CN103606620A - Led packaging structure - Google Patents
Led packaging structure Download PDFInfo
- Publication number
- CN103606620A CN103606620A CN201310608330.4A CN201310608330A CN103606620A CN 103606620 A CN103606620 A CN 103606620A CN 201310608330 A CN201310608330 A CN 201310608330A CN 103606620 A CN103606620 A CN 103606620A
- Authority
- CN
- China
- Prior art keywords
- crystal
- barium sulfate
- bonding adhesive
- sulfate particles
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 44
- 239000002245 particle Substances 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract 5
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000003292 glue Substances 0.000 abstract description 8
- 238000002310 reflectometry Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 4
- 238000010521 absorption reaction Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 230000007547 defect Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
Landscapes
- Led Device Packages (AREA)
Abstract
本发明涉及一种LED封装结构，包括碗杯状支架，其特征是：在所述支架的碗杯底部设置反射固晶胶层，在反射固晶胶层上表面设置固晶胶，在固晶胶上粘接LED芯片；在所述反射固晶胶层中均匀分布若干硫酸钡颗粒。所述硫酸钡颗粒的直径为0.3～5μm，硫酸钡颗粒占反射固晶胶层质量的55%～85%。本发明具有以下优点：（1）本发明可以减少光线在支架和LED芯片底部反复反射造成的吸收，提高芯片的外量子效率；（2）本发明采用的反射固晶胶层中的硫酸钡颗粒在350～600nm波段均有98%的高反射率，并且硫酸钡具有稳定的化学性质与良好的热稳定性。
The invention relates to an LED packaging structure, which includes a cup-shaped bracket, and is characterized in that: a reflective crystal-bonding glue layer is set on the bottom of the bowl of the bracket, and a crystal-bonding glue is set on the upper surface of the reflective crystal-bonding glue layer. The LED chip is bonded on the glue; a number of barium sulfate particles are evenly distributed in the reflective crystal-bonding glue layer. The diameter of the barium sulfate particles is 0.3-5 μm, and the barium sulfate particles account for 55%-85% of the mass of the reflective crystal-bonding adhesive layer. The present invention has the following advantages: (1) The present invention can reduce the absorption caused by repeated reflection of light on the bracket and the bottom of the LED chip, and improve the external quantum efficiency of the chip; (2) The barium sulfate particles in the reflective crystal-bonding glue layer used in the present invention It has a high reflectivity of 98% in the 350-600nm band, and barium sulfate has stable chemical properties and good thermal stability.
Description
Technical field
The present invention relates to a kind of LED encapsulating structure, belong to LED encapsulation technology field.
Background technology
LED encapsulating structure in conventional art as shown in Figure 1, comprises the devices such as support 1, crystal-bonding adhesive 2, wafer 3.In order to improve the external quantum efficiency of LED, conventionally in the bowl cup the inside of support, be coated with the argent that visible ray is had to better reflectivity.Crystal-bonding adhesive 2 is arranged on support 1, and wafer 3 is sticky and in crystal-bonding adhesive 1 surface.The application kind of crystal-bonding adhesive 1, can be divided into conducting resinl and insulating cement by its conductivity, by its light transmission, can be divided into transparent adhesive tape (or semi-transparent gelatin) and nontransparent glue.
While adopting transparent crystal-bonding adhesive, the light that send LED chip bottom surface can pass transparent crystal-bonding adhesive; Can there is similar mirror-reflection in the silver coating surface in bowl cup bottom.But its reflection approach can be at chip bottom and a bowl cup bottom interreflection, and light is in each reflection process, inevitably by a part that material absorbs.
Adopt nontransparent crystal-bonding adhesive, nontransparent glue is the crystal-bonding adhesive that contains silver-colored particle, is referred to as elargol, conduction crystal-bonding adhesive utilization silver particle conduction and have conductivity.The light that send LED chip bottom surface can be in crystal-bonding adhesive silver-colored particle surface generation diffuse reflection, the silver content of diffuse reflection in crystal-bonding adhesive is relevant.The silver content of common elargol is 80%.Relatively transparent crystal-bonding adhesive, the light that elargol can improve chip back reflects bottom, can promote external quantum efficiency, but the defect one of silver: reflectivity is still not ideal enough, at the reflectivity 83%-95% of 350nm to 500nm wave band.Defect two: the thermal stability of silver is bad, and silver has higher transport property, if silver moves on chip, can cause chip to occur electric leakage; If silver is oxidized, can cause crystal-bonding adhesive bonding force to reduce.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of LED encapsulating structure is provided, can make the light of chip bottom reflect away as much as possible.
According to technical scheme provided by the invention, described LED encapsulating structure, comprises a bowl cup-shaped support, it is characterized in that: the bowl cup bottom at described support arranges reflection die bond glue-line, at reflection die bond glue-line upper surface, crystal-bonding adhesive is set, bonding LED chip on crystal-bonding adhesive; In described reflection die bond glue-line, be uniformly distributed some barium sulfate particles.
The diameter of described barium sulfate particle is 0.3～5 μ m, and barium sulfate particle accounts for 55%～85% of reflection die bond glue-line quality.
The present invention has the following advantages: (1) the present invention can reduce the light absorption that interreflection causes bottom support and LED chip, improves the external quantum efficiency of chip; (2) barium sulfate particle in the reflection die bond glue-line that the present invention adopts all has 98% high reflectance at 350～600nm wave band, and barium sulfate has stable chemical property and good thermal stability.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of LED encapsulating structure in prior art.
Fig. 2 is structural representation of the present invention.
Embodiment
Below in conjunction with concrete accompanying drawing, the invention will be further described.
As shown in Figure 2: described LED encapsulating structure comprises support 11, reflection die bond glue-line 12, crystal-bonding adhesive 13, LED chip 14 etc.
As shown in Figure 2, the present invention includes bowl cup-shaped support 11, in the bowl cup bottom of support 11, reflection die bond glue-line 12 is set, at reflection die bond glue-line 12 upper surfaces, crystal-bonding adhesive 13 is set, bonding LED chip 14 on crystal-bonding adhesive 13; In described reflection die bond glue-line 12, be uniformly distributed some barium sulfate particles;
Described reflection die bond glue-line 12 forms through hot setting after adopting crystal-bonding adhesive and barium sulfate particle to mix; The diameter of described barium sulfate particle is 0.3～5 μ m, and barium sulfate particle accounts for 55%～85% of reflection die bond glue-line 12 quality; Choosing diameter 0.3～5 μ m and 55%～85% proportion is in order to take into account shear strength and adhesion, and this is because along with the proportion of barium sulfate particle at crystal-bonding adhesive increases, the probability that light is reflected can increase, but the shear strength of crystal-bonding adhesive and adhesion can reduce.
The present invention adopts crystal-bonding adhesive and barium sulfate particle to be mixed and made into reflection die bond glue-line 12 below crystal-bonding adhesive 13, can make the light of chip bottom reflect as much as possible.In use, the light that LED chip bottom surface is penetrated enters after reflection die bond glue-line, there is diffuse reflection in the barium sulfate particle surface in reflection die bond glue-line, thereby change the direction of propagation of light, reduce the light absorption that interreflection causes bottom support and LED chip, improve the external quantum efficiency of chip.
The present invention adopts reflection die bond glue-line to have following excellent pad: (1) barium sulfate all has 98% high reflectance at 350～600nm wave band; (2) barium sulfate has stable chemical property and good thermal stability.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608330.4A CN103606620A (en) | 2013-11-25 | 2013-11-25 | Led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608330.4A CN103606620A (en) | 2013-11-25 | 2013-11-25 | Led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103606620A true CN103606620A (en) | 2014-02-26 |
Family
ID=50124834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310608330.4A Pending CN103606620A (en) | 2013-11-25 | 2013-11-25 | Led packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103606620A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113809057A (en) * | 2021-05-25 | 2021-12-17 | 吉安市木林森显示器件有限公司 | A kind of solid crystal glue applied to anti-electromigration lamp beads and anti-electromigration lamp beads |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378791A (en) * | 2009-03-31 | 2012-03-14 | 吉坤日矿日石能源株式会社 | Wholly aromatic thermotropic liquid-crystal polyester resin composition, molded object, and led reflector |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
| WO2012133173A1 (en) * | 2011-03-28 | 2012-10-04 | 富士フイルム株式会社 | Reflective substrate for light-emitting element and method for producing same |
-
2013
- 2013-11-25 CN CN201310608330.4A patent/CN103606620A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378791A (en) * | 2009-03-31 | 2012-03-14 | 吉坤日矿日石能源株式会社 | Wholly aromatic thermotropic liquid-crystal polyester resin composition, molded object, and led reflector |
| WO2012133173A1 (en) * | 2011-03-28 | 2012-10-04 | 富士フイルム株式会社 | Reflective substrate for light-emitting element and method for producing same |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113809057A (en) * | 2021-05-25 | 2021-12-17 | 吉安市木林森显示器件有限公司 | A kind of solid crystal glue applied to anti-electromigration lamp beads and anti-electromigration lamp beads |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140226 |