CN103773300B - Repairable underfill and preparation method thereof - Google Patents
Repairable underfill and preparation method thereof Download PDFInfo
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- CN103773300B CN103773300B CN201310719026.7A CN201310719026A CN103773300B CN 103773300 B CN103773300 B CN 103773300B CN 201310719026 A CN201310719026 A CN 201310719026A CN 103773300 B CN103773300 B CN 103773300B
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Abstract
The invention relates to the technical field of electronic glue and in particular relates to repairable underfill and a preparation method thereof. The underfill has the beneficial effects that the underfill adopts the peculiar formula formed by epoxy resin, a diluting agent, a dispersing agent, an accelerant, a coupling agent and a curing agent; through scientific component matching and the preparation method, the prepared underfill has tested melting point exceeding 60 DEG C and has the characteristic of easiness in repair; lower temperatures can be used during heating and glue removing, thus reducing the thermal damages to mainboards and components; the underfill is easier to shed from the mainboards and the components when being heated, so that the underfill has excellent repairable effects and low repair rejection rate; and besides, the energy consumption of shorter heating at a lower temperature is low, thus reducing the repair cost.
Description
Technical field
The present invention relates to electronics glue technical field, refer in particular to a kind of reworkable underfill and preparation method thereof.
Background technology
Underfill technology last century the seventies rise in IBM Corporation, become at present electronic manufacture industry important make part.The underfill system of current use can be divided three classes: kapillary underfill, no-reflow underfill, a premolding (angle-underfill system.Every type systematic has its benefit and limitation, but the most widely used be at present kapillary underfill system, its range of application comprise FCOB (FCOB) and encapsulation in flip-chip (FCiP).Can the surperficial stress born of dispersed chip and then the reliability improving whole product by employing underfill.In order to the requirement of the slimming of satisfied digital mobile product, miniaturization, high performance, instead of QFP in the past at BGA (BallGridArray) and CSP (Chip Size/ScalePackage) etc. that IC encapsulation field is highly integrated, be rapidly spread popularization.
BGA with CSP utilizes tin ball and the electrode on wiring board to carry out being connected.But can be subject to temperature shock after actual load, and wiring board such as to bend at the impact of the internal stress produced, make BGA, the reliability connected between CSP and wiring board can not get good guarantee.This problem has been got more and more concern in recent years.Underfill promptly can be impregnated into BGA and CSP etc. between chip and wiring board, has excellent filling characteristic; Can play after solidification and relax temperature shock and absorb internal stress, the effect of the connection of reinforcement BGA and substrate, and then the trustworthiness greatly enhancing connection.
Along with the slimming of digital mobile product, miniaturization, as more and more higher in the product components and parts such as ultra-thin smart handset integrated level on mainboard, the probability reprocessed due to problems such as rack of fusion is more and more higher, conventional underfill brings the problem of reprocessing except glue difficulty, when especially adopting thinner wiring board, heat resistanceheat resistant damage performance is more weak, more easily produce and scrap the problems such as many, but because the fusing point of current underfill is generally all at about 80 DEG C, when needs are reprocessed electronic component, after needing higher Heating temperature and longer time just can make underfill gum softening, electronic component is reprocessed, comparatively high temps and in the long period, easily cause the secondary injury to other elements of circuit, reprocess condemnation factor high, in addition, high to the heating energy consumption of comparatively high temps and long period, increase and reprocess cost.
Summary of the invention
The invention reside in and reprocess the high problem caused of temperature for current underfill, and reworkable underfill of the one overcome the above problems and preparation method thereof is provided.
For achieving the above object, the present invention adopts following technical scheme:
A kind of reworkable underfill, composition and the Parts by Ingredients of described filling glue are as follows:
Epoxy resin: dihydroxyphenyl propane and bisphenol F epoxy resin be a kind of or its combination wherein, containing 40.0 ~ 70.0 parts;
Thinner: glyceryl ether, containing 10.0 ~ 20.0 parts;
Dispersion agent: second aluminum alkoxide di-isopropyl couplant, containing 2 ~ 4 parts;
The two hydrazine ultramicro powder of promotor: UDH-J, 2,4,6-tri-(dimethylamino methyl) phenol, glyoxal ethyline urea wherein a kind of or arbitrary combination, containing 3.5 ~ 8.5 parts;
Coupling agent: silane coupling agent, γ-chloropropyl triethoxysilane, titanate coupling agent, aluminate coupling agent is a kind of or arbitrary combination wherein, containing 0.5 ~ 1 part;
Filler: nm-class active calcium carbonate, nano active magnesium hydroxide, nano titanium oxide be a kind of or arbitrary combination wherein; Containing 9.0 ~ 19.0 parts;
Pigment: carbon black, containing 0.5 ~ 1.0 part;
Solidifying agent: 2-heptadecyl imidazole, nano double cyanamide, diethylenetriamine be a kind of or arbitrary combination wherein, containing 14.5 ~ 19.5 parts.
Preferably, described epoxy resin is bisphenol A epoxide resin is bisphenol A epoxide resin 826, bisphenol A epoxide resin 828 wherein a kind of or arbitrary combination, and bisphenol F epoxy resin is bisphenol F epoxy resin 862.
Preferably, described glyceryl ether is one wherein in a kind of or arbitrary combination of glycidyl allyl ether, n-butyl glycidyl ether, diglycidylether, butanediol diglycidyl ether or arbitrary combination.
The preparation method of above-mentioned reworkable underfill, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 1000r/min ± 50r/min, stirring at low speed speed 50r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 45 ± 5 DEG C, and dispersed with stirring is even;
(2), more successively dispersion agent, promotor, coupling agent, filler are added, high-speed stirring speed 1400r/min ± 50r/min, stirring at low speed speed 80r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and dispersed with stirring is even;
(3), again solidifying agent is added, high-speed stirring speed 1200r/min ± 50r/min, stirring at low speed speed 60r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 60 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains described reworkable underfill.
Beneficial effect of the present invention is: adopt the epoxy resin of peculiar formula, thinner, dispersion agent, promotor, coupling agent, solidifying agent in underfill of the present invention, the particularly selection of nano level filler and solidifying agent kind and deal, by composition proportion and the preparation method of science, obtained underfill is worth fusing point after tested more than 60 DEG C, there is easily reworkable feature, heating can use lower temperature except during glue, reduces the thermal damage to mainboard and components and parts; Easilier when being heated to come off from mainboard and components and parts, thus have excellent reworkable effect, reprocess condemnation factor low, in addition, the heating energy consumption of lesser temps and short period is low, reduces and reprocesses cost.
Embodiment
Below in conjunction with embodiment, the present invention is further described:
Embodiment 1:
The underfill of the present embodiment is made up of the component containing following weight part:
Embodiment 2:
The underfill of the present embodiment is made up of the component containing following weight part:
Embodiment 3:
The underfill of the present embodiment is made up of the component containing following weight part:
Embodiment 4:
The underfill of the present embodiment is made up of the component containing following weight part:
The preparation method of reworkable underfill of the present invention, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 1000r/min ± 50r/min, stirring at low speed speed 50r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 45 ± 5 DEG C, and dispersed with stirring is even;
(2), more successively dispersion agent, promotor, coupling agent, filler are added, high-speed stirring speed 1400r/min ± 50r/min, stirring at low speed speed 80r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and dispersed with stirring is even;
(3), again solidifying agent is added, high-speed stirring speed 1200r/min ± 50r/min, stirring at low speed speed 60r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 60 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains described reworkable underfill.
Detect by experiment, the fusing point of the present invention four embodiment and existing conventional underfill and the electronic component produced carry out reprocessing test, many groups test result sees the following form 1, can significantly find out: obtained underfill is worth fusing point after tested more than 60 DEG C, there is easily reworkable feature, heating can use lower temperature except during glue, reduces the thermal damage to mainboard and components and parts; Easilier when being heated to come off from mainboard and components and parts, thus have excellent reworkable effect, reprocess condemnation factor low, in addition, the heating energy consumption of lesser temps and short period is low, reduces and reprocesses cost.
Table 1 detects Data Comparison table
The above embodiment, just preferred embodiments of the present invention, be not limit practical range of the present invention, therefore all equivalences done according to structure, feature and the principle described in the present patent application the scope of the claims change or modify, and all should be included in patent claim of the present invention.
Claims (4)
1. a reworkable underfill, is characterized in that, composition and the Parts by Ingredients of described filling glue are as follows:
Epoxy resin: dihydroxyphenyl propane and bisphenol F epoxy resin be a kind of or its combination wherein, containing 40.0 ~ 70.0 parts;
Thinner: glyceryl ether, containing 10.0 ~ 20.0 parts;
Dispersion agent: second aluminum alkoxide di-isopropyl couplant, containing 2 ~ 4 parts;
The two hydrazine ultramicro powder of promotor: UDH-J, 2,4,6-tri-(dimethylamino methyl) phenol, glyoxal ethyline urea wherein a kind of or arbitrary combination, containing 3.5 ~ 8.5 parts;
Coupling agent: γ-chloropropyl triethoxysilane, titanate coupling agent, aluminate coupling agent is a kind of or arbitrary combination wherein, containing 0.5 ~ 1 part;
Filler: nm-class active calcium carbonate, nano active magnesium hydroxide, nano titanium oxide be a kind of or arbitrary combination wherein; Containing 9.0 ~ 19.0 parts;
Pigment: carbon black, containing 0.5 ~ 1.0 part;
Solidifying agent: 2-heptadecyl imidazole, nano double cyanamide, diethylenetriamine be a kind of or arbitrary combination wherein, containing 14.5 ~ 19.5 parts.
2. reworkable underfill according to claim 1, it is characterized in that: described epoxy resin is bisphenol A epoxide resin is bisphenol A epoxide resin 826, bisphenol A epoxide resin 828 wherein a kind of or arbitrary combination, and bisphenol F epoxy resin is bisphenol F epoxy resin 862.
3. reworkable underfill according to claim 1, is characterized in that: described glyceryl ether is one wherein in a kind of or arbitrary combination of glycidyl allyl ether, n-butyl glycidyl ether, diglycidylether, butanediol diglycidyl ether or arbitrary combination.
4. the preparation method of the reworkable underfill according to claim 1-3 any one, comprises following processing step:
(1), successively epoxy resin, thinner, pigment are added in vacuum double planetary mixer, high-speed stirring speed 1000r/min ± 50r/min, stirring at low speed speed 50r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 30 ± 5min, temperature controls at 45 ± 5 DEG C, and dispersed with stirring is even;
(2), more successively dispersion agent, promotor, coupling agent, filler are added, high-speed stirring speed 1400r/min ± 50r/min, stirring at low speed speed 80r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 90 ± 5min, temperature controls at 20 ± 5 DEG C, and dispersed with stirring is even;
(3), again solidifying agent is added, high-speed stirring speed 1200r/min ± 50r/min, stirring at low speed speed 60r/min ± 5r/min, vacuum tightness 0.06-0.09MPa, time 60 ± 5min, temperature controls at 20 ± 5 DEG C, and namely dispersed with stirring evenly obtains, described reworkable underfill.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310719026.7A CN103773300B (en) | 2013-12-23 | 2013-12-23 | Repairable underfill and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310719026.7A CN103773300B (en) | 2013-12-23 | 2013-12-23 | Repairable underfill and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103773300A CN103773300A (en) | 2014-05-07 |
| CN103773300B true CN103773300B (en) | 2015-07-01 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016114786A1 (en) * | 2015-01-16 | 2016-07-21 | Halliburton Energy Services, Inc. | Hydrazide-based curing agents for use in subterranean operations |
| CN106085315A (en) * | 2016-06-08 | 2016-11-09 | 蚌埠高华电子股份有限公司 | A kind of modified composite epoxy casting glue of LED display anti-light aging |
| CN109294499A (en) * | 2018-09-20 | 2019-02-01 | 王景硕 | A kind of electronic device bottom filling glue |
| CN110591292B (en) * | 2019-09-29 | 2022-05-13 | 烟台德邦科技股份有限公司 | Underfill adhesive with high surface insulation resistance and preparation method thereof |
| CN111500237A (en) * | 2020-06-08 | 2020-08-07 | 东莞市新懿电子材料技术有限公司 | Fast-flowing low-temperature-curable underfill adhesive and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57133122A (en) * | 1981-02-12 | 1982-08-17 | Toshiba Corp | Curable resin composition |
| US6015848A (en) * | 1996-12-05 | 2000-01-18 | Kansai Paint Co., Ltd. | Coating composition and method for application thereof |
| JP2006003387A (en) * | 2004-06-15 | 2006-01-05 | Daiso Co Ltd | Photosensitive composition for volume phase type hologram recording, hologram recording medium and method for manufacturing same, and hologram recording method |
| CN103131364A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Preparation method of single component room temperature curing epoxy construction glue |
| CN103131365A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Single component room temperature curing epoxy construction glue |
-
2013
- 2013-12-23 CN CN201310719026.7A patent/CN103773300B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57133122A (en) * | 1981-02-12 | 1982-08-17 | Toshiba Corp | Curable resin composition |
| US6015848A (en) * | 1996-12-05 | 2000-01-18 | Kansai Paint Co., Ltd. | Coating composition and method for application thereof |
| JP2006003387A (en) * | 2004-06-15 | 2006-01-05 | Daiso Co Ltd | Photosensitive composition for volume phase type hologram recording, hologram recording medium and method for manufacturing same, and hologram recording method |
| CN103131364A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Preparation method of single component room temperature curing epoxy construction glue |
| CN103131365A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Single component room temperature curing epoxy construction glue |
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