CN103904070A - Light bar and lighting source using same - Google Patents
Light bar and lighting source using same Download PDFInfo
- Publication number
- CN103904070A CN103904070A CN201410100897.5A CN201410100897A CN103904070A CN 103904070 A CN103904070 A CN 103904070A CN 201410100897 A CN201410100897 A CN 201410100897A CN 103904070 A CN103904070 A CN 103904070A
- Authority
- CN
- China
- Prior art keywords
- radiating part
- optical wand
- support portion
- light
- fluorescent glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims description 34
- 230000017525 heat dissipation Effects 0.000 abstract 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a light bar which comprises LED chips, a substrate and fluorescent glue. The substrate comprises supporting portions and a heat dissipation portion. The supporting portions are used for storing the LED chips. The fluorescent glue is used for wrapping the supporting portions of the substrate so as to seal the LED chips. The heat dissipation portion is connected with the supporting portions and exposed of the fluorescent glue so as to dissipate heat. The invention further provides a light source using the light bar. The heat dissipation portion in the light bar and the light source is connected with the supporting portions and exposed of the fluorescent glue, heat dissipation performance is good, and the LED chips with high power can be utilized.
Description
Technical field
The invention relates to lighting technical field, and particularly about a kind of optical wand and use its light source.
Background technology
Light-emitting diode (light emitting diode, LED) is because the features such as it is energy-conservation, safety, long service life are widely used.
Existing optical wand comprises substrate, LED chip and fluorescent glue, and wherein, described substrate is used for placing described LED chip, and described fluorescent glue covers whole substrate, to seal described LED chip.
But the fluorescent glue of existing optical wand covers whole substrate, causes poor radiation, affect the useful life of LED chip, particularly, in the time that the power of LED chip is larger, easily cause the damage of element.
Therefore, be necessary to provide improved technical scheme to overcome the above technical problem existing in prior art.
Summary of the invention
The object of this invention is to provide the optical wand that a kind of thermal diffusivity is good.
The present invention proposes a kind of optical wand, and described optical wand comprises LED chip, substrate and fluorescent glue.Described substrate comprises support portion and radiating part, and described support portion is used for placing described LED chip.Described fluorescent glue is for the support portion of coated described substrate, to seal described LED chip.Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
The present invention also provides a kind of light source, and described light source comprises optical wand.Described optical wand comprises LED chip, substrate and fluorescent glue.Described substrate comprises support portion and radiating part, and described support portion is used for placing described LED chip.Described fluorescent glue is for the support portion of coated described substrate, to seal described LED chip.Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
Radiating part in optical wand of the present invention and light source is connected with support portion, and exposed outside fluorescent glue, and thermal diffusivity is good, can use high-power LED chip.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technology hand end of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by embodiment, and coordinate accompanying drawing, be described in detail as follows.
Brief description of the drawings
Fig. 1 be first embodiment of the invention the structural representation of optical wand.
Fig. 2 be second embodiment of the invention the structural representation of optical wand.
Embodiment
Technology hand end and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to the optical wand proposing according to the present invention and use embodiment, structure, feature and effect thereof of its light source, be described in detail as follows:
Fig. 1 is the structural representation of the optical wand 1 of one embodiment of the invention.As shown in Figure 1, optical wand 1 comprises light-emitting diode (light emitting diode, LED) chip 10, substrate 11 and fluorescent glue 12.Substrate 11 comprises support portion 111 and radiating part 112, and support portion 111 is for placing LED chip 10.Fluorescent glue 12 is for the support portion 111 of coated substrate 11, with sealing LED chip 10.Wherein, radiating part 112 is connected with support portion 111, and radiating part 112 is exposed outside fluorescent glue 12, to dispel the heat.
In an embodiment of the present invention, support portion 111 and radiating part 112 are metal material and form.
In an embodiment of the present invention, optical wand 1 comprise in multiple LED chip 10(figure only illustrate 12), multiple LED chips 10 are cascaded.
In an embodiment of the present invention, support portion 111 comprises the base that is connected with radiating part 112 and the multiple lug bosses in base projection, and wherein, the number of lug boss is identical with the number of LED chip 10.
In an embodiment of the present invention, lug boss is rectangular column, the growing up in wide of lug boss, lug boss be wider than height.Lug boss comprises end face, the side adjacent with end face, bottom surface relative with end face and that be connected with radiating part 112.Wherein, the end face of lug boss refers to the plane of area minimum in lug boss.
In an embodiment of the present invention, LED chip 10 is positioned at the end face of lug boss, can approach 360 degree with the lighting angle that makes LED chip 10.
In an embodiment of the present invention, on the base of support portion 111, be provided with bonding hole 20, to improve the bonding force of fluorescent glue 12.
In an embodiment of the present invention, radiating part 112 comprises that the first radiating part 1121 and the second radiating part 1122, the first radiating parts 1121 are connected by glue (not shown) with the second radiating part 1122.
In an embodiment of the present invention, between the first radiating part 1121 and the second radiating part 1122, be provided with close-fitting lines, to improve the bonding force of glue.
In an embodiment of the present invention, on the first radiating part 1121, be provided with convex lines, on the second radiating part 1122, be provided with spill lines.
Fig. 2 be second embodiment of the invention the structural representation of optical wand 2.Optical wand 2 shown in Fig. 2 is basic identical with optical wand 1 structure shown in Fig. 1, and difference is only: the lug boss of support portion 111 comprises multiple face 1111 and multiple bottom surfaces 1112 of being in the light, and bottom surface 1112 is for placing LED chip 10.Wherein, be in the light face 1111 and LED chip 10 are positioned at the same side of bottom surface 1112, to adjust the lighting angle of LED chip 10.
In one embodiment of the present invention, the face 1111 that is in the light is adjacent with bottom surface 1112, and orthogonal.Fluorescent glue 12 is made up of multiple triangular prisms, and the wherein two sides of each triangular prism is overlapping with the face of being in the light 1111 and bottom surface 1112 respectively.
Certainly it will be appreciated by those skilled in the art that, the face 1111 that is in the light can be adjusted according to the needs of LED chip 10 lighting angles with the angle of bottom surface 1112.
The present invention also provides a kind of light source, and light source comprises as Fig. 1 or optical wand as shown in Figure 2.Optical wand comprises light-emitting diode (light emitting diode, LED) chip 10, substrate 11 and fluorescent glue 12.Substrate 11 comprises support portion 111 and radiating part 112, and support portion 111 is for placing LED chip 10.Fluorescent glue 12 is for the support portion 111 of coated substrate 11, with sealing LED chip 10.Wherein, radiating part 112 is connected with support portion 111, and exposed outside fluorescent glue 12, to dispel the heat.
Radiating part 112 in optical wand of the present invention and light source is connected with support portion 111, and exposed outside fluorescent glue 12, and thermal diffusivity is good, can use high-power LED chip 10.
Above, only embodiments of the invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. an optical wand, is characterized in that, described optical wand comprises:
LED chip;
Substrate, described substrate comprises support portion and radiating part, described support portion is used for placing described LED chip; And
Fluorescent glue, described fluorescent glue is for the support portion of coated described substrate, to seal described LED chip;
Wherein, described radiating part is connected with described support portion, and described radiating part is exposed outside described fluorescent glue, to dispel the heat.
2. optical wand as claimed in claim 1, is characterized in that, described optical wand comprises multiple LED chips, and described multiple LED chips are cascaded.
3. optical wand as claimed in claim 2, is characterized in that, described support portion comprises the base and the multiple lug boss that are connected with described radiating part.
4. optical wand as claimed in claim 3, is characterized in that, the lug boss of described support portion comprises:
Face is in the light; And
Bottom surface, described bottom surface is used for placing described light-emitting diode chip for backlight unit;
Wherein, described in be in the light face and described light-emitting diode chip for backlight unit be positioned at the same side of described bottom surface, to adjust the lighting angle of described light-emitting diode chip for backlight unit.
5. optical wand as claimed in claim 3, is characterized in that, on the base of described support portion, is provided with circular hole.
6. optical wand as claimed in claim 3, is characterized in that, described multiple LED chips are positioned at the end face of described lug boss.
7. optical wand as claimed in claim 1, is characterized in that, described radiating part comprises the first radiating part and the second radiating part, and described the first radiating part is connected by glue with described the second radiating part.
8. optical wand as claimed in claim 7, is characterized in that, between described the first radiating part and described the second radiating part, is provided with close-fitting lines.
9. optical wand as claimed in claim 8, is characterized in that, on described the first radiating part, is provided with convex lines, on described the second radiating part, is provided with spill lines.
10. a light source, is characterized in that, described light source comprises the optical wand as described in claim 1-9 any one.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100897.5A CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
| CN201410361287.0A CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
| TW103129059A TW201537090A (en) | 2014-03-18 | 2014-08-22 | Light bar and light source using the same |
| KR1020150003228A KR20150108736A (en) | 2014-03-18 | 2015-01-09 | Light bar and light source using same |
| PCT/CN2015/074170 WO2015139580A1 (en) | 2014-03-18 | 2015-03-13 | Light bar and light source using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100897.5A CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103904070A true CN103904070A (en) | 2014-07-02 |
Family
ID=50995324
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100897.5A Pending CN103904070A (en) | 2014-03-18 | 2014-03-18 | Light bar and lighting source using same |
| CN201410361287.0A Pending CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410361287.0A Pending CN104167409A (en) | 2014-03-18 | 2014-07-25 | Light rod and light source using same |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20150108736A (en) |
| CN (2) | CN103904070A (en) |
| TW (1) | TW201537090A (en) |
| WO (1) | WO2015139580A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139580A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市光之谷新材料科技有限公司 | Light bar and light source using same |
| WO2016011821A1 (en) * | 2014-07-25 | 2016-01-28 | 深圳市光之谷新材料科技有限公司 | Led display unit and display device using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277482A (en) * | 2019-07-03 | 2019-09-24 | 华南理工大学 | A kind of terrace with edge substrate LED car lamp |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101451677A (en) * | 2007-12-07 | 2009-06-10 | 富士迈半导体精密工业（上海）有限公司 | Solid lighting device |
| CN102338307A (en) * | 2010-07-19 | 2012-02-01 | 惠州元晖光电有限公司 | Phosphor coating films and lighting apparatuses using the same |
| JP2012248687A (en) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | Light-emitting module and illumination apparatus |
| CN203800044U (en) * | 2014-03-18 | 2014-08-27 | 深圳市光之谷新材料科技有限公司 | Lighting bar, and light source using same |
| CN103904070A (en) * | 2014-03-18 | 2014-07-02 | 深圳市光之谷新材料科技有限公司 | Light bar and lighting source using same |
-
2014
- 2014-03-18 CN CN201410100897.5A patent/CN103904070A/en active Pending
- 2014-07-25 CN CN201410361287.0A patent/CN104167409A/en active Pending
- 2014-08-22 TW TW103129059A patent/TW201537090A/en unknown
-
2015
- 2015-01-09 KR KR1020150003228A patent/KR20150108736A/en not_active Application Discontinuation
- 2015-03-13 WO PCT/CN2015/074170 patent/WO2015139580A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139580A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市光之谷新材料科技有限公司 | Light bar and light source using same |
| WO2016011821A1 (en) * | 2014-07-25 | 2016-01-28 | 深圳市光之谷新材料科技有限公司 | Led display unit and display device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104167409A (en) | 2014-11-26 |
| WO2015139580A1 (en) | 2015-09-24 |
| TW201537090A (en) | 2015-10-01 |
| KR20150108736A (en) | 2015-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140702 |