CN103454032A - Pressure sensitive core with thermistor - Google Patents
Pressure sensitive core with thermistor Download PDFInfo
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- CN103454032A CN103454032A CN2013103577124A CN201310357712A CN103454032A CN 103454032 A CN103454032 A CN 103454032A CN 2013103577124 A CN2013103577124 A CN 2013103577124A CN 201310357712 A CN201310357712 A CN 201310357712A CN 103454032 A CN103454032 A CN 103454032A
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Abstract
The invention discloses a pressure sensitive core with a thermistor, and belongs to the field of pressure measurement. In order to solve the problem that an existing silicon piezoresistive pressure sensor is large in temperature excursion, the pressure sensitive core with the thermistor comprises a tube base with an inner cavity, a pressure sensitive chip and the thermistor, wherein the pressure sensitive chip and the thermistor are installed in the inner cavity of the tube base. A plurality of pins are installed on the tube base, the pressure sensitive chip is electrically connected with a part of pins, the thermistor is electrically connected with the other part of pins. A corrugated diaphragm is arranged at the bottom of the tube base, a closed cavity is formed between the corrugated diaphragm and the tube base, and silicon oil is contained in the closed cavity. The pressure sensitive core with the thermistor solves the problem that the temperature excursion of the pressure sensor can not be compensated for with high precision when a pure-resistance network is adopted, the NTC thermistor provides signal output in nonlinear relation with temperature, and the nonlinear output signal can compensate for the temperature excursion of the pressure sensitive chip with high precision.
Description
Technical field
The present invention relates to the pressure sensing field, be specially a kind of pressure sensitive core with thermistor, the especially applicable wide warm area of pressure survey, the occasion of low temperature drift.
Background technology
The shortcoming of silicon substrate pressure sensor maximum is that temperature is floated greatly.At present, the temperature compensation of silicon substrate pressure sensor has several different methods, wherein a kind of is the resistance network compensation method, it reduces the temperature drift of pressure transducer by the method for series and parallel compensated resistance, compensate temperature-coefficient of electrical resistance used little, even compensating resistance and presser sensor chip be in same temperature, also compensate for temperature drift effectively.But this method compensation ability is limited, wants further to improve compensation precision, one of needs are nonlinear amount with temperature and participate in compensation.The present invention provides a non-linear parameter by the accurate temperature-sensitive of thermistor.
Summary of the invention
Float large shortcoming in order to solve traditional silica-based force-sensing resistor networking compensation method temperature, the present invention aims to provide a kind of pressure sensitive core with thermistor, this assembly contains a silica-based presser sensor chip and a thermistor with negative temperature coefficient, and is encapsulated in the Dew Point that is filled with silicone oil.
To achieve these goals, the technical solution adopted in the present invention is:
A kind of pressure sensitive core with thermistor, its design feature is, comprises the base with inner chamber, is contained in presser sensor chip and the thermistor of base inner chamber; Many pins are housed on described base, and described presser sensor chip is electrically connected to a part of pin, and described thermistor is electrically connected to another part pin; Described base bottom is provided with convoluted diaphragm, between this convoluted diaphragm and base, forms closed cavity, in this closed cavity, silicone oil is housed.
Be below the technical scheme of further improvement of the present invention:
Further, described pin has seven, and wherein two pins are electrically connected to described thermistor, and remaining five pins are electrically connected to described presser sensor chip.
In order to guarantee to connect sensitivity, described thermistor and presser sensor chip are electrically connected to corresponding pin by spun gold respectively.
As a kind of concrete version, the pin be contained on described base top cover partly stretches into described base inner chamber.Further, be provided with glass glaze between described pin and described base top cover.
Described presser sensor chip is preferably silica-based presser sensor chip.
Described thermistor is preferably NTC(Negative Temperature Coefficient) thermistor.
Described pin is preferably the Covar pin.
For the vibration resistance and the shock-resistant ability that guarantee described assembly, described presser sensor chip and thermistor all are bonded on the top cover of described base.In order to guarantee the pressure cycling life-span of product, the bondline thickness between described presser sensor chip and thermistor and described base is less than 0.2mm.
By said structure, be provided with pressure measuring element on silica-based presser sensor chip, pressure measuring element is four presser sensor resistance, four presser sensor resistance form the open loop type Wheatstone bridge.Described thermistor is an independently element, and described thermistor resistance reduces along with the increase of temperature.Described silica-based presser sensor chip and thermistor are fixed on same base, this base has the Covar pin of 7 glass sinterings, and the mode that described silica-based presser sensor chip and thermistor connect by gold ball bonding and described Covar pin keep electrical communication.In described silica-based presser sensor chip and the thermistor silicone oil environment in sealing, the cavity that described silicone oil consists of stainless steel ripple diaphragm and pedestal is sealed.Temperature and pressure measuring sensor on silicon, in same base, is experienced the temperature of silicone oil and the pressure of silicone oil simultaneously.
Core body of the present invention is encapsulated in silica-based presser sensor chip and thermistor in a base, and this core body can be realized tonometricly exporting one simultaneously and becoming nonlinear resistance value with temperature.
Compared with prior art, the invention has the beneficial effects as follows: the platform of pressure transducer high precision temperature drift compensation is provided, and the output of thermistor more is conducive to the temperature compensation of described silica-based presser sensor chip.
Below in conjunction with drawings and Examples, the present invention is further elaborated.
The accompanying drawing explanation
Fig. 1 is the structure principle chart of an embodiment of the present invention;
Fig. 2 is the A-A cut-open view of Fig. 1.
In the drawings
The silica-based presser sensor chip of 1-; The 2-thermistor; The 3-tackifier; The 4-base;
The 5-spun gold; 6-Covar pin; 7-silicone oil; The 8-convoluted diaphragm; The 9-glass glaze.
Embodiment
A kind of pressure sensitive core with thermistor, as shown in Figure 1, silica-based presser sensor chip 1 and NTC thermistor 2 are bonded on base 4 by tackifier 3, base 4 bottom package have convoluted diaphragm 8, silica-based presser sensor chip 1 and NTC thermistor 2 keep electrical connection by spun gold 5 and Covar pin 6, wherein silica-based presser sensor chip 1 is electrically connected to five Covar pins 6 respectively, and NTC thermistor 2 is electrically connected to two Covar pins 6; The diameter of described base 4 is Φ 15.6mm, the interior filling silicone oil 7 of base 4, convoluted diaphragm 8 sealing silicone oil 7 isolating exterior media.The thickness that described adhesive means finally forms sizing material is less than 0.2mm.The silica-based presser sensor chip of MEMS that described silica-based presser sensor chip is the research and development of commercially available prod ，Ru Shenyang Instrument Sciences Academy.
The content that above-described embodiment is illustrated should be understood to these embodiment only for being illustrated more clearly in the present invention, and be not used in, limit the scope of the invention, after having read the present invention, those skilled in the art all fall within the application's claims limited range to the modification of the various equivalent form of values of the present invention.
Claims (10)
1. the pressure sensitive core with thermistor, is characterized in that, comprises the base (4) with inner chamber, is contained in presser sensor chip (1) and the thermistor (2) of base (4) inner chamber; Many pins (6) are housed on described base (4), and described presser sensor chip (1) is electrically connected to a part of pin (6), and described thermistor (2) is electrically connected to another part pin (6); Described base (4) bottom is provided with convoluted diaphragm (8), between this convoluted diaphragm (8) and base (4), forms closed cavity, and silicone oil (7) is housed in this closed cavity.
2. the pressure sensitive core with thermistor according to claim 1, it is characterized in that, described pin (6) has seven, and wherein two pins (6) are electrically connected to described thermistor (2), and remaining five pins (6) are electrically connected to described presser sensor chip (1).
3. the pressure sensitive core with thermistor according to claim 1, is characterized in that, described thermistor (2) and presser sensor chip (1) are electrically connected to corresponding pin (6) by spun gold (5) respectively.
4. the pressure sensitive core with thermistor according to claim 1, is characterized in that, pin (6) part be contained on described base (4) top cover stretches into described base (4) inner chamber.
5. the pressure sensitive core with thermistor according to claim 4, is characterized in that, between described pin (6) and described base (4) top cover, is provided with glass glaze (9).
6. according to the described pressure sensitive core with thermistor of one of claim 1 ~ 5, it is characterized in that, described presser sensor chip (1) is silica-based presser sensor chip.
7. according to the described pressure sensitive core with thermistor of one of claim 1 ~ 5, it is characterized in that, described thermistor (2) is the NTC thermistor.
8. according to the described pressure sensitive core with thermistor of one of claim 1 ~ 5, it is characterized in that, described pin (6) is the Covar pin.
9. according to the described pressure sensitive core with thermistor of one of claim 1 ~ 5, it is characterized in that, described presser sensor chip (1) and thermistor (2) all are bonded on the top cover of described base (4).
10. the pressure sensitive core with thermistor according to claim 9, is characterized in that, the bondline thickness between described presser sensor chip (1) and thermistor (2) and described base (4) is less than 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103577124A CN103454032A (en) | 2013-08-16 | 2013-08-16 | Pressure sensitive core with thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103577124A CN103454032A (en) | 2013-08-16 | 2013-08-16 | Pressure sensitive core with thermistor |
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| CN103454032A true CN103454032A (en) | 2013-12-18 |
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| CN2013103577124A Pending CN103454032A (en) | 2013-08-16 | 2013-08-16 | Pressure sensitive core with thermistor |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104819799A (en) * | 2014-02-05 | 2015-08-05 | Mgi库贴公司 | Pressure and temperature determining device, pressure and temperature sensor comprising such a device and method for manufacturing such a device |
| EP3029443A1 (en) * | 2014-12-02 | 2016-06-08 | Sensata Technologies, Inc. | Case isolated oil filled mems pressure sensor |
| US9638559B1 (en) | 2016-02-10 | 2017-05-02 | Sensata Technologies Inc. | System, devices and methods for measuring differential and absolute pressure utilizing two MEMS sense elements |
| CN106768592A (en) * | 2017-02-24 | 2017-05-31 | 中国电子科技集团公司第三十八研究所 | A kind of pressure transmitter oil filling core body of band signal processing function |
| CN105466626B (en) * | 2015-12-11 | 2019-01-11 | 中国电子科技集团公司第四十八研究所 | Diaphragm pressure sensor and its manufacturing method |
| US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10345156B2 (en) | 2015-07-01 | 2019-07-09 | Sensata Technologies, Inc. | Temperature sensor and method for the production of a temperature sensor |
| US10428716B2 (en) | 2016-12-20 | 2019-10-01 | Sensata Technologies, Inc. | High-temperature exhaust sensor |
| US10488289B2 (en) | 2016-04-11 | 2019-11-26 | Sensata Technologies, Inc. | Pressure sensors with plugs for cold weather protection and methods for manufacturing the plugs |
| US10502641B2 (en) | 2017-05-18 | 2019-12-10 | Sensata Technologies, Inc. | Floating conductor housing |
| US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
| US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
| US10871413B2 (en) | 2016-04-20 | 2020-12-22 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| WO2022085497A1 (en) * | 2020-10-20 | 2022-04-28 | イーグル工業株式会社 | Pressure and temperature sensor |
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| JPS6020692B2 (en) * | 1979-05-01 | 1985-05-23 | 株式会社東芝 | Semiconductor pressure detection device |
| JPH06129927A (en) * | 1992-10-14 | 1994-05-13 | Saapasu Kogyo Kk | Pressure sensor |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104819799A (en) * | 2014-02-05 | 2015-08-05 | Mgi库贴公司 | Pressure and temperature determining device, pressure and temperature sensor comprising such a device and method for manufacturing such a device |
| EP3029443A1 (en) * | 2014-12-02 | 2016-06-08 | Sensata Technologies, Inc. | Case isolated oil filled mems pressure sensor |
| US9915577B2 (en) | 2014-12-02 | 2018-03-13 | Sensata Technologies, Inc. | Case isolated oil filled MEMS pressure sensor |
| US10345156B2 (en) | 2015-07-01 | 2019-07-09 | Sensata Technologies, Inc. | Temperature sensor and method for the production of a temperature sensor |
| CN105466626B (en) * | 2015-12-11 | 2019-01-11 | 中国电子科技集团公司第四十八研究所 | Diaphragm pressure sensor and its manufacturing method |
| US9638559B1 (en) | 2016-02-10 | 2017-05-02 | Sensata Technologies Inc. | System, devices and methods for measuring differential and absolute pressure utilizing two MEMS sense elements |
| US10488289B2 (en) | 2016-04-11 | 2019-11-26 | Sensata Technologies, Inc. | Pressure sensors with plugs for cold weather protection and methods for manufacturing the plugs |
| US10871413B2 (en) | 2016-04-20 | 2020-12-22 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| US10428716B2 (en) | 2016-12-20 | 2019-10-01 | Sensata Technologies, Inc. | High-temperature exhaust sensor |
| CN106768592A (en) * | 2017-02-24 | 2017-05-31 | 中国电子科技集团公司第三十八研究所 | A kind of pressure transmitter oil filling core body of band signal processing function |
| US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| US11105698B2 (en) | 2017-05-04 | 2021-08-31 | Sensata Technologies, Inc. | Method of assembling a sensing device having a double clinch seal |
| US10502641B2 (en) | 2017-05-18 | 2019-12-10 | Sensata Technologies, Inc. | Floating conductor housing |
| US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10969288B2 (en) | 2017-06-30 | 2021-04-06 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
| US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
| WO2022085497A1 (en) * | 2020-10-20 | 2022-04-28 | イーグル工業株式会社 | Pressure and temperature sensor |
| EP4235132A4 (en) * | 2020-10-20 | 2024-09-25 | Eagle Ind Co Ltd | Pressure and temperature sensor |
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Application publication date: 20131218 |