CN103811400A - Wafer support base - Google Patents
Wafer support base Download PDFInfo
- Publication number
- CN103811400A CN103811400A CN201410086113.8A CN201410086113A CN103811400A CN 103811400 A CN103811400 A CN 103811400A CN 201410086113 A CN201410086113 A CN 201410086113A CN 103811400 A CN103811400 A CN 103811400A
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- Prior art keywords
- pole
- plate
- supporting bracket
- wafer support
- support pedestal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer support base. The wafer support base comprises a support plate, a support rod and an inserting plate, wherein the support plate is taken as a holding platform of a wafer; the support rod is used for supporting the support plate; the first surface of the support plate is used for holding the wafer; the second surface of the support plate is provided with an opening; the first end of the support rod is inserted into the opening; the side wall of the support plate is provided with a slot; the slot is communicated with the opening; the inserting plate is arranged in the slot, and is fixedly connected with the support rod through a locking structure. By adopting the technical scheme, the first end of the support rod can be firmly fixed in the opening, the support rod is prevented from being separated from the support plate, and the firmness of the support rod fixed to the support plate is improved.
Description
Technical field
The present invention relates to semiconductor applications, be specifically related to a kind of wafer support pedestal.
Background technology
In integrated circuit preparation process, mostly adopt thin film coating technology at the crystal column surface different thin layers of growing.Described thin film coating technology comprises employing physical vapour deposition (PVD) (Physical Vapor Deposition, PVD), chemical vapour deposition (CVD) (Chemical Vapor Deposition, CVD) etc.
With reference to figure 1, show the schematic diagram of a kind of thin film coating equipment of prior art.In thin film coating process, in a coating cavity (not shown), complete.Wherein, comprise an elevating mechanism 10 at coating cavity, and for placing the wafer support pedestal 20 of layer crystal circle 30 to be plated, described wafer support pedestal 20 comprises a wafer placement platform 21, and is fixed on the wafer placement platform 21 passive poles in below (pin) 22.
As in CVD thin film coating process, wafer 30 is placed on after wafer placement platform 21, by described elevating mechanism 10, wafer 30 is delivered to ad-hoc location, in coating cavity, carry gas by the pipeline of the reacting gas of coating cavity, form thin layer on the surface of described wafer 30.
In existing wafer support pedestal 20, described wafer placement platform 21 is fixedly connected with pole 22 by bonding mode, its concrete structure comprises: on wafer placement platform 21, offer through hole, described pole 22 is inserted in described through hole, and by adhesive, both is fixedly connected with.
But after long-time use, adhesive there will be aging phenomenon, and at the higher temperature of thin film coating technique, adhesive is easily melted, above-mentioned defect has had a strong impact on the bonding strength between pole 22 and wafer placement platform 21.In use, be placed on after wafer placement platform 21 at wafer 30, pole 22 and wafer placement platform 21 places occur that loosening phenomenon can affect the force unbalance that is subject to of each pole 22, and then cause wafer placement platform 21 to occur tilting, cause wafer 30 landings, also there will be what is more pole 22 to be come off by wafer placement platform 21, or pole 22 phenomenon of ruptures.
For this reason, how improving the wafer placement platform 21 of wafer support pedestal 20 and the bonding strength of pole 22 and stability is the problem that those skilled in the art need solution badly.
Summary of the invention
The problem that the present invention solves is to provide a kind of wafer support pedestal, effectively improves bonding strength and the stability of wafer placement platform and pole.
For addressing the above problem, the invention provides a kind of wafer support pedestal, comprising:
Supporting bracket, described supporting bracket comprises first surface, second surface, and around the sidewall of described first surface and second surface, described first surface is used for placing wafer; The second surface of described supporting bracket offers perforate; The sidewall of described supporting bracket offers slot, and described slot and described perforate communicate;
Pole, comprises first end, and described first end is positioned at described perforate;
Plate, is arranged in described slot, is fixedly connected with the first end that is positioned at described pole by locking mechanism.
Alternatively, described locking mechanism comprises: be opened in the draw-in groove of described pole first end, described plate is in the top of described pole is inserted into described draw-in groove.
Alternatively, described draw-in groove is the annular groove centered by described pole central shaft.
Alternatively, described pole is cylindrical.
Alternatively, described pole has the first diameter in draw-in groove, has Second bobbin diameter outward at described draw-in groove, and described locking mechanism also comprises: be opened in end described in plate, and towards the recess of described support bar;
The opening bore of described recess is more than or equal to described the first diameter, and is less than described Second bobbin diameter.
Alternatively, described the first diameter is 4/5～9/10 with the ratio of described Second bobbin diameter.
Alternatively, the degree of depth of described recess is more than or equal to 1/2 of described the first diameter.
Alternatively, described wafer support pedestal also comprises: plate fixture, and for described plate is fixed on to described supporting bracket.
Alternatively, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;
Be positioned at the pinning of described the first lockhole, described pinning top props up described plate.
Alternatively, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;
Be positioned at the pinning of described the first lockhole, described pinning runs through described plate.
Compared with prior art, technical scheme of the present invention has the following advantages:
Wafer support pedestal comprises supporting bracket, is arranged on pole and plate in described supporting bracket; Described supporting bracket is as the placement platform of wafer, and the first surface of supporting bracket is used for placing wafer, and described pole is in order to support described supporting bracket.Wherein, the second surface of supporting bracket is provided with perforate, and the first end of described pole is positioned at described perforate; Sidewall in described supporting bracket is offered slot, and described slot communicates with perforate.Described plate is positioned at described slot, and described plate is fixedly connected with the first end of described pole by locking mechanism.Plate is fixedly connected with by the first end of locking mechanism territory pole, pole can be fixed in described perforate firmly, avoids pole to depart from described supporting bracket, improves described pole and is fixed on firmness and the stability in supporting bracket.
Further, described retaining mechanism comprises the draw-in groove of offering on pole first end, and described draw-in groove is the loop configuration centered by the central shaft of described pole, described plate, in the described draw-in groove of insertion of described pole, can improve pole top and be fixed on the convenient degree in described supporting bracket.
Further, offer recess at described plate towards the end of described pole, described recess can embed in described draw-in groove, is fixed on the intensity in supporting bracket thereby improve pole, avoids pole to depart from supporting bracket.
Further, also comprise plate fixture in described wafer support pedestal, for described plate is fixed on to described supporting bracket, described plate fixture can effectively improve the constant intensity of plate in described supporting bracket, avoid described plate to occur displacement, to improve the bonding strength of plate and pole.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of thin film coating equipment of prior art;
Fig. 2 is the explosive view of wafer support pedestal one embodiment of the present invention;
Fig. 3 is the structural representation after wafer support pedestal assembling in Fig. 2;
Fig. 4 is the pole of wafer support pedestal and the structural representation of plate in Fig. 2;
Fig. 5 is the structural representation of the supporting bracket of another embodiment of wafer support pedestal of the present invention;
Fig. 6 is the explosive view of the another embodiment of wafer support pedestal provided by the invention;
Fig. 7 is the structural representation after wafer support pedestal assembling in Fig. 6;
Fig. 8 is the structural representation of the supporting bracket of wafer support pedestal in Fig. 6;
Fig. 9 is the structural representation of Fig. 6 centerboard.
Embodiment
As stated in the Background Art, in existing wafer support pedestal, pole is fixed in wafer placement platform by bonding mode, but the aging phenomenon that adhesive there will be after long-time use, or in use, the temperature conditions adhesive that based thin film plating process is higher there will be fusing, thereby can affect the bonding strength between pole and wafer placement platform, causes occurring between pole and wafer placement platform loosening.In use, between pole and wafer placement platform, occur that loosening phenomenon can cause force difference between each pole, and then make wafer placement platform occur tilting, cause wafer landing; What is more, pole can be come off by wafer placement platform, or causes pole fracture based on force difference between each pole.
In order to solve the problems of the technologies described above, the invention provides a kind of wafer support pedestal, to improve bonding strength and the stability of wafer placement platform and pole, thereby avoid pole to be come off by wafer placement platform, reduce the probability that causes pole fracture based on pole and wafer placement platform bonding strength problem.
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.
Fig. 2～Fig. 4 is the structural representation of an embodiment of wafer support pedestal provided by the invention.
Wherein, the explosive view of the wafer support pedestal structure that Fig. 2 provides for the present embodiment, Fig. 3 is the structural representation after wafer support pedestal assembling in Fig. 2.
Shown in figure 2, the wafer support pedestal that the present embodiment offers comprises supporting bracket 100 and is arranged on passive pole 200 in described supporting bracket 100.Many described poles 200 are installed in described supporting bracket 100, in figure, only show a described pole, more clearly to represent the syndeton of pole 200 and supporting bracket 100.
In the present embodiment, described supporting bracket 100, effect is equivalent to wafer placement platform, for placing wafer.Described supporting bracket 100 comprises lower surface 110(, first surface) and upper surface 120(is, second surface), the upper surface 120 of described supporting bracket 100 is for placing wafer, and described pole 200 is fixed on the lower surface of described supporting bracket 100.The concrete syndeton of described supporting bracket 100 and pole 200 comprises:
On the sidewall of described supporting bracket 100, offer slot 102, described perforate 101 and slot 102 communicate.
On the lower surface 110 of described supporting bracket 100, offer multiple described perforates 101, for many described poles 200 are installed.On the sidewall of described supporting bracket 100, offer the corresponding described slot 102 of multiple and each perforate 101, and plate is installed in each slot 102 to fix each pole 200.
In conjunction with reference to shown in figure 4, described locking mechanism comprises:
The draw-in groove 201 of offering on the first end 202 of described pole 200, described draw-in groove 201 is corresponding with the position of described slot 102, described plate 300 inserts after described slot 102, plate 300 is in described draw-in groove 201 is inserted on the top of described pole 200, in described perforate 101, thereby described pole 200 cannot be extracted vertically locked the first end of described pole 200 202.
In the present embodiment, described draw-in groove 201 is the loop configuration centered by the central shaft of described pole 200, and particularly, the draw-in groove 201 of described loop configuration is the central shaft around described pole 200, is end to end structure.The draw-in groove 201 of loop configuration is convenient to plate 300 and described draw-in groove 201 contrapositions.
But in other embodiment except the present embodiment, described draw-in groove also can be a structure that is similar to perforate, and insert in described draw-in groove on described plate top, and described plate and slot are equivalent to a pin feature.When comparing and the present embodiment, when described pin feature is used, the location trouble of draw-in groove and plate.
Semiconductor preparation field, the material of described pole 200 mostly is the thermal conductivity such as pottery and the poor material of conductivity is made.As pottery, its fragility is larger, and smooth surface, and in addition, the diameter of section of described pole 200 is also less.For this reason, if the degree of depth of the draw-in groove on pole 201 is too small, reduce the constant intensity of plate 300 for pole 200; If described draw-in groove 201 degree of depth are excessive, make the meticulous and easily broken of pole in draw-in groove 201.
In the present embodiment, described pole 200 is cylindrical structural, diameter described pole 200 in described draw-in groove 201 is the first diameter d 4, the diameter of described pole 200 outside described draw-in groove 201 is Second bobbin diameter d2, described draw-in groove 201 is perpendicular to the axial depth d 3 of described pole 200, the ratio of d4:d2 is 4/5～9/10, and the ratio of d3 and d2 is 1/10～1/20.As, in the present embodiment, the Second bobbin diameter d2 of described pole 200 is 2mm left and right, and described draw-in groove 201 is 0.1～0.2mm perpendicular to the axial depth d 3 of described pole 200, and now, the diameter d 4 of described pole 200 in draw-in groove 201 is 1.6mm～1.8mm.
In possibility, described locking mechanism also comprises: the recess 301 of offering on the top of described pole 200 at described clamp 300, described recess 301 matches with the structure of described draw-in groove 201.
In the present embodiment, described recess 301 for described pole 200 structures match circular-arc, insert in described draw-in groove 201 inner side of described recess 301, and fit with the sidewall of described pole 200.Alternatively, the opening bore d1 of described recess 301 is more than or equal to pole 200 at draw-in groove 201 interior diameter d4, is less than the diameter d 2 of described pole 200 outside draw-in groove 201.
In possibility, the degree of depth of described recess 301 (described recess 301 inner side to the distance of described plate 300 towards the top of described pole 200 end face) h2 be more than or equal to described pole in draw-in groove 201 the first diameter d 4 1/2, i.e. h2 >=0.5 × d4.At least draw-in groove 201 described in semi-surrounding of described recess 301 can be made like this, thereby the constant intensity of described plate 300 to pole 200 can be effectively improved.
In addition, in conjunction with reference to shown in figure 2, described plate 300 equals described draw-in groove 201 along the axial degree of depth h4 of described pole 200 along the axial thickness h 3 of described pole 200, when the top of described plate 300 embeds after described draw-in groove 201, described plate 300 can with described pole 200 close contacts, move vertically thereby reduce pole 200, improve the stability of pole 200.
In conjunction with reference to shown in figure 2 and 3, when use, the first end of described pole 200 202 is inserted in the perforate 101 of described supporting bracket 100, the draw-in groove of described pole 200 201 is relative with slot 102 positions of described supporting bracket 100; Plate 300 is inserted in described supporting bracket 100 by described slot 102, and the recess 301 on described plate 300 tops embeds in the draw-in groove 201 of described pole 200, thus by locked the first end of described pole 200 202 in described perforate 101.
Except the present embodiment, the perforate 101 of described supporting bracket 100 also can run through the upper and lower surface of described supporting bracket 100, and this structure makes described pole 200 to insert described supporting bracket 100 by the upper surface of described supporting bracket 100 or lower surface.
In addition in the present embodiment, described pole 200 is cylindrical, and in other embodiment except the present embodiment, described pole 200 also can be other column constructions such as regular prism shape.These simply change all in protection scope of the present invention.
In another embodiment of the present invention, wafer support pedestal also comprises plate fixture, for described plate 300 is fixed on to described supporting bracket 100, thereby improve the constant intensity of described plate 300 in described slot 102, and then improve the stability of pole 200 in described supporting bracket 100.
In conjunction with reference to shown in figure 6～Fig. 9, described plate fixture comprises:
First combination is with reference to shown in figure 6 and Fig. 8, the first lockhole 104 of offering on described supporting bracket 100 lower surfaces 110, described the first lockhole 104 communicates with described slot 102, and at the interior installation pinning 400 of described the first lockhole 104, described pinning 400 tops are stretched in described slot 102.
When use, when described plate 300 inserts after described slot 102, described pinning 400 is inserted in described the first lockhole 102, the top of described pinning 400 is stretched in described slot 102, and the top of described pinning 400 props up described plate 300, be fixed on the stability in described slot 102 thereby improve plate 300.
In the present embodiment, described the first lockhole 104 is chosen as screwed hole, at the inwall of described the first lockhole 104, internal thread is set; Described pinning 400 is drive screw, is provided with at the outer wall of pinning 400 external screw thread that the female thread structure of described the first lockhole 104 matches, thereby improves the bonding strength of described pinning 400 and supporting bracket 100.
Then combination is with reference to shown in figure 6 and Fig. 9, alternatively, on described plate 300, offering the second lockhole 302 inserts in described slot 102 when described plate 300, described the second lockhole 302 is corresponding with described the first lockhole 104 positions, and then the top of described pinning 400 can be fixed in described the second lockhole 302.
Alternatively, described the second lockhole 302 runs through described plate 300, and described plate 300 can be run through in the top of described pinning 400.
Further alternatively, described the second lockhole 302 can be thread pore structure, be arranged at the inwall of described the second lockhole 302 internal thread that the external thread structure of described pinning 400 matches, and then improve bonding strength and the stability of described pinning 400 and described plate 300.
In conjunction with reference to shown in figure 6 and Fig. 7, when use, described plate 300 insert described supporting bracket 100 interior after, described pinning 400 is placed in described the first lockhole 104, and the top of described pinning 400 is stretched in the second lockhole 302 of described plate 300, described plate 300 is locked in described slot 102 securely.
It should be noted that; in the present embodiment, described the first lockhole 104 is opened in the lower surface 110 of described supporting bracket 100, in other embodiment except the present embodiment; described the first lockhole 104 can be opened in the upper surface 120 of described supporting bracket 100 equally, and it does not affect protection scope of the present invention.But compare and the technical scheme that the first lockhole 104 is opened in to the upper surface 120 of supporting bracket 100, in use, the upper surface 120 of described supporting bracket 100 is directly used in placement wafer, thereby, the first lockhole 104 is opened in to the technical scheme of the lower surface 110 of supporting bracket 100, can effectively improve the planarization of the upper surface 120 of supporting bracket 100, thereby avoid wafer damage.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (10)
1. a wafer support pedestal, is characterized in that, comprising:
Supporting bracket, described supporting bracket comprises first surface, second surface, and around the sidewall of described first surface and second surface, described first surface is used for placing wafer; The second surface of described supporting bracket offers perforate; The sidewall of described supporting bracket offers slot, and described slot and described perforate communicate;
Pole, comprises first end, and described first end is positioned at described perforate;
Plate, is arranged in described slot, is fixedly connected with the first end that is positioned at described pole by locking mechanism.
2. wafer support pedestal as claimed in claim 1, is characterized in that, described locking mechanism comprises: be opened in the draw-in groove of described pole first end, described plate is in the top of described pole is inserted into described draw-in groove.
3. wafer support pedestal as claimed in claim 2, is characterized in that, described draw-in groove is the loop configuration centered by described pole central shaft.
4. wafer support pedestal as claimed in claim 3, is characterized in that, described pole is cylindrical.
5. wafer support pedestal as claimed in claim 4, is characterized in that, described pole has the first diameter in draw-in groove, has Second bobbin diameter outward at described draw-in groove; Described locking mechanism also comprises: be opened in the end of plate, and towards the recess of described support bar;
The opening bore of described recess is more than or equal to described the first diameter, and is less than described Second bobbin diameter.
6. wafer support pedestal as claimed in claim 5, is characterized in that, described the first diameter is 4/5～9/10 with the ratio of described Second bobbin diameter.
7. wafer support pedestal as claimed in claim 5, is characterized in that, the degree of depth of described recess is more than or equal to 1/2 of described the first diameter.
8. wafer support pedestal as claimed in claim 1, is characterized in that, described wafer support pedestal also comprises: plate fixture, and for described plate is fixed on to described supporting bracket.
9. wafer support pedestal as claimed in claim 8, is characterized in that, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;
Be positioned at the pinning of described lockhole, described pinning top props up described plate.
10. wafer support pedestal as claimed in claim 8, is characterized in that, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;
Be positioned at the pinning of described the first lockhole, described pinning runs through described plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086113.8A CN103811400A (en) | 2014-03-10 | 2014-03-10 | Wafer support base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086113.8A CN103811400A (en) | 2014-03-10 | 2014-03-10 | Wafer support base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103811400A true CN103811400A (en) | 2014-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410086113.8A Pending CN103811400A (en) | 2014-03-10 | 2014-03-10 | Wafer support base |
Country Status (1)
| Country | Link |
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| CN (1) | CN103811400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105903832A (en) * | 2016-07-05 | 2016-08-31 | 奥美森智能装备股份有限公司 | Fixed structure of U-shaped pipe fixed clamp on pipe expander |
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| JPS6337629A (en) * | 1986-07-31 | 1988-02-18 | Tokyo Electron Ltd | Jig for holding wafer |
| CN1200538A (en) * | 1997-04-17 | 1998-12-02 | 中道株式会社 | Clamping mechanism |
| JP2004088033A (en) * | 2002-08-29 | 2004-03-18 | Sumitomo Precision Prod Co Ltd | Ozone treatment device |
| CN201075514Y (en) * | 2007-06-20 | 2008-06-18 | 华龙国际科技股份有限公司 | Positioning structure of connector of electronic card |
| CN101515115A (en) * | 2008-02-18 | 2009-08-26 | 株式会社Orc制作所 | Substrate supporting mechanism of exposure device |
| CN201717282U (en) * | 2010-06-12 | 2011-01-19 | 晶澳太阳能有限公司 | Etching fixture for silicon solar battery plate |
| CN202103034U (en) * | 2011-05-04 | 2012-01-04 | 黄用九 | Wafer machine platform regulator |
| CN202293111U (en) * | 2011-10-14 | 2012-07-04 | 台州市黄岩西诺模具有限公司 | Inserted type fixing mechanism for connecting bar and plate block of mold |
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2014
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6337629A (en) * | 1986-07-31 | 1988-02-18 | Tokyo Electron Ltd | Jig for holding wafer |
| CN1200538A (en) * | 1997-04-17 | 1998-12-02 | 中道株式会社 | Clamping mechanism |
| JP2004088033A (en) * | 2002-08-29 | 2004-03-18 | Sumitomo Precision Prod Co Ltd | Ozone treatment device |
| CN201075514Y (en) * | 2007-06-20 | 2008-06-18 | 华龙国际科技股份有限公司 | Positioning structure of connector of electronic card |
| CN101515115A (en) * | 2008-02-18 | 2009-08-26 | 株式会社Orc制作所 | Substrate supporting mechanism of exposure device |
| CN201717282U (en) * | 2010-06-12 | 2011-01-19 | 晶澳太阳能有限公司 | Etching fixture for silicon solar battery plate |
| CN202103034U (en) * | 2011-05-04 | 2012-01-04 | 黄用九 | Wafer machine platform regulator |
| CN202293111U (en) * | 2011-10-14 | 2012-07-04 | 台州市黄岩西诺模具有限公司 | Inserted type fixing mechanism for connecting bar and plate block of mold |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105903832A (en) * | 2016-07-05 | 2016-08-31 | 奥美森智能装备股份有限公司 | Fixed structure of U-shaped pipe fixed clamp on pipe expander |
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Application publication date: 20140521 |
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