CN103789732A - Evaporator and evaporation method - Google Patents
Evaporator and evaporation method Download PDFInfo
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- CN103789732A CN103789732A CN201410050558.0A CN201410050558A CN103789732A CN 103789732 A CN103789732 A CN 103789732A CN 201410050558 A CN201410050558 A CN 201410050558A CN 103789732 A CN103789732 A CN 103789732A
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- evaporation
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Abstract
The invention provides an evaporator and an evaporation method, which can remarkably improve the utilization rate of an organic material and reduce the cost. The evaporator comprises a first evaporation cavity, a second evaporation cavity and a linear evaporation source, wherein the first evaporation cavity and the second evaporation cavity are communicated with each other, and the linear evaporation source can move between the first evaporation cavity and the second evaporation cavity.
Description
Technical field
The present invention relates to the evaporator and the evaporation coating method that in the time manufacturing organic light emitting diode (Organic Light-Emitting Diode is called for short OLED), use.
Background technology
Organic light emitting diode is mainly for example, to be made up of coating of organic material and substrate (glass substrate), and in the time having electric current to pass through, this organic materials will be luminous.
At present, because OLED display screen visible angle is large, and can significantly save electric energy, it is widely used in field of flat panel displays; Wherein, the evaporation coating technique of OLED is the gordian technique of OLED scale production.
In OLED manufacturing cost, the organic materials of evaporator institute evaporation accounts for sizable part.Existing evaporation mechanism becomes the linear vapor deposition source of arranging in pairs or groups in an evaporation cavity and carrys out evaporation organic materials on substrate, owing to continuing ejection organic materials, therefore existing problems from linear vapor deposition source.; when oled substrate is in the time carrying out contraposition or carrying; can not be deposited on substrate from the material that linear vapor deposition source distilled out; the linear vapor deposition source of evaporator is to organic materials utilization ratio only approximately 15%; cause organic materials cost payout to increase and make cost high; and the rate of utilization to organic materials also reduces, make thus OLED development be severely limited.
Summary of the invention
The present invention proposes in order to address the above problem, and its object is to provide a kind of evaporator and evaporation coating method, can significantly improve the utilization ratio to organic materials, reduces costs.
Technical scheme 1 is a kind of evaporator, it is characterized in that, comprising:
The first evaporation cavity and the second evaporation cavity, described the first evaporation cavity and described the second evaporation cavity communicate with each other;
A linear vapor deposition source, described linear vapor deposition source can move between described the first evaporation cavity and described the second evaporation cavity.
Technical scheme 2 is the evaporator as described in technical scheme 1, is characterised in that,
There is a plating rate detector, described plating rate detector, between described the first evaporation cavity and described the second evaporation cavity, was detected the plating rate of described linear vapor deposition source for move to described the first evaporation cavity or described the second evaporation cavity in described linear vapor deposition source before.
Technical scheme 3 is the evaporator as described in technical scheme 1 or 2, is characterised in that,
Described linear vapor deposition source moves between described the first evaporation cavity and described the second evaporation cavity by ball screw mechanism.
Technical scheme 4 is the evaporator as described in technical scheme 1 or 2, is characterised in that,
There is the first mechanical manipulator and the second mechanical manipulator,
Described the first mechanical manipulator is for moving into the substrate of evaporation not to described the first evaporation cavity or taking out of the complete substrate of evaporation from described the first evaporation cavity,
Described the second mechanical manipulator is for moving into the substrate of evaporation not or taking out of the complete substrate of evaporation from described the second evaporation cavity to described the second evaporation cavity.
Technical scheme 5 is a kind of evaporation coating method, to substrate evaporation organic materials, it is characterized in that, comprising:
First step, is utilizing linear vapor deposition source during to the substrate evaporation organic materials of evaporation not, to move into the not substrate of evaporation to the second cavity in the first cavity;
Second step completes after the evaporation of the substrate of evaporation not in described the first cavity, takes out of the complete substrate of evaporation, and makes described linear vapor deposition source move to described the second cavity, carrys out the substrate evaporation organic materials to described not evaporation in described the second cavity;
Third step, is utilizing described linear vapor deposition source during to the substrate evaporation organic materials of evaporation not, to move into the not substrate of evaporation to described the first cavity in described the second cavity,
The 4th step completes after the evaporation of the substrate of evaporation not in described the second cavity, takes out of the complete substrate of evaporation, and described linear vapor deposition source is moved in described the first cavity, comes in described the first cavity the substrate evaporation organic materials of evaporation not.
Technical scheme 6 is the evaporation coating method as described in technical scheme 5, is characterised in that,
Before described linear vapor deposition source moves to described the first evaporation cavity or described the second evaporation cavity, utilize a plating rate detector to detect the plating rate of described linear vapor deposition source.
Technical scheme 7 is the evaporation coating method as described in technical scheme 5 or 6, is characterised in that,
Described linear vapor deposition source moves between described the first evaporation cavity and described the second evaporation cavity by ball screw mechanism.
Technical scheme 8 is the evaporation coating method as described in claim 5 or 6, is characterised in that,
Utilize the first mechanical manipulator move into the substrate of evaporation not or take out of the complete substrate of evaporation from described the first evaporation cavity to described the first evaporation cavity,
Utilize the second mechanical manipulator for moving into the substrate of evaporation not to described the second evaporation cavity or taking out of the complete substrate of evaporation from described the second evaporation cavity.
As mentioned above, in the present invention, owing to utilizing two evaporation cavitys and a linear vapor deposition source, therefore can make the designs simplification of evaporator, reduce costs.And, when carry out evaporation in the first evaporation cavity time, can in the second evaporation cavity, start to carry out board carrying with to bit motion, when substrate evaporation in the first evaporation cavity completes, linear vapor deposition source can be moved to evaporation substrate in the second evaporation cavity, otherwise, when carry out evaporation in the second evaporation cavity time, can in the first evaporation cavity, start to carry out board carrying with to bit motion, when substrate evaporation in the second evaporation cavity completes, linear vapor deposition source can be moved to evaporation substrate in the first evaporation cavity.Thus, original 15% organic materials utilization ratio can be promoted to 30%, and production capacity is promoted to one times, effectively reduce OLED manufacturing cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that represents the structure of evaporator of the present invention.
Fig. 2 is the schema that represents the evaporate process of evaporator of the present invention.
Wherein, description of reference numerals is as follows:
A evaporation cavity
11a CCD(Charge-coupled Device: charge coupled cell) pick up camera
12a mask plate
13a deposition table
B evaporation cavity
21b ccd video camera
22b mask plate
23b deposition table
C mechanical manipulator cavity
D mechanical manipulator cavity
30c mechanical manipulator
40d mechanical manipulator
3 plating rate detectors
4 linear vapor deposition source
41 material squit holes
5 transfer mechanisms
L1 carries path
L2 carries path
Embodiment
Below, with reference to accompanying drawing, the present invention will be described in more detail.In addition, in the present invention, the width of paper is made as to left and right directions, the length direction of paper is made as to above-below direction.
Fig. 1 is the schematic diagram that represents the structure of evaporator of the present invention.Evaporator of the present invention is the evaporator using in the time manufacturing OLED, for evaporation organic materials on substrate.As shown in Figure 1, evaporator of the present invention has two of left and right evaporation cavity A and evaporation cavity B, and evaporation cavity A and evaporation cavity B communicate with each other.
In addition, be provided with mechanical manipulator cavity C in the left side of evaporation cavity A via carrying path L1, the first mechanical manipulator 30c for carrying substrate between evaporation cavity A and this mechanical manipulator cavity C is installed in this mechanical manipulator cavity C.In addition, be provided with mechanical manipulator cavity D on the right side of evaporation cavity B via carrying path L2, the second mechanical manipulator 40d for carrying substrate between evaporation cavity B and this mechanical manipulator cavity D is installed in this mechanical manipulator cavity D.
In evaporation cavity A, via bracket, deposition table 13a is installed at the top of evaporation cavity A, the mask plate 12a for aiming at substrate is installed on deposition table 13a.The substrate of evaporation is not arranged on deposition table 13a and goes up and be positioned under mask 12a, and, substrate will by evaporation facing to below so that can with linear vapor deposition source 4 described later in opposite directions.
In the time that the substrate of evaporation is not transported to deposition table 13a by above-mentioned mechanical manipulator 30c via carrying path L1, utilize multiple ccd video camera 11a at the top that is arranged on cavity A to carry out contraposition operation, the substrate of evaporation is not aimed at mask plate 12a.As the method for aiming at, can adopt the whole bag of tricks, a for example figure on substrate, a figure on mask plate, the two complete center coincide just to be proved to have aimed at.
In addition, A is same with evaporation cavity, in evaporation cavity B, via bracket, deposition table 23b is installed at the top of evaporation cavity B, and the mask plate 22b for aiming at substrate is installed on deposition table 23b.The substrate of evaporation is not arranged on deposition table 23b and goes up and be positioned under mask plate 22b, and, substrate will by evaporation facing to below so that can with linear vapor deposition source 4 described later in opposite directions.
In the time that substrate is transported to deposition table 23b by above-mentioned mechanical manipulator 40d, utilize multiple ccd video camera 21b at the top that is arranged on cavity A to carry out contraposition operation, substrate is aimed at mask plate 22b.
In addition, between the top of evaporation cavity A and the top of evaporation cavity B, be installed with plating rate detector 3 via bracket, this plating rate detector 3 is detected for the plating rate to linear vapor deposition source 4 described later (evaporation speed), come well substrate to be carried out to evaporation to can control linear vapor deposition source 4, improve finished product rate.
In addition, as shown in Figure 1, linear vapor deposition source 4 can move between evaporation cavity A and evaporation cavity B along the bottom of evaporation cavity A, B by transfer mechanism 5.Linear vapor deposition source 4 has squit hole 41, can continue ejection organic materials from this squit hole 41, linear vapor deposition source 4 be positioned at substrate below time, the organic materials spraying from squit hole 41 is deposited on substrate, linear vapor deposition source 4 be positioned at plating rate detector 3 under while detecting position, plating rate detector 3 is detected the plating rate of linear vapor deposition source 4.
This transfer mechanism 5 is for example ball screw mechanism, can certainly be other mechanisms, as long as can make linear vapor deposition source 4 mobile between evaporation cavity A and evaporation cavity B.
In addition, evaporation cavity A, evaporation cavity B, mechanical manipulator cavity C, mechanical manipulator cavity D form an enclosed space, can be evacuated to by vacuum pump (not shown) pressure of vacuum or hope.
In addition, although do not illustrate, also can on carrying path L1, carrying path L2, gate be installed respectively.For example, carry out evaporation in evaporation cavity A time, close the gate of carrying path L1, prevent that organic materials from entering mechanical manipulator cavity C; In the time that mechanical manipulator 30c takes out of substrate to evaporation cavity A carrying substrate or from evaporation cavity A, open the gate of carrying path L1; The gate of closing carrying path L2 carry out evaporation in evaporation cavity B time, prevents that organic materials from entering mechanical manipulator cavity D; Take out of substrate constantly at mechanical manipulator 40d to evaporation cavity B carrying substrate or from evaporation cavity B, open the gate of carrying path L2.
Below, the evaporate process of evaporator of the present invention is described.
Fig. 2 is the schema that represents the evaporate process of evaporator of the present invention.As shown in Figure 2, first, by mechanical manipulator 30c, the board carrying of evaporation not is upper to the deposition table 13a in evaporation cavity A, and utilize ccd video camera 11a to carry out contraposition, this substrate is aimed at mask plate 12a.After aligning completes, plating rate detector 3 is detected the plating rate of the linear vapor deposition source 4 of position and is detected to being positioned at position under it, after detecting completes, utilize transfer mechanism 5 to make linear vapor deposition source 4 move to the below of deposition table 13a from detecting position, start to carry out evaporation.And then, on aforesaid substrate, form after the coating of specific thickness, finish the evaporation in evaporation cavity A, take out of the complete substrate of evaporation by mechanical manipulator 30c, and utilize transfer mechanism 5 to make linear vapor deposition source 4 turn back to detecting position.
In addition, in the time starting the substrate in evaporation cavity A to carry out evaporation, by mechanical manipulator 40d, the board carrying of evaporation not is upper to the deposition table 23b in evaporation cavity B, and utilize ccd video camera 21b to carry out contraposition, this substrate is aimed at mask plate 22b.
Make linear vapor deposition source 4 turn back to detecting position during finishing the evaporation in evaporation cavity A, plating rate detector 3 is detected the plating rate of linear vapor deposition source 4 again, after detecting completes, utilize transfer mechanism 5 to make linear vapor deposition source 4 move to the below of deposition table 23b from detecting position, start to carry out evaporation.And then, on aforesaid substrate, form after the coating of specific thickness, finish the evaporation in evaporation cavity B, take out of the complete substrate of evaporation by mechanical manipulator 40d, and utilize transfer mechanism 5 to make linear vapor deposition source 4 turn back to detecting position.
In addition, with above-mentioned same, in the time starting the substrate in evaporation cavity B to carry out evaporation, by mechanical manipulator 30c by the board carrying of new not evaporation to the deposition table 13a in evaporation cavity A, and utilize ccd video camera 11a to carry out contraposition, this substrate is aimed at mask plate 12a.Complete after the evaporation in evaporation cavity B in linear vapor deposition source 4, again the substrate in evaporation cavity A is carried out to evaporation.
By repeatedly carrying out above-mentioned action, in each evaporation cavity A, B, carry out evaporation.
As mentioned above, in the present invention, two evaporation cavity A, B share one group of linear vapor deposition source 4 and plating rate detector 3, therefore can make the designs simplification of evaporator, reduce costs.And, when carry out evaporation in evaporation cavity A time, can in evaporation cavity B, start to carry out board carrying with to bit motion, when substrate evaporation in evaporation cavity A completes, linear vapor deposition source 4 can be moved to evaporation substrate in evaporation cavity B, otherwise, when carry out evaporation in evaporation cavity B time, can in evaporation cavity A, start to carry out board carrying with to bit motion, when the substrate evaporation in evaporation cavity B completes, linear vapor deposition source 4 can be moved to evaporation substrate in evaporation cavity A.Thus, original 15% organic materials utilization ratio can be promoted to 30%, and production capacity is promoted to one times, effectively reduce OLED manufacturing cost.
By embodiment, the present invention is described above, still, has the invention is not restricted to this, not departing from the scope of aim of the present invention, can carry out various distortion.
Claims (8)
1. an evaporator, is characterized in that, comprising:
The first evaporation cavity and the second evaporation cavity, described the first evaporation cavity and described the second evaporation cavity communicate with each other;
A linear vapor deposition source, described linear vapor deposition source can move back and forth between described the first evaporation cavity and described the second evaporation cavity.
2. evaporator as claimed in claim 1, is characterised in that,
There is a plating rate detector, described plating rate detector, between described the first evaporation cavity and described the second evaporation cavity, was detected the plating rate of described linear vapor deposition source for move to described the first evaporation cavity or described the second evaporation cavity in described linear vapor deposition source before.
3. evaporator as claimed in claim 1 or 2, is characterised in that,
Described linear vapor deposition source moves between described the first evaporation cavity and described the second evaporation cavity by ball screw mechanism.
4. evaporator as claimed in claim 1 or 2, is characterised in that,
There is the first mechanical manipulator and the second mechanical manipulator,
Described the first mechanical manipulator is for moving into the substrate of evaporation not to described the first evaporation cavity or taking out of the complete substrate of evaporation from described the first evaporation cavity,
Described the second mechanical manipulator is for moving into the substrate of evaporation not or taking out of the complete substrate of evaporation from described the second evaporation cavity to described the second evaporation cavity.
5. an evaporation coating method, to substrate evaporation organic materials, is characterized in that, comprising:
First step, is utilizing linear vapor deposition source during to the substrate evaporation organic materials of evaporation not, to move into the not substrate of evaporation to the second cavity in the first cavity;
Second step completes after the evaporation of the substrate of evaporation not in described the first cavity, takes out of the complete substrate of evaporation, and makes described linear vapor deposition source move to described the second cavity, carrys out the substrate evaporation organic materials to described not evaporation in described the second cavity;
Third step, is utilizing described linear vapor deposition source during to the substrate evaporation organic materials of evaporation not, to move into the not substrate of evaporation to described the first cavity in described the second cavity,
The 4th step completes after the evaporation of the substrate of evaporation not in described the second cavity, takes out of the complete substrate of evaporation, and described linear vapor deposition source is moved in described the first cavity, comes in described the first cavity the substrate evaporation organic materials of evaporation not.
6. evaporation coating method as claimed in claim 5, is characterised in that,
Before described linear vapor deposition source moves to described the first evaporation cavity or described the second evaporation cavity, utilize a plating rate detector to detect the plating rate of described linear vapor deposition source.
7. the evaporation coating method as described in claim 5 or 6, is characterised in that,
Described linear vapor deposition source moves between described the first evaporation cavity and described the second evaporation cavity by ball screw mechanism.
8. the evaporation coating method as described in claim 5 or 6, is characterised in that,
Utilize the first mechanical manipulator move into the substrate of evaporation not or take out of the complete substrate of evaporation from described the first evaporation cavity to described the first evaporation cavity,
Utilize the second mechanical manipulator for moving into the substrate of evaporation not to described the second evaporation cavity or taking out of the complete substrate of evaporation from described the second evaporation cavity.
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| CN201410050558.0A CN103789732A (en) | 2014-02-13 | 2014-02-13 | Evaporator and evaporation method |
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| CN201410050558.0A CN103789732A (en) | 2014-02-13 | 2014-02-13 | Evaporator and evaporation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104004995A (en) * | 2014-06-05 | 2014-08-27 | 上海和辉光电有限公司 | Vapor plating device, vapor plating equipment and vapor plating method |
| CN105695938A (en) * | 2016-04-08 | 2016-06-22 | 光驰科技(上海)有限公司 | Coating device adopting scanning type evaporation source and coating method of coating device |
| CN106319451A (en) * | 2015-06-19 | 2017-01-11 | 上海和辉光电有限公司 | Evaporation equipment and evaporation method |
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| CN103107132A (en) * | 2011-11-11 | 2013-05-15 | Snu精密股份有限公司 | Apparatus for manufacturing flat panel display |
| CN103160798A (en) * | 2013-02-26 | 2013-06-19 | 上海和辉光电有限公司 | Device for detecting evaporation source and method |
| CN104120386A (en) * | 2013-04-26 | 2014-10-29 | 三星显示有限公司 | Deposition apparatus and method of manufacturing organic light emitting diode display |
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Patent Citations (5)
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| JPS60181610A (en) * | 1984-02-28 | 1985-09-17 | Mitsubishi Electric Corp | Measurement of film thickness |
| CN101880865A (en) * | 2009-05-04 | 2010-11-10 | 三星移动显示器株式会社 | The device and deposition method and the depositing system that are used for depositing organic material |
| CN103107132A (en) * | 2011-11-11 | 2013-05-15 | Snu精密股份有限公司 | Apparatus for manufacturing flat panel display |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104004995A (en) * | 2014-06-05 | 2014-08-27 | 上海和辉光电有限公司 | Vapor plating device, vapor plating equipment and vapor plating method |
| CN106319451A (en) * | 2015-06-19 | 2017-01-11 | 上海和辉光电有限公司 | Evaporation equipment and evaporation method |
| CN106319451B (en) * | 2015-06-19 | 2019-06-11 | 上海和辉光电有限公司 | A kind of evaporated device and evaporation coating method |
| CN105695938A (en) * | 2016-04-08 | 2016-06-22 | 光驰科技(上海)有限公司 | Coating device adopting scanning type evaporation source and coating method of coating device |
| CN105695938B (en) * | 2016-04-08 | 2018-06-12 | 光驰科技(上海)有限公司 | Using the coating apparatus and its film plating process of scan-type evaporation source |
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Application publication date: 20140514 |