CN103763849A

CN103763849A - High-heat radiation copper-based circuit board

Info

Publication number: CN103763849A
Application number: CN201310517425.5A
Authority: CN
Inventors: 郑嵘; 施德林
Original assignee: GAODE ELECTRONIC (SUZHOU) CO Ltd
Current assignee: GAODE ELECTRONIC (SUZHOU) CO Ltd
Priority date: 2013-10-28
Filing date: 2013-10-28
Publication date: 2014-04-30

Abstract

The invention relates to a high-heat radiation copper-based circuit boar comprising a board body. The board body is formed by composition of a circuit layer (1), an insulated heat conduction layer (2), and a cooper base layer (3). The high-heat radiation copper-based circuit board is characterized in that reinforced heat radiation zones (4) without current flowing are arranged at the surface of one side of the circuit layer (1) of the board body; a plurality of blind holes (5) along the direction of the board thickness are arranged in each of the reinforced heat radiation zones (4); and the blind holes (5) punch the circuit layer (1) and the insulated heat conduction layer (2), so that the bottoms of the blind holes (5) are communicated with the cooper base layer (3). Moreover, copper-plated layers (6) cover the walls and the bottoms of all the blind holes (5); and the circuit layer (1) and the cooper base layer (3) are connected by the copper-plated layers (6). According to the invention, the heat of the circuit layer is directly conducted to the cooper base layer through the copper-plated layers in the blind holes, so that the heat radiation capabilities of the reinforced heat radiation zones are enhanced and the heat radiation speed is accelerated.

Description

A kind of high radiating copper base circuit board

Technical field

The present invention relates to a kind of wiring board, be specifically related to a kind of high radiating copper base circuit board.

Background technology

Along with the development of electronics industry, national governments are more and more tighter to the requirement of environmental protection, and the application of LED is more and more extensive.High radiating copper base circuit board is often applied in LED module, because high radiating copper base circuit board has the advantage of high heat conduction, can be effectively by the thermal energy conduction of LED to external environment, reduce the temperature of LED simultaneously, improve luminous efficiency, corresponding briliancy, and increase the service life.

Existing high radiating copper base circuit board, comprises three layers: ground floor is line layer, for designed lines; The second layer is thermal insulation layer, and this thermal insulation layer is special material, can heat conduction and high pressure resistant; The 3rd layer is thicker base copper layer, for quick heat radiating.That is, during use, LED is installed on line layer, and the heat of LED conducts to base copper layer through thermal insulation layer, by base copper layer, is shed fast.

Existing high radiating copper base circuit board, though thermal insulation layer is special material, has certain heat conductivility, and it is certainly still very different that its heat conductivility is compared copper, and the temperature on line layer conducts to base copper layer through thermal insulation layer, and heat conducting speed is still quick not.

Summary of the invention

The object of the invention is to provide a kind of high radiating copper base circuit board, to improve the radiating rate of regional area on wiring board.

For achieving the above object, the technical solution used in the present invention is: a kind of high radiating copper base circuit board, comprise a plate body, this plate body forms by three layers, line layer, thermal insulation layer and base copper layer are compound, that side surface of the line layer of described plate body is provided with to walk the reinforcement heat dissipation region of electric current, a plurality of blind holes along thickness of slab direction are set in this reinforcement heat dissipation region, and these blind holes are punched line layer and thermal insulation layer, make to connect base copper layer at the bottom of the hole of blind hole; And, be covered with copper coating at the bottom of the hole wall of each blind hole and hole, and via this copper coating, described line layer be connected with described base copper layer.

In such scheme, described blind hole is laser hole, and its orifice diameter is 0.1-0.125mm.

Because technique scheme is used, the present invention compared with prior art has following advantages:

In reinforcement heat dissipation region of the present invention, by the copper coating in a plurality of blind holes, directly line layer is connected with base copper layer, be heat on line layer via the copper coating in blind hole directly conduction to base copper layer, the heat conduction of copper is in 300W/m*k left and right, be far longer than the 3W/m*k of thermal insulation layer, therefore it is much better than to strengthen the heat-sinking capability of heat dissipation region, radiating rate is also faster.During application, can strengthen, in heat dissipation region, high-power LED or other large power, electrically sub-elements are installed.

Accompanying drawing explanation

Fig. 1 is embodiment of the present invention structural plan schematic diagram;

Fig. 2 is the blind hole place schematic cross-section of the embodiment of the present invention.

In above accompanying drawing: 1, line layer; 2, thermal insulation layer; 3, base copper layer; 4, strengthen heat dissipation region; 5, blind hole; 6, copper coating; 7, pad.

Embodiment

Below in conjunction with drawings and Examples, the invention will be further described:

Embodiment: shown in Fig. 1, Fig. 2:

A high radiating copper base circuit board, comprises a plate body, and this plate body forms by 3 three layers, line layer 1, thermal insulation layer 2 and base copper layer are compound, sees Fig. 2.

Referring to Fig. 1, line layer 1 that side surface of described plate body is provided with to walk the reinforcement heat dissipation region 4 of electric current, a plurality of blind holes 5 along thickness of slab direction is set this reinforcement heat dissipation region 4 is interior.These blind holes 5 are punched line layer 1 and thermal insulation layer 2, make to connect base copper layer 3 at the bottom of the hole of blind hole 5; And, be covered with copper coating 6 at the bottom of the hole wall of each blind hole 5 and hole, and via this copper coating 6, described line layer 1 be connected with described base copper layer 2, see Fig. 2.

Described blind hole 5 is preferably and adopts small laser hole, and its orifice diameter is 0.1-0.125mm, and these blind holes 5 are being strengthened the interior intensive layout of heat dissipation region 4.

Strengthen by the copper coating 6 in a plurality of blind holes 5, directly 2 layers of line layer 1 and base copper being connected in heat dissipation region 4, be heat on line layer 1 via the copper coating 6 in blind hole 5 directly conduction to base copper layer 3, the heat conduction of copper is in 300W/m*k left and right, be far longer than the 3W/m*k of thermal insulation layer, therefore it is much better than to strengthen the heat-sinking capability of heat dissipation region 4, radiating rate is also faster.

On plate body, can establish one or numerous and strengthen heat dissipation region 4, these are strengthened in heat dissipation region 4 for high-power LED or other large power, electrically sub-elements are installed, specifically the heating part of LED or electronic component is covered on and strengthens in heat dissipation region 4, and the pin of LED or the electronic component pad 7 other with strengthening heat dissipation region 4 welds in addition.

The material of described thermal insulation layer 2 is generally the PP that has added Heat Conduction Material, and thickness is generally 0.1mm, and base copper layer 3 is thicker, conventionally has a 1mm.

Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.

Claims

1. one kind high radiating copper base circuit board, comprise a plate body, this plate body is by line layer (1), thermal insulation layer (2) and (3) three layers of compound formation of base copper layer, it is characterized in that: that side surface of the line layer of described plate body (1) is provided with to walk the reinforcement heat dissipation region (4) of electric current, a plurality of blind holes along thickness of slab direction (5) are set in this reinforcement heat dissipation region (4), these blind holes (5) are punched line layer (1) and thermal insulation layer (2), make to connect base copper layer (3) at the bottom of the hole of blind hole (5); And, be covered with copper coating (6) at the bottom of the hole wall of each blind hole (5) and hole, and via this copper coating (6), described line layer (1) be connected with described base copper layer (2).

2. high radiating copper base circuit board according to claim 1, is characterized in that: described blind hole (5) is laser hole, and its orifice diameter is 0.1-0.125mm.