CN103774189B - The processing method of a kind of chromium plating and water transfer compound base amount method - Google Patents
The processing method of a kind of chromium plating and water transfer compound base amount method Download PDFInfo
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- CN103774189B CN103774189B CN201410012101.0A CN201410012101A CN103774189B CN 103774189 B CN103774189 B CN 103774189B CN 201410012101 A CN201410012101 A CN 201410012101A CN 103774189 B CN103774189 B CN 103774189B
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- chromium plating
- water transfer
- water
- protection
- product
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 238000007747 plating Methods 0.000 title claims abstract description 55
- 229910052804 chromium Inorganic materials 0.000 title claims abstract description 53
- 239000011651 chromium Substances 0.000 title claims abstract description 53
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000012546 transfer Methods 0.000 title claims abstract description 37
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 150000001875 compounds Chemical class 0.000 title claims abstract description 9
- 238000010023 transfer printing Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000047 product Substances 0.000 claims description 18
- 239000003973 paint Substances 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000005491 wire drawing Methods 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000006227 byproduct Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000008399 tap water Substances 0.000 claims description 2
- 235000020679 tap water Nutrition 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 230000002860 competitive effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000002585 base Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of chromium plating and the processing method of water transfer compound base amount method, comprise the steps: substrate surface treatment; Non-chromium plating face insulating protection; Chromium plating; Remove insulating protection; Non-water transfer place is protected; Water transfers; Remove protection; Edge, seam place is repaired. Chrome-plated process and water transfer printing technique are combined enforcement at same product surface by the present invention, it is to increase product specification, makes product more competitive, more has added value.
Description
Technical field
The present invention relates to a kind of process of surface treatment, the processing method of especially a kind of chromium plating and water transfer compound base amount method.
Background technology
Owing to chromium coating has excellent performance, it is widely used as extexine and the functional coating of protection one decorative coating system, electroplating industry accounts for important status always. After product surface decorative chromium plating, it is possible to obtain the specular gloss of Beijing enamel ware look. Prolonged nondiscoloration in an atmosphere. This kind of coating is extensively for protection and the decoration of the component such as automobile, bike, sewing machine, clock and watch, instrument, haberdashery and hardware.
Water transfer technique is a kind of printing utilizing hydraulic pressure that the transfer paper/plastic film of band multi color pattern carries out macromolecule hydrolysis. Along with people are to the raising of the packing of product and the requirement of decoration, the purposes of water transfer is more and more extensive. The principle of its indirect printing and perfect printing effect solve a difficult problem for many product surfaces decoration.
The product appearance requirement of chromium plating and water transfer, also all widespread use motor-car, on the interior products such as high ferro and subway. But, traditional surface treatment mode can only be independent chromium plating or independent water transfer process, cannot meet the appearance requirement of some products simultaneously, and thus single surface treatment mode causes product competitiveness weak, and added value is lower.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind of can substrate surface do simultaneously chromium plating and water transfer surface process processing method.
The technical solution adopted in the present invention is: the processing method of a kind of chromium plating and water transfer compound base amount method, comprises the following steps:
1) polish at substrate surface, wire drawing and/or polished finish;
2) insulating protection is done at non-chromium plating position;
3) chromium plating process is carried out;
4) after chromium plating has processed, remove the insulating protection at non-chromium plating position, and do the transfer protection of non-water at chromium plating position;
5) water transfer process is carried out;
6) water transfer process removes water transfer protection after completing, and completes the finishing of edge, seam place.
Specifically, the base material in step 1) of the present invention comprises iron part, zinc alloy or stainless steel.
Step 2 of the present invention) in, the insulating protection method at non-chromium plating position comprises: adopt adhesive tape sticking be evenly coated at non-chromium plating position, with wax liquid non-chromium plating position, with conductive resin or only plating paint be coated in non-chromium plating position; In described step 4), the position doing the transfer protection of non-water is the boundary place with water transfer process for chromium plating position; Described non-water transfer protection adopts high temperature gummed tape to paste the edge at chromium plating position.
The invention has the beneficial effects as follows: chromium plating and water transfer two kinds of surface treatment modes and deposits, meet different superficial makings requirements, color clarification, be the space that the selection offer of various superficial makings is more wide.
Embodiment
The present invention is further detailed explanation in conjunction with the embodiments now.
Example 1
A processing method for chromium plating and water transfer compound base amount method, comprises the steps:
1) polish at substrate surface, wire drawing or polished finish;
2) with high temperature resistant, the adhesive tape of resistance to peracid, is bonded in the position of non-chromium plating;
3) chromium plating process;
4) anti-retaining tape is removed;
5) position of non-water transfer it is bonded in high temperature gummed tape;
6) water transfer process;
7) high temperature gummed tape is removed;
8) edge, seam place finishing.
Example 2
1) polish at substrate surface, wire drawing or polished finish;
2) position of the non-chromium plating of product it is coated in uniformly with wax liquid;
3) chromium plating process;
4) wax layer is removed;
5) position of non-water transfer it is bonded in high temperature gummed tape;
6) water transfer process;
7) high temperature gummed tape is removed;
8) edge, seam place finishing.
As the Some substitute scheme of above-mentioned example approach, non-chromium plating face insulating protection can also adopt painting conductive resin, is coated with the method for only plating paint insulation.
As the preferred version of above-mentioned example approach, described non-chromium plating face insulating protection adopts adhesive tape insulation method.
As the preferred version of above-mentioned example approach, described non-water transfer place protection adopts high temperature gummed tape.
Wherein, the chrome-plated process method of different base materials is as follows:
1, iron part chrome-plated process flow process:
Except wax �� hot dipping oil removing �� negative electrode �� anode �� electrolytic degreasing �� mild acid etching �� preplating alkali copper �� acidity bright copper (selection) �� bright nickel �� chromium plating or other
Except wax �� hot dipping oil removing �� negative electrode �� anode �� electrolytic degreasing �� mild acid etching �� semi-bright nickel �� high sulphur nickel �� bright nickel �� nickel envelope (selection) �� chromium plating
2, zinc alloy chrome-plated process flow process
Except wax �� hot dipping oil removing �� catholyte oil removing �� pickling �� alkalescence bright copper �� cupric pyrophosphate (selectivity) �� acidity bright copper (selectivity) �� bright nickel �� chromium plating
3, stainless steel direct plating chromium process
1) electrochemical degreasing �� hot water wash �� cold water washes �� pickling activation (1ml/LHCL, 10ml/LH2SO4, room temperature, half a minute; It is applicable on automation line stainless steel chromium plating, unsuitable copper facing or nickel) �� washing �� chromium plating.
2) electrochemical cathode oil removing �� cleaning �� anode activation (10A/dm2) �� directly chromium plating.
3) electrochemical deoiling �� cleaning �� anode electrochemical oil removing (0.5A/dm2) �� cleaning �� pickling activation (1ml/LHCL, 10ml/LH2SO4, room temperature, 45S) and �� cleaning �� chromium plating
The water transfer printing technique method of the present invention is:
1) tap water is injected in tank;
2) being attached on the water surface by water transfer printing film, spray the water transfer printing film on the water surface with promoting agent gently, after water transfer printing film resolves into particulate, leave standstill about one minute, water temperature is at about 30 DEG C;
3) product being put into tank gently, due to electrostatic adsorption, the pattern particulate of water transfer printing film is adsorbed on product surface;
4) product is removed, rinse with clear water, the particulate remaining in product surface is cleaned clean;
5) product of printed pattern is placed in 60 DEG C of baking ovens 1 hour, solidification.
6) by product surface spray coating finishing paint, to be solidified.
The just the specific embodiment of the present invention described in above specification sheets, the flesh and blood of the present invention is not construed as limiting by various illustration, person of an ordinary skill in the technical field after having read specification sheets can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of invention.
Claims (3)
1. the processing method of a chromium plating and water transfer compound base amount method, it is characterised in that comprise the following steps:
1) polish at substrate surface, wire drawing and/or polished finish;
2) insulating protection is done at non-chromium plating position; The insulating protection method at non-chromium plating position comprises: adopt adhesive tape sticking be evenly coated at non-chromium plating position, with wax liquid non-chromium plating position, with conductive resin or only plating paint be coated in non-chromium plating position;
3) chromium plating process is carried out;
4) after chromium plating has processed, remove the insulating protection at non-chromium plating position, and do the transfer protection of non-water at chromium plating position; The position doing the transfer protection of non-water is the boundary place with water transfer process for chromium plating position;
5) water transfer process is carried out; Water transfer printing technique method is:
A) tap water is injected in tank;
B) being attached on the water surface by water transfer printing film, spray the water transfer printing film on the water surface with promoting agent gently, after water transfer printing film resolves into particulate, leave standstill about one minute, water temperature is at about 30 DEG C;
C) product being put into tank gently, due to electrostatic adsorption, the pattern particulate of water transfer printing film is adsorbed on product surface;
D) product is removed, rinse with clear water, the particulate remaining in product surface is cleaned clean;
E) product of printed pattern is placed in 60 DEG C of baking ovens 1 hour, solidification;
F) by product surface spray coating finishing paint, to be solidified;
6) water transfer process removes water transfer protection after completing, and completes the finishing of edge, seam place.
2. the processing method of a kind of chromium plating as claimed in claim 1 and water transfer compound base amount method, it is characterised in that: the described base material in step 1) comprises iron part, zinc alloy or stainless steel.
3. the processing method of a kind of chromium plating as claimed in claim 1 and water transfer compound base amount method, it is characterised in that: described non-water transfer protection adopts high temperature gummed tape to paste the edge at chromium plating position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012101.0A CN103774189B (en) | 2014-01-10 | 2014-01-10 | The processing method of a kind of chromium plating and water transfer compound base amount method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012101.0A CN103774189B (en) | 2014-01-10 | 2014-01-10 | The processing method of a kind of chromium plating and water transfer compound base amount method |
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| Publication Number | Publication Date |
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| CN103774189A CN103774189A (en) | 2014-05-07 |
| CN103774189B true CN103774189B (en) | 2016-06-01 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104357885A (en) * | 2014-10-15 | 2015-02-18 | 中航飞机股份有限公司西安飞机分公司 | Protection method for local chromium electroplating of shaft type part |
| CN105984247A (en) * | 2015-02-02 | 2016-10-05 | 上海齐迈五金有限公司 | Transferring method of hardware tool and accessory thereof |
| CN106119907A (en) * | 2016-08-31 | 2016-11-16 | 柳州市金元机械制造有限公司 | A kind of chrome-plating method of automobile rustless steel tail gas decoration |
| CN108486620A (en) * | 2018-01-31 | 2018-09-04 | 厦门建霖健康家居股份有限公司 | A kind of method that plating is stopped in zinc alloy workpiece inner cavity |
| CN110424031A (en) * | 2018-12-21 | 2019-11-08 | 西安成立航空制造有限公司 | A kind of improved method for part interior angle chrome-plated process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0499689A (en) * | 1990-06-14 | 1992-03-31 | Shinji Miura | Plating pattern structure having adhesive layer and preparation thereof |
| WO2003055690A2 (en) * | 2001-12-27 | 2003-07-10 | Smart Desing Systems Gmbh | Printing film, and device for freeform-printing on objects |
| CN101125499A (en) * | 2007-09-11 | 2008-02-20 | 林其武 | Method for making water-transfer printing paper by using printer to make pattern |
| CN102296331A (en) * | 2010-06-24 | 2011-12-28 | 詹涂城 | Making method for hierarchic visual effect of plastic electroplating |
| CN202559181U (en) * | 2012-05-16 | 2012-11-28 | 政伸企业股份有限公司 | Water transfer printing paper with metal luster |
| CN103179795A (en) * | 2013-04-23 | 2013-06-26 | 无锡江南计算技术研究所 | Making method of outer layer patterns of local gold-plating printed plate |
-
2014
- 2014-01-10 CN CN201410012101.0A patent/CN103774189B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0499689A (en) * | 1990-06-14 | 1992-03-31 | Shinji Miura | Plating pattern structure having adhesive layer and preparation thereof |
| WO2003055690A2 (en) * | 2001-12-27 | 2003-07-10 | Smart Desing Systems Gmbh | Printing film, and device for freeform-printing on objects |
| CN101125499A (en) * | 2007-09-11 | 2008-02-20 | 林其武 | Method for making water-transfer printing paper by using printer to make pattern |
| CN102296331A (en) * | 2010-06-24 | 2011-12-28 | 詹涂城 | Making method for hierarchic visual effect of plastic electroplating |
| CN202559181U (en) * | 2012-05-16 | 2012-11-28 | 政伸企业股份有限公司 | Water transfer printing paper with metal luster |
| CN103179795A (en) * | 2013-04-23 | 2013-06-26 | 无锡江南计算技术研究所 | Making method of outer layer patterns of local gold-plating printed plate |
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| CN103774189A (en) | 2014-05-07 |
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Effective date of registration: 20210527 Address after: 213102 Industry Park, remote town, Wujin District, Jiangsu, Changzhou Patentee after: CHANGZHOU TELEVIC-KTK ELECTRONICS Co.,Ltd. Address before: 213102 88-89 Chuang Chuang Road, Yao Guan Town, Wujin District, Changzhou, Jiangsu Patentee before: KTK GROUP Co.,Ltd. |
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Effective date of registration: 20231029 Address after: 213000 No. 88-89, Jinchuang Road, Yaoguan Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: KTK GROUP Co.,Ltd. Address before: 213102 Industry Park, remote town, Wujin District, Jiangsu, Changzhou Patentee before: CHANGZHOU TELEVIC-KTK ELECTRONICS Co.,Ltd. |