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CN103531109A - Method for solving failure of LED display screen and manufacturing method of LED display screen - Google Patents

Method for solving failure of LED display screen and manufacturing method of LED display screen Download PDF

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Publication number
CN103531109A
CN103531109A CN201310537315.5A CN201310537315A CN103531109A CN 103531109 A CN103531109 A CN 103531109A CN 201310537315 A CN201310537315 A CN 201310537315A CN 103531109 A CN103531109 A CN 103531109A
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Prior art keywords
led display
luminescence chip
primary colors
sub
display
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CN201310537315.5A
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Chinese (zh)
Inventor
彭晓林
丁家磊
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Vtron Technologies Ltd
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Vtron Technologies Ltd
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Priority to CN201310537315.5A priority Critical patent/CN103531109A/en
Publication of CN103531109A publication Critical patent/CN103531109A/en
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Abstract

The invention relates to the field of LED display screens, and discloses a method for solving failure of an LED display screen and a manufacturing method of the LED display screen. The method for solving the failure of the LED display screen includes the steps that primary color luminous chips forming display pixels of the LED display screen are connected by means of M luminous sub-chips, M luminous sub-chips are in electric parallel connection, M is a positive integer larger than or equal to 2, the luminous sub-chips are mutually backup so that the failure phenomenon of the LED display screen does not occur when H luminous sub-chips corresponding to a certain primary color in a certain display pixel of the LED display screen are damaged or power is cut off, H is a positive integer smaller than or equal to M-1, and therefore normal display of images through the LED display screen is guaranteed.

Description

Solve the method for the dead lamp of LED display and the preparation method of LED display
?
Technical field
The present invention relates to LED display field, more specifically, relate to a kind of method of the dead lamp of LED display and preparation method of LED display of solving.
Background technology
LED(Light Emitting Diode) display screen is the display screen being rearranged by LED device array, have the plurality of advantages such as brightness is high, bright in luster, visual angle is large, volume is little, the life-span is long, low in energy consumption, demonstration and indoor demonstration aspect all play an important role out of doors.LED display is the viewing area being obtained by the combination of LED Pixel arrangement, a kind of primary colors that each LED pixel is concentrated by primary colors or multiple combination of primaries form, primary colors collection has a lot of possibilities, such as: ruddiness (R), green glow (G), blue light (B), ruddiness green glow blue light (RGB), ruddiness green glow blue light gold-tinted (RGBY), ruddiness green glow blue light white light (RGBW) etc.
All there is a very general problem in the LED display of each manufacturer production of industry, be exactly dead lamp phenomenon, so-called dead lamp phenomenon be exactly LED display in use for some time, always more or less there will be the phenomenon that part LED lamp does not work or brightness is darker.According to thinking of industry, occur that the phenomenon of dead lamp mainly contains the reason of following two aspects:
One, electrostatic breakdown: static causes damage to LED display chip, lost efficacy the PN junction of LED chip, and leakage current increases, and becomes a pure resistance.
Two, the inner connecting lead wire of LED lamp disconnects: because the inner connecting lead wire of certain LED lamp disconnects, cause electric current to pass through, thereby cause dead lamp phenomenon, if there are other LED lamp series connections with it to use, other LED lamps also can be affected so.
The dead lamp of LED display is the crux that affects product quality, reliability, how to reduce and to stop dead lamp, improve product quality and reliability, it is the major issue that encapsulation, the current urgent need of application enterprise solve, but at present, industry does not still propose the dead lamp phenomenon that effective method solves LED display.
Summary of the invention
The present invention is at least one defect (deficiency) overcoming described in above-mentioned prior art, provides a kind of for solving the method for the dead lamp phenomenon of LED display, can effectively avoid damaging or electric disconnection causes the dead lamp phenomenon of LED display because of luminescence chip.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
A kind of for solving the method for the dead lamp phenomenon of LED display, adopt M sub-luminescence chip to be formed by connecting each primary colors luminescence chip that forms LED display display pixel, in M sub-luminescence chip, between every sub-luminescence chip, adopt electrical connection in parallel, M >=2 and be positive integer.
Between sub-luminescence chip, adopt electrical connection in parallel, make to form backup mutually between each sub-luminescence chip, can effectively reduce the dead lamp phenomenon of LED display; Individual sub-luminescence chip damages the H of corresponding certain primary colors in forming certain display pixel of LED display (H≤M-1 and be positive integer) or electric disconnection can not cause the dead lamp phenomenon of LED display yet, thereby guarantees that LED display shows the normal demonstration of image.
The preparation method who has an object to propose again a kind of LED display of the present invention, comprising:
S1. the M of a certain primary colors sub-luminescence chip is picked and placeed in LED and drives substrate specific location, M sub-luminescence chip be by vertical or horizontal one dimension or two-dimensional arrangements, and M sub-luminescence chip be set to electrical connection in parallel, M >=2 and be positive integer;
S2. the M of other each primary colors sub-luminescence chip arranged by the mode of step S1, formed LED display display unit;
S3. encapsulate display unit, form LED display module;
S4. LED display module is spliced, be made into LED display.
Compared with prior art, the beneficial effect of technical solution of the present invention is: by each primary colors luminescence chip that forms LED display display pixel being further subdivided into M(M >=2 and being positive integer) individual sub-luminescence chip, between every sub-luminescence chip, electrical connection in parallel is set, between every sub-luminescence chip, form backup mutually, like this when forming that the individual sub-luminescence chip of H (H≤M-1 and be positive integer) of corresponding certain primary colors in certain display pixel of LED display damages or electric disconnection can not cause the dead lamp phenomenon of LED display yet, thereby guarantee that LED display shows the normal demonstration of image.
Accompanying drawing explanation
Fig. 1 is the figure of correcting process gradually of the present invention.
Fig. 2 is that common LED full color display luminescence chip forms schematic diagram.
Fig. 3 is that LED full color display luminescence chip of the present invention forms schematic diagram (3 sub-luminescence chip Vertical one dimensionals are arranged).
Fig. 4 is that LED full color display luminescence chip of the present invention forms schematic diagram (3 horizontal one dimensions of sub-luminescence chip are arranged).
Fig. 5 is that LED full color display luminescence chip of the present invention forms schematic diagram (4 sub-luminescence chip vertical and horizontal two-dimensional arrangements).
Fig. 6 is that embodiment tri-blue chips excite color-converting material to form LED full color display schematic diagram.
Fig. 7 is that embodiment tri-luminescence chip layers are arranged schematic diagram (the sub-luminescence chip of M B (blue light) is along laterally one dimension arrangement).
Fig. 8 is that embodiment tri-luminescence chip layers are arranged schematic diagram (the sub-luminescence chip of M B (blue light) longitudinally one dimension is arranged).
Fig. 9 is that embodiment tri-luminescence chip layers are arranged schematic diagram (the sub-luminescence chip of M B (blue light) is along horizontal and vertical two-dimensional arrangements).
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
For better explanation the present embodiment, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing some known features and explanation thereof may to omit be understandable.
Below in conjunction with drawings and Examples, technical scheme of the present invention is described further
The present invention propose for solving the method for the dead lamp phenomenon of LED display, by each primary colors luminescence chip that forms LED display display pixel being further subdivided into M(M >=2 and being positive integer) individual sub-luminescence chip, between every sub-luminescence chip, electrical connection in parallel is set, between every sub-luminescence chip, form backup mutually, like this when forming that the individual sub-luminescence chip of H (H≤M-1 and be positive integer) of corresponding certain primary colors in certain display pixel of LED display damages or electric disconnection can not cause the dead lamp phenomenon of LED display yet, recycling pointwise correction technology eliminates that individual sub-luminescence chip damages or electric disconnection causes this display pixel brightness or colourity to occur the situation of deviation because forming certain display pixel H of LED display (H≤M-1 and be positive integer), thereby guarantee that LED display shows the normal demonstration of image, pointwise correction flow process as shown in Figure 1.
The mode of pointwise correction is specially: pointwise correction detailed process is divided three aspects; 1 raw data acquisition---adopt LED YC survey instrument (for example YC distribution detector based on CCD) shield each pixel brightness of front shooting, collecting LED display or chroma data and be transferred to computer processing system LED display.2 correction datas generate---and the raw data correction that first will collect acquisition system is eliminated the systematic error that objective condition (for example shooting angle) is introduced.Then set correction target value.Finally by calculating, generate correction data.3 drive to control---correction data is stored in the middle of corresponding hardware system (storer), it is luminous that setting program makes each input signal after correction data correction, be transferred to driving chip drives LED chip, drive control LED chip to have two kinds of modes: a current amplitude is controlled, two pulse width controls (PWM mode).Because current amplitude and brightness are not strict linear relationship, thereby and the increase and decrease of electric current can cause that the fluctuation of LED chip junction temperature causes the skew of LED chip predominant wavelength.Therefore conventional mode is pulse width control (PWM mode) at present.
The present invention propose for solving the method for the dead lamp phenomenon of LED display, can effectively reduce the dead lamp phenomenon of LED display, and utilize pointwise correction method to guarantee that LED display shows the normal demonstration of image, the inventive method is applicable to the LED display that one or more primary colors form, in order to reduce the increase of the cost bringing because of primary colors luminescence chip of a plurality of sub-chips composition, corresponding primary colors WAFER can be reduced to the area that chip is used material by the luminescence chip cutting splitting of smaller szie.Following examples all be take RGB primitive colours LED full color display and are illustrated specific embodiment of the invention method as example.
Specific embodiment one
1, by M(M >=2 of R (ruddiness) primary colors and for positive integer) individual sub-luminescence chip picks and places in LED and drives substrate specific location, M(M >=2 and be positive integer) individual sub-luminescence chip arranges by vertical or horizontal one dimension, and M(M >=2 and be positive integer) individual sub-luminescence chip is set to electrical connection in parallel.
2, by G(green glow) and the former dice luminescence chip of B (blue light) form LED display display unit after doing same processing by 1 step respectively, wherein each display pixel all have M(M >=2 and for positive integer) individual red light chips, M(M >=2 and be positive integer) individual green glow chip, M(M >=2 and be positive integer) individual blue chip, take M=3 as example, as shown in Figure 3 and Figure 4.
3, complete chip package, form LED display module
4, module is spliced, complete LED display manufacturing process
In the present embodiment, each primary colors (ruddiness R, green glow G and the blue light B) luminescence chip that forms each display pixel of LED display all has 3(M=3) individual sub-luminescence chip formation, what between 3 sub-luminescence chips, adopt is electrical connection scheme in parallel, when wherein 1 or 2 sub-luminescence chips are damaged or electric disconnection, can not cause the dead lamp phenomenon of LED display, recycling pointwise correction technology can guarantee that LED display shows the normal demonstration of image.
Specific embodiment two
1, by M(M >=2 of R (ruddiness) primary colors and for positive integer) sub-luminescence chip picks and places in LED and drives substrate specific location, M(M >=2 and for positive integer) individual sub-luminescence chip is by the horizontal and vertical two-dimensional arrangements of carrying out, and M(M >=2 and be positive integer) individual sub-luminescence chip is set to electrical connection in parallel.
2, by G(green glow) and the former dice luminescence chip of B (blue light) form LED display display unit after doing same processing by 1 step respectively, wherein each display pixel all have M(M >=2 and for positive integer) individual red light chips, M(M >=2 and be positive integer) individual green glow chip, M(M >=2 and be positive integer) individual blue chip, take M=4 as example, as shown in Figure 5.
3, complete chip package, form LED display module
4, module is spliced, complete LED display manufacturing process
In the present embodiment, each primary colors (R(ruddiness), the G(green glow that form each display pixel of LED display), B (blue light)) luminescence chip all has 4(M=4) individual sub-luminescence chip forms, what between 4 sub-luminescence chips, adopt is electrical connection scheme in parallel, when wherein 1 or 2 or 3 sub-luminescence chips are damaged or electric disconnection, can not cause the dead lamp phenomenon of LED display, recycling pointwise correction technology can guarantee that LED display shows the normal demonstration of image.
Specific embodiment three
Producing LED full color display has two kinds of methods, and a kind of is to make respectively corresponding primary colors (for example R(ruddiness), G(green glow), B (blue light)), luminescence chip, more corresponding primary colors luminescence chip is combined to form to the full-color demonstration of LED.Another kind is to make single primary colors (B (blue light) or ultraviolet light) luminescence chip, then on single primary colors luminescence chip surface, apply color-converting material (for example fluorescent material or quanta point material), under the exciting of single primary colors (B (blue light) or ultraviolet light) luminescence chip, by optionally applying different color-converting materials, can obtain other different primary colors (for example R(ruddiness), G (green glow) again), finally different luminous primary colors being combined is the full-color demonstration that realizes LED display.
A kind of method that solves the dead lamp phenomenon of LED display that the present invention proposes is not only applicable to the first LED full color display and is applicable to too the second LED full color display, for the first LED full color display embodiment of the present invention one and embodiment bis-, provided concrete implementation method, the present embodiment is applicable to the second LED full color display by the method for the dead lamp phenomenon of solution LED display that just the present invention proposes and provides concrete elaboration.
The present embodiment take after blue-light excited color-converting material form R(ruddiness), G (green glow), B (blue light) LED full color display be example, as shown in Figure 6.
Wherein 1 is PCB substrate.3 is color-converting material coat, the color-converting material that wherein r material is R (ruddiness) primary colors for the primary colors changed after exciting, the color-converting material that g material is G (green glow) primary colors for the primary colors changed after exciting, b material is transparent material.2 is luminescence chip layer (B(blue light)), be used for exciting color-converting material to form R(ruddiness) primary colors and G (green glow) primary colors, wherein each primary colors of corresponding LED display display pixel all has M, M >=2 and be the sub-luminescence chip of a positive integer B (blue light), M B(blue light) sub-luminescence chip is set to electrical connection in parallel, like this when H wherein (H≤M-1 and be positive integer) the sub-luminescence chip of individual B (blue light) damages or during electric disconnection, color-converting material can be subject to the primary colors that excites generation corresponding equally, therefore can't there is the phenomenon of the dead lamp of LED display, recycling pointwise correction technology is eliminated and is caused this display pixel brightness or colourity to occur the situation of deviation because of the sub-luminescence chip damage of H B (blue light) or electric disconnection, thereby guarantee that LED display shows the normal demonstration of image.M(M >=2 of corresponding each primary colors of LED display display pixel and be positive integer) the sub-luminescence chip of individual B (blue light) can, along laterally or longitudinally carrying out one dimension arrangement as shown in Figure 7 with shown in Fig. 8, also can carry out two-dimensional arrangements as shown in Figure 9 along horizontal and vertical.
In accompanying drawing, describe position relationship for only for exemplary illustration, can not be interpreted as the restriction to this patent;
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all embodiments.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in the protection domain of the claims in the present invention.

Claims (8)

1. a method that solves the dead lamp of LED display, it is characterized in that, adopt M sub-luminescence chip to be formed by connecting each primary colors luminescence chip that forms LED display display pixel, in M sub-luminescence chip, between every sub-luminescence chip, adopt electrical connection in parallel, M >=2 and be positive integer.
2. the method for the dead lamp of solution LED display according to claim 1, is characterized in that, in described M sub-luminescence chip, the sub-luminescence chip of same primary colors is by obtaining after one or more corresponding primary colors wafer cuttings.
3. the method for the dead lamp of solution LED display according to claim 1, it is characterized in that, described LED display is full color display, be that primary colors luminescence chip by multiple different colours forms full color display, the different primary colors wafers corresponding to primary colors luminescence chip of described multiple different colours are to be independently made.
4. the method for the dead lamp of solution LED display according to claim 1, it is characterized in that, described LED display is full color display, that primary colors luminescence chip by multiple different colours forms full color display, in the primary colors luminescence chip of described multiple different colours, the production method of various primary colors luminescence chips is: make single primary colors luminescence chip, then on single primary colors luminescence chip surface, apply color-converting material, under the exciting of single primary colors luminescence chip, by optionally applying different color-converting materials, obtain other different primary colors again, finally different luminous primary colors is combined, realize the full-color demonstration of LED display.
5. the method for the dead lamp of solution LED display according to claim 4, is characterized in that, the color-converting material that described single primary colors luminescence chip surface applies is fluorescent material or quanta point material.
6. according to the method for the dead lamp of solution LED display described in claim 1 to 4 any one, it is characterized in that, the method also comprises: according to the brightness of each display pixel of LED display or colourity situation, judge whether to exist damage or the electric disconnection of sub-luminescence chip; In certain display pixel of LED display, the H of corresponding certain primary colors sub-luminescence chip damages or electric disconnection, recycling pointwise correction method is eliminated because forming certain display pixel H of LED display sub-luminescence chip and is damaged or electric disconnection, wherein H≤M-1 and be positive integer.
7. a preparation method for LED display, is characterized in that, comprising:
S1. the M of a certain primary colors sub-luminescence chip is picked and placeed in LED and drives substrate specific location, M sub-luminescence chip be by vertical or horizontal one dimension or two-dimensional arrangements, and M sub-luminescence chip be set to electrical connection in parallel, M >=2 and be positive integer;
S2. the M of other each primary colors sub-luminescence chip arranged by the mode of step S1, formed LED display display unit;
S3. encapsulate display unit, form LED display module;
S4. LED display module is spliced, be made into LED display.
8. the preparation method of LED display according to claim 7, is characterized in that, in described step S2, the sub-luminescence chip of other each primary colors is the sub-luminescence chip of same primary color or different primary colors.
CN201310537315.5A 2013-11-04 2013-11-04 Method for solving failure of LED display screen and manufacturing method of LED display screen Pending CN103531109A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653982A (en) * 2016-12-13 2017-05-10 深圳市创想视讯技术有限公司 N*N packaging structure for LED paster element
CN112753063A (en) * 2018-10-01 2021-05-04 三星电子株式会社 Display device and method for manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935376A (en) * 2008-02-15 2009-08-16 Foxsemicon Integrated Tech Inc LED display
CN102569284A (en) * 2012-03-16 2012-07-11 广东科立盈光电技术有限公司 Novel light-emitting diode (LED) light-emitting chip and LED lamp formed by assembling LED light-emitting chips
CN102751275A (en) * 2012-07-19 2012-10-24 广东威创视讯科技股份有限公司 Light-emitting diode display screen and manufacturing method thereof
CN203010345U (en) * 2012-12-27 2013-06-19 鹤山丽得电子实业有限公司 Novel light-emitting diode (LED) video light bar

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935376A (en) * 2008-02-15 2009-08-16 Foxsemicon Integrated Tech Inc LED display
CN102569284A (en) * 2012-03-16 2012-07-11 广东科立盈光电技术有限公司 Novel light-emitting diode (LED) light-emitting chip and LED lamp formed by assembling LED light-emitting chips
CN102751275A (en) * 2012-07-19 2012-10-24 广东威创视讯科技股份有限公司 Light-emitting diode display screen and manufacturing method thereof
CN203010345U (en) * 2012-12-27 2013-06-19 鹤山丽得电子实业有限公司 Novel light-emitting diode (LED) video light bar

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653982A (en) * 2016-12-13 2017-05-10 深圳市创想视讯技术有限公司 N*N packaging structure for LED paster element
CN112753063A (en) * 2018-10-01 2021-05-04 三星电子株式会社 Display device and method for manufacturing the same
CN112753063B (en) * 2018-10-01 2024-05-24 三星电子株式会社 Display device and method for manufacturing the same

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Application publication date: 20140122