Background technology
Grinding tool (such as Grinding wheel) is for the processing of fragile material.Wherein use this type of grinding work
One aspect of tool is the instrument that processing is made up of hard metal (tungsten carbide).Such as, grinding tool
Can be used for process operation, in this process operation, drilling tool or milling tool pass through grinding forming.If treated
The workpiece shaped is made up of hard material (such as tungsten carbide), and milling tool must have stone
The abrasive grain of material.In implementation process, this often means that abrasive grain be diamond particles or
Cubic boron nitride crystal grain.Diamond for the purpose or cubic boron nitride crystal grain is commercially available and
Standard ingredient can be considered.Diamond for the purpose can be generally of the particle mean size of 50 μm
(granularity of particle has difference certainly) and have and multiple can cut hard material (such as carbonization
Tungsten) sharp edges.
The grinding tool of known type for the purpose is the Grinding wheel with core, and this core can be by
(such as) metal material (such as steel or aluminum) is made.Core can also be (the most poly-by nonmetallic materials
Laminate material) make.Core can be shaped as disk, and this disk may be mounted on tool spindle, with
For rotating around the axis of disc shape metal core.Milled border is around core and is bonded to core.
Milled border can include abrasive grain, and this abrasive grain embeds the base with one or more binding agents
In matter.Material used in milled border is generally more expensive than the material of core.Therefore, grinding compared with core
Edge has less extension in radial directions, and (that is, owing to milled border is more expensive, therefore it is usual
Smaller portions in abrasive wheel).
In grinding process, milled border is gradually worn down until exhausting, and Grinding wheel can not again by
Use.
The known binding agent for the milled border of Grinding wheel includes polymer adhesive, for example, electricity
Wood.Or, binding agent can be ceramic binder.Further it is known that use metal-to-metal adhesive, tool
Say the bronze binding agent for being prepared by sintering body.In this type of sinters, including copper and the operation of stannum
Metal dust and abrasive grain are sintered together and become diamond particles or cubic boron nitride crystal grain.Have
Time, silver can be added so that bronze comprises copper (Cu), stannum (Sn) and silver (Ag).Past, practical experience
Showing, Cu/Sn/Ag alloy serves as the binding agent of abrasive material well, and this type of binding agent is in grinding
Journey plays a role well.Although not exclusively understand the exact cause of do so, but the present inventor's phase
Believe and can explain that the alloy comprising silver serves as abrasive material well by the thermal conductivity adding the improvement that silver is formed
The reason of binding agent.But, silver is expensive, it is possible to use other bell metals, in order to reduce
Cost, and present disclosure additionally applies for the bell metal of not argentiferous.
Bronze compositions known to for the purpose other include copper/stannum/cobalt (Cu/Sn/Co) and copper/stannum/
Nickel (Cu/Sn/Ni).Also it has been proposed that, bronze compositions for the purpose can include copper/stannum/titanium
(Cu/Sn/Ti)。
System known to another includes the mixture of polymer and metal-to-metal adhesive, wherein metal dust
Sintering together with polymeric material thus form substrate, in this substrate, polymer adhesive and metal glue
Mixture (the most above-mentioned bell metal) is the most mutually wound around in microcosmic degree.Mix at this type of
In thing, metal-to-metal adhesive and polymer adhesive each self-forming network, and the respective net of binding agent
Network interpenetrates.This type of mixture substrate comprising metal-to-metal adhesive and polymer adhesive exists
(such as) disclosed in United States Patent (USP) 6063148 has.
In addition to metal and polymer adhesive, this kind of mixture the most also includes a kind of or several
Filler.This type of filler a kind of can be graphite, and described graphite is used because of its greasy property.
Abrasive grain used can have different character.Such as, according to the mesh using grinding tool
, the fragility of diamond can have difference.The character that can mate different diamond is glued with satisfied difference
The performance of mixture (or binder combination).
In good grinding tool, in the way of abrasive grain should play required function to make grinding tool
It is bonded in its substrate.Expect that grinding tool has good wearability so that it can make for a long time
With.But, good wearability is not unique required characteristic, and has the mill of high-wearing feature
The instrument of cutting is not necessarily best selection.Other desired character include that low energy consumption (that is, drives grinding work
Power needed for tool will not be too high) and constant or the most predictable Performance Characteristics.If grinding limit
It is excessive that the ground effect of edge elapses change in time, this generates problem.Performance when grinding tool
When changing in an unpredictable manner especially true.
The degree of grinding tool abrasion depends greatly on and is wherein embedded with abrasive material in a given case
The character of the substrate of granule.Therefore, the composition of substrate is critically important.
When grinding tool is used for processing workpiece, workpiece is acted as by wedge angle and sharp edge on abrasive grain
With.Thus, the abrasive grain embedded in substrate is applied power.In grinding process, abrasive grain quilt
Damage.Little by little, piece of debris splits away off from abrasive grain so that abrasive grain is gradually ground
Damage.After the abrasive grain in one region of milled border is completely worn, workpiece directly contacts
Substrate.The hardness of substrate own is less than workpiece, and it is worn and torn rapidly.Therefore, new abrasive grain
Occur in the surface of milled border and can start workpiece is worked.
But, if the substrate of holding abrasive grain is the most weak, abrasive grain may before being worn just
Depart from from substrate.When on the part surface of milled border, this thing happens, workpiece will be with phase
Frangible substrate is produced directly contact and substrate of wearing and tearing prematurely.When this occurs, merit
Consumption declines immediately, until a large amount of substrate is worn so that new abrasive grain occurs in surface.Therefore,
The elsewhere abrasion more original than it of the milled border of grinding tool is faster.If preprogramming grinding
The operation of instrument, its result is probably grinding action cannot be properly functioning, because grinding tool is set
For operating based on the tool diameter supposed, and the tool diameter supposed is currently incorrect.As
Really wear and tear in the way of being difficult to predict milled border, if such as abrasion occurs prominent irregularly carry out
Sending out in step, this problem can become more serious.
It is also expected to the power needed for relatively low grinding action can be kept so that the energy consumption in grinding process
Minimum.
Another desired performance of grinding tool is high grinding ratio.Grinding ratio represents passes through grinding tool
Between volume and the volume (abrasion instrument) lost by grinding tool of the material of workpiece removing
Ratio.Good grinding tool has high grinding ratio.
Therefore, it is an object of the present invention to provide there is the grinding tool of excellent abrasive resistance.The present invention's is another
Outer target is to provide the instrument worn and torn with rule and predictable mode, and this instrument has low merit
Rate demand and high grinding ratio.Use the invention to realize these targets, as will be described hereinafter.
Summary of the invention
The present invention relates to grinding tool.Grinding tool is intended in particular to as processing hard and/or fragility
The grinding tool of material (such as tungsten carbide), but the grinding tool of the present invention can also be used for grinding other
Material.Grinding tool includes core and milled border.Milled border includes embedding the abrasive grain in substrate
And substrate includes metal-to-metal adhesive, this metal-to-metal adhesive is the bell metal of sintering.Metal-to-metal adhesive
Account for 50 volume %-100 volume % of substrate.According to the present invention, metal-to-metal adhesive comprise account for metal bonding
0.1 volume %-5.0 volume %'s of 0.02 volume %-5.0 volume % of agent or optionally metal-to-metal adhesive
Silicon nitride.
In an embodiment of the present invention, substrate can optionally further comprise polymer adhesive, should
Polymer adhesive sinters so that polymer adhesive and metal-to-metal adhesive are formed together with metal-to-metal adhesive
The network connected.
In an embodiment of the present invention, silicon nitride accounts for 0.3 volume %-5.0 volume % of metal-to-metal adhesive.
Such as, it can account for 0.5 volume %-5.0 volume % of metal-to-metal adhesive, 1.0 bodies of metal-to-metal adhesive
Long-pending %-5.0 volume % or 0.5 volume %-3.0 volume % or 0.5 volume %-2.0 volume %.
Silicon nitride can be with average grain size for preferably less than 10 μm but also preferably greater than 0.1 μm
Crystal grain presented in.This type of particle can be 1250 Taylor's purpose particles.Therefore, although average
Crystallite dimension is less, but particle can include the crystal grain of up to 10 μm.
When polymer adhesive is substrate a part of, polymer adhesive can comprise polyimides
Or be completely or almost completely made up of polyimides.
Substrate can optionally additionally comprise packing material, such as graphite.Graphite has in grinding process
Desired greasy property.
Metal-to-metal adhesive preferably comprises the bell metal of copper, stannum and silver.
Abrasive grain can be (such as) diamond particles or cubic boron nitride crystal grain.For diamond
For cubic boron nitride, abrasive grain has the particle mean size in 4 μm-181 μ m.?
In multiple practical embodiments, abrasive grain can have the granularity in 46 μm-91 μ m.?
In embodiments of the invention, abrasive grain can have copper or nickel coating.
The method that the invention still further relates to prepare grinding tool of the present invention.The method include by abrasive grain with
Metal dust sinters together so that sintering produces the substrate being wherein embedded with abrasive grain.Thus, substrate
Metal-to-metal adhesive will be comprised.Metal dust comprises copper and stannum so that metal-to-metal adhesive is by the green grass or young crops for sintering
Copper alloy.According to the present invention, add the silicon nitride of powder type to metal dust before sintering,
And reach silicon nitride and will account for 0.02 volume %-5.0 volume % of metal-to-metal adhesive, preferably comprise from metal
The degree of 0.1 volume %-5.0 volume % of binding agent.
In embodiments of the inventive method, metal dust can additionally comprise silver.
When relating to silicon nitride relative scale in metal-to-metal adhesive, it will be appreciated that this refer to for
The volume ratio of the powder in manufacture process.In other words, manufacture method is for making to add before sintering
Powder in, the 0.02 volume %-5.0 volume %(silicon nitride accounting for metal-to-metal adhesive is regarded by silicon nitride
A part for metal-to-metal adhesive).Assume that carborundum particle after the sintering also will keep identical total
The relative scale of volume.
Optionally, before sintering polymer is added to metal dust, preferably with polyimide powder
The form at end is added so that also forming polymer adhesive, described polymer adhesive is the one of substrate
Part.
The method can be used in the dusty material of the binding agent of substrate and mix with abrasive grain to be formed mixed
The mode of compound is carried out.Then by the mixture compacted of gained in cold press.Then in stove,
At a temperature in the range of 380 DEG C-520 DEG C, preferably 400 DEG C-500 DEG C, by the mixture of the compacting of gained
Solidify 120-150 minute.Hereafter, the compacting of gained and the mixture of solidification are placed in press, and
And it is subjected to 1500kg/cm2-2000kg/cm2Pressure.Then this pressure is kept until mixture
Reach the temperature less than 300 DEG C.
Optionally, that was added by packing material before sintering operation to metal dust and abrasive grain is mixed
In compound.Packing material can optionally comprise graphite.
The substrate of grinding tool of the present invention can be advantageously mixture substrate, i.e. has metal-to-metal adhesive
Substrate with polymer adhesive;The adhesive solution of mixing can be by the optimality of metal-to-metal adhesive
Can be combined with the optimum performance of polymer adhesive.Reface if necessary by sharpening instrument, tool
The grinding tool having mixture substrate can be more easy to reface than simple metal substrate.Meanwhile, there is mixture
The grinding tool ratio of substrate only uses the substrate of polymer adhesive to have more preferable wearability.
Detailed description of the invention
In conjunction with Fig. 1, it is shown that grinding tool 1.Specifically, grinding tool can be to be intended to for adding
Work hard and/or the Grinding wheel of fragile material (such as tungsten carbide).This type of material may reside in for
In the workpiece of instrument (for example, drilling tool or milling tool), and the grinding tool 1 of the present invention is permissible
For the Grinding wheel for making this type of instrument shape.Grinding tool 1 includes core 2 and milled border 4.Core 2
Can be made up of comparatively cheap material, such as steel or other metals.Or, core can be by (example
As) polymeric material makes.Core can also comprise more than one material.Such as, it can be partly
It is made up of metal (such as steel or aluminum) and partly for polymeric material.Core 2 can be provided with logical
Hole or cavity 3 so that grinding tool 1 may be installed on main shaft (not shown), to carry out rotating fortune
Dynamic.In conjunction with Fig. 2, milled border 4 includes embedding the abrasive grain 5 in substrate 6.Substrate 6 comprises again
Metal-to-metal adhesive, this binding agent is the bell metal of sintering.Metal-to-metal adhesive accounts for 50 volumes of substrate 6
%-100 volume %, and such that it is able to expect the most whole substrate6The reality being made up of metal-to-metal adhesive
Execute example.But, substrate 6 generally comprises other components of at least some.Such as, it can comprise and fills out
Material, such as, have the graphite of greasy property.In most embodiments, also will comprise can be by for substrate 6
The polymer adhesive that polyimides is formed.
If substrate 6 can keep abrasive grain 5 well, abrasive grain 5 will send fractionlet and
Little by little it is worn.Therefore, the abrasion on milled border 4 is by relatively slow so that grinding tool 1
Diameter can keep substantial constant within longer one period.Additionally, the mill on milled border 4
Damage by keep uniform speed and in operation power will not have big change.
On the contrary, if substrate 6 can not firmly hold abrasive grain 5, it may occur however that abrasive grain exists
It fluffs before becoming fragment.Therefore, they will all grind before potential energy is finished at it and lose.Grind
Grinder tool 1 will wear and tear and the diameter of grinding tool (such as Grinding wheel) will subtract quickly quickly
Little.The small diameter of grinding tool 1 can cause the machining accuracy of workpiece relatively low.
In conjunction with Fig. 3, workpiece 7 is worked by grinding tool 1.Workpiece 7 can be that (such as) will shape
For the workpiece bored.Grinding tool 1 uses the power supply by the (not shown) effect of (such as) main shaft to enter
Row rotates.Thus, the milled border 4 of grinding tool acts on workpiece 7, recessed to cut within the workpiece
Groove.In figure 3, workpiece has the core diameter CD determined under the effect of grinding tool 1.If mill
Cut instrument 1 and be worn so that its diameter reduces, unless abrasion is compensated (such as by relative to
Grinding tool 1 reorientated by workpiece 7), otherwise core diameter CD will increase.Accordingly it is highly desirable to can
To keep the abrasion of minuent, and the abrasion occurred occurs without the uncertain sharp increase of burst.
Can supplement, when abrasive grain 5 fragmentation the most piecewise, for grinding tool 1
For free cutting performance (that is, grinding tool reface the ability of himself), this is useful.Work as mill
Material granule 5 is when becoming fragment step by step, and the abrasion in substrate 6 can be smoothed out and milled border 4
Surface will not the most easily be blocked.On the contrary, if abrasive grain is at the prolapse suitably becoming fragment
So being worn away, this often causes surface blockade to increase.The surface of milled border 4 can be at more great Cheng
Blocked by the small particles 5 from workpiece 7 on degree.This may need by grinding tool 1 from operation temporarily
Remove so that grinding tool 1 can be refaced.If abrasive grain 5 gradually becomes broken
Sheet, this type of risk blocked is less.When abrasive grain is completely worn, new abrasive grain 5 can
Occurring from the teeth outwards with smoother process, this process itself contributes to grinding tool (or rather
Milled border 4 for grinding tool 1) reface.
When abrasive grain ground off from milled border before becoming fragment completely, this is often in grinding
In the power consumption of instrument, oneself illustrates;When abrasive grain suitably kept by substrate so that its be allowed to
During they due mode fragmentations, power reduces suddenly and starts soon again to rise, and this is also
Can find out in power consumption.In this case, As time goes on, power often keeps phase
To constant (it should be noted, however, that the power demand on the first workpiece is the most always gradually increased,
Lucky first workpiece is made to need less power).
At the article of E.D.Kizikov and P.Kebko (by Metallovedenie I Termicheskaya
" micro-addition of system Cu-Sn-Ti alloy " that Obrabotka Metallov translates and comes
(" Microadditions to alloys of the system Cu-Sn-Ti ") the 1st phase, 50-53
Page, in January, 1987, superhard material association, Soviet Socialist Republic of Ukraine national science
Institute, Kiev) in mention, will treat that the Cu/Sn/Ti alloy of the binding agent as diamond grinding tool is used
0.01% silicon nitride (Si3N4) strengthen.According to the author of this article, this interpolation forms the surrender improved
Intensity.
The present inventor considers and which step can be taked to keep the energy of abrasive grain to improve substrate
Power.Without wishing to be bound by theory, it is believed that metal-to-metal adhesive discharges the mill being embedded
One reason of material granule may make metal-to-metal adhesive die down for the dislocation within metal-to-metal adhesive.Assume
This theory is correct, and first the present inventor speculates, can stop in metal-to-metal adhesive by using
The particle of dislocation substrate is carried out reinforcing to improve substrate.
Therefore, the present inventor's trial adds different in the metal dust for sintering metal binding agent
Additive.A kind of additive attempted is aluminium oxide, and its addition is equivalent to the metal of 1.0 volume %
Binding agent.This causes raising to a certain degree, but as raising degree does not has the present inventor desired
Good.The present inventor also attempts adding the silicon nitride of 0.01 volume %.The raising degree of this interpolation is the least
In the raising degree that aluminium oxide is realized.
Then, whether the amount that present inventors studied increase silicon nitride will produce more preferable result.This
Point is confirmed in the test that the present inventor is carried out.When the addition of silicon nitride is for being noticeably greater than
During the metal-to-metal adhesive of 0.01 volume %, find to obtain the raising of highly significant.
Such as, a kind of compositions is tested by the present inventor, and wherein metal-to-metal adhesive comprises 1.0 bodies
Long-pending % silicon nitride (Si3N4).Then, will there is the grinding tool of said composition with use mixture substrate also
And do not comprise silicon nitride (Si3N4) standard grinding tool compare.Described grinding tool is grinding
Wheel, wherein milled border 4 is shaped about the ring of core 2.At similar conditions, conventional tool
Diameter is worn 136 μm, 58 μm and the diameter with the grinding tool of Experimental composition is only worn.
The grinding ratio of the instrument with 1.0% silicon nitride is 2335.By comparing, use 0.01 volume % nitridation
The instrument of silicon is worn 94 μm, and uses the instrument of 1.0 volume % silicon oxides to be worn 84 μm.
Testing by compositions, wherein silicon nitride accounts for 5 volume % of metal-to-metal adhesive.Wearability is still
Very well, but and not exclusively the best as there is the wearability of the grinding tool of 1.0 volume % silicon nitrides.This
Outward, the instrument with 5.0% silicon nitride has higher power consumption.Grinding ratio is fine, but and the most such as
The instrument with 1.0 volume % and 0.1 volume % is the best.
Inventor is also tested for Grinding wheel, and it has and shape and combination as other tool-class of test
Thing, but wherein silicon nitride accounts for 0.1 volume % of metal-to-metal adhesive.It has been found that in other works with test
Having under identical test condition, the abrasion of the instrument with 0.1 volume % silicon nitride is 62 μm, and
Grinding ratio is 2084.Although this not as by 1 volume % obtain result, but with standard grinding tool phase
It is still the raising of highly significant than it.
Inventor is also tested for Grinding wheel, and its silicon nitride content is the metal-to-metal adhesive of 0.02 volume %,
But it is similar to other Grinding wheels of test in other respects.Under similar test condition, have 0.02
Grinding wheel abrasion (diameter reduction) 58 μm of volume % silicon nitride, and grinding ratio is 2283.Cause
This, result is slightly better than the result obtained by the ratio of 0.1 volume %.
Result is reached a conclusion, and notable preferably result is at 0.02 volume %-5.0 volume % silicon nitride (Si3N4)
In the range of obtain.Within the range, it was found that grinding ratio and wearability are all considerably better than 0% or 0.01%
The grinding ratio at place and wearability.
0 volume %, 0.01 volume %, 0.02 volume %, 1.0 volume % and 5.0 volume % nitrogen are pressed
SiClx has carried out wearability test and grinding ratio test.
The instrument tested is the Grinding wheel of essentially kind shown in Fig. 5, i.e. have around core 2
The grinding tool that grinding edge 4 and the most in operation grinding tool 1 rotate around axis A.
Can be seen that the wearability change with silicon nitride content in the figure 7.Wearability is expressed as directly in the figure 7
Footpath reduces.From figure 7 it can be seen that when silicon nitride content increases to 0.02% from 0.01%, wearability
Dramatically increase.Wearability continues higher, and up to silicon nitride content is the metal bonding of 5.0 volume %
Agent.But, at 5.0 volume % silicon nitrides, wearability is observed with at the content of 0.02%-1.0%
To wearability compare and reduce to a certain extent.The present inventor is it follows that at 0.02 volume
Optimal wear resistance is obtained in the range of %-5.0 volume %.
Can be seen that the grinding ratio change with silicon nitride content in fig. 8.It can be seen that nitrogen
Optimum is obtained when SiClx content is in the range of 0.02%-5.0%.Can also draw from Fig. 8, although mill
Cut still preferable than at 5.0 volume %, but grinding ratio reduces on the right side of accompanying drawing.
Therefore, the present inventor reaches a conclusion, and metal-to-metal adhesive can comprise and accounts for the 0.02 of metal-to-metal adhesive
The silicon nitride of volume %-5.0 volume %.Owing under 5.0 volume %, power consumption is higher, therefore the present inventor
Reaching a conclusion, compared with having the instrument that silicon nitride content is 5 volume %, the value less than 5.0% will tool
There are good wearability and relatively low power consumption.Accordingly, it is preferred that may range from 0.02 volume %-
3.0 volume %, 0.5 volume %-3.0 volume %, 0.5 volume %-2.0 volume % or 1.0 volume %-2.0
The metal-to-metal adhesive of volume %.
Under 0.1 volume %, power consumption is usually less than the power consumption under 0.02 volume %.At silicon nitride it is
At 5.0 volume %, power consumption is at 0.02% higher than content, but the power consumption at 5.0 volume % is evenly,
More predictability compared with the power consumption at 0.02 volume %.
Silicon nitride particles should preferably have the granularity of up to 10 μm (1250 Taylor's mesh).Right
In the particle sifted out, this generally represents that average grain size is less than 10 μm.Silicon nitride particles average
Granularity (D50) can be 2 μm-3 μm (depending on the metering system of particle mean size) therewith.Silicon nitride grain
The specific surface area of son can be advantageously at 5m2/g–6m2In/g range.If particle used is the least,
This may cause occurring obstruction and difficulty in the fabrication process.Additionally, in order to give metal-to-metal adhesive
The intensity optimized, it is believed that the particle that should preferably include up to 10 μm.
Generally, substrate 6 should also comprise polymer adhesive, and this polymer adhesive glues with metal
Mixture is sintered together so that polymer adhesive and metal-to-metal adhesive formed connect network (although
This type of polymer adhesive is optional).Use polymer adhesive make fine setting substrate performance and
Adapt it to different types of abrasive grain be possibly realized.Polymer adhesive can be suitably polyamides
Imines or comprise polyimides.The reason of do so is that polyimides has thermostability and can burn
During knot high temperature resistant.If use polymer adhesive, the content of polymer adhesive can be to
(that is, the amount of polymer adhesive is the base at 0 volume %-50 volume % to the substrate of many 50 volume %
In the range of matter).Such as, polymer adhesive can be expressed as 10 volume %-40 volume % or 10 bodies
The substrate of long-pending %-30 volume %.
Possibly, polymer adhesive can be formed by some other polymeric materials.Such as, it can
To be formed by also being able to resistant to elevated temperatures polyamide-imides.But, polyimides be preferably as
It has the grinding performance being better than polyamide-imides.
Metal-to-metal adhesive preferably comprises the bell metal of copper, stannum and silver.Silver improves desired
The performance of metal-to-metal adhesive.
Abrasive grain 5 can be diamond particles or cubic boron nitride particles.Diamond is harder and has
Have and preferably grind performance, but cubic boron nitride thermostability is higher.Additionally, diamond can be with some
Material carries out chemical reaction.
Abrasive grain 5 can be diamond particles or cubic boron nitride particles.Particle can be 4 μm-
In 181 μ m, but the particle outside this scope can be considered according to the demand of every kind of concrete condition.
In multiple practical embodiments, abrasive grain 5 can have be applicable to many grinding actions in 46 μm
Particle mean size in-91 μ m.
Abrasive grain 5 can optionally have copper or nickel coating.Copper or nickel coating can improve abrasive material
Bonding between grain 5 and substrate 6.But, if particle has this type coating, the abrasiveness of particle 5
Can will reduce to a certain extent.
Abrasive grain 5 can be according in difference relative to the relative ratios of binding agent and filler in substrate 6
In the case of demand and have difference.In multiple practical embodiments, the amount of abrasive grain can be expressed as
The 10%-50% of the cumulative volume (that is, abrasive grain and the cumulative volume of substrate) of milled border.If mill
The relative scale of material granule is higher than 50%, there is substrate and it can no longer hold the notable of abrasive grain
Dangerous.If the relative scale of abrasive grain is less than 10%, ground effect can become the least.Abrasive material
The relative scale of granule can advantageously be in the range of 15%-30% and suitably value can be
25%。
Preferably, silicon nitride is presented in crystal grain, and described crystal grain has equal to or less than 10 μm
But the average grain size more than 0.1 μm.Such as, its can have 1 μm-10 μm or 2 μm-
Average grain size in 9 μ m.It is believed by the inventors that can less than the silicon nitride particles of 0.1 μm
To cause the obstruction of silicon nitride particles, this reduce its consolidation effect.
Silicon nitride particles can have referred to as α phase, β phase and γ phase (also referred to as triangle phase, hexagonal phase and
Cubic phase) three kinds of different crystal structures.α phase is modal with β phase.γ phase only can be at high pressure
Synthesize with under high temperature.Any one in these phases can be used.Preferably, used is α phase mutually.
The silicon nitride particles added can also be the mixture of out of phase particle.
In conjunction with Fig. 4, the grinding tool according to the present invention is compared with standard grinding tool.Vertically
Axle represents power consumption, and trunnion axis represents that respective grinding tool carries out the number of the workpiece acted on thereon
Mesh.In the diagram, B5 represents the grinding tool according to the present invention, and EZ represents standard grinding work
Tool.As can be seen in Figure 4, it is expressed as the instrument of B5 to have and be first substantially increased and protect subsequently
Hold substantially invariable power consumption.It is expressed as the conventional tool of EZ to have and be first substantially increased and subsequently at it
Suddenly the power consumption declined before again rising.This shows that the abrasive grain of B5 instrument slowly becomes fragment,
And EZ represents the grinding tool that wherein abrasive grain discharges suddenly.Therefore, the abrasion on instrument will more
Hurry up.
Can supplement, B5 represents the instrument with metal-to-metal adhesive and polymer adhesive.
Metal-to-metal adhesive is the bronze with copper, stannum and silver.Use comprises 45 volume % copper, 45 volume % stannum
It is sintered with the metal dust of 10 volume % silver.According in the instrument of B5, polymer adhesive
Account for 1.0 volume % of binding agent total amount.
The grinding tool of Fig. 1 can have cross section as shown in Figure 5.In this type of embodiment, grind
Edging edge 4 is radially arranged in the outside of core 2 so that edge 4 is entirely around core 2.In this type of grinding work
The test that Fig. 4, Fig. 7 and Fig. 8 illustrate it is combined on tool.But, the invention is not restricted to this type of
Embodiment.In conjunction with Fig. 6, it will be appreciated that core 2 can extend in radial directions at least with milled border
4 as many.In figure 6, grinding tool has the grinding limit extending not more than core 2 in radial directions
Edge 4.On the contrary, milled border 4 has the extension in the axial direction different from core 2 (when grinding tool quilt
It is axially the rotation axis A of grinding tool 1 during main shaft drives, sees Fig. 5 and 6).Additionally should manage
Solving, grinding tool 1 is not necessarily intended to for rotating.On the contrary, workpiece can be acted as by it with reciprocating
With.Thus, in the context of claim, term " core " should be broadly interpreted as
Any carrier element of milled border.Equally, term " edge " should also be as being broadly construed
For being fixed to any layer that core 2 makes abrasive grain can work workpiece.
Present invention additionally comprises the method preparing grinding tool of the present invention.The method include by abrasive grain with
Comprise copper to sinter together with the metal dust of stannum so that sintering produces the base being wherein embedded with abrasive grain 5
Matter.Substrate comprises metal-to-metal adhesive, and this binding agent is the bell metal of sintering.According to the present invention,
Before sintering, the silicon nitride of powder type is added to metal dust, metal will be accounted for glue reaching silicon nitride
The degree of 0.1 volume %-5.0 volume % of mixture.
Metal dust used preferably has the metal dust of particle, and described particle is less than 44 μm
But it should be preferably more than silicon nitride particles.Preferably its to should be at least twice big.15 μm-
Particle mean size in 44 μ m is probably suitably.
Metal dust can also optionally comprise silver.
Metal dust can go out by the particle using the form of prealloy particle or as fine copper, pure tin, fine silver etc.
Existing.
Before sintering polymer can be added to metal dust, preferably with polyimide powder
Form is added so that also forming polymer adhesive, described polymer adhesive is of substrate 6
Point.
Can be sintered method so that the dusty material of the binding agent of substrate 6 mixes with abrasive grain 5
Close.By the mixture compacted of gained in cold press.Then in stove, 380 DEG C-520 DEG C, preferably
At a temperature in the range of 400 DEG C-500 DEG C or 440 DEG C-460 DEG C, the mixture of the compacting of gained is solidified
120-150 minute.The required time depends on granularity.In bigger press form, when needing more
Between.Then (the most following closely) compacting of gained and the mixture of solidification are arranged in press
And it is subjected to 1500kg/cm2-2000kg/cm2Pressure.Then this pressure is kept until mixing
Thing reaches the temperature less than 300 DEG C.
Such as, according to the party's legal system during the temperature in the present inventor's stove the most wherein is 450 DEG C
For grinding tool.
Discharge plasma sintering method (SPS) can also be used to manufacture milled border 4.By this skill
Art, can very rapidly prepare milled border 4.
The edge with the substrate containing abrasive grain can be sintered separately and fasten (e.g., glue subsequently
Viscous) on core 2.Or, milled border 5 can be directly sintered on core 2 so that it is such as its shape
Core it is bonded to as one-tenth.Before sintering, can be by the core 2 of contact milled border 4 at least
With copper, core is carried out electrolysis on one surface to electroplate.Then milled border 4 can be sintered to copper facing table
On face so that form seam.
Packing material optionally can be added to metal dust and abrasive grain 5 before sintering operation
Mixture in.As it was previously stated, packing material can comprise graphite.Other possible packing materials can
To include the spheroid of such as aluminium oxide.
Preferably, bronze used in metal-to-metal adhesive is selected from copper-stannum (Cu/Sn), copper-stannum-cobalt
(Cu/Sn/Co), copper-tin-nickel (Cu/Sn/Ni) or copper-Xi-silver (Cu/Sn/Ag).Even further preferably, it is blue or green
Copper is copper-stannum-silver bronze.It is also contemplated that other bell metals.
Grinding tool of the present invention can be used for processing hard and/or fragile material.This is not excluded for grinding tool also
May be used for the probability of other materials.
In an embodiment of the present invention, substrate 6 can also optionally comprise at least one ceramic particle shape
The ceramic composition of formula.Ceramic composition can be (such as) frit and comprise SiO2.For substrate
Ceramic particle can be the frit of spheroidal particle form, according to the size of abrasive grain, described ball
The granularity of shape particle is 50 μm-500 μm.For bigger abrasive grain, bigger pottery will be used
Particle.Abrasive grain can embed in ceramic particle, and ceramic particle embeds and has metal-to-metal adhesive simultaneously
With in the mixture substrate of polymer adhesive.Compared with abrasive grain, substrate can be protected more potently
Hold ceramic particle.Thus improve the free cutting performance of milled border.Ceramic composition does not have and gold
Belong to the good wearability that binding agent is the same.By combining pottery, metal and polymer adhesive, can
To combine the optimum performance of these binding agents.