CN103885141A - Planar optical waveguide type parallel optical assembly and optical module - Google Patents
Planar optical waveguide type parallel optical assembly and optical module Download PDFInfo
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- CN103885141A CN103885141A CN201210554040.1A CN201210554040A CN103885141A CN 103885141 A CN103885141 A CN 103885141A CN 201210554040 A CN201210554040 A CN 201210554040A CN 103885141 A CN103885141 A CN 103885141A
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Abstract
Disclosed in the invention is a planar optical waveguide type parallel optical assembly comprising a circuit board, an optical waveguide, a laser array, a driver, an optical detector array and a transconductance amplifier. A photoelectric chip is installed at a first side of the circuit board in a back bonding mode. A light-transmitting device is arranged at the circuit board; and the optical waveguide is contacted to a second side of the circuit board and contains a 45-degree mirror surface. In addition, the invention also discloses a planar optical waveguide type parallel optical module. With the planar optical waveguide type parallel optical assembly and optical module, the bandwidth density of optical interconnection is improved; and the process based on the photoelectric integration scheme is simple, so that large-scale production can be realized beneficially. The photoelectric chip is installed by using the back bonding technique, thereby effectively reducing an electric parasitic effect. The light path enters the optical waveguide by a bending way and is directly coupled to a pluggable interface of the parallel fiber, so that the lens is not needed; the less optical elements are used, the coupling structure is simple, and the cost is low. The polymer film is used for manufacturing the optical waveguide; the bending radius is small; and the maneuverability is enhanced.
Description
Technical field
The present invention relates to optical communication field, relate in particular to a kind of planar type optical waveguide parallel light assembly and optical module.
Background technology
Past 10 years, optical transceiver module market experienced unprecedented growth, and optical transceiver module is widely used in telecommunications and data communication field.With the increase of bandwidth demand, to the requirement of profile compact in size and low power consumption also further, people pay close attention to space energy consumption efficiency and port speed density more.The parallel optical fibre interconnect scheme of miniaturization can be realized by increasing parallel data transmission channel the infinite expanding of bandwidth.Parallel optical interconnecting becomes gradually data center, with high-performance computer, the standard scheme being connected is installed, and the active optical cable that comprises two high-speed parallel optical transceivers is extensively configured.
Concern with respect to people in long-range network to spectrum efficiency and distance-bit rate, short haul connection as the internal network of data center in, the optical fiber that is used for connecting is only from several meters to several kilometers, and what people more paid close attention to is space energy consumption efficiency and port speed density.Parallel optical fibre is interconnected in the communication in data center and plays a very important effect, can realize the infinite expanding of bandwidth by increasing parallel data transmission channel.Due to parallel optical interconnecting there is high bandwidth, without crosstalking, the advantage such as long distance, lightweight, low in energy consumption, anti-electromagnetic interference (EMI), become the best and safest carrier of high-speed transfer information.
Vertical cavity surface emitting laser (VCSEL) can be given full play to the operation repetitive ability of photon, has broad application prospects in fields such as light interconnection, optical communication, picture signal processing, pattern-recognition and neural network, laser printing, optical storage read/write light sources.In addition, the live width of VCSEL is narrower, and its emission wavelength is also less to temperature drift.The threshold current of VCSEL is also less, power consumption is lower, and is not easy to produce and warbles.
Become the optimal selection of parallel light transceiver because the surface launching characteristic of VCSEL makes it, and parallel data connect and the parallel processing mechanism of data center also matches.VCSEL has the circular light beam that emission angle is very little, has higher coupling efficiency with coupling fiber time, and cost integrated and encapsulation also can correspondingly reduce.But VCSEL, in the application of optical transceiver module, usually needs bending electrical signal line 90 degree.The conventional parallel light transceiving module based on VCSEL adopts flexible PCB (FPC) by bending signal wire 90 degree at present.Flexible PCB is connected with ceramic sheet, and ceramic sheet is as the substrate of VCSEL chip.VCSEL driver chip is arranged in a groove of ceramic bases.In the parallel integrated module of optical transceiver, VCSEL chip array, VCSEL driver chip, photo detector chip array are sticked in ceramic bases together with trsanscondutance amplifier chip.All chip electrodes adopt spun gold Wire Bonding Technology to be electrically connected with electrode corresponding on lead frame.The parts that this scheme adopts are more, and technique is more complicated, and manufacturing cost is high.The employing of flexible PCB and longer contact conductor, also increased the electric ghost effect of optical assembly greatly, limited the transfer rate of system.
Summary of the invention
The present invention, in order to overcome above deficiency, realizes highdensity photon integrated, has proposed a kind of planar type optical waveguide parallel light assembly and optical module.
Technical matters of the present invention is solved by following technical scheme:
A kind of planar type optical waveguide parallel light assembly, comprise circuit board, optical waveguide, laser array, driver, photodetector array and trsanscondutance amplifier, the first side of described circuit board is furnished with electrod-array, described laser array, driver, photodetector array and trsanscondutance amplifier are arranged in the mode of back bonding in the first side of circuit board, and be electrically connected with described electrod-array, described circuit board is provided with light transmission device, described optical waveguide is attached in the second side of circuit board, described optical waveguide comprises 45 degree minute surfaces, described 45 degree minute surfaces and laser array and photodetector array are coupled and aligned, laser emitting light is reflected in optical waveguide, and the light that optical waveguide is transmitted is reflected into photo-detector.
In one embodiment of the invention, described light transmission device is aperture, and described aperture is located at the position of aiming at laser array and photodetector array.
In one embodiment of the invention, described light transmission device is transparent flexible parent metal.
In one embodiment of the invention, described transparent flexible parent metal is Kapton.
In one embodiment of the invention, the thickness of described Kapton is 20-50 micron.
In one embodiment of the invention, bonding by transparent heat moulding between described optical waveguide and circuit board.
In one embodiment of the invention, described optical waveguide is macromolecule membrane, comprises the first covering, sandwich layer and the second covering.
In one embodiment of the invention, described macromolecule membrane is formed by oligomer and macromolecule resin blending.
In one embodiment of the invention, described macromolecule membrane is attached on circuit board by the mode of overall dry film hot pressing.
In one embodiment of the invention, described macromolecule membrane is made formation in the following way: first on described circuit board, make the first covering, sandwich layer hot pressing is got on, sandwich layer is exposed and developed according to pre-set light path pattern, then pressing the second covering.
In one embodiment of the invention, the thickness of described the first covering and the second covering is 30 microns, and the thickness of described sandwich layer is 50 microns.
The invention also discloses a kind of planar type optical waveguide parallel optical module, comprise circuit substrate, shell, parallel optical fibre can connecting-disconnecting interface and above-mentioned arbitrary claim described in planar type optical waveguide parallel light assembly.
Planar type optical waveguide parallel light assembly of the present invention, is convenient to integratedly, is conducive to increase the bandwidth density of light interconnection.Integrated Solution of the present invention is suitable for adopting vertical cavity surface emitting laser (VCSEL), and bottom illuminaton photo-detector (PD).The light that VCSEL sends, after the transmission of light transmission device on circuit board, incides 45 degree minute surfaces.The emergent light of VCSEL is after 45 degree mirror-reflections, and light path bending enters optical waveguide, and being then coupled to parallel optical fibre can connecting-disconnecting interface.The optical element of this scheme is realized direct-coupling, and without lens, and optical element is few, and coupled structure is simple, and cost is lower.
The present invention selects the transparent base of Kapton as circuit board, and the transmissivity of the 850nm near infrared light that it sends VCSEL can reach more than 85%.The macromolecule membrane that adopts oligomer and macromolecule resin blending to form, possesses less bending radius, can be 3 millimeter, and through repeatedly bending and folding, the increase of light loss is not obvious.Flexible circuit board and optical waveguide, improved portability greatly, especially for hand-held product, improved operability, reduced the damage in Production and application process.
In addition, planar type optical waveguide parallel light assembly of the present invention adopts the process Installation photoelectric chip of back bonding, because the interconnection line of back bonding is shorter, can effectively reduce electric ghost effect.Be secured at a side of circuit board containing the plane light wave guide card of 45 degree minute surfaces, the opposite side of circuit board is used for making electronics wiring, on circuit board, make the aperture of printing opacity or adopted transparent flexible parent metal, be used for realizing the optically-coupled between VCSEL array, PD array and optical waveguide, realize High-speed Electric transmission simultaneously.This oeic package technique is succinct, is conducive to large-scale production.
Accompanying drawing explanation
Fig. 1 is the side view of the planar type optical waveguide parallel light assembly of embodiments of the invention one;
Fig. 2 is the photoelectric chip of planar type optical waveguide parallel light assembly of the present invention layout schematic diagram on circuit board;
Fig. 3 is the structural representation of the optical waveguide of planar type optical waveguide parallel light assembly of the present invention;
Fig. 4 is the side view of the planar type optical waveguide parallel light assembly of embodiments of the invention two and embodiment tri-.
Embodiment
Also by reference to the accompanying drawings the present invention is described in further details below by concrete embodiment.
Embodiment mono-:
As depicted in figs. 1 and 2, the planar type optical waveguide parallel light assembly of the present embodiment, comprises circuit board 1, optical waveguide 2, laser array 3, driver 4, photodetector array 5 and trsanscondutance amplifier 6.Laser array 3 and photodetector array 5 are four parallel arrays.The laser instrument of the present embodiment is vertical cavity surface emitting laser (VCSEL).
The first side 11 of described circuit board 1 is furnished with electrod-array 7, and described VCSEL array 3, driver 4, photodetector array 5 and trsanscondutance amplifier 6 are arranged in the first side 11 of circuit board 1 in the mode of back bonding, and is electrically connected with described electrod-array 7.Described VCSEL array 3, driver 4, photodetector array 5 and the layout of trsanscondutance amplifier 6 on circuit board 1 are as shown in Figure 2.
As shown in Figure 1, the light transmission device of establishing on described circuit board 1 is aperture 8, and aperture 8 is located at the position of aiming at VCSEL array 3 and photodetector array 5, and circuit board 1 itself possesses multilayer circuit.Described optical waveguide 2 is attached in the second side 12 of circuit board 1, described optical waveguide 2 comprises 45 degree minute surfaces 9, be coupled and aligned with VCSEL array 3 and photodetector array 5, VCSEL 3 emergent lights are reflected in optical waveguide 2, and the light that optical waveguide 2 is transmitted is reflected into photodetector array 5.Described optical waveguide 2 comprises 12 path channels, and the light output end of optical waveguide 2 and parallel optical fibre can be coupled and aligned by connecting-disconnecting interface.
As shown in Figure 3, optical waveguide 2 is macromolecule membrane, and the thickness of the first covering 21, sandwich layer 22 and second covering 23 of optical waveguide 2 is followed successively by 30 microns, 50 microns and 30 microns.Bonding by transparent heat moulding between the optical waveguide 2 of the present embodiment and circuit board 1, by the method for overall dry film hot pressing, the macromolecule membrane of optical waveguide 2 is attached on circuit board 1.In the present embodiment, the cross section of the optical waveguide 2 of made is 30 microns × 30 microns.Because the spacing of the adjacent laser instrument of VCSEL array 3 is identical with the spacing of the adjacent photo-detector of photodetector array 5, be all 250 microns, the distance between the adjacent channel of the optical waveguide 2 of the present embodiment is also 250 microns accordingly.
When work, at signal transmitting terminal, under the driving of driver 4, VCSEL array 3 sends the parallel utilizing emitted light of four bundles, and through the loss-free transmission of printing opacity aperture 8, incides 45 degree minute surfaces 9.The emergent light of VCSEL is after 45 degree minute surfaces 9 reflections, and light path bending enters optical waveguide 2, and being then coupled to parallel optical fibre can connecting-disconnecting interface, enters optical communication link.At signal receiving end, light signal can be coupled in optical waveguide 2 by connecting-disconnecting interface through parallel optical fibre, then incide 45 degree minute surfaces 9, after 45 degree minute surface 9 reflections, light path bending enters printing opacity aperture 8, after the loss-free transmission of printing opacity aperture 8, incide photodetector array 5, and be converted to current signal by photodetector array 5, and be then further converted to the voltage signal of amplification through trsanscondutance amplifier 6, interconnect thereby realize with the light of peripheral link.Planar type optical waveguide parallel light assembly of the present invention comprises and transmits and receives unit, can carry out two-way signal transmission simultaneously.
Embodiment bis-:
The difference of the present embodiment and embodiment mono-is, the light transmission device of establishing on described circuit board 1 is by adopting transparent base to realize, as shown in Figure 4.In the present embodiment, transparent base is Kapton.Select the transparent base of Kapton as circuit board, the transmissivity of the 850nm near infrared light that it sends VCSEL can reach more than 85%.The Kapton thickness of the present embodiment is 30 microns.Circuit board 1 itself possesses multilayer circuit.Adopt transparent Kapton can save the program of boring as board substrate, thereby reduce costs.
As shown in Figure 2 and Figure 4, the planar type optical waveguide parallel light assembly of the present embodiment, comprises circuit board 1, optical waveguide 2, laser array 3, driver 4, photodetector array 5 and trsanscondutance amplifier 6.Laser array 3 and photodetector array 5 are four parallel arrays.The laser instrument of the present embodiment is vertical cavity surface emitting laser (VCSEL).
The first side of described circuit board 1 is furnished with electrod-array 7, and described VCSEL array 3, driver 4, photodetector array 5 and trsanscondutance amplifier 6 are arranged in the first side 11 of circuit board 1 in the mode of back bonding, and is electrically connected with described electrod-array 7.Described optical waveguide 2 is attached in the second side 12 of circuit board 1, described optical waveguide 2 comprises 45 degree minute surfaces 9, be coupled and aligned with VCSEL array 3 and photodetector array 5, VCSEL 3 emergent lights are reflected in optical waveguide 2, and the light that optical waveguide 2 is transmitted is reflected into photo-detector 5.Described optical waveguide 2 comprises 12 path channels, and the light output end of optical waveguide 2 and parallel optical fibre can be coupled and aligned by connecting-disconnecting interface.
As shown in Figure 3, optical waveguide 2 is macromolecule membrane, and the thickness of the first covering 21, sandwich layer 22 and second covering 23 of optical waveguide 2 is followed successively by 30 microns, 50 microns and 30 microns.The present embodiment is attached to macromolecule membrane on circuit board 1 by the method for overall dry film hot pressing.In the present embodiment, the cross section of the optical waveguide 2 of made is 30 microns × 30 microns.Because the spacing of the adjacent laser instrument of VCSEL array 3 is identical with the spacing of the adjacent photo-detector of photodetector array 5, be all 250 microns, the distance between the adjacent channel of the optical waveguide 2 of the present embodiment is also 250 microns accordingly.
When work, at signal transmitting terminal, under the driving of driver 4, VCSEL array 3 sends the parallel utilizing emitted light of four bundles, and flexible PCB 1 transmission forming through Kapton, incides 45 degree minute surfaces 9.The emergent light of VCSEL is after 45 degree minute surfaces 9 reflections, and light path bending enters optical waveguide 2, and being then coupled to parallel optical fibre can connecting-disconnecting interface, enters optical communication link.At signal receiving end, light signal can be coupled in optical waveguide 2 by connecting-disconnecting interface through parallel optical fibre, then incide 45 degree minute surfaces 9, after 45 degree minute surface 9 reflections, the flexible PCB 1 that Kapton forms is incided in light path bending, after flexible PCB 1 transmission forming through Kapton, incide photodetector array 5, and be converted to current signal by photodetector array 5, then be further converted to the voltage signal of amplification through trsanscondutance amplifier 6, interconnect thereby realize with the light of peripheral link.Planar type optical waveguide parallel light assembly of the present invention comprises and transmits and receives unit, can carry out two-way signal transmission simultaneously.
Embodiment tri-:
The difference of the present embodiment and embodiment mono-is, the macromolecule membrane of described optical waveguide 2 is by the method for dry film pressing, by the first covering 11, sandwich layer 2, the second successively hot pressing of covering 13 on circuit board 1.First on described circuit board 1, make the first covering 11, the dry film hot pressing of sandwich layer 12 is got on, sandwich layer 12 is exposed and developed according to pre-set light path pattern, form the wiring of photo-signal channel, then pressing the second covering 13, in waveguide, cap rock is filled up the space of wiring.The macromolecule membrane of the present embodiment is formed by oligomer and macromolecule resin blending.Preferably, can adopt uv-curing type oligomer.
The macromolecule membrane that adopts oligomer and macromolecule resin blending to form, possesses less bending radius, can be 3 millimeter, and through repeatedly bending and folding, light loss increases less than 0.1dB/cm.
Embodiment tetra-:
The present embodiment is the parallel optical module that adopts the described planar type optical waveguide parallel light of any one scheme assembly in embodiment mono-, two and three, preferred, adopts the planar type optical waveguide parallel light assembly of embodiment bis-.
The planar type optical waveguide parallel optical module of the present embodiment, comprises circuit substrate, shell, parallel optical fibre can connecting-disconnecting interface and planar type optical waveguide parallel light assembly.Circuit substrate and planar type optical waveguide parallel light assembly all encapsulate in the enclosure.Circuit substrate is connected with planar type optical waveguide parallel light electrical component, and the electrical interface of parallel optical module adopts golden finger electrode.Parallel optical fibre can connecting-disconnecting interface Wei12 road, is coupled and aligned with VCSEL array 3 and the photodetector array 5 of planar type optical waveguide parallel light assembly of the present invention, and the optical interface externally connecting as parallel optical module, connects ribbon fiber.
Further, VCSEL array 3 and photodetector array 5 can Huo12 roads, Wei10 road, and corresponding parallel optical fibre can Huo24 road, connecting-disconnecting interface Wei20 road.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; can also make some simple deduction or replace; for example structure or the material of the light transmission device based on design variation circuit board of the present invention or change optical waveguide; or the number that changes parallel light path is also VCSEL and photo-detector number etc., all should be considered as belonging to protection scope of the present invention.
Claims (12)
1. a planar type optical waveguide parallel light assembly, comprise circuit board, optical waveguide, laser array, driver, photodetector array and trsanscondutance amplifier, it is characterized in that, the first side of described circuit board is furnished with electrod-array, described laser array, driver, photodetector array and trsanscondutance amplifier are arranged in the mode of back bonding in the first side of circuit board, and be electrically connected with described electrod-array, described circuit board is provided with light transmission device, described optical waveguide is attached in the second side of circuit board, described optical waveguide comprises 45 degree minute surfaces, described 45 degree minute surfaces and laser array and photodetector array are coupled and aligned, laser emitting light is reflected in optical waveguide, and the light that optical waveguide is transmitted is reflected into photo-detector.
2. planar type optical waveguide parallel light assembly according to claim 1, is characterized in that, described light transmission device is aperture, and described aperture is located at the position of aiming at laser array and photodetector array.
3. planar type optical waveguide parallel light assembly according to claim 1, is characterized in that, described light transmission device is transparent flexible parent metal.
4. planar type optical waveguide parallel light assembly according to claim 3, is characterized in that, described transparent flexible parent metal is Kapton.
5. planar type optical waveguide parallel light assembly according to claim 4, is characterized in that, the thickness of described Kapton is 20-50 micron.
6. planar type optical waveguide parallel light assembly according to claim 1, is characterized in that, bonding by transparent heat moulding between described optical waveguide and circuit board.
7. planar type optical waveguide parallel light assembly according to claim 1, is characterized in that, described optical waveguide is macromolecule membrane, comprises the first covering, sandwich layer and the second covering.
8. planar type optical waveguide parallel light assembly according to claim 7, is characterized in that, described macromolecule membrane is formed by oligomer and macromolecule resin blending.
9. planar type optical waveguide parallel light assembly according to claim 7, is characterized in that, described macromolecule membrane is attached on circuit board by the mode of overall dry film hot pressing.
10. planar type optical waveguide parallel light assembly according to claim 7, it is characterized in that, described macromolecule membrane is made formation in the following way: first on described circuit board, make the first covering, sandwich layer hot pressing is got on, sandwich layer is exposed and developed according to pre-set light path pattern, then pressing the second covering.
11. planar type optical waveguide parallel light assemblies according to claim 7, is characterized in that, the thickness of described the first covering and the second covering is 30 microns, and the thickness of described sandwich layer is 50 microns.
12. 1 kinds of planar type optical waveguide parallel optical modules, is characterized in that, comprising circuit substrate, shell, parallel optical fibre can connecting-disconnecting interface and the arbitrary described planar type optical waveguide parallel light assembly of claim 1-11.
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| CN105629401A (en) * | 2014-10-28 | 2016-06-01 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion device |
| WO2017031960A1 (en) * | 2015-08-25 | 2017-03-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN108091629A (en) * | 2017-12-08 | 2018-05-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of photoelectric chip integrated morphology |
| CN108681004A (en) * | 2018-05-22 | 2018-10-19 | 苏州席正通信科技有限公司 | The assembly method of opto-electronic integrated circuit plate and connector |
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| CN108681004A (en) * | 2018-05-22 | 2018-10-19 | 苏州席正通信科技有限公司 | The assembly method of opto-electronic integrated circuit plate and connector |
| CN115053161A (en) * | 2020-02-12 | 2022-09-13 | 日东电工株式会社 | Opto-electric hybrid board |
| CN116184586A (en) * | 2023-02-21 | 2023-05-30 | 讯芸电子科技(中山)有限公司 | 400G silicon optical integrated optical module of photoelectric integrated substrate |
| CN116184586B (en) * | 2023-02-21 | 2023-08-25 | 讯芸电子科技(中山)有限公司 | 400G silicon optical integrated optical module of photoelectric integrated substrate |
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Application publication date: 20140625 |