CN103724964B - A kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof - Google Patents

Abstract

The present invention aims to provide a kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof, its composition comprises by weight proportion: ABS resin 5-15%, PC/ABS compatilizer: 1-3%, light diffusing agent 0.1-2%, dispersion agent 0.1-0.5%, oxidation inhibitor 0.2-0.6%, surplus is PC resin, it also can comprise other auxiliary agents (toner and whitening agent), and each component is put into twin screw extruder extruding pelletization and namely obtained product of the present invention mix 1 ~ 2 minute in high speed mixer after.The present invention is by PC resin and the rational allocation of ABS resin ratio and the use of light diffusing agent, make that transmittance is high, the PC/ABS alloy material of high diffusibility, the problem adding processibility and the internal stress cracking improving PC greatly of toughner and ABS resin simultaneously, light can be replaced to spread PC for this alloy material and light diffusion ABS material is applied to optical field, and solve the diffusion of existing light PC and light diffusion ABS material under ask for something severe condition (as product to play self-tapping screw, the situation such as product wants that strong acid and strong base contacts) a non-serviceable difficult problem.

Description

A kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof

Technical field

The present invention relates to technical field of polymer materials, especially a kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof.

Background technology

Photodiffusion material refers to the material that a line source can be changed into line area source, generally prepare by the light diffusion particle of specific refraction different from base material is dispersed in transparent substrate, be used for the backlight source material of liquid-crystal display in early days, be also called light-scattering material or diffusion material; Photodiffusion material being used for light emitting diode LED lighting is a new opplication field of opening up in recent years.LED illumination compared with the stronger fill light of liquid crystal backlight linearly can the higher photodiffusion material for LED illumination while diffusion light, light loss must be reduced as far as possible; Therefore organic smooth diffusion particle and the polycarbonate of adopting has the LED illumination photodiffusion material of high transmission rate and high light diffusing energy concurrently by blending method preparation more.

But because simple PC resin and light diffusing agent also exist easy stress cracking by the light diffusion PC material of blended preparation, the defects such as poor in processability, geneogenous deficiency is there is under the condition that some environmental requirements are severe, limit the application neck of light diffusion PC to a great extent, based on this, the present invention, by improving the deficiency of existing photodiffusion material, meets the demand that client is more and more higher, expands the Application Areas of photodiffusion material.

Summary of the invention

For the shortcoming that above-mentioned prior art exists, the experience of this area work is engaged in the present inventor's accumulation for many years, through feasibility study repeatedly, obtain generation of the present invention eventually, the present invention is by PC resin and the rational allocation of ABS resin ratio and the use of light diffusing agent, make the PC/ABS alloy material of high diffusibility, the problem adding processibility and the internal stress cracking improving PC greatly of toughner and ABS resin simultaneously, this alloy material can replace light to spread PC and light diffusion ABS material, solve simultaneously existing light diffusion PC and light diffusion ABS material under ask for something severe condition (as product will play self-tapping screw, product wants the situations such as strong acid and strong base contact) a non-serviceable difficult problem, add the Application Areas of photodiffusion material.

The technical solution used in the present invention: a kind of High-ductility high-diffusion PC/ABS alloy material component (according to weight percent) disclosed by the invention comprising:

Preferably, PC resin is bisphenol A-type polycarbonate, in sticky, its melting index at 10 ~ 12g/10min, and is dried and within 4 hours, is controlled moisture below 0.1% at 120 DEG C.

Preferably, ABS resin is acrylonitrile-butadiene-styrene terpolymer, and at 90 DEG C, dries 4 hours control moisture below 0.1%.

Preferably, PC/ABS compatilizer is by the ternary atactic copolymer of vinylbenzene (S), vinyl cyanide (AN) and maleic anhydride (MA) three kinds of monomer copolymerizations, and at 90 DEG C, dries 4 hours control moisture below 0.1%.

Preferably, light diffusing agent is formulated by the mass ratio of 10% and 90% by acrylic resin and polysiloxane dispersible granule.

Preferably, dispersion agent is ethylene acrylic acid co polymer.

Preferably, oxidation inhibitor is phenolic antioxidant four [β-(3 ', 5 '-di-t-butyl-4 '-hydroxy phenyl) propionic acid] pentaerythritol ester and/or phosphite ester kind antioxidant (2,4 di-tert-butyl-phenyl) tris phosphite.

Preferably, toner and/or whitening agent is also comprised.

The present invention also comprises a kind of method preparing above-mentioned High-ductility high-diffusion PC/ABS alloy material, comprises the following steps:

(1) raw-material process and mixing

Dry PC resin and ABS resin;

Major ingredient and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, other auxiliary agents (toner and/or whitening agent) are mixed in high speed mixer, makes the abundant dispersed with stirring of each component even;

(2) melt extrude

Add in twin screw extruder by the material mixed, melt extrude temperature between 230-270 DEG C, screw speed is 200-600 rev/min;

(3) granulation and aftertreatment

The material extruded is cooled, air-dry, pelletizing, crosses strong magnetic, be packaged to be finished product.

Preferably, in step (1), PC resin dries 4 hours at 120 DEG C, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 DEG C, controls moisture below 0.1%.

Each component is put into twin screw extruder extruding pelletization and is namely obtained product of the present invention mix 1 ~ 2 minute in high speed mixer after.High-ductility high-diffusion PC/ABS alloy material of the present invention can meet the diffusion of original light PC and light diffusion ABS material under ask for something severe condition (as product to play self-tapping screw, the situation such as product wants that strong acid and strong base contacts) non-serviceable deficiency, significantly increase the Application Areas of photodiffusion material.Simultaneously this material possess high strength, good toughness, can the feature such as rapid shaping, high performance-price ratio.

Embodiment

The present invention is illustrated below in conjunction with embodiment.

Embodiment 1

First the PC resin of 92.5% weight is dried at 120 DEG C and within 4 hours, control moisture below 0.1%, dry at 90 DEG C with the ABS resin of 5% weight subsequently and within 4 hours, control moisture below 0.1%, the PC/ABS compatilizer of 1% weight, the light diffusing agent of 0.5% weight, the dispersion agent of 0.3% weight, primary antioxidant four (β-(3 of 0.1% weight, 5-di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol ester (1010) and 0.1% auxiliary antioxidant three (2, 4-di-tert-butyl-phenyl) phosphorous acid ester (168), twin screw extruder plasticizing is entered from metering feeding device after other auxiliary agents (toner and whitening agent) of 0.5% weight mix 2 minutes by high speed mixer, melting, again through extruding, cooling, cross magnetic, be packaged to be product,

Embodiment 2

First the PC resin of 80% weight is dried at 120 DEG C and within 4 hours, control moisture below 0.1%, dry at 90 DEG C with the ABS resin of 13% weight subsequently and within 4 hours, control moisture below 0.1%, the PC/ABS compatilizer of 3% weight, the light diffusing agent of 2% weight, the dispersion agent of 0.5% weight, primary antioxidant four (β-(3 of 0.2% weight, 5-di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol ester (1010) and 0.3% auxiliary antioxidant three (2, 4-di-tert-butyl-phenyl) phosphorous acid ester (168), twin screw extruder plasticizing is entered from metering feeding device after other auxiliary agents (toner and whitening agent) of 1% weight mix 2 minutes by high speed mixer, melting, again through extruding, cooling, cross magnetic, be packaged to be product,

Preparation method and the technique of embodiment are as follows:

(1) raw-material process and mixing

PC resin dries 4 hours at 120 DEG C, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 DEG C, controls moisture below 0.1%;

Major ingredient and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, other auxiliary agents (toner and/or whitening agent) are mixed 2 minutes in high speed mixer, makes the abundant dispersed with stirring of each component even;

(2) melt extrude

Add in twin screw extruder by the material mixed, melt extrude temperature between 230-270 DEG C, screw speed is 200-600 rev/min;

(3) granulation and aftertreatment

The material extruded is cooled, air-dry, pelletizing, crosses strong magnetic, be packaged to be finished product.

As follows according to the performance of the High-ductility high-diffusion PC/ABS alloy material of embodiment 1 and embodiment 2 gained:

Test event	Testing standard	Test condition	Embodiment 1	Embodiment 2
					Proportion (g/cm3)	D792	23℃	1.20	1.19
Tensile strength (Mpa)	D638	10mm/min	62	58
					Elongation at break (%)	D638	10mm/min	50	56
Flexural strength (Mpa)	D790	2mm/min	96	92
					Modulus in flexure (Mpa)	D790	2mm/min	2400	2300
Notched Izod impact strength (J/m)	D256	3.2mm,23℃	700	680
					Heat-drawn wire (DEG C)	D648	1.8Mpa,6.4mm	130	128
Flame retardant resistance (Class)	UL94	1.5mm	V-2	V-2
					Transmittance (%)	D1003	1.0mm	75	72
Mist degree (%)	D1003	1.0mm	23.5	24.5

In sum, be preferred embodiment of the present invention, all according to the change done by technical solution of the present invention, when the function produced does not exceed the scope of technical solution of the present invention, all belong to protection scope of the present invention.

Claims (6)

1. a High-ductility high-diffusion PC/ABS alloy material, is characterized in that comprising following component by weight percentage:

Surplus is PC resin;

Wherein, PC resin is bisphenol A polycarbonate, in sticky, its melting index is at 10 ~ 12g/10min, and at 120 DEG C, dry 4 hours control moisture below 0.1%, described PC/ABS compatilizer is by the ternary atactic copolymer of vinylbenzene, vinyl cyanide and maleic anhydride three kinds of monomer copolymerizations, and at 90 DEG C, dries 4 hours control moisture below 0.1%; The mass ratio that light diffusing agent presses 10% and 90% by acrylic resin and polysiloxane dispersible granule is formulated; Dispersion agent is ethylene acrylic acid co polymer.

2. High-ductility high-diffusion PC/ABS alloy material as claimed in claim 1, is characterized in that ABS resin is acrylonitrile-butadiene-styrene terpolymer, and at 90 DEG C, dries 4 hours control moisture below 0.1%.

3. High-ductility high-diffusion PC/ABS alloy material as claimed in claim 1, it is characterized in that oxidation inhibitor is phenolic antioxidant four (β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol ester and/or phosphite ester kind antioxidant three (2,4-di-tert-butyl-phenyl) phosphorous acid ester.

4. High-ductility high-diffusion PC/ABS alloy material as claimed in claim 1, characterized by further comprising toner and whitening agent.

5. the preparation method of High-ductility high-diffusion PC/ABS alloy material as claimed in claim 4, is characterized in that comprising the following steps:

(1) raw-material process and mixing

Dry PC resin and ABS resin; PC resin, ABS resin and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, toner and whitening agent are mixed in high speed mixer, makes the abundant dispersed with stirring of each component even;

(2) melt extrude

Add in twin screw extruder by the material mixed, melt extrude temperature between 230-270 DEG C, screw speed is 200-600 rev/min;

(3) granulation and aftertreatment

The material extruded is cooled, air-dry, pelletizing, crosses strong magnetic, be packaged to be finished product.

6. method as claimed in claim 5, is characterized in that, in step (1), PC resin dries 4 hours at 120 DEG C, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 DEG C, controls moisture below 0.1%.