CN103522167A - Grinding head and grinding device - Google Patents
Grinding head and grinding device Download PDFInfo
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- CN103522167A CN103522167A CN201210226406.2A CN201210226406A CN103522167A CN 103522167 A CN103522167 A CN 103522167A CN 201210226406 A CN201210226406 A CN 201210226406A CN 103522167 A CN103522167 A CN 103522167A
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- grinding
- grinding head
- spacing ring
- bulge loop
- head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a grinding head which comprises wafer adsorption space and a limiting ring. The limiting ring is arranged outside the wafer adsorption space in a surrounding mode and the bottom of the limiting ring is further provided with a grinding adjusting mechanism. The invention further provides a grinding device which comprises a grinding pad and a grinding head. The grinding head is placed on the grinding pad and the grinding head is the provided grinding head. A traditional grinding head and a traditional adjustor are ingeniously combined together through the design of an annular structure, the function of the traditional grinding head and the function of the traditional adjustor are integrated into one device, so that the purpose of fixation of a wafer is achieved, adjustment of grinding liquid and grinding particles is accomplished, the quality and the efficiency of the grinding technology are further improved, and cost is greatly saved.
Description
Technical field
The present invention relates to the cmp technical field in semiconductor manufacture, relate in particular to grinding head and lapping device in a kind of cmp.
Background technology
Cmp (CMP), as requisite one technique in chip manufacture, is not only used at wafer preparatory phase, and in wafer machining process, is also used to do crystal column surface global planarization.Chemical mechanical milling method is mainly to utilize mechanical polishing principle, coordinates chemical assistant and the chip surface planarization that just yo-yo profile is polished in lapping liquid.It is suitable that the parameter of the various processing procedures of one highest wisdom is controlled, cmp can provide and be polished surface and reach more than 94% flatness, but the development along with semicon industry, rapidly, cmp is also faced with more and more higher challenge as indispensable one technique in chip manufacture in integrated circuit manufacturing industry development.
Please refer to Fig. 1, its schematic diagram that is existing chemical mechanical polishing device.Existing chemical mechanical polishing device comprises: grinding plate 101, grinding pad 102, grinding head 104 and adjuster 105, and the bottom of described adjuster 105 is provided with diamond 106, and wafer 103 is adsorbed on the bottom of described grinding head 104.Please refer to Fig. 2, it is the elevational schematic view of existing grinding head 104, and the bottom of described grinding head 104 is provided with groove 107 and smooth surface 108, thereby facilitates the circulation of lapping liquid.
In process of lapping, grinding plate 101 starts rotation, grinding pad 102 rotates thereupon, vertical direction is pinned grinding head 104, its role is to fixedly wafer 103, makes wafer 103 can access grinding, the existence of adjuster 105 on the one hand can be so that being more evenly distributed of lapping liquid, in its bottom, be provided with diamond 106 on the other hand, can utilize the hardness feature of diamond 106 that the abrasive grains of deposition is smashed, it is distributed uniformly.
In existing process of lapping, the residue grinding is difficult for dredging, the effect that easily deposition affects is ground, same, the residue grinding is also easy to be deposited on the diamond 106 of adjuster 105 bottoms, thereby make diamond 106 can not effectively smash abrasive grains, also can affect adjuster 105 and make the equally distributed function of lapping liquid simultaneously.
Summary of the invention
The technical problem to be solved in the present invention is, in chemical mechanical polishing device, provides a kind of cost is lower, function is more polynary grinding head and the technical problem of lapping device.
In order to solve this technical problem, the invention provides a kind of grinding head, comprise wafer adsorption space and spacing ring, described spacing ring is around the outside of being located at described wafer adsorption space, and the bottom of described spacing ring is also provided with grinding governor motion.
Described grinding governor motion comprises some grinding crystal that are arranged at the evagination of described spacing ring bottom
The bottom inner edge of described spacing ring is provided with bulge loop.
The bottom of described spacing ring is provided with cannelure, and described cannelure is set around the outside of described bulge loop and is positioned at the inner side of described grinding crystal.
Described bulge loop is provided with several through holes, and described through hole is communicated with described cannelure and described wafer adsorption space.
Described in several, through hole is uniformly distributed on described bulge loop.
The bottom outer rim of described spacing ring is provided with slope.
The bottom of described spacing ring is provided with several guiding gutters, and described guiding gutter is shape linearly, and described guiding gutter connects described cannelure and described slope.
Described in several, guiding gutter is uniformly distributed around described bulge loop.
The radial direction of described guiding gutter and described bulge loop forms fixing angle.
The present invention also provides a kind of lapping device, comprises grinding pad and grinding head, and described grinding head is positioned on described grinding pad, and described grinding head adopts a kind of grinding head provided by the invention.
The present invention combines traditional grinding head and adjuster dexterously by the design of circulus, both functions are pooled in a device, and be provided with described cannelure on its surface, guiding gutter, slope etc., further improved lapping liquid, abrasive grains, grind the circulation of residue, quality and the efficiency of the technique of grinding have greatly been improved, greatly saved the cost of technique, the present invention had both reached the fixedly object of wafer, also completed the adjusting to lapping liquid and abrasive grains simultaneously, solved technical problem to be solved, provide a kind of cost lower, the grinding head that function is more polynary.
Accompanying drawing explanation
Fig. 1 is the structural representation of chemical mechanical polishing device of the prior art;
Fig. 2 is the elevational schematic view of the grinding head in chemical mechanical polishing device of the prior art;
Fig. 3 is the generalized section of an embodiment of a kind of grinding head of the present invention;
Fig. 4 is the elevational schematic view of an embodiment of a kind of grinding head of the present invention.
In figure, 101-grinding plate; 102-grinding pad; 103-wafer; 104-grinding head; 105-adjuster; 106-diamond; 107-groove; 108-smooth surface;
201-grinding pad; 202-wafer adsorption space; 203-wafer; 204-bulge loop; 205-grinds crystal; 206-slope; 207-cannelure; 208-guiding gutter; 209-spacing ring.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Refer to accompanying drawing 3 and accompanying drawing 4, the present embodiment provides a kind of grinding head, comprise wafer adsorption space 202 and spacing ring 209, in wafer adsorption space 202, be provided with for adsorbing the wafer adsorption mechanism (not shown) of wafer, described spacing ring 209 is around the outside of being located at described wafer adsorption space 202, the internal diameter of described spacing ring 209 mates with the diameter of wafer 203, and the bottom of described spacing ring 209 is also provided with grinding governor motion.The present embodiment combines traditional grinding head and adjuster dexterously by the design of spacing ring 209, and both functions are pooled in a device.
Described grinding governor motion comprises some grinding crystal 205 that are arranged at the evagination of described spacing ring 209 bottoms.Wherein grind crystal 205 and can use diamond material.
In process of lapping, grinding governor motion can be uniformly distributed and come so that be fed to lapping liquid on grinding pad 201 and abrasive grains, be conducive to the grinding to wafer 203, in addition, adopt the grinding crystal 205 of diamond material can utilize its hardness feature that the abrasive grains of deposition is smashed, avoided the grinding defect of bringing due to the deposition of abrasive grains.
The bottom inner edge of described spacing ring 209 is provided with bulge loop 204.Wherein, be placed in wafer 203 in wafer adsorption space 202 because the effect of bulge loop 204 makes its horizontal level more firm.
The bottom of described spacing ring 209 is provided with cannelure 207, and described cannelure 207 is set around the outside of described bulge loop 204 and is positioned at the inner side of described grinding crystal 205, and described grinding crystal 205 is uniformly distributed in the form of a ring round described cannelure 207.The setting of cannelure 207, is conducive to abrasive grains and lapping liquid circulation in cannelure, further strengthens the trafficability performance of whole grinding head.
Described bulge loop 204 is provided with several through hole (not shown), and described through hole is communicated with described cannelure 207 and described wafer adsorption space 202.Described in several, through hole is uniformly distributed on described bulge loop 204.
Be arranged so that lapping liquid, abrasive grains and the grinding residue of through hole can be passed in cannelure 207 from wafer adsorption space 202, lapping liquid in cannelure 207, abrasive grains also can be successfully passed in wafer adsorption space 202, and then wafer 203 is ground effectively.
The bottom outer rim of described spacing ring 209 is provided with slope 206.Slope 206 can make the circulation of lapping liquid, abrasive grains, grinding residue more smooth, mild.
The bottom of described spacing ring 209 is provided with several guiding gutters 208, and described guiding gutter 208 is shape linearly, and described guiding gutter 208 connects described cannelure 207 and described slope 206.Described in several, guiding gutter 208 is uniformly distributed around described bulge loop.In the present embodiment, lapping liquid in cannelure 207, abrasive grains, particularly grinding residue can be circulated in slope 206 by guiding gutter 208, and then the grinding head circulating out in the present embodiment, otherwise, also be conducive to lapping liquid and abrasive grains and be circulated in cannelure 207 by guiding gutter 208, and then enter in wafer adsorption space 202 by through hole, contribute to the effective grinding to wafer 203.
The radial direction of described guiding gutter and described bulge loop forms fixing angle.The scope of angle is preferably 0 degree to 90 degree in the present embodiment, in the process of lapping of the present embodiment, described wafer mounting apparatus is axle rotation by take the axle center of bulge loop 204, so be more conducive to the circulation of lapping liquid, abrasive grains and grinding residue when the radial direction of guiding gutter 208 and bulge loop 204 forms fixed angle.
The present embodiment also provides a kind of lapping device, comprises grinding pad 201 and grinding head, and described grinding head is positioned on described grinding pad, a kind of grinding head that described grinding head adopts the present embodiment to provide.
In the process of lapping that the grinding head that uses the present embodiment to provide grinds wafer, comprise the following steps:
S01 step: wafer 203 is positioned in wafer adsorption space 202;
S02 step: wafer mounting apparatus is placed on grinding pad 201, the bottom of grinding head is close on grinding pad 201;
S03 step: spin finishing platform in the time of supply lapping liquid and abrasive grains keeps the position of grinding head not rotate with grinding plate simultaneously; In the present embodiment, it is axle rotation that grinding head be take the axle center of bulge loop 204, strengthens the effect of grinding
S04 step: ground, grinding plate stops the rotation; Simultaneous grinding head also stops rotation.
In sum, grinding head provided by the invention and lapping device, design by circulus combines traditional grinding head and adjuster dexterously, both functions are pooled in a device, and be provided with described cannelure on its surface, guiding gutter, slope etc., further improved lapping liquid, abrasive grains, grind the circulation of residue, quality and the efficiency of the technique of grinding have greatly been improved, greatly saved the cost of technique, the present invention had both reached the fixedly object of wafer, also completed the adjusting to lapping liquid and abrasive grains simultaneously, solved technical problem to be solved, provide a kind of cost lower, the grinding head that function is more polynary.
Claims (12)
1. a grinding head, is characterized in that: comprise wafer adsorption space and spacing ring, described spacing ring is around the outside of being located at described wafer adsorption space, and the bottom of described spacing ring is also provided with grinding governor motion.
2. grinding head as claimed in claim 1, is characterized in that: described grinding governor motion comprises some grinding crystal that are arranged at the evagination of described spacing ring bottom.
3. grinding head as claimed in claim 2, is characterized in that: the bottom inner edge of described spacing ring is provided with bulge loop.
4. grinding head as claimed in claim 3, is characterized in that: the bottom of described spacing ring is provided with cannelure, and described cannelure is set around the outside of described bulge loop and is positioned at the inner side of described grinding crystal.
5. grinding head as claimed in claim 4, is characterized in that: described bulge loop is provided with several through holes, and described through hole is communicated with described cannelure and wafer adsorption space.
6. grinding head as claimed in claim 5, is characterized in that: described in several, through hole is uniformly distributed on described bulge loop.
7. grinding head as claimed in claim 1, is characterized in that: the bottom outer rim of described spacing ring is provided with slope.
8. grinding head as claimed in claim 7, is characterized in that: the bottom of described spacing ring is provided with several guiding gutters, and described guiding gutter is shape linearly, and described guiding gutter connects described cannelure and described slope.
9. grinding head as claimed in claim 8, is characterized in that: described in several, guiding gutter is uniformly distributed around described bulge loop.
10. grinding head as claimed in claim 9, is characterized in that: the radial direction of described guiding gutter and described bulge loop forms fixing angle.
11. grinding heads as claimed in claim 10, is characterized in that: the scope of described angle is 0 to 90 degree.
12. 1 kinds of lapping devices, comprise grinding pad and grinding head, and described grinding head is positioned on described grinding pad, it is characterized in that, described grinding head adopts the grinding head as described in any one in claim 1～10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210226406.2A CN103522167B (en) | 2012-07-02 | 2012-07-02 | Grinding head and lapping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210226406.2A CN103522167B (en) | 2012-07-02 | 2012-07-02 | Grinding head and lapping device |
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| Publication Number | Publication Date |
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| CN103522167A true CN103522167A (en) | 2014-01-22 |
| CN103522167B CN103522167B (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210226406.2A Active CN103522167B (en) | 2012-07-02 | 2012-07-02 | Grinding head and lapping device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110549242A (en) * | 2018-05-31 | 2019-12-10 | 许栋梁 | Omnidirectional integrated regulating device |
| CN114310657A (en) * | 2021-11-24 | 2022-04-12 | 北京子牛亦东科技有限公司 | Grinding head for chemical mechanical grinding equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW505967B (en) * | 2001-10-11 | 2002-10-11 | Macronix Int Co Ltd | Wafer carrier structure of chemical mechanical polishing device |
| JP2004119495A (en) * | 2002-09-24 | 2004-04-15 | Sony Corp | Polishing head, chemical mechanical polishing equipment, and method for manufacturing semiconductor device |
| US20100146756A1 (en) * | 2006-02-20 | 2010-06-17 | Samsung Electronics Co., Ltd | Piezoelectric actuator inkjet head and method of forming the same |
| KR101134177B1 (en) * | 2010-07-30 | 2012-04-09 | 주식회사리온 | Retainer ring for CMP head, and CMP head having the same |
| CN102437013A (en) * | 2011-08-29 | 2012-05-02 | 上海华力微电子有限公司 | Built-in wafer cleaning device for chemical mechanical polishing (CMP) machine table |
-
2012
- 2012-07-02 CN CN201210226406.2A patent/CN103522167B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW505967B (en) * | 2001-10-11 | 2002-10-11 | Macronix Int Co Ltd | Wafer carrier structure of chemical mechanical polishing device |
| JP2004119495A (en) * | 2002-09-24 | 2004-04-15 | Sony Corp | Polishing head, chemical mechanical polishing equipment, and method for manufacturing semiconductor device |
| US20100146756A1 (en) * | 2006-02-20 | 2010-06-17 | Samsung Electronics Co., Ltd | Piezoelectric actuator inkjet head and method of forming the same |
| KR101134177B1 (en) * | 2010-07-30 | 2012-04-09 | 주식회사리온 | Retainer ring for CMP head, and CMP head having the same |
| CN102437013A (en) * | 2011-08-29 | 2012-05-02 | 上海华力微电子有限公司 | Built-in wafer cleaning device for chemical mechanical polishing (CMP) machine table |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110549242A (en) * | 2018-05-31 | 2019-12-10 | 许栋梁 | Omnidirectional integrated regulating device |
| CN114310657A (en) * | 2021-11-24 | 2022-04-12 | 北京子牛亦东科技有限公司 | Grinding head for chemical mechanical grinding equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103522167B (en) | 2015-11-25 |
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