confined space of radiator 15 and lens 12, be filled with packing colloid, substrate 14 and the packed colloid of each LED luminous element are coated, therefore have good water resistance.In LED module of the present invention, the heat that LED luminous element produces not only can transmit to substrate 14 by the bottom surface of the cooling stand of self, and can outwards transmit by packing colloid, makes radiating effect better.Certainly, also can be as required, in the confined space of radiator 15 and lens 12, can be partially filled full packing colloid.
In addition, radiator 15 is directly connected with substrate 14 and further comprises directly laminating, clamping of radiator 15, is spirally connected or welding substrate 14, or radiator 15 is connected and is further comprised that radiator 15 is connected with substrate 14 by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate 15.Radiator 15 is not limit with the type of attachment of substrate 14, as long as can reach the effect of abundant heat radiation.Also it should be noted that, radiator 15 is mainly the radiating fin that the other one side that contacts with substrate 14 is arranged to have high-cooling property, and existing radiating fin is design side by side mainly.The radiating effect that the applicant finds parallel radiating fin is not necessarily best, for this reason, the applicant has invented the arrangement mode of the radiating fin with better radiating effect, such as, a kind of arrangement mode is: from intercepting face, radiating fin be divided into central part and centered by central part surrounding heronsbill mode disperse the fin unit of arranging, this set has better radiating effect to the heat at center.Also have, although the radiating fin of radiator 15 is interval designs side by side, each radiating fin is not continuously protruding, and each radiating fin can arrange some vacancies, the vacancy of adjacent radiating fin staggers, or the vacancy of adjacent radiating fin staggers between two.The radiating effect of the radiating fin of this radiator 15 is also extraordinary.
LED module also comprises in order to by sealing clamping ring fixing lens 12 11 and black box, and sealing clamping ring 11 makes lens 12 and radiator 15 form described seal cavity by black box.In this example, black box comprises sealing ring 17 and/or conical surface fit sealing assembly, and conical surface fit sealing assembly is arranged on sealing clamping ring 11 and radiator 15.Refer to Fig. 5.Sealing clamping ring 11 surroundings are set to grid, and are convexly equipped with reinforcement in surrounding, and the bottom of sealing ring 17 and inner ring setting have some annular projections of better water proofing property.Sealing ring 17 can be interior " U " type structure, and upper and lower two rings are packaged in the periphery of lens 12, and bottom arranges some annular projections with inner ring setting with better water proofing property, guarantees to greatest extent sealing grade between sealing ring 17 and trim ring 11, lens 12.It should be noted that lens and not necessarily buckle of radiator fixed form are also played screw; Not necessarily lattice-shaped of sealing clamping ring shape, lattice-shaped is just as preferred.
In this example, the waterproof screwed pipe arranging on water-proof wire 18 wore radiator 15 by T-shaped sealing ring 19 and was connected with substrate 14.Screw is realized being spirally connected of radiator 15 and substrate 14 by silicone gasket 16.Certainly, arranging of water-proof wire 18 is not limited thereto, has a variety of implementations, and above is only for example, it should be noted that, in any case connect the sealing grade that must protect water-proof wire 18 to connect after getting on.Equally, radiator 15 is only also one with being spirally connected of substrate 14 and gives an example.
Embodiment 2
Unique different from embodiment 1, water-proof wire 21 is realized and being connected and sealing by back seal circle 22.
LED module of the present invention only arranges lens, is only provided with a protruding cavity on these lens.In this projection cavity, place many wafer level encapsulated LED light sources.Like this, to whole LED module, the optics proportioning such as colour temperature, aobvious finger is carried out in unification, improves the optical property of whole LED module.This LED module is owing to can plurality of LEDs particle being installed at a protruding cavity, and fill in order to improve the index-matching fluid of light efficiency in cavity, greatly improve the light efficiency of single led module, can, as application places such as the car lights of automobile, greatly improve the application scenarios of LED module.
Embodiment 3
Refer to Fig. 3 A and Fig. 3 B, it is a kind of LED module instance graph with two protruding cavitys.A kind of LED module, comprise radiator 38, lens 31, be provided with the substrate 34 of LED luminous element, LED luminous element is arranged in lens 31, lens 31 are provided with at least one protruding cavity, and (lens 31 are provided with two protruding cavitys 311 in this example, 312), LED luminous element at least comprises a LED luminous element unit (in this example, LED luminous element comprises two LED luminous element unit 331, 332), projection cavity 311, 312 with LED luminous element unit 331, 332 is corresponding one by one, the protruding cavity 311 of lens 31, 312 and radiator between form place LED luminous element unit 331, 332 water-tight space, substrate 34 is fixed on radiator 38, LED luminous element unit 331, 332 can be by one or several wafer level encapsulated LED light sources, LED light source composition that can certainly be common.
LED light source can be welded on substrate 34, and substrate 34 comprises one of them of metal substrate, ceramic substrate.
If wafer level encapsulated LED light source, wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and pad is arranged at luminescent layer bottom, and sapphire is arranged on luminescent layer, and fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation; Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
In addition, LED light source can carry out the optics proportioning such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can be by adding red-light source, realize aobvious finger and adjust.In this example, a LED module can only arrange lens 31, and these lens 11 are provided with two protruding cavitys 311,312.The LED luminous element unit 331,332 of placing respectively in those protruding cavitys.
On water-tight space, be provided with the wire hole for water-proof wire 37 outlets, and for hole for injecting glue and the steam vent of injecting glue.In lens 31, protruding cavity 311, the 312 interior fillings between wafer level encapsulated LED light source and lens 31 are provided with to improve the index-matching fluid of light efficiency.In airtight waterproof space, can fill full packing colloid completely, packing colloid is filled with confined space by the technique of injecting glue.Certainly, index-matching fluid, mainly fills by injecting glue or some glue form.In this example, packing colloid is transparence, and its refractive index is 1.3 ~ 1.7, and the refractive index of the lens in refractive index and the set of lenses of packing colloid approaches.In LED module of the present invention, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid mates with the lens in set of lenses, has improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%.In LED module of the present invention, in the confined space of radiator 38 and lens 31, be filled with packing colloid, substrate 34 and the packed colloid of each LED luminous element are coated, therefore have good water resistance.In LED module of the present invention, the heat that LED luminous element produces not only can transmit to substrate 34 by the bottom surface of the cooling stand of self, and can outwards transmit by packing colloid, makes radiating effect better.
In addition, radiator 38 is directly connected with substrate 34 and further comprises directly laminating, clamping of radiator 38, is spirally connected or welding substrate 34, or radiator 38 is connected and is further comprised that radiator 38 is connected with substrate 34 by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate 34.Radiator 38 is not limit with the type of attachment of substrate 34, as long as can reach the effect of abundant heat radiation.Also it should be noted that, radiator 38 is mainly the radiating fin that the other one side that contacts with substrate 34 is arranged to have high-cooling property, and existing radiating fin is mainly design side by side.The radiating effect that the applicant finds radiating fin is side by side not necessarily best, for this reason, the applicant has invented the arrangement mode of the radiating fin with better radiating effect, such as, a kind of arrangement mode is: from intercepting face, radiating fin be divided into central part and centered by central part surrounding heronsbill mode disperse the fin unit of arranging, this set has better radiating effect to the heat at center.Also have, although the radiating fin of radiator 18 is interval designs side by side, each radiating fin is not continuously protruding, and each radiating fin can arrange some vacancies, the vacancy of adjacent radiating fin staggers, or the vacancy of adjacent radiating fin staggers between two.The radiating effect of the radiating fin of this radiator 38 is also extraordinary.In addition, radiator 38 is set to the non-radiating layout with better radiating effect that flushes.The height of radiating fin can be also different, needs the aspect ratio of place (as center) fin of heat radiation higher, and shorter the closer to the height of the fin of side.
In this example, the lens 31 of LED module are provided with fastener, and lens are fixed on radiator by fastener and form described water-tight space.It should be noted that lens and not necessarily buckle of radiator fixed form are also played screw; Not necessarily lattice-shaped of sealing clamping ring shape, lattice-shaped is just as preferred.
It should be noted that, in order to mate with existing LED module, the profile that this LED module is made can be identical with original LED module, reaches the effect being convenient for changing.
Certainly, the outlet of module is water-proof wire or bare wire.
In this example, the waterproof screwed pipe 36 arranging on water-proof wire 37 wore radiator 38 by T-shaped sealing ring 35 and was connected with substrate 34.Certainly, arranging of water-proof wire 37 is not limited thereto, has a variety of implementations, and above is only for example, it should be noted that, in any case connect the sealing grade that must protect water-proof wire 17 to connect after getting on.Equally, radiator 18 is only also one with being spirally connected of substrate 14 and gives an example.
Embodiment 4
Unique different from embodiment 1, four protruding cavitys 311 are set on lens 31, same, LED light is sent out body and is comprised four corresponding LED luminous element unit 331.
Radiator the 18, the 38th, forms at interior arbitrary technological forming by comprising cold section, drawing, die casting.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection range.。
Claims (15)
1. a LED module, is characterized in that, comprises radiator, lens, is provided with the substrate of LED luminous element, and described LED luminous element is arranged in described lens, and described lens are provided with at least one protruding cavity, and LED luminous element at least comprises a LED luminous element unit,
When described protruding cavity is multiple, described protruding cavity is corresponding one by one with described LED luminous element unit, forms the water-tight space of placing described LED luminous element between the protruding cavity of described lens and radiator, and described substrate is fixed on radiator;
When described protruding cavity is single, between the protruding cavity of list of described lens and described radiator, form the water-tight space of placing described LED luminous element; In described lens, in the protruding cavity between LED luminous element and described lens, fill the index-matching fluid that is provided with to improve light efficiency.
2. LED module as claimed in claim 1, is characterized in that, described index-matching fluid is filled by injecting glue or some glue form, and described index-matching fluid can be the state of filling full state or being partly full of.
3. LED module as claimed in claim 1 or 2, is characterized in that, the described lens of described LED module are provided with fastener, and described lens are fixed on described radiator by fastener and form described water-tight space.
4. LED module as claimed in claim 1, is characterized in that, on described water-tight space, is provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
5. LED module as claimed in claim 1 or 2, is characterized in that, described radiator is set to the non-radiating layout with better radiating effect that flushes.
6. LED module as claimed in claim 1, is characterized in that, the outlet of module is water-proof wire or bare wire.
7. LED module as claimed in claim 1, is characterized in that,
Radiator is directly connected and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate with substrate, or
Radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
8. LED module as claimed in claim 1, it is characterized in that, described LED module also comprises that in order to by sealing clamping ring fixing described lens and black box, described sealing clamping ring makes described lens and described radiator form described water-tight space by black box.
9. LED module as claimed in claim 8, is characterized in that, described black box comprises sealing ring and/or conical surface fit sealing assembly, and described conical surface fit sealing assembly is arranged on sealing clamping ring and radiator.
10. LED module as claimed in claim 8, is characterized in that, described sealing clamping ring surrounding is set to grid, and is convexly equipped with reinforcement in surrounding, and the bottom of described sealing ring and inner ring setting have some annular projections of better water proofing property.
11. LED modules as claimed in claim 8, it is characterized in that, described sealing ring is interior " U " type structure, upper and lower two rings are packaged in the periphery of lens, bottom arranges some annular projections with inner ring setting with better water proofing property, guarantees to greatest extent sealing grade between sealing ring and trim ring, lens.
12. LED modules as claimed in claim 1, it is characterized in that, LED luminous element unit comprises at least one LED lamp pearl or at least one the LED chip containing fluorescent material or COB or is combined or combined by the LED chip containing fluorescent material of multiple different-colour by multiple different-colour LED lamp pearl.
13. LED modules as claimed in claim 1, is characterized in that, described wafer level encapsulated LED light source is welded on described substrate, and substrate comprises metal substrate, ceramic substrate.
14. LED modules as claimed in claim 1, is characterized in that, described substrate can directly be connected or connect by medium with described radiator, and radiator is to form at interior arbitrary technological forming by comprising cold forging, drawing, die casting.
15. 1 kinds at least comprise the lighting device of claim 1 to any one LED module in claim 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410159910.4A CN103915558A (en) | 2014-04-21 | 2014-04-21 | LED module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410159910.4A CN103915558A (en) | 2014-04-21 | 2014-04-21 | LED module |
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| CN103915558A true CN103915558A (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410159910.4A Pending CN103915558A (en) | 2014-04-21 | 2014-04-21 | LED module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104344380A (en) * | 2014-09-01 | 2015-02-11 | 苏州骏发精密机械有限公司 | Automobile LED radiator |
| CN105355757A (en) * | 2015-11-16 | 2016-02-24 | 江西华柏节能照明科技协同创新有限公司 | Integrated light engine packaging method |
| WO2016146025A1 (en) * | 2015-03-13 | 2016-09-22 | 杭州华普永明光电股份有限公司 | Light emitting diode lighting device and assembly method thereof |
| CN110034081A (en) * | 2018-01-12 | 2019-07-19 | 智光股份有限公司 | Radiating module and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202487569U (en) * | 2011-11-04 | 2012-10-10 | 杭州华普永明光电股份有限公司 | LED module group |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202487569U (en) * | 2011-11-04 | 2012-10-10 | 杭州华普永明光电股份有限公司 | LED module group |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104344380A (en) * | 2014-09-01 | 2015-02-11 | 苏州骏发精密机械有限公司 | Automobile LED radiator |
| CN104344380B (en) * | 2014-09-01 | 2017-09-19 | 苏州骏发精密机械有限公司 | Automobile LED radiator |
| WO2016146025A1 (en) * | 2015-03-13 | 2016-09-22 | 杭州华普永明光电股份有限公司 | Light emitting diode lighting device and assembly method thereof |
| US10337718B2 (en) | 2015-03-13 | 2019-07-02 | Hangzhou Hpwinner Opto Corporation | Light emitting diode lighting device and assembly method thereof |
| CN105355757A (en) * | 2015-11-16 | 2016-02-24 | 江西华柏节能照明科技协同创新有限公司 | Integrated light engine packaging method |
| CN110034081A (en) * | 2018-01-12 | 2019-07-19 | 智光股份有限公司 | Radiating module and preparation method thereof |
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