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CN103765751A - Power conversion device - Google Patents

Power conversion device Download PDF

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Publication number
CN103765751A
CN103765751A CN201280041893.3A CN201280041893A CN103765751A CN 103765751 A CN103765751 A CN 103765751A CN 201280041893 A CN201280041893 A CN 201280041893A CN 103765751 A CN103765751 A CN 103765751A
Authority
CN
China
Prior art keywords
power
heat conduction
heat
base plate
installation base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201280041893.3A
Other languages
Chinese (zh)
Other versions
CN103765751B (en
Inventor
田中泰仁
柴田美里
小高章弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN103765751A publication Critical patent/CN103765751A/en
Application granted granted Critical
Publication of CN103765751B publication Critical patent/CN103765751B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
    • B60L3/003—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to inverters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2200/00—Type of vehicles
    • B60L2200/26—Rail vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00—Control parameters of input or output; Target parameters
    • B60L2240/10—Vehicle control parameters
    • B60L2240/36—Temperature of vehicle components or parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00—Control parameters of input or output; Target parameters
    • B60L2240/40—Drive Train control parameters
    • B60L2240/52—Drive Train control parameters related to converters
    • B60L2240/525—Temperature of converter or components thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Transportation (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)

Abstract

Provided is a power conversion device capable of efficiently dissipating heat from a heat generating circuit component to a cooling body without interposing a housing on the heat dissipation path of the heat generation circuit component mounted on a substrate. A power conversion device (1) is provided with a module (11) in which a semiconductor switching element for power conversion is built into a case body (12) and a cooling member that is in contact with a cooling body (3) is formed on one surface of the case body (12). Moreover, the power conversion device (1) is provided with mounting substrates (22, 23), on which are mounted circuit components comprising the heat generating circuit component for driving the semiconductor switching element, and is provided with heat-transferring support members (32, 33) that support the mounting substrates (22, 23) at a prescribed distance from the module and that are in contact with the cooling body (3) so that heat generated by the mounting substrates is dissipated to the cooling body.

Description

Power-converting device
Technical field
The present invention relates to power-converting device, described power-converting device is set to keep predetermined space and support the installation base plate that circuit block has been installed in the module of the thyristor of using at built-in power converter, and described circuit block comprises the heating circuit parts that drive above-mentioned thyristor.
Background technology
As this power-converting device, the known electric power variation device that has patent documentation 1 to record.This power-converting device is set to configure water cold sleeve in basket, configures built-in as the power model of the IGBT of thyristor on this water cold sleeve, carries out cooling thus to this power model.In addition, in basket, be set to following structure: the opposition side at the water cold sleeve of power model keeps preset distance and configures control circuit substrate, the heat being produced by this control circuit substrate conducts to the Metal Substrate base plate of support and control circuit substrate by thermal component, and the heat that conducts to Metal Substrate base plate conducts to water cold sleeve by the sidewall of the basket that supports this Metal Substrate base plate.
Prior art document
Patent documentation
Patent documentation 1: No. 4657329 communique of Japan Patent
Summary of the invention
Technical problem
But in the conventional example of recording at above-mentioned patent documentation 1, the heat being produced by control circuit substrate is dispelled the heat with the such path of control circuit substrate → thermal component → Metal Substrate base plate → basket → water cold sleeve.Therefore, basket is as the part of thermally conductive pathways and be utilized, cause the requirement to basket to have good thermal conductivity, material is restricted to the metal that pyroconductivity is high, in the power-converting device that requires miniaturization and, existence can not be selected the light-type materials such as resin, is difficult to realize light-weighted an open question.
In addition, basket is often required to waterproof and dustproof, therefore conventionally between Metal Substrate base plate and basket, carry out the coating of liquid sealant and/or inserting of rubber filler processed between basket and water cold sleeve.Also there is following an open question: due to liquid sealant and/or the common pyroconductivity of rubber filler processed low, and between hot cooling path, thereby make thermal impedance increase, cooling effectiveness reduction.In order to solve this open question, need to be by make the heating that cannot the remove heat radiation of substrate and/or installing component from the free convection of basket and/or basket lid, in order to make the surface area of basket and/or basket lid become large, and make the outer deformation of basket and/or basket lid large, thereby power-converting device maximizes.
Technical scheme
Therefore, the present invention makes in view of the problem of the Wei Xie Decision of above-mentioned conventional example, object is to provide a kind of hot heat dissipation path that does not make basket be present in the heating circuit parts of installing at substrate, and the heat of heating circuit parts can be dispelled the heat efficiently to the power-converting device of cooling body.
To achieve these goals, the 1st form of power-converting device of the present invention possesses: semi-conductor power module, and it is formed with cooling-part in one side; Cooling body, it engages with described cooling-part; Heat conduction support component, its heat that has made to install the installation base plate of circuit block conducts to described cooling body, and to keep the mode of predetermined space to support this installation base plate between this installation base plate and described semi-conductor power module, described circuit block comprises the heating circuit parts that drive described semi-conductor power module.
According to this formation, the heat of the heating circuit parts that are arranged on installation base plate directly can be dispelled the heat to cooling body by heat conduction support component.
In addition, the 2nd form of power-converting device of the present invention possesses: module, and its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body; And installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; In addition, above-mentioned the 1st form possesses heat conduction support component, it to be to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and contacts with described cooling body, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
According to this formation, the heat energy that is arranged on the heating circuit parts of installation base plate is not enough situated between and is dispelled the heat to cooling body by basket by heat conduction support component.
In addition, the 3rd form of power-converting device of the present invention possesses: module, and its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body; And installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor.In addition, above-mentioned the 3rd form possesses heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and by least one side of described module and with described cooling body, contact, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
According to this formation, with above-mentioned the 2nd form similarly, the heat energy that is arranged on the heating circuit parts of installation base plate is not enough situated between and is dispelled the heat to cooling body by basket by heat conduction support component.In addition, heat conduction support component contacts with cooling body by a side of module, therefore can shorten thermally conductive pathways.
In addition, the casing that the 4th form of power-converting device of the present invention is described module has the flat rectangular shape that is provided with rectangular plane, and described heat conduction support component is configured in the mode of the side of the long side by described casing.
According to this formation, can expand the heat conduction cross-sectional area of heat conduction support component, improve radiating effect.
In addition, the 5th form of power-converting device of the present invention possesses the many groups of groups that consist of described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board contacts by the different side of described module and with described cooling-part.
According to this formation, in the case of existing multiple groups that formed by installation base plate and heat transfer support plate portion, can form different heat dissipation path according to each installation base plate.
In addition, to be described heat conduction support component be formed with patchhole in the position corresponding with being formed on splicing ear on the casing of described module to the 6th form of power-converting device of the present invention.
According to this formation, can between adjacent patchhole, form thermally conductive pathways, can make the cross-sectional area of thermally conductive pathways increase and heat conduction efficiently.In addition, can guarantee the rigidity with respect to vibration.
In addition, the 7th form of power-converting device of the present invention possesses: module, and its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body; And installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor.In addition, above-mentioned the 7th form possesses heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and by least a portion of described module and with described cooling body, contact, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
According to this formation, heat conduction support component at least a portion by module contacts with cooling body, therefore, in the case of the external shape of module is large, can shorten thermally conductive pathways.
In addition, the 8th form of power-converting device of the present invention is, in above-mentioned the 7th form, possess the many groups of groups that formed by described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board contacts by a part for described module and with described cooling-part.
According to this formation, in the case of existing multiple groups that formed by installation base plate and heat transfer support plate portion, can form different heat dissipation path according to each installation base plate.
In addition, the 9th form of power-converting device of the present invention is that described installation base plate consists of metallic substrates circuit substrate.
According to this formation, thereby can carry out efficiently the heat radiation of radiating circuit parts by heating panel and the link of heat conduction support component of metallic substrates circuit substrate.
In addition, the 10th form of power-converting device of the present invention for planting conducting-heat elements between described installation base plate and described heat conduction support component.
According to this formation, the heat energy of the radiating circuit parts of installation base plate is enough situated between by conducting-heat elements heat conduction efficiently to heat conduction support component.
In addition, the 11st form of power-converting device of the present invention is that described conducting-heat elements consists of the insulator with insulating properties.
According to this formation, conducting-heat elements consists of insulator, therefore can reliably must make installation base plate and the insulation of heat transfer support plate portion.
In addition, the 12nd form of power-converting device of the present invention is that described conducting-heat elements consists of the elastomer with retractility.
According to this formation, conducting-heat elements consists of elastomer, therefore makes installation base plate and the contact area of the circuit block that is mounted increases, and can make radiating effect improve.
In addition, the 13rd form of power-converting device of the present invention is that described conducting-heat elements consists of the elastomer with retractility, at the installed surface of described heat conduction board one side of described installation base plate, described heating circuit parts is installed.
According to this formation, can make conducting-heat elements directly contact the heating circuit parts of installation base plate, can bring into play large radiating effect.
In addition, the 14th form of power-converting device of the present invention is that described conducting-heat elements is formed as identical size with described installation base plate.
According to this formation, the size of conducting-heat elements is identical with installation base plate, therefore can increase heat-conducting area and improve radiating effect.
In addition, the 15th form of power-converting device of the present invention is that described conducting-heat elements is only configured in caloric value in the electronic circuit component that is installed on described installation base plate or the relatively large heating circuit parts of heat conduction density around.
According to this formation, only at the partial configuration conducting-heat elements of wish performance radiating effect, therefore can make the usable floor area of conducting-heat elements reduce, realize cost degradation.
In addition, the 16th form of power-converting device of the present invention is that the heat transfer support plate portion of described installation base plate and described heat conduction support component is fixed by fastening fixed part across described conducting-heat elements.
According to this formation, under the state that clamps heat-conducting part between installation base plate and the heat transfer support plate portion of heat conduction support component, by fastening fixed part, fixed, therefore can easily install.
In addition, the 17th form of power-converting device of the present invention is plant interval adjustment component around described fastening fixed part, and described interval adjustment component is predetermined value by the distance maintaining of the heat transfer support plate portion of described installation base plate and described heat conduction support component.
According to this formation, at conducting-heat elements, be in elastomeric situation, the compression ratio of conducting-heat elements can be correctly provided.
In addition, to be described heat conduction support component form by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling body across described conducting-heat elements the 18th form of power-converting device of the present invention.
According to this formation, installation base plate is supported by heat transfer support plate portion, therefore can improve the rigidity of installation base plate.
In addition, the 19th form of power-converting device of the present invention is that described heat conduction support-side board has the side plate corresponding with each side of described installation base plate, is formed with the support portion of the described heat transfer support plate of support portion at this each board.
According to this formation, can support multiple installation base plates by 1 heat conduction support-side board.
In addition, the 20th form of power-converting device of the present invention is that described heat transfer support plate portion and described heat conduction support-side board form as one.
According to this formation, heat transfer support plate portion and heat conduction support-side board are formed one, and therefore the linking part does not between the two have seam, can make the thermal resistance of linking part reduce.
In addition, the 21st form of power-converting device of the present invention is that described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
According to this formation, heat transfer support plate portion is by multiple heat conduction support-side board fixed supports, and therefore can make increases and dispel the heat efficiently to the heat-conducting area of cooling body.
In addition, the 22nd form of power-converting device of the present invention is that the heat conduction support-side board of described heat conduction support component has the cooling body contact board between cooling-part and the described cooling body that is inserted in described module.
According to this formation, at heat conduction support-side board, there is the cooling body contact board contacting with cooling body, therefore can carry out reliably the heat radiation to cooling body.
In addition, the 23rd form of power-converting device of the present invention is the tabular elastomeric element of planting between described cooling body contact board and the cooling-part of described module.
According to this formation, by tabular elastomeric element, cooling body is contacted to board and be expressed to cooling body, therefore can carry out reliably cooling body and contact with cooling body the contact of board.
In addition, the 24th form of power-converting device of the present invention is that described cooling body contact board is being formed with fixed part patchhole with the opposed position of the patchhole that is formed at described module, described in insert in the hole and insert the fixed part that this module is fixed to described cooling body.
According to this formation, module and heat conduction support component can be fixed on to cooling body simultaneously, and can make installation procedure quantity reduce.
In addition, the 25th form of power-converting device of the present invention is to form peristome in described module, so that described cooling-part is in the face of the side contrary with described cooling-part of this module, described heat conduction support component forms by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling-part by the described peristome of described module across described conducting-heat elements.
According to this formation, heat conduction support-side board contacts with cooling-part by the peristome of module, therefore can make module and heat conduction support side plate integrally.
In addition, the 26th form of power-converting device of the present invention is that described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
According to this formation, heat transfer support plate portion is by multiple heat conduction support-side board fixed supports, and therefore can make increases and dispel the heat efficiently to the heat-conducting area of cooling body.
In addition, the 27th form of power-converting device of the present invention is the surface that described heat conduction support component has black.
According to this formation, by making the surface of heat conduction support component, be black, can increase hot emissivity, increase radiation heat conduction amount, therefore can make, to activeization of heat radiation of the surrounding of heat conduction support component, to make the hot cooling high-efficiency of substrate.
In addition, the 28th form of power-converting device of the present invention be described installation base plate by caloric value or the relatively large heating circuit component configuration of heat conduction density and described cooling body between the short position of heat conduction distance.
According to this formation, the mode shortening with heat-dissipating distance configures the radiating circuit parts to installation base plate heat radiation, therefore can increase heat dissipation capacity and dispels the heat efficiently.
The effect of invention
According to the present invention, the heat conduction support component contacting with cooling body and be not situated between to be supported by basket the installation base plate of the circuit block that comprises heating circuit parts has been installed, therefore the heat being produced by heating circuit parts, can be situated between and directly be dispelled the heat to cooling body by heat conduction support component, can suppress thermal resistance and to carry out the heat that cooling effectiveness is high cooling.Therefore, can provide the Zu He Minus that can make with the heating functioin from basket and/or basket lid few, suppress the size of basket and/or basket lid, miniaturization and economic power-converting device.
In addition, basket is not needed to good thermal conductivity, therefore the light material that uses resin etc. at basket can be provided, make basket lightweight and economic power-converting device.
Accompanying drawing explanation
Fig. 1 is the sectional view that represents the entirety formation of the 1st execution mode of power-converting device of the present invention.
Fig. 2 is the amplification sectional view that represents the major part of the 1st execution mode.
Fig. 3 is the amplification sectional view that has represented to install the concrete formation of the state of installation base plate.
Fig. 4 represents installation base plate to be installed to the figure of the method for the installation of heat conduction support component.
Fig. 5 is the sectional view that represents installation base plate to be installed to the state of heat conduction support component.
Fig. 6 is the sectional view that represents the variation of conducting-heat elements.
Fig. 7 is the end view that represents heat conduction support component.
Fig. 8 is the figure of the heat dissipation path in the base board unit of explanation heating circuit parts.
Fig. 9 is the figure in the integral heat sink path of explanation heating circuit parts.
Figure 10 is the figure representing for the state of power-converting device effect up-down vibration and/or transverse shakiness.
Figure 11 is the model utility stereogram that represents the configuration example of the heating circuit parts of installing to installation base plate.
Figure 12 is the sectional view that represents the configuration example of the heating circuit parts of installing to installation base plate.
Figure 13 is the figure of the heat dissipation path of the variation of explanation the 1st execution mode.
Figure 14 is the sectional view that represents the entirety formation of the 2nd execution mode of power-converting device of the present invention.
Figure 15 is the sectional view that represents the major part of the 2nd execution mode.
Figure 16 is the sectional view that represents the major part of the 3rd execution mode of power-converting device of the present invention.
Figure 17 is the sectional view that represents the variation of the 3rd execution mode.
Figure 18 is other routine sectional views that represent heat conduction support component.
Figure 19 is the sectional view that has represented to apply the variation of the situation of metallic substrates circuit substrate.
Figure 20 is the stereogram that represents the another example of heat conduction support component.
Figure 21 is the vertical view of Figure 20.
Figure 22 is the front view of Figure 20.
Figure 23 is the end view of Figure 20.
Figure 24 is the stereogram of the heat conduction support component of Figure 20.
Symbol description
1 power-converting device
2 baskets
3 cooling bodies
4 film capacitors
5 storage battery incorporating sections
11 power models
12 casings
13 thermal components
21 drive circuit substrate
22 control circuit substrates
23 power circuit substrates
24,25 bell taps
32 heat conduction support components
32a heat transfer support plate portion
32b hold-down screw
32c heat conduction support-side board
33 heat conduction support components
33a heat transfer support plate portion
33b hold-down screw
33c heat conduction support-side board
34 base plate
35,37 conducting-heat elements
39 heating circuit parts
40 shims (interval adjustment component)
45 tabular elastomeric elements
61 cooling fins
71 heating panels
72 insulating barriers
73 circuitous patterns
74 metallic substrates circuit substrates
81a, 81b through hole
90 heat conduction support-side boards
91a front side board
91b rear side board
91c left side board
91d right side board
93a, 93b, 94a, 94b, 96a, 96b, 97a, 97b support portion
Embodiment
Below, with reference to accompanying drawing, describe embodiments of the present invention in detail.
Fig. 1 is the sectional view that represents the entirety formation of power-converting device of the present invention.
In figure, 1 represents power-converting device, and this power-converting device 1 is incorporated in basket 2.Basket 2 is the parts by synthetic resin material forming, the bottom basket 2A and the top basket 2B that are split to form up and down across having the cooling body forming 3 of water cold sleeve, consists of.
Bottom basket 2A is by there being end square tube body to form.The open-top of this bottom basket 2A is covered by cooling body 3, level and smooth with film capacitor 4 in inside storage.
Top basket 2B possesses the lid 2b on the square tube body 2a of top and open bottom end and the top of sealing the party cylindrical shell 2a.And square tube body 2a is sealed by cooling body 3 bottom.Although not shown, between the bottom of the party's cylindrical shell 2a and cooling body 3, there is the encapsulant through inserting of the coating of liquid sealant and/or rubber filler processed etc.
In cooling body 3, the admission port 3a of cooling water and discharge outlet 3b are in the outer openings of basket 2.These admission ports 3a and discharge outlet 3b are for example connected with not shown cooling water supply source by flexible pipe.This cooling body 3 is for example by aluminium high pyroconductivity, aluminium alloy injection mo(u)lding and form.The bottom surface of cooling body 3 becomes tabular surface, and end face retains central portion 3c and forms the circumferential slot 3d of square frame shape.In addition, form the inserting hole 3e that inserts up and down positive and negative electrode 4a at cooling body 3, this positive and negative electrode 4a is the electrode that is insulated covering by the film capacitor 4 of bottom basket 2A maintenance.
Simultaneously known with reference to Fig. 2, power-converting device 1 comprises power model 11, the thyristor that for example forms converter circuit that this power model 11 is used as power converter and be built-in with for example igbt (IGBT).This power model 11, at the built-in IGBT of casing 12 of flat rectangular-shaped insulating properties, forms metal thermal component 13 at the lower surface of casing 12.From the direction of overlooking, the quadrangle on casing 12 and thermal component 13 becomes to insert the patchhole 15 as the hold-down screw 14 of fixed part.In addition, at the upper surface of casing 12 than the substrate fixed part 16 of the outstanding formation in patchhole 15 4 positions in the inner part predetermined altitude.
The drive circuit substrate 21 that has fixedly mounted drive circuit etc. in the upper end of this substrate fixed part 16, this drive circuit drives at the built-in IGBT of power model 11.In addition, above drive circuit substrate 21d, keep predetermined space and the fixing control circuit substrate 22 as installation base plate, this control circuit substrate 22 as installation base plate has been installed and has been comprised and control the IGBT that is built in power model 11, caloric value is large comparatively speaking, or the control circuit of the large heating circuit parts of heat generation density etc.And, above control circuit substrate 22, keep the fixing power circuit substrate 23 as installation base plate of predetermined space, this power circuit substrate 23 as installation base plate has been installed the power circuit of the heating circuit parts that comprise the supply power of the IGBT to being built in power model 11 etc.
Drive circuit substrate 21, by insert the external thread part 24a of bell tap 24 in the patchhole 21a forming with the opposed position of substrate fixed part 16, screws togather this external thread part 24a and the internal thread part 16a that the upper surface at substrate fixed part 16 forms and be fixed.
In addition, control circuit substrate 22, by inserting the external thread part 25a of bell tap 25 in the patchhole 22a forming in the opposed position of internal thread part 24b forming with the upper end of bell tap 24, screws togather the internal thread part 24b of this external thread part 25a and bell tap 24 and be fixed.
And power circuit substrate 23, by inserting hold-down screw 26 in the patchhole 23a forming in the opposed position of internal thread part 25b forming with the upper end of bell tap 25, screws togather this hold-down screw 26 and be fixed with the internal thread part 25b of bell tap 25.
In addition, control circuit substrate 22 and power circuit substrate 23 are supported to form separately not by basket 2 by heat conduction support component 3233 to the mode of the heat dissipation path of cooling body 3.These heat conduction support components 32 and 33 are formed by pyroconductivity high for example aluminium of metal or aluminium alloy.
In addition, heat conduction support component 32 and 33 has in the circumferential slot 3d of the cooling body 3 that is configured in support and control circuit substrate 22 and as the common base plate 34 of the square frame shape of cooling body contact board.Therefore, heat conduction support component 32 and 33 is bonded and is integrated by base plate 34.
Heat conduction support component 32 and 33 and base plate 34 there is the surface of black.In order to make these heat conduction support components 32 and 33 and the surface stain of base plate 34, can, at surface-coated black resin, also can use blacking application.So, by make heat conduction support component 32 and 33 and the surface of base plate 34 become black, thereby with the material color of metal relatively thermal emissivity rate become large, can make radiation heat conduction amount increase.Therefore, can make heat conduction support component 32 and 33 and the peripherad heat radiation of base plate 34 active, the heat of carrying out efficiently control circuit substrate 22 and power circuit substrate 23 is cooling.In addition, also can only make the surface of heat conduction support component 32 and 33 become black except base plate 34.
Heat conduction support component 32 consists of the 32a of heat transfer support plate portion on flat board and heat conduction support-side board 32c, while observing from Fig. 2, this heat conduction support-side board 32c fixes with hold-down screw 32b in the right-hand member side on the long limit along power model 11 of the 32a of this heat transfer support plate portion.Heat conduction support-side board 32c and common base plate 34 link.
Control circuit substrate 22 is fixed on the 32a of heat transfer support plate portion across conducting-heat elements 35 by hold-down screw 36.Conducting-heat elements 35 is configured to the overall dimension identical with power circuit substrate 23 by the elastomer with retractility.As this conducting-heat elements 35, apply by making metal charge be present in the inside of silica gel, thereby can bring into play insulation property, can improve again the parts of thermal conductivity.
In addition, as shown in Figure 2, heat conduction support-side board 32c is formed as cross section and is the word of falling L shape by linking board 32d and upper plate portion 32e, this connection board 32d links and is integrated and extends upward with the neighboring of the long side of the common base plate 34 configuring in the circumferential slot 3d of cooling body 3, and this upper plate portion 32e extends to the left from the upper end of this link board 32d.Linking board 32d extends upward by the right flank of the long side of power model 11.
Heat conduction support component 33 consists of the 33a of heat transfer support plate portion on flat board and heat conduction support-side board 33c, while observing from Fig. 2, this heat conduction support-side board 33c is fixed by hold-down screw 33b in the left end side on the long limit along power model 11 of the 33a of this heat transfer support plate portion.Heat conduction support-side board 33c and common base plate 34 link.
Power circuit substrate 23 is fixed on the 33a of heat transfer support plate portion across the conducting-heat elements 37 identical with aforesaid conducting-heat elements 35 by hold-down screw 38.
In addition, as shown in FIG. 2 and 3, heat conduction support-side board 33c is formed as cross section and is the word of falling L shape by linking board 33d and upper plate portion 33e, this link board 33d links and is integrated and extends upward with the neighboring of the long side of the common base plate 34 configuring in the circumferential slot 3d of cooling body 3, and this upper plate portion 33e extends to the left from this link board 33d upper end.Linking board 33d extends upward by the left surface of the long side of power model 11.
Link the base plate 34 of board 33d and the linking part of upper plate portion 33e and be formed as the flexure plane 33f and the 33g that for example by a part for barrel surface, are formed.So, by making the linking part that links board 33d and base plate 34 and upper plate portion 33e become flexure plane 33f cylindraceous and 33g, thereby can improve the vibration resistance with respect to up-down vibration and/or transverse shakiness etc.That is,, when up-down vibration and/or transverse shakiness are conducted to power-converting device 1, can relax the stress producing at the linking part that links board 33d and base plate 34 and upper plate portion 33e and concentrate.
And, by making the linking part that links board 33d and base plate 34 and upper plate portion 33e become flexure plane 33f cylindraceous and 33g, thereby with the situation comparison that the linking part that links board 33d and base plate 34 and upper plate portion 33e is configured to the L word shape at right angle, can shortening heat conducting path.Therefore, can shorten the heat conduction path from the 33a of heat transfer support plate portion to cooling body 3, carry out efficiently heat cooling.
And on control circuit substrate 22 and power circuit substrate 23, as shown in FIG. 4 and 5, heating circuit parts 39 are installed in lower face side.
The link of control circuit substrate 22 and power circuit substrate 23 and conducting- heat elements 35,37 and the 32a of heat transfer support plate portion, 33a is carried out in mode as shown in Figure 4.The link of these control circuit substrates 22 and power circuit substrate 23 and the 32a of heat transfer support plate portion and 33a is except left and right is contrary, identical in fact, therefore power circuit substrate 23 and the 33a of heat transfer support plate portion is described as representative.
For the link of this power circuit substrate 23 and the 33a of heat transfer support plate portion, as shown in FIG. 4 and 5, as interval adjustment component, use shim 40, this shim 40 has the heat conduction board management height H thinner than the thickness T of conducting-heat elements 37.This shim 40 waits the outer circumferential side that is temporarily fixed on the internal thread part 41 screwing togather with hold-down screw 38 forming at the 33a of heat transfer support plate portion by adhesion.Here, the heat conduction board of shim 40 management height H is set to and makes the compression ratio of conducting-heat elements 37 be about 5～30%.So, by conducting-heat elements 37 is compressed to 5～30% left and right, thereby can reduce thermal impedance, bring into play efficient heat-conducting effect.
On the other hand, at conducting-heat elements 37, form the patchhole 37a that can insert bell tap 25 and the patchhole 37b that can insert shim 40.
With by the 33a of heat transfer support plate portion temporary fixed shim 40 mode that is inserted into patchhole 37b conducting-heat elements 37 is placed on to the 33a of heat transfer support plate portion, on the 33a of this heat transfer support plate portion, so that the mode that heating circuit parts 39 contact with conducting-heat elements 37 loads power circuit substrate 23.
Under this state, make hold-down screw 38 by the patchhole 23b of power circuit substrate 23, and screw togather with the internal thread part 41 of the 33a of heat transfer support plate portion by the central opening of shim 40.By hold-down screw 38 be screwed to make the upper surface of conducting-heat elements 37 and the upper surface of shim 40 roughly consistent.
Therefore, conducting-heat elements 37 is compressed with the compression ratio of 5～30% left and right, thereby can reduce thermal impedance and bring into play efficient heat-conducting effect.At this moment, the compression ratio of conducting-heat elements 37 is managed by the height H of shim 40, therefore can not produce and twist too loose or overtorquing, can carry out suitable tightening.
In addition, the heating circuit parts 39 that are arranged on the lower face side of power circuit substrate 23 are embedded in conducting-heat elements 37 by the elasticity of conducting-heat elements 37.Therefore, contacting of heating circuit parts 39 and conducting-heat elements 37 can be too not enough, and conducting-heat elements 37 can carry out well with contacting of power circuit substrate 23 and the 33a of heat transfer support plate portion, can make the thermal impedance between conducting-heat elements 37 and power circuit substrate 23 and the 33a of heat transfer support plate portion reduce.
With the above-mentioned link across conducting-heat elements 35 of similarly carrying out control circuit substrate 22 and the 32a of heat transfer support plate portion.
In addition, at the 32a of heat transfer support plate portion of heat conduction support component 32 and 33 and the lower surface of 33a, in order to shorten insulation distance, attach insulating trip 42 and 43.
In addition, at the link board 33d of the heat conduction support-side board 33c of heat conduction support component 33, as shown in Figure 7, in the 3 corresponding positions of cross streams lead-out terminal 11b shown in Fig. 1 of power model 11, form for example square 3 the patchhole 33i that insert busbar 55 described later.So, by forming 3 patchhole 33i, thereby can between adjacent patchhole 33i, form wider thermally conductive pathways Lh, the cross-sectional area of overall thermally conductive pathways is increased and heat conduction efficiently.In addition, can guarantee the rigidity for vibration.
Similarly, at the linking part of the heat conduction support-side board 32c of heat conduction support component 32, as shown in Figure 1, also forming respectively same patchhole 32i with positive pole and the opposed position of negative terminal 11a of power model 11.By forming this patchhole 32i, thereby can obtain the action effect same with above-mentioned patchhole 33i.
In addition, in the common base plate 34 of heat conduction support component 32 and 33, as shown in FIG. 2 and 3, forming fixed part patchhole 34a with the opposed position of patchhole 15 of the hold-down screw 14 that inserts power model 11.And, tabular elastomeric element 45 be inserted in the upper surface of base plate 34 and the lower surface of the thermal component 13 that forms at power model 11 between.
By hold-down screw 14 being inserted to the patchhole 15 of power model 11 and thermal component 13 and the fixed part patchhole 34a of base plate 34, this hold-down screw 14 and the internal thread part 3f forming at cooling body 3 are screwed togather, thereby make power model 11 and base plate 34 be fixed in cooling body 3.
The assembly method of the power-converting device 1 of above-mentioned the 1st execution mode then, is described.
First, in Fig. 4 as previously mentioned, power circuit substrate 23 is overlapped across conducting-heat elements 37 with the 33a of heat transfer support plate portion of heat conduction support component 33, by hold-down screw 38 fixed power source circuit substrate 23, conducting-heat elements 37 and the 33a of heat transfer support plate portion under the state that conducting-heat elements 37 compressed with the compression ratio of 5～30% left and right, be pre-formed power circuit unit U3.
Similarly, control circuit substrate 22 is overlapped across conducting-heat elements 35 with the 32a of heat transfer support plate portion of heat conduction support component 32, by hold-down screw 36, under the state that conducting-heat elements 35 compressed with the compression ratio of 5～30% left and right, fix control circuit substrate 22, conducting-heat elements 35 and the 32a of heat transfer support plate portion, be pre-formed control circuit unit U2.
On the other hand, in the circumferential slot 3d of cooling body 3, under the state of the tabular elastomeric element 45 of planting between the upper surface of the common base plate 34 of heat conduction support component 32 and 33 and the lower surface of the thermal component 13 that forms at power model 11, base plate 34 is fixed by hold-down screw 14 together with power model 11.So, the common base plate 34 of power model 11 and heat conduction holding components 32 and 33 can be fixed on to cooling body 3 simultaneously, therefore can make assembling procedure quantity reduce.
In addition, when base plate 34 is fixed on to cooling body 3, owing to making tabular elastomeric element 45 between base plate 34 and the thermal component 13 of power model 11, therefore according to this tabular elastomeric element 45, base plate 34 is extruded to the bottom of the circumferential slot 3d of cooling body 3, base plate 34 is contacted reliably with cooling body 3, can guarantee wide contact area.
In addition, before being fixed on cooling body 3 or after fixing, the substrate fixed part 16 forming at the upper surface of power model 11 loads drive circuit substrate 21.Then, by connect 4 bell taps 24 above drive circuit substrate 21, thereby this drive circuit substrate 21 is fixed on to substrate fixed part 16.Then, the 32a of heat transfer support plate portion is attached to heat conduction support-side board 32c by hold-down screw 32b.
Then, at the upper surface of bell tap 24, load the control circuit substrate 22 of control circuit unit U2, by 4 bell taps 25, fix.And, at the power circuit substrate 23 of the upper surface mounting power circuit unit U3 of bell tap 25, by 4 hold-down screws 26, fix.Then, the 33a of heat transfer support plate portion is attached to heat conduction support-side board 33c by hold-down screw 33b.
Then, as shown in Figure 1, at the sub-11a of positive and negative direct-flow input end of power model 11, connect busbar 50, at the other end of this busbar 50, by hold-down screw 51, link the positive and negative electrode 4a of the film capacitor 4 that connects cooling body 3.And at the fixing crimp type terminal 53 of the sub-11a of direct-flow input end of power model 11, this crimp type terminal 53 is fixed at the front end of the connecting line 52 that is connected to external transducer (not shown).
Further, at 3 cross streams lead-out terminal 11b of power model 11, by hold-down screw 56, connect busbar 55, in this busbar 55, configure current sensor 57.The other end at busbar 55 is fixedly connected with crimp type terminal 59 by hold-down screw 60, and this crimp type terminal 59 is fixed at the front end of the motor connecting line 58 that is connected to 3 outside phase electro-motors (not shown).
Then, at lower surface and the upper surface of cooling body 3, bottom basket 2A and top basket 2B are fixed and complete the assembling of power-converting device 1 by encapsulant.
Under this state, from external transducer (not shown), supply with direct current power, and the power circuit that makes to install at power circuit substrate 23, the control circuit of installing at control circuit substrate 22 are in running order, from control circuit, the gating signal for example consisting of pulse width modulating signal are supplied to power model 11 by the drive circuit of installing in drive circuit substrate 21.Accordingly, the IGBT built-in at power model 11 controlled, and direct current power is transformed to alternating electromotive force.The alternating electromotive force having converted is supplied to motor connecting line 58 and drives and control 3 phase electro-motors (not shown) from 3 cross streams lead-out terminal 11b by busbar 55.
At this moment, by generating heat at the built-in IGBT of power model 11.Because the thermal component 13 forming at power model 11 directly contacts with the central portion 3c of cooling body 3, therefore this heating is cooled by the cooling water that is supplied to cooling body 3.On the other hand, control circuit and the power circuit at control circuit substrate 22 and power circuit substrate 23, installed comprise heating circuit parts 39, by these heating circuit parts 39, produce heating.At this moment, heating circuit parts 39 are installed in the lower face side of control circuit substrate 22 and power circuit substrate 23.
In the lower face side of these control circuit substrates 22 and power circuit substrate 23, high and there is flexible conducting- heat elements 35 and 37 and arrange the 32a of heat transfer support plate portion and the 33a of heat conduction support component 32 and 33 across pyroconductivity.
Therefore, heating circuit parts 39 are covered by conducting- heat elements 35 and 37, and the contact area of heating circuit parts 39 and conducting- heat elements 35 and 37 becomes large and is close to, thereby the thermal impedance of heating circuit parts 39 and conducting- heat elements 35 and 37 diminishes.Therefore, the heating of heating circuit parts 39 is arrived conducting- heat elements 35 and 37 by heat conduction efficiently.Because conducting- heat elements 35 and 37 self is compressed with the compression ratio of 5～30% left and right, pyroconductivity is enhanced, therefore as shown in Figure 8, heat conduction is transmitted to the 32a of heat transfer support plate portion and the 33a of heat conduction support component 32 and 33 efficiently to the heat of conducting- heat elements 35 and 37.
At the 32a of heat transfer support plate portion and 33a, link heat conduction support- side board 32c and 33c, be therefore transmitted to the heat of the 32a of heat transfer support plate portion and 33a, as shown in Figure 9, by heat conduction support- side board 32c and 33c, be transmitted to common base plate 34.In the circumferential slot 3d of this base plate 34 and cooling body 3, directly contact, the heat of therefore being conducted is rejected heat to cooling body 3.
And the heat that is conducted to base plate 34 from it face side is conducted to the thermal component 13 of power model 11 by tabular elastomeric element 45, conducted to the central portion 3c of cooling body 3 and dispelled the heat by this thermal component 13.
So, according to above-mentioned the 1st execution mode, the heating of the heating circuit parts 39 of installing at control circuit substrate 22 and power circuit substrate 23 in the case of not by thermal impedance very large control circuit substrate 22 and power circuit substrate 23 directly heat conduction to conducting- heat elements 35 and 37, therefore can dispel the heat efficiently.
The heat that conducts to conducting- heat elements 35 and 37 to the 32a of heat transfer support plate portion and 33a, is further conducted to heat conduction support- side board 32c and 33c by heat conduction.At this moment, along the long limit of power model 11, heat conduction support- side board 32c and 33c are set.
Therefore, can make heat-conducting area large, can guarantee wide heat dissipation path.In addition, the kink that makes heat conduction support- side board 32c and 33c is bend cylindraceous, is therefore the situation comparison of L word shape with making kink, can make the heat conduction Distance Shortened of cooling body 3.Here, heat conveying capacity Q can be represented by following (1) formula.
Q＝λ×（A/L）×T （1）
Here, λ is pyroconductivity [W/m ℃], T be temperature difference [℃]: substrate temperature T1-cooling body temperature T 2, A is heat conduction smallest cross-section area [m 2], L is heat conduction length [m].
From this (1) formula, if heat conduction length L is short, increase heat conveying capacity Q, thereby can bring into play good cooling effect.
In addition, because heat conduction support-side board 32c and the 33c of heat conduction support component 32 and 33 are integrated by common base plate 34, therefore between heat conduction support- side board 32c and 33c and base plate 34, there is no the seam between parts, can suppress thermal impedance.
And, not comprising basket 2 from control circuit substrate 22 and power circuit substrate 23 that heating circuit parts 39 have been installed the heat dissipation path of cooling body 3, therefore can not require thermal conductivity to basket 2.Therefore, as the constituent material of basket 2, do not need to use the metal of the high thermoconductivities such as aluminium, and can form basket 2 by synthetic resin material, thereby can realize lightweight.。
In addition, heat dissipation path does not rely on basket 2, power-converting device 1 can be individually formed heat dissipation path, therefore power-converting device 1 integrated to power model 11, drive circuit substrate 21, control circuit substrate 22 and power circuit substrate 23 and that form can be applied to basket 2 and/or the cooling body 3 of various different shapes.Therefore, can improve rigidity and thermal diffusivity and the operability of power-converting device 1 as a whole.
In addition, due to the 32a of heat transfer support plate portion and 33a in control circuit substrate 22 and power circuit substrate 23 fixing metal systems, therefore can improve the rigidity of control circuit substrate 22 and power circuit substrate 23.That is, can be by the 32a of heat transfer support plate portion and 33a performance heat conduction function and rigidity Strongization function.Therefore, as the situation that power-converting device 1 is used with the motor drive circuit of motor as driving Vehicle Driving Cycle, even when power-converting device 1 produces the up-down vibration shown in Figure 10 and/or transverse shakiness, also can improve rigidity according to heat conduction support component 32 and 33.Therefore, the little power-converting device 1 of impact of up-down vibration and/or transverse shakiness etc. can be provided.
At this, the situation that makes conducting- heat elements 35 and 37 be identical profile with control circuit substrate 22 and power circuit substrate 23 has been described in above-mentioned the 1st execution mode in control circuit unit U2 and power circuit unit U3.But the present invention is not limited to above-mentioned formation, also can by conducting- heat elements 35 and 37 as shown in Figure 6, only be arranged at the position that heating circuit parts 39 exist.
The situation of conducting- heat elements 35 and 37 1 sides that heating circuit parts 39 are arranged on to rear side in control circuit substrate 22 and power circuit substrate 23 has been described in addition, in above-mentioned the 1st execution mode.But the present invention is not limited to above-mentioned formation.That is, as shown in figure 11, also can install at outer regions Ao control circuit substrate 22 and power circuit substrate 23 and conducting- heat elements 35 and 37 opposition sides.In this situation, the heating circuit parts 39 that caloric value is large are configured in peripheral part side, and the situation comparison of therefore being surrounded by other circuit blocks with heating circuit parts 39 are configured in to central authorities, can carry out the heat radiation to space of heating circuit parts.Therefore, can carry out efficiently heat cooling.
And, as shown in figure 12, also can be set to by heating circuit parts 39 being configured in to the part near heat conduction support- side board 32c and 33c in each of control circuit substrate 22 and power circuit substrate 23, thereby shorten to the distance of the heat dissipation path till cooling body 3.Even in this case, also can shorten heating circuit parts 39 till the distance of the heat dissipation path of cooling body 3 therefore can dispel the heat efficiently.
In addition, in above-mentioned the 1st execution mode, the situation that exists two kinds the substrate of heating circuit parts 39 has been installed has been described.But the present invention is not limited to above-mentioned formation, the substrate that heating circuit parts 39 have been installed is only for example, in the situation of control circuit substrate 22 these pieces, can be also formation as shown in Figure 13 (a).That is, in the left and right sides of control circuit substrate 22, heat conduction support- side board 32c and 32f are set respectively, in the both sides of the 32a of heat transfer support plate portion, form heat dissipation path.According to this formation, by the both sides at the 32a of heat transfer support plate portion, form heat dissipation path, thereby can make radiating effect further improve.
And, as shown in Figure 13 (b), also can be set to form at heat conduction support-side board 32c the upper plate portion 32e of the each circuit unit U2 of multiple supports and U3, support thus multiple circuit substrates.
Then, with reference to Figure 14 and Figure 15, the 2nd execution mode of the present invention is described.
The 2nd execution mode is configured to the thermal component 13 forming at power model 11 and has the cooling fins 61 directly contacting with the cooling water flowing through at cooling body 3.Correspondingly, at the central portion of cooling body 3, form and make cooling fins 61 be immersed in the dipping portion 62 of cooling water path.
Surrounding the seal member 66 that arranges O type ring etc. between the perisporium 63 of dipping portion 62 and thermal component 13.
Other formation has the formation same with aforesaid the 1st execution mode, use prosign, and description is omitted in the part corresponding with Fig. 1 and Fig. 2.
According to the 2nd execution mode, at the thermal component 13 of power model 11, form cooling fins 61, this cooling fins 61 is impregnated into cooling water at cooling water in dipping portion 62, therefore cooling power module 11 more efficiently.
Then, with reference to Figure 16, the 3rd execution mode of the present invention is described.
The 3rd execution mode is set to make heat conduction support- side board 32c and 33c by contacting with cooling body 3 in power model 11.
That is,, in the 3rd execution mode, in the left and right end portions side of power model 11, along fore-and-aft direction prolongation, form through hole 81a and the 81b as the peristome that heat conduction support- side board 32c and 33c are inserted.
Here, the position of through hole 81a and 81b and width arrange can insert the heat conduction support-side board 32c of heat conduction support component 32 and 33 and the upper plate portion 32e of 33c and the mode of 33e respectively.
Above the heat conduction support component 32 and 33 being linked by base plate 34, make the state of power model 11 in aliging with upper plate portion 32e and the opposed mode of 33e of heat conduction support- side board 32c and 33c with this through hole 81a and 81b.Under this state, by power model 11 is declined, thereby the upper plate portion 32e of heat conduction support-side board 32c and the upper plate portion 33e of heat conduction support-side board 33c are inserted in through hole 81a and 81b downwards.And, the lower surface of the cooling-part 13 of power model 11 is contacted with the upper surface of the tabular elastomeric element 45 of the upper surface formation in base plate 34.
Under this state, by power model 11 and base plate 34 are twisted to cooling body 3 together by hold-down screw 14, thereby by heat conduction support component 32 and 33 and power model 11 be jointly fixed to cooling body 3.
Then, with aforesaid the 1st execution mode similarly, at the upper surface of power model 11, drive circuit substrate 21, control circuit unit U2 and power circuit unit U3 are installed successively, the 32a of heat transfer support plate portion of control circuit unit U2 side are screwed to the upper plate portion 32e of heat conduction support-side board 32c by hold-down screw 32b.In addition, the 33a of heat transfer support plate portion of power circuit unit U3 side is screwed to the upper plate portion 33e of heat conduction support-side board 33c by hold-down screw 33b.
According to the 3rd execution mode, except the action effect of above-mentioned the 1st execution mode, also has following action effect: under opposed state above the heat conduction support component 32 and 33 that makes the through hole 81a of power model 11 and 81b and linked by common base plate 34, power model 11 and heat conduction support component 32 and 33 are relatively moved, thereby can assemble power model 11 and heat conduction support component 32 and 33, can easily carry out assembly operation.
At this, in above-mentioned the 3rd execution mode, illustrated on power model 11 in the through hole 81a that forms and 18b and inserted the heat conduction support component 32 and 33 being linked by common base plate 34, and base plate 34 has been fixed to together with power model 11 to the situation of cooling body 3.But the present invention is not limited to above-mentioned formation, as shown in figure 17, also can be set to heat conduction support component 32 and 33 in through hole 81a and 81b, to be directly fixed to cooling-part 13.
That is, power model 11 is configured to, and this cooling-part 13 is extended in the mode of facing the upper side of power model 11 by through hole 81a and 81b.
On the other hand, the base plate 34 that links heat conduction support component 32 and 33 is configured to the shape that retains both ends, left and right and cut off.
The base plate 32h of the heat conduction support-side board 32c of the heat conduction support component of heat conduction support component 32 and 33 32 and 33 and 33c and 33h being inserted in through hole 81a and 81 with the state of the upper surface butt of cooling-part 13 under, heat conduction support component 32 and 33 is fixed etc. to fixed form by hard solder, screw thread and is fixed to cooling-part 13.In this situation, by make in advance heat conduction support component 32 and 33 and power model 11 integrated, thereby can reduce installation procedure quantity, more easily carry out fitting operation.In this case, the through hole 81a forming on power model 11 and the width of 81b can be set as inserting heat conduction support-side board 32c and the base plate 32h of 33c and the width of 33h.
In addition, in above-mentioned the 3rd execution mode, illustrated and be formed on the through hole 81a of formation on power model 11 and the situation of 18b, but be not limited thereto, also can form to the inside otch from the left and right end portions of power model 11 and replace through hole 81a and 81b.In a word, as long as form, can insert the heat conduction support-side board 32c of heat conduction support component 32 and 33 and the peristome of 33c.
In addition, the situation that forms through hole 81a and 81b in the left and right end portions side of power model 11 has been described in above-mentioned the 3rd execution mode, but be not limited thereto, also can form through hole in front and back end side, further, a side on the limit adjacent with power model 11 forms through hole 81a, at opposite side, forms through hole 81b.
In addition, the situation that has formed 2 through hole 81a and 81b at power model 11 has been described in above-mentioned the 3rd execution mode, but according to the size of power model 11, also can only form in through hole 81a and 81b, make the heat conduction support-side board that inserts another through hole by the side of power model 11, be fixed to cooling body 3 as the 1st execution mode.
At this, the situation of the 32a of heat transfer support plate portion and 33a and heat conduction support-side board 32c and the 33c that form respectively heat conduction support component 32 and 33 has been described in above-mentioned the 1st～3rd execution mode.But the present invention is not limited to above-mentioned formation, as shown in figure 18, also can make the 32a of heat transfer support plate portion and 33a and heat conduction support- side board 32c and 33c be configured to one.In this situation, between the 32a of heat transfer support plate portion and 33a and heat conduction support- side board 32c and 32c, do not form seam, therefore can make thermal impedance reduce, dispel the heat more efficiently.
In addition, in above-mentioned the 1st～3rd execution mode, illustrated at control circuit substrate 22 and power circuit substrate 23 across conducting- heat elements 35 and 37 situations in conjunction with the 32a of heat transfer support plate portion and 33a.But, the present invention is not limited to above-mentioned formation, as control circuit substrate 22 and power circuit substrate, as shown in figure 19, can use at aluminium or aluminium alloy and across insulating barrier 72, form the metallic substrates circuit substrate 74 of circuitous pattern 73 on as the heating panel 71 of main body.In this situation, as shown in figure 19, can omit conducting- heat elements 35 and 37 and the 32a of heat transfer support plate portion and 33a, and the heating panel 71 of metallic substrates circuit substrate 74 is directly connected with heat conduction support- side board 32c and 33c.
In addition, control circuit substrate 22 and power circuit substrate 23 situation by independent heat conduction support member supports has been described in above-mentioned the 1st～3rd execution mode.But the present invention is not limited to above-mentioned formation, can make heat conduction support component is the structure as shown in Figure 20～Figure 24.
; omit the heat conduction support- side board 32 and 33 of aforesaid the 1st～3rd execution mode; instead, for example, by 4 front side board 91a, rear side board 91b, left side board 91c and the right side board 91d of each side of the control circuit standard 22 corresponding to rectangle and power circuit substrate 23 are upwards erect and form heat conduction support side plate 90 from common base plate 34.In these each board 91a～91d, on front side board 91a and rear side board 91b, form the pair of right and left wider slit of falling U-shaped 92a, 92b with the opposed position of the 32a of heat transfer support plate portion of support and control circuit substrate 22, by the board 90 degree bendings to the inside of these slits of falling U-shaped 92a, 92b encirclement, form support portion 93a, 93b.
In addition, on front side board 91a and rear side board 91b, form support portion 94a and 94b with the 90 degree bendings to the inside of the opposed upper end of power circuit substrate 23.
And, on left side board 91c and right side board 91d, also similarly form 1 slit of falling U-shaped 95a and 95b with front side board 91a and rear side board 91b, make to form support portion 96a and 96b by the board 90 degree bendings to the inside of these slits of falling U-shaped 95a and 95b encirclement.In addition, on left side board 91c and right side board 91d, form support portion 97a and 97b with the 90 degree bendings to the inside of the opposed upper end of power circuit substrate 23.
As shown in Figure 20～Figure 23, on supporting board 93a, 93b, 96a and the 96b forming at the pars intermedia of side plate 91a～81d, across conducting-heat elements 35, load the 32a of heat transfer support plate portion of support and control circuit substrate 22, by not shown hold-down screw, fixed.Similarly, supporting board 94a, 94b, 97a and the 97b forming in the upper end of each side plate 91a～91d loads the 33a of heat transfer support plate portion of Power Support circuit substrate 23 across conducting-heat elements 35, by not shown hold-down screw, fixed.
So, the heat conduction support-side board 90 of support and control circuit substrate 22 and power circuit substrate 23 and the described the 1st and the 2nd execution mode similarly, are fixed on cooling body 3 together with semi-conductor power module 12.
By as above-mentioned formation heat conduction support-side board 90, the heating being produced by the heating circuit parts that are arranged on control circuit substrate 22 and power circuit substrate 23 can be dispelled the heat to cooling body 3 reliably by the 32a of heat transfer support plate portion and 33a and heat conduction support-side board 90.Therefore, can obtain the action effect same with the above-mentioned the 1st and the 2nd execution mode.In addition, by form heat conduction support-side board 90 according to Figure 20～Figure 24, thereby can be configured for by 1 parts the heat conduction support-side board of support and control circuit substrate 22 and power circuit substrate 23, and can guarantee multiple thermally conductive pathways, can make radiating efficiency improve.And support portion 83a, 83b and 86a, 86b are by being formed by the board bending of the slit of falling U-shaped 82a, 82b and 85a, 85b encirclement.Therefore, by bending, formed afterwards and connected the inside and outside spatial portion of heat conduction support-side board 90, thereby can utilize this spatial portion as heat dissipation path, can make radiating effect further improve.At this, the situation that support portion 83a, 83b, 84a, 84b, 86a, 86b, 87a, 87b form as warpage support portion has been described in the formation of Figure 20～Figure 24, but can has been also fixing outstanding tabular support portion to the inside such as the fixed form of welding etc.
In addition, in above-mentioned the 1st～3rd execution mode, illustrated that the conducting- heat elements 35 and 37 of planting has flexible situation between control circuit substrate 22 and power circuit substrate 23 and the 32a of heat transfer support plate portion and 33a.But the present invention is not limited to above-mentioned formation, that also can use insulation covered metallic plate etc. does not have a flexible conducting-heat elements.
And, in above-mentioned the 1st～3rd execution mode, illustrated and used the situation of film capacitor 4 as smoothing capacitor, but be not limited thereto, also can use columned electrolytic capacitor.
In addition, in above-mentioned the 1st～3rd execution mode, the situation of applying power-converting device of the present invention at electric automobile has been described, but be not limited thereto, also can use the present invention at the rail truck that travels on track, can be in the present invention of electrically driven vehicle use arbitrarily.And, as power-converting device, be not limited to Electricity power and drive vehicle, can use power-converting device of the present invention in the situation of driver of electro-motor etc. of the industrial equipment that drives other.
Utilizability in industry
According to the present invention, can provide and not make basket between the hot heat dissipation path of radiating circuit parts that is arranged on substrate, and can efficiently the heat of radiating circuit parts be dispelled the heat to the power-converting device of cooling body.
Claims (according to the modification of the 19th article of treaty)
After 1.(revises) a kind of power-converting device, it is characterized in that possessing:
Semi-conductor power module;
Attached finned thermal component, it receives the heat of this semi-conductor power module at a side joint of described semi-conductor power module;
Cooling body, it engages with described attached finned thermal component;
Heat conduction support component, its heat that has made to install the installation base plate of circuit block conducts to described cooling body, and to keep the mode of predetermined space to support this installation base plate between this installation base plate and described semi-conductor power module, described circuit block comprises the heating circuit parts that drive described semi-conductor power module.
After 2.(revises) power-converting device as claimed in claim 1, it is characterized in that,
Described cooling body has water cold sleeve.
After 3.(revises) a kind of power-converting device, it is characterized in that possessing:
Semi-conductor power module, the thyristor that its in-built electrical force transformation is used, has attached finned thermal component in one side;
Cooling body, it engages with described attached finned thermal component;
Installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; With
Heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described semi-conductor power module, and pass through at least one side of described semi-conductor power module and contact with described cooling body, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
After 4.(revises) power-converting device as claimed in claim 3, it is characterized in that,
Described semi-conductor power module has the flat rectangular shape that is provided with rectangular plane, and described heat conduction support component is configured in the mode of the side of the long side by described semi-conductor power module.
After 5.(revises) power-converting device as claimed in claim 3, it is characterized in that,
Possess the many groups of groups that formed by described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board passes through the different side of described semi-conductor power module and contacts with described cooling body.
After 6.(revises) power-converting device as claimed in claim 4, it is characterized in that,
Described heat conduction support component is formed with patchhole in the position corresponding with being formed on splicing ear on the casing of described semi-conductor power module.
After 7.(revises) a kind of power-converting device, it is characterized in that possessing:
Semi-conductor power module, the thyristor that its in-built electrical force transformation is used, forms the attached finned thermal component contacting with cooling body in one side;
Installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; With
Heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described semi-conductor power module, and by least a portion of described semi-conductor power module and with described cooling body, contact, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
After 8.(revises) power-converting device as claimed in claim 7, it is characterized in that,
Possess the many groups of groups that formed by described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board contacts by a part for described semi-conductor power module and with described cooling body.
9. the power-converting device as described in claim 1 to 8 any one, is characterized in that,
Described installation base plate consists of metallic substrates circuit substrate.
10. the power-converting device as described in claim 1 to 8 any one, is characterized in that,
The conducting-heat elements of planting between described installation base plate and described heat conduction support component.
11. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the insulator with insulating properties.
12. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the elastomer with retractility.
13. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the elastomer with retractility, at the installed surface of described heat conduction board one side of described installation base plate, described heating circuit parts is installed.
14. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements is formed as identical size with described installation base plate.
15. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements is only configured in caloric value in the electronic circuit component that is installed on described installation base plate or the relatively large heating circuit parts of heat conduction density around.
16. power-converting devices as claimed in claim 10, is characterized in that,
The heat transfer support plate portion of described installation base plate and described heat conduction support component is fixed by fastening fixed part across described conducting-heat elements.
17. power-converting devices as claimed in claim 16, is characterized in that,
Plant interval adjustment component around described fastening fixed part, described interval adjustment component is predetermined value by the distance maintaining of the heat transfer support plate portion of described installation base plate and described heat conduction support component.
18. power-converting devices as described in claim 1 to 7 any one, is characterized in that,
Described heat conduction support component forms by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling body across described conducting-heat elements.
19. power-converting devices as claimed in claim 18, is characterized in that,
Described heat conduction support-side board has the board corresponding with each side of described installation base plate, is formed with the support portion of the described heat transfer support plate of support portion at this each board.
20. power-converting devices as described in claim 18 or 19, is characterized in that,
Described heat transfer support plate portion and described heat conduction support-side board form as one.
21. power-converting devices as claimed in claim 20, is characterized in that,
Described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
After 22.(revises) power-converting device as described in claim 18 or 19, it is characterized in that,
The heat conduction support-side board of described heat conduction support component has the cooling body contact board between cooling-part and the described cooling body that is inserted in described semi-conductor power module.
After 23.(revises) power-converting device as claimed in claim 22, it is characterized in that,
The tabular elastomeric element of planting between described cooling body contact board and the attached finned thermal component of described semi-conductor power module.
After 24.(revises) power-converting device as claimed in claim 23, it is characterized in that,
Described cooling body contact board is being formed with fixed part patchhole with the opposed position of the patchhole that is formed at described semi-conductor power module, described in insert in the hole and insert the fixed part that this semi-conductor power module is fixed to described cooling body.
After 25.(revises) power-converting device as claimed in claim 4, it is characterized in that,
At described semi-conductor power module, form peristome, so that described cooling body is faced a side contrary with described cooling body of this semi-conductor power module,
Described heat conduction support component forms by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling body by the described peristome of described semi-conductor power module across described conducting-heat elements.
26. power-converting devices as claimed in claim 25, is characterized in that,
Described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
27. power-converting devices as described in claim 1 to 19 any one, is characterized in that,
Described heat conduction support component has the surface of black.
28. power-converting devices as described in claim 1 to 19 any one, is characterized in that,
Described installation base plate by caloric value or the relatively large heating circuit component configuration of heat conduction density and described cooling body between the short position of heat conduction distance.

Claims (28)

1. a power-converting device, is characterized in that, possesses:
Semi-conductor power module, it is formed with cooling-part in one side;
Cooling body, it engages with described cooling-part;
Heat conduction support component, its heat that has made to install the installation base plate of circuit block conducts to described cooling body, and to keep the mode of predetermined space to support this installation base plate between this installation base plate and described semi-conductor power module, described circuit block comprises the heating circuit parts that drive described semi-conductor power module.
2. a power-converting device, is characterized in that, possesses:
Module, its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body;
Installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; With
Heat conduction support component, it to be to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and contacts with described cooling body, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
3. a power-converting device, is characterized in that, possesses:
Module, its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body;
Installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; With
Heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and by least one side of described module and with described cooling body, contact, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
4. power-converting device as claimed in claim 3, is characterized in that,
The casing of described module has the flat rectangular shape that is provided with rectangular plane, and described heat conduction support component is configured in the mode of the side of the long side by described casing.
5. power-converting device as claimed in claim 3, is characterized in that,
Possess the many groups of groups that formed by described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board contacts by the different side of described module and with described cooling-part.
6. power-converting device as claimed in claim 4, is characterized in that,
Described heat conduction support component is formed with patchhole in the position corresponding with being formed on splicing ear on the casing of described module.
7. a power-converting device, is characterized in that, possesses:
Module, its thyristor that power converter is used is built in casing, in the one side of this casing, forms the cooling-part contacting with cooling body;
Installation base plate, it has installed circuit block, and described circuit block comprises the heating circuit parts that drive described thyristor; With
Heat conduction support component, it is to keep the mode of predetermined space to support this installation base plate between this installation base plate and described module, and by least a portion of described module and with described cooling body, contact, so that the heat that this installation base plate sends is not dispelled the heat to described cooling body by basket.
8. power-converting device as claimed in claim 7, is characterized in that,
Possess the many groups of groups that formed by described installation base plate and described heat conduction support component, make the height difference of the described heat conduction support-side board of the described heat conduction support component of each described group, and this heat conduction support-side board contacts by a part for described module and with described cooling-part.
9. the power-converting device as described in claim 1 to 8 any one, is characterized in that,
Described installation base plate consists of metallic substrates circuit substrate.
10. the power-converting device as described in claim 1 to 8 any one, is characterized in that,
The conducting-heat elements of planting between described installation base plate and described heat conduction support component.
11. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the insulator with insulating properties.
12. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the elastomer with retractility.
13. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements consists of the elastomer with retractility, at the installed surface of described heat conduction board one side of described installation base plate, described heating circuit parts is installed.
14. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements is formed as identical size with described installation base plate.
15. power-converting devices as claimed in claim 10, is characterized in that,
Described conducting-heat elements is only configured in caloric value in the electronic circuit component that is installed on described installation base plate or the relatively large heating circuit parts of heat conduction density around.
16. power-converting devices as claimed in claim 10, is characterized in that,
The heat transfer support plate portion of described installation base plate and described heat conduction support component is fixed by fastening fixed part across described conducting-heat elements.
17. power-converting devices as claimed in claim 16, is characterized in that,
Plant interval adjustment component around described fastening fixed part, described interval adjustment component is predetermined value by the distance maintaining of the heat transfer support plate portion of described installation base plate and described heat conduction support component.
18. power-converting devices as described in claim 1 to 7 any one, is characterized in that,
Described heat conduction support component forms by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling body across described conducting-heat elements.
19. power-converting devices as claimed in claim 18, is characterized in that,
Described heat conduction support-side board has the board corresponding with each side of described installation base plate, is formed with the support portion of the described heat transfer support plate of support portion at this each board.
20. power-converting devices as described in claim 18 or 19, is characterized in that,
Described heat transfer support plate portion and described heat conduction support-side board form as one.
21. power-converting devices as claimed in claim 20, is characterized in that,
Described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
22. power-converting devices as described in claim 18 or 19, is characterized in that,
The heat conduction support-side board of described heat conduction support component has the cooling body contact board between cooling-part and the described cooling body that is inserted in described module.
23. power-converting devices as claimed in claim 22, is characterized in that,
The tabular elastomeric element of planting between described cooling body contact board and the cooling-part of described module.
24. power-converting devices as claimed in claim 23, is characterized in that,
Described cooling body contact board is being formed with fixed part patchhole with the opposed position of the patchhole that is formed at described module, described in insert in the hole and insert the fixed part that this module is fixed to described cooling body.
25. power-converting devices as claimed in claim 4, is characterized in that,
In described module, form peristome, so that described cooling-part is faced a side contrary with described cooling-part of this module,
Described heat conduction support component forms by support the side of this heat transfer support plate portion of heat transfer support plate portion and fixed support of described installation base plate the heat conduction support-side board contacting with described cooling-part by the described peristome of described module across described conducting-heat elements.
26. power-converting devices as claimed in claim 25, is characterized in that,
Described heat transfer support plate portion is by multiple heat conduction support-side board fixed supports.
27. power-converting devices as described in claim 1 to 19 any one, is characterized in that,
Described heat conduction support component has the surface of black.
28. power-converting devices as described in claim 1 to 19 any one, is characterized in that,
Described installation base plate by caloric value or the relatively large heating circuit component configuration of heat conduction density and described cooling body between the short position of heat conduction distance.
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