CN103418928A - Novel lead-free solder wire - Google Patents
Novel lead-free solder wire Download PDFInfo
- Publication number
- CN103418928A CN103418928A CN2013103767434A CN201310376743A CN103418928A CN 103418928 A CN103418928 A CN 103418928A CN 2013103767434 A CN2013103767434 A CN 2013103767434A CN 201310376743 A CN201310376743 A CN 201310376743A CN 103418928 A CN103418928 A CN 103418928A
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- layer
- free solder
- novel lead
- tin layer
- solder stick
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Abstract
The invention relates to a novel lead-free solder wire, comprising a welding assisting layer, a tin layer and an anti-oxidation layer; the tin layer is wrapped on the face of the welding assisting layer; the anti-oxidation layer is uniformly coated on the face of the tin layer; at least one semicircular convex face is arranged at the outer face of the welding assisting layer; at least one interlayer is arranged in the tin layer. The face of the novel lead-free solder wire is not oxidative, the firmness of welding points is ensured, the welding assisting layer can be uniformly released due to the arrangement of the semicircular convex face, and the welding quality is high as the interlayer is arranged in the tin layer.
Description
Technical field
The present invention relates to a kind of novel lead-free solder stick.
Background technology
Scolding tin is the essential industry raw material of connecting electronic components and parts in the welding circuit, is widely used in electronics industry, household appliances manufacturing, auto manufacturing, maintenance industry and daily life.Solder stick is manual welding circuit board, scolder the most easily.Solder stick can be divided into lead-free soldering wire and plumbous solder stick is arranged by its metal ingredient, and the different solder stick of composition has different fusing points, and purposes is also had nothing in common with each other.
The main component of lead-free soldering wire is tin, is a kind of lead-free tin alloy silk.Because of the solder stick diameter too small, the solder stick of prior art is the wire-shaped of monolithic extruded moulding, must additionally add scaling powder when welding, thereby cause the welding residue uncontrollable, affect the reliability of solder joint, and production efficiency is low, be difficult to realize continuous welding, simultaneously, solder stick surface oxidation-resistant ability, easily oxidation deterioration, affect welding quality and intensity.
Summary of the invention
The objective of the invention is, in order to overcome the deficiencies in the prior art, provides a kind of novel lead-free solder stick.
The present invention is achieved through the following technical solutions:
A kind of novel lead-free solder stick, comprise and help layer, tin layer and anti oxidation layer, described tin layer is coated on the surface that helps layer, described anti oxidation layer is coated in the surface of tin layer equably, the described outer surface of layer that helps is provided with at least one semi-cylindrical hill face, in described tin layer, is provided with at least one interlayer.
Further, the quantity of described semi-cylindrical hill face is four, and helps layer one-body molded.
Further, the rounded structure of described tin layer cross section, its diameter is 0.55-0.85mm.
Further, the cross section of described anti oxidation layer is rounded, and its thickness is 2.0-5.0 μ m.
Further, the quantity of described interlayer is four, along the tin layer, circumferentially is uniformly distributed.
Compared with prior art, the invention has the beneficial effects as follows: the present invention can prevent surface oxidation, has guaranteed the fastness of solder joint; By the semi-cylindrical hill face is set, help layer evenly to discharge; By sandwich establishment in the tin layer, welding quality is high.
The accompanying drawing explanation
The structural representation that Fig. 1 is a kind of novel lead-free solder stick of the present invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1, the structural representation that Fig. 1 is a kind of novel lead-free solder stick of the present invention.
Described a kind of novel lead-free solder stick, comprise and help layer 1, tin layer 3 and anti oxidation layer 5, described tin layer 3 is coated on the surface that helps layer 1, described anti oxidation layer 5 is coated in the surface of tin layer 3 equably, and the described outer surface of layer 1 that helps is provided with at least one semi-cylindrical hill face 2, as preferred version, the quantity of described semi-cylindrical hill face 2 is four, with helping, layer 1 is one-body molded, by semi-cylindrical hill face 2 is set, helps layer 1 evenly to discharge.
Be provided with at least one interlayer 4 in described tin layer 3, as preferred version, the quantity of interlayer 4 is four, along tin layer 3, circumferentially is uniformly distributed, and by the interior sandwich establishment 4 of tin layer 3, welding quality is high.
The described tin layer 3 rounded structure in cross section, its diameter is 0.55-0.85mm, and the cross section of described anti oxidation layer 5 is rounded, and its thickness is 2.0-5.0 μ m.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. a novel lead-free solder stick, comprise and help layer (1), tin layer (3) and anti oxidation layer (5), described tin layer (3) is coated on the surface that helps layer (1), described anti oxidation layer (5) is coated in the surface of tin layer (3) equably, it is characterized in that, the described outer surface of layer (1) that helps is provided with at least one semi-cylindrical hill face (2), is provided with at least one interlayer (4) in described tin layer (3).
2. a kind of novel lead-free solder stick according to claim 1, is characterized in that, the quantity of described semi-cylindrical hill face (2) is four, and with helping, layer (1) is one-body molded.
3. a kind of novel lead-free solder stick according to claim 1, is characterized in that, the rounded structure in described tin layer (3) cross section, and its diameter is 0.55-0.85mm.
4. a kind of novel lead-free solder stick according to claim 1, is characterized in that, the cross section of described anti oxidation layer (5) is rounded, and its thickness is 2.0-5.0 μ m.
5. a kind of novel lead-free solder stick according to claim 1, is characterized in that, the quantity of described interlayer (4) is four, along tin layer (3), circumferentially is uniformly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103767434A CN103418928A (en) | 2013-08-27 | 2013-08-27 | Novel lead-free solder wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103767434A CN103418928A (en) | 2013-08-27 | 2013-08-27 | Novel lead-free solder wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103418928A true CN103418928A (en) | 2013-12-04 |
Family
ID=49644577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103767434A Pending CN103418928A (en) | 2013-08-27 | 2013-08-27 | Novel lead-free solder wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103418928A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551438A (en) * | 2014-11-13 | 2015-04-29 | 上海施威焊接产业有限公司 | Submerged-arc welding tubular flux-cored wire |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB947474A (en) * | 1961-11-17 | 1964-01-22 | Intercito Holding | Improvements in or relating to welding electrodes |
| US4973809A (en) * | 1986-11-03 | 1990-11-27 | Jenkins Henry H | Cutting and gouging electrode |
| CN202780257U (en) * | 2012-09-05 | 2013-03-13 | 昆山市宏嘉焊锡制造有限公司 | Solder wire |
| CN202846039U (en) * | 2012-09-25 | 2013-04-03 | 昆山市圣翰锡业有限公司 | Novel tin wire |
| CN203509374U (en) * | 2013-08-27 | 2014-04-02 | 昆山市宏嘉焊锡制造有限公司 | Novel lead-free solder wire |
-
2013
- 2013-08-27 CN CN2013103767434A patent/CN103418928A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB947474A (en) * | 1961-11-17 | 1964-01-22 | Intercito Holding | Improvements in or relating to welding electrodes |
| US4973809A (en) * | 1986-11-03 | 1990-11-27 | Jenkins Henry H | Cutting and gouging electrode |
| CN202780257U (en) * | 2012-09-05 | 2013-03-13 | 昆山市宏嘉焊锡制造有限公司 | Solder wire |
| CN202846039U (en) * | 2012-09-25 | 2013-04-03 | 昆山市圣翰锡业有限公司 | Novel tin wire |
| CN203509374U (en) * | 2013-08-27 | 2014-04-02 | 昆山市宏嘉焊锡制造有限公司 | Novel lead-free solder wire |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104551438A (en) * | 2014-11-13 | 2015-04-29 | 上海施威焊接产业有限公司 | Submerged-arc welding tubular flux-cored wire |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |