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CN103901359A - Test platform with dry environment - Google Patents

Test platform with dry environment Download PDF

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Publication number
CN103901359A
CN103901359A CN201210590876.7A CN201210590876A CN103901359A CN 103901359 A CN103901359 A CN 103901359A CN 201210590876 A CN201210590876 A CN 201210590876A CN 103901359 A CN103901359 A CN 103901359A
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CN
China
Prior art keywords
dry
dry gas
test
test platform
deflector
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Granted
Application number
CN201210590876.7A
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Chinese (zh)
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CN103901359B (en
Inventor
吴信毅
沈轩任
高宏达
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Chroma ATE Suzhou Co Ltd
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Chroma ATE Suzhou Co Ltd
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Priority to CN201210590876.7A priority Critical patent/CN103901359B/en
Publication of CN103901359A publication Critical patent/CN103901359A/en
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Publication of CN103901359B publication Critical patent/CN103901359B/en
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A test platform with a dry environment comprises a bearing seat, a flow guiding mechanism and a drying air generating device. The bearing seat comprises a testing area, the flow guiding mechanism surrounds the bearing seat, the drying air generating device is connected to the flow guiding mechanism to generate drying air, and the drying air is guided by the flow guiding mechanism to flow to the testing area, so that the dry environment is generated, and moisture condensation is avoided.

Description

There is the test platform of dry environment
Technical field
The present invention relates to a kind of test platform with dry environment, relate in particular to one and utilize deflector that dry gas is guided to test zone, to produce the test platform of dry environment.
Background technology
When progress along with development in science and technology and epoch; people's environmental consciousness new line and environmental protection ideas are along with progress; carbon reduction has become the subject under discussion of countries in the world attention and the target of effort; therefore process in vain lamp, daylight lamp, iodine-tungsten lamp and high-pressure mercury lamp with what use habitually in the past, gradually by light emitting diode (Light Emitting Diode; LED) lamp replaces, LED light fixture for non-friable, power saving, environmental protection without mercury, light source tool directivity, volume is little, colour gamut is enriched, can be applicable to low temperature environment, cause light evil less and the advantage of long working life, therefore LED will widely, revolutionaryly replace the existing light sources such as traditional incandescent lamp, and then becomes the principal light source that meets energy-conserving and environment-protective theme.
Wherein, existing LED chip manufacturing process technique includes on the substrate of base material and to form the crystal silicon technique of heap of stone of crystal silicon wafer (Epitaxial Wafer) of heap of stone, produce the crystal grain technique of several LED chips, the packaging technology of utilizing the LED chip that crystal grain technique produces and test by the test technology of the handled LED chip of packaging technology with wafer.Wherein, in the test technology of traditional LED chip, need on test platform, carry out testing electrical property, and then learn optical characteristics and the current characteristics of upper each LED chip of a wafer (disk), and carrying out in the process of testing electrical property, because test environment need to be normal temperature conventionally, need at different temperature, test what is more (as low temperature or the high temperature of 135 ℃ etc. of negative 40 ℃ or negative 50 ℃).But, because the humidity of the test environment of existing test platform is higher, in the time that it tests under low temperature environment, LED chip easily has the problem that dewfall is even frozen to occur, and then have influence on the result of testing electrical property, the space that therefore prior art is still improved.
Summary of the invention
Technical matters and object that institute of the present invention wish solves:
Because in the prior art, because existing test platform is under low temperature environment when test chip, it has the problem that easy dewfall even freezes and has influence on the result of testing electrical property, so this test platform must be placed in a dry room, and this room must be isolated from the outside really, to avoid above-mentioned condensation trouble to occur, in the time that test process needs repairing or tests end, all must allow system rise again to normal temperature and just can carry out subsequent job, in use, have its inconvenience.
Edge this, fundamental purpose of the present invention is to provide a kind of test platform with dry environment, it is to utilize deflector that dry gas is guided to test zone, uses the dry test environment and then the Antidewing that produce coated test platform and determinand.
The technological means that the present invention deals with problems:
The present invention is the problem that solves prior art, and the necessary technology means that adopt are to provide a kind of test platform with dry environment, and test platform comprises a load bearing seat, a deflector and a dry gas generation device.Load bearing seat has a test zone, deflector arranges the periphery that surrounds load bearing seat, dry gas generation device system is linked to deflector, in order to produce a dry gas, dry gas system utilizes the guiding of deflector to flow toward test zone, produces dry environment Antidewing to be coated test zone and determinand.
Preferably, in above-mentioned test platform, deflector has a diversion division, and flow to after diversion division at dry gas, the guiding that utilizes diversion division is flowed toward test zone, and deflector also has multiple ventholes, and dry gas flows to diversion division by those ventholes.In addition, deflector also has an air admission hole, in order to link dry gas generation device, dry gas is entered deflector and is flowed to those ventholes by air admission hole, in addition, diversion division has a channelization angle, uses and increases dry gas toward the mobile homogeneity of test zone.
Preferably, in above-mentioned test platform, it is furnished with light emitting diode (Light Emitting Diode in order to test one; LED) wafer to be measured (disk) of chip (wafer), and comprise a housing and a dry gas pipeline, housing is in order to hide the superjacent air space of test zone, and dry gas pipeline is linked to dry gas generation device, dry gas pipeline installing, in enclosure interior, produces dry environment Antidewing with the superjacent air space in test zone.In addition, dry gas generation device is an air strainer, and load bearing seat is one to have the load bearing seat of temp. control function, can carry out temperature control to test zone.
The present invention's effect against existing technologies:
Compared to prior art, utilize the test platform with dry environment provided by the present invention, produce dry test environment owing to utilizing deflector that dry gas is guided to test zone, thereby make test can Antidewing when LED chip or icing phenomenon occur, and then improve the fiduciary level of testing electrical property.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 shows the schematic diagram of the test platform with dry environment of the present invention's the first preferred embodiment;
Fig. 2 shows load bearing seat and the three-dimensional cross-sectional schematic of deflector of the present invention's the first preferred embodiment;
Fig. 3 shows load bearing seat and the three-dimensional cross-sectional schematic of deflector of the test platform of the present invention's the second preferred embodiment; And
Fig. 4 shows the cross-sectional schematic of the test platform with dry environment of third embodiment of the invention.
Wherein, Reference numeral
1,1a has the test platform of dry environment
11,11a load bearing seat
111,111a test zone
12,12a deflector
121,121a diversion division
1211 channelization angles
122,122a air admission hole
123a venthole
13 dry gas generation devices
14 housings
15 dry gas pipelines
Embodiment
In the test platform with dry environment provided by the present invention, its combination embodiment is too numerous to enumerate, therefore this is no longer going to repeat them, only enumerates three preferred embodiments and is illustrated.
See also Fig. 1 and Fig. 2, Fig. 1 shows the schematic diagram of the test platform with dry environment of the present invention's the first preferred embodiment, and Fig. 2 shows load bearing seat and the three-dimensional cross-sectional schematic of deflector of the present invention's the first preferred embodiment.As shown in the figure, the test platform with dry environment 1 that the present invention's the first preferred embodiment provides is furnished with light emitting diode (Light Emitting Diode in order to test one; LED) wafer to be measured (wafer) of chip, certainly can test other determinands in other embodiments and be not limited to above-mentioned, wherein, the test platform 1 with dry environment comprises load bearing seat 11, a deflector 12 and a dry gas generation device 13 with temp. control function, load bearing seat 11 has a test zone 111, test zone 111 is in order to accommodating above-mentioned determinand to carry out testing electrical property, and load bearing seat 11 can carry out temperature control to test zone 111.
Deflector 12 arranges the periphery that surrounds load bearing seat 11, furthermore around and be adjacent to load bearing seat 11 and arrange, and 11 of deflector 12 and load bearing seats have gap, and deflector 12 can be made up of the metal material generally with rigidity, in addition, deflector 12 is provided with in a diversion division 121 and four air admission hole 122(figure and only indicates one), diversion division 121 has channelization angle 1211, and channelization angle 1211 hides in above-mentioned gap, and the angle of channelization angle 1211 is for example 30 degree or 45 degree (angle of down being opened for surface level with the plane of diversion division 121), but be not limited to above-mentioned.
Dry gas generation device 13 is linked to deflector 12, specifically utilize pipeline (not shown) to be linked to air admission hole 122, and dry gas generation device 13 can produce dry gas, and dry gas generation device 13 is an air strainer, but be not limited to above-mentioned, as long as the device that can produce dry gas does not all depart from spirit of the present invention.
Wherein, user is in the time starting the test platform 1 with dry environment that the present invention the first preferred embodiment provides, dry gas generation device 13 produces dry gas, and dry gas is via pipeline and above-mentioned gap, and flow via air admission hole 122, flow to after diversion division 121 at dry gas, to utilize the guiding of deflector 12 to flow toward test zone 111, so that test zone 111 forms dry environment and then Antidewing, wherein, channelization angle 1211 can increase dry gas toward the mobile homogeneity of test zone 111.
Refer to Fig. 3, Fig. 3 shows load bearing seat and the three-dimensional cross-sectional schematic of deflector of the test platform of the present invention's the second preferred embodiment.As shown in Figure 3, what the second preferred embodiment was different from the first preferred embodiment is, deflector 12a only comprise in diversion division 121a, multiple air admission hole 122a(figure only indicate one) and multiple venthole 123a(figure in only indicate one), and do not comprise the channelization angle 1211 as the first preferred embodiment.Wherein, user is in the time starting the test platform 1a with dry environment that the present invention the second preferred embodiment provides, dry gas is to be entered deflector 12a and flowed to those ventholes 123a by air admission hole 122a, dry gas flows to diversion division 121a by those ventholes 123a again, the guiding of recycling diversion division 121a is flowed toward test zone 111a, other are all identical with the first preferred embodiment, are no longer repeated at this.
Refer to Fig. 4, Fig. 4 shows the cross-sectional schematic of the test platform with dry environment of third embodiment of the invention.As shown in Figure 4, different from the first preferred embodiment is, the test platform 1 with dry environment also comprises a housing 14 and a dry gas pipeline 15, housing 14 is in order to hide the superjacent air space of test zone 111, and dry gas pipeline 15 is linked to dry gas generation device 13, and be arranged at the inside of housing 14, produce dry environment and Antidewing with the superjacent air space in test zone 111, all the other are all identical with the first preferred embodiment, are no longer repeated at this.
Comprehensive the above, utilize the test platform with dry environment provided by the present invention, produce dry test environment owing to utilizing deflector that dry gas is guided to test zone, thereby make test can Antidewing when LED chip or icing phenomenon occur, and then improve the fiduciary level of testing electrical property.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (9)

1. a test platform with dry environment, is characterized in that, this test platform comprises:
One load bearing seat, has a test zone;
One deflector, arranges the periphery that surrounds this load bearing seat; And
One dry gas generation device, is linked to this deflector, and in order to produce a dry gas, this dry gas utilizes the guiding of this deflector to flow toward this test zone, to produce dry environment Antidewing.
2. the test platform with dry environment according to claim 1, is characterized in that, this deflector has a diversion division, and flows to after this diversion division at this dry gas, utilizes the guiding of this diversion division to flow toward this test zone.
3. the test platform with dry environment according to claim 2, is characterized in that, this deflector also has multiple ventholes, and this dry gas flows to this diversion division by those ventholes.
4. the test platform with dry environment according to claim 3, it is characterized in that, this deflector also has an air admission hole, and in order to link this dry gas generation device, this dry gas is entered this deflector and flowed to those ventholes by this air admission hole.
5. the test platform with dry environment according to claim 2, is characterized in that, this diversion division has a channelization angle, uses and increases this dry gas toward the mobile homogeneity of this test zone.
6. the test platform with dry environment according to claim 1, is characterized in that, in order to test a wafer to be measured that is furnished with light-emitting diode chip for backlight unit.
7. the test platform with dry environment according to claim 1, is characterized in that, also comprises:
One housing, in order to hide the superjacent air space of this test zone; And
One dry gas pipeline, is linked to this dry gas generation device, and this dry gas pipeline installing, in this enclosure interior, produces dry environment Antidewing with the superjacent air space in this test zone.
8. the test platform with dry environment according to claim 1, is characterized in that, this dry gas generation device is an air strainer.
9. the test platform with dry environment according to claim 1, is characterized in that, this load bearing seat is one to have the load bearing seat of temp. control function, and this test zone is carried out to temperature control.
CN201210590876.7A 2012-12-31 2012-12-31 There is the test platform of dry environment Active CN103901359B (en)

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Application Number Priority Date Filing Date Title
CN201210590876.7A CN103901359B (en) 2012-12-31 2012-12-31 There is the test platform of dry environment

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CN103901359A true CN103901359A (en) 2014-07-02
CN103901359B CN103901359B (en) 2016-06-29

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108037321A (en) * 2016-10-25 2018-05-15 致茂电子股份有限公司 Anti-dewing module of test socket and electronic element detection device with same
CN110673011A (en) * 2019-10-31 2020-01-10 苏州通富超威半导体有限公司 Semiconductor testing device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
CN1433059A (en) * 2002-01-07 2003-07-30 三星电子株式会社 Semiconductor device test system
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
TWI239586B (en) * 2004-11-23 2005-09-11 Advanced Semiconductor Eng A package testing socket
CN201007721Y (en) * 2006-12-27 2008-01-16 中茂电子(深圳)有限公司 Semiconductor component testing table with ventiduct cooling device
TWM328004U (en) * 2007-09-14 2008-03-01 Everlight Electronics Co Ltd Measuring system for measuring characteristic temperature of light-emitting diode
CN101650374A (en) * 2008-08-12 2010-02-17 中茂电子(深圳)有限公司 Semiconductor component test base provided with temperature-changing device and test machine platform
CN201897631U (en) * 2010-10-19 2011-07-13 致茂电子(苏州)有限公司 Semiconductor wafer testing device and detecting system with cooling devices
CN202630627U (en) * 2012-05-14 2012-12-26 上海晟泰试验设备有限公司 Drying device and high and low temperature test device adopting drying device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
CN1433059A (en) * 2002-01-07 2003-07-30 三星电子株式会社 Semiconductor device test system
TWI239586B (en) * 2004-11-23 2005-09-11 Advanced Semiconductor Eng A package testing socket
CN201007721Y (en) * 2006-12-27 2008-01-16 中茂电子(深圳)有限公司 Semiconductor component testing table with ventiduct cooling device
TWM328004U (en) * 2007-09-14 2008-03-01 Everlight Electronics Co Ltd Measuring system for measuring characteristic temperature of light-emitting diode
CN101650374A (en) * 2008-08-12 2010-02-17 中茂电子(深圳)有限公司 Semiconductor component test base provided with temperature-changing device and test machine platform
CN201897631U (en) * 2010-10-19 2011-07-13 致茂电子(苏州)有限公司 Semiconductor wafer testing device and detecting system with cooling devices
CN202630627U (en) * 2012-05-14 2012-12-26 上海晟泰试验设备有限公司 Drying device and high and low temperature test device adopting drying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108037321A (en) * 2016-10-25 2018-05-15 致茂电子股份有限公司 Anti-dewing module of test socket and electronic element detection device with same
CN110673011A (en) * 2019-10-31 2020-01-10 苏州通富超威半导体有限公司 Semiconductor testing device

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