CN103779511B - A kind of manufacture method of OLED encapsulation - Google Patents
A kind of manufacture method of OLED encapsulation Download PDFInfo
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- CN103779511B CN103779511B CN201410038307.0A CN201410038307A CN103779511B CN 103779511 B CN103779511 B CN 103779511B CN 201410038307 A CN201410038307 A CN 201410038307A CN 103779511 B CN103779511 B CN 103779511B
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- light emitting
- emitting diode
- organic light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A manufacture method for OLED encapsulation, substrate (1), division wall (2), glass cover-plate (4), organic packaging materials bar (3), Organic Light Emitting Diode (5); Substrate (1) is formed OLED (5), around Organic Light Emitting Diode (5), formation is around circle division wall (2) of Organic Light Emitting Diode (5), division wall (2) arranges organic packaging materials bar (3) and glass cover-plate (4) to adhere to each other the cover plate formed, cover Organic Light Emitting Diode (5) from above; Organic packaging materials is the quartz sand of 30%, the polyimides of 30%, the acrylonitrile-butadiene-styrene copolymer of 20% or polyethylene or polypropylene, the zinc oxide of 20%; Above-mentioned 4 kinds of material mixed sinterings are formed material strips, uses the conventional clear binder in this area material strips and glass cover-plate to be bonded together.
Description
Technical field
The present invention relates to Organic Light Emitting Diode (OLED) Display Technique field, relate to the encapsulation of OLED, particularly relate to a kind of encapsulating structure of larger-size oled panel.
Background technology
Organic electroluminescent LED (OLED) is a kind of all solid state, active illuminating, high brightness, high-contrast, ultra-thin and ultra-light, low-power consumption, without characteristics such as angle limitations, operating temperature range are wide, be considered to the emerging application technology of follow-on flat-panel screens.But, the part-structure of OLED display be especially positioned at electrode wherein and Organic Light Emitting Diode extremely responsive for the such as external environmental factor such as oxygen and steam, need in actual use to be encapsulated device to make device and water vapour and oxygen-barrier to extend the useful life of OLED.
A kind of method at present for OLED encapsulation adopts dissimilar epoxy resin, inorganic material and/or the organic material by forming sealing after ultraviolet light polymerization.Although this encapsulating method can provide good mechanical strength usually, in many circumstances, these sealings fail to provide enough obstructing capacities to water vapour and oxygen.
The sealing of employing welding glass material is the method for packing of another OLED, and the method has excellent sealing property, moistureproof damp proof.But for the organic LED panel of large-size (being usually not less than 10 cun), in the use procedure of panel, when cover plate and/or substrate are subject to self gravitation or external force local compression and are bending time, glass cover-plate can be made to contact with the Organic Light Emitting Diode on substrate, thus Organic Light Emitting Diode is squeezed and damages.。
Summary of the invention
A manufacture method for OLED encapsulation, substrate 1, division wall 2, glass cover-plate 4, organic packaging materials bar 3, Organic Light Emitting Diode 5.Be formed with OLED 5 on the base 1, around diode 5, form the circle division wall 2 around diode 5, division wall 2 arranges organic packaging materials bar 3 and glass cover-plate 4 and to adhere to each other the cover plate formed, cover diode 5 from above.
Organic packaging materials is the quartz sand of 30%, the polyimides of 30%, the acrylonitrile-butadiene-styrene copolymer of 20% or polyethylene or polypropylene, the zinc oxide of 20%; Above-mentioned 4 kinds of material mixed sinterings are formed material strips, uses the conventional clear binder in this area material strips and glass cover-plate to be bonded together.
Wherein, the thickness of glass cover-plate is 30-40mm, and the thickness of organic packaging materials bar is 30-40mm.Physical separation wall height is the arbitrary height value between 0.5mm or 1mm or 30mm or 0.5 ~ 30mm, and thickness is the arbitrary height value between 1mm or 3mm or 50mm or 1 ~ 50mm.
Accompanying drawing explanation
Fig. 1 is the generalized section of OLED encapsulating structure of the present invention.
Embodiment
In order to make the clearer understanding of those skilled in the art technical scheme of the present invention, below in conjunction with accompanying drawing, its embodiment is described.
OLED encapsulates, substrate 1, division wall 2, glass cover-plate 4, organic packaging materials bar 3, Organic Light Emitting Diode 5.Be formed with OLED 5 on the base 1, around diode 5, form the circle division wall 2 around diode 5, division wall 2 arranges organic packaging materials bar 3 and glass cover-plate 4 and to adhere to each other the cover plate formed, cover diode 5 from above.Wherein physical separation wall height is the arbitrary height value between 0.5mm or 1mm or 30mm or 0.5 ~ 30mm, and thickness is the arbitrary height value between 1mm or 3mm or 50mm or 1 ~ 50mm.Wherein the increase of height value effectively can solve large scale oled panel by the problem damaging Organic Light Emitting Diode and/or electrode during external force extruding; The corresponding increase of one-tenth-value thickness 1/10 simultaneously, its object is to the mechanical strength increasing encapsulating structure.And one-tenth-value thickness 1/10 is more obvious to the barriering effect of steam and oxygen etc. after increasing.Organic packaging materials is used to form strip; together with glass cover-plate laminate adhesive; be formed in above whole encapsulation together, cover plate as a whole, to encapsulate from above; such structure; improve the obstructing capacity to oxygen, aqueous vapor, can support glass cover-plate below simultaneously, make glass plate be not easy distortion; if intensity makes enough greatly glass plate be out of shape, also Organic Light Emitting Diode can be protected.Wherein the thickness of glass cover-plate is 30-40mm, and the thickness of organic packaging materials bar is 30-40mm.
Wherein organic packaging materials bar is transparent material, in order to realize better moistureproof and tolerance function, proving by experiment, the material that use is combined below, under 90% relative humidities, at 90 degrees Celsius, can keep the sealing property of 8000 hours.
Organic packaging materials is the quartz sand of 30%, the polyimides of 30%, the acrylonitrile-butadiene-styrene copolymer of 20% or polyethylene or polypropylene, the zinc oxide of 20%.
Above-mentioned 4 kinds of material mixed sinterings are formed material strips, uses the conventional clear binder in this area material strips and glass cover-plate to be bonded together.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (1)
1. a manufacture method for OLED encapsulation, substrate (1), division wall (2), glass cover-plate (4), organic packaging materials bar (3), Organic Light Emitting Diode (5); Substrate (1) is formed OLED (5), around Organic Light Emitting Diode (5), formation is around circle division wall (2) of Organic Light Emitting Diode (5), division wall (2) arranges organic packaging materials bar (3) and glass cover-plate (4) to adhere to each other the cover plate formed, cover Organic Light Emitting Diode (5) from above;
Organic packaging materials is the quartz sand of 30%, the polyimides of 30%, the acrylonitrile-butadiene-styrene copolymer of 20% or polyethylene or polypropylene, the zinc oxide of 20%; Above-mentioned 4 kinds of material mixed sinterings are formed material strips, uses the conventional clear binder in this area material strips and glass cover-plate to be bonded together;
Wherein, the thickness of glass cover-plate is 30-40mm, and the thickness of organic packaging materials bar is 30-40mm; Physical separation wall height is the arbitrary height value between 0.5 ~ 30mm, and thickness is the arbitrary height value between 1 ~ 50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038307.0A CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410038307.0A CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
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| Publication Number | Publication Date |
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| CN103779511A CN103779511A (en) | 2014-05-07 |
| CN103779511B true CN103779511B (en) | 2016-01-20 |
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| CN201410038307.0A Active CN103779511B (en) | 2014-01-26 | 2014-01-26 | A kind of manufacture method of OLED encapsulation |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820432A (en) * | 2011-06-08 | 2012-12-12 | 乐金显示有限公司 | Organic light emitting device and method for manufacturing the same |
| US8421353B2 (en) * | 2010-12-14 | 2013-04-16 | Samsung Display Co., Ltd. | Organic light emitting diode display with specific sealing member |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010106853A1 (en) * | 2009-03-16 | 2010-09-23 | コニカミノルタホールディングス株式会社 | Organic electronic panel and method for manufacturing organic electronic panel |
| KR101074807B1 (en) * | 2009-12-10 | 2011-10-19 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus |
| US8735874B2 (en) * | 2011-02-14 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, display device, and method for manufacturing the same |
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2014
- 2014-01-26 CN CN201410038307.0A patent/CN103779511B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8421353B2 (en) * | 2010-12-14 | 2013-04-16 | Samsung Display Co., Ltd. | Organic light emitting diode display with specific sealing member |
| CN102820432A (en) * | 2011-06-08 | 2012-12-12 | 乐金显示有限公司 | Organic light emitting device and method for manufacturing the same |
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| Publication number | Publication date |
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| CN103779511A (en) | 2014-05-07 |
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