CN103414003A - Defected ground structure interdigital coupler - Google Patents
Defected ground structure interdigital coupler Download PDFInfo
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- CN103414003A CN103414003A CN2013103043837A CN201310304383A CN103414003A CN 103414003 A CN103414003 A CN 103414003A CN 2013103043837 A CN2013103043837 A CN 2013103043837A CN 201310304383 A CN201310304383 A CN 201310304383A CN 103414003 A CN103414003 A CN 103414003A
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Abstract
The invention provides a defected ground structure interdigital coupler. Wire jumping bridging is adopted in the coupler to achieve four-wire interdigital coupling, accordingly, the large bandwidth is obtained, meanwhile, a DGS at the position of a ground plate of an interdigital coupling structure is introduced, current distribution of the interdigital coupling structure is changed, strong coupling of the coupler is guaranteed, the good isolation effect is achieved at the same time, and the work bandwidth of the coupler can be effectively increased. Meanwhile, the defected ground structure interdigital coupler is small in size and simple in structure, can be easily integrated with other parts, and reduces requirements for the processing process.
Description
Technical field
The invention belongs to microwave technical field, specifically refer to the interdigital coupler of a kind of defect grounding structure.
Background technology
Coupler, as a kind of microwave passive component, has indispensable effect in the development of whole microwave system; The development of Wideband/Ultra-Wideband communication has proposed harsher requirement to comprising coupler in interior microwave passive component.Coupler possesses the instructions for use that larger bandwidth can meet broadband connections, can also increase the versatility of device.No matter be coupler or the filter of realizing by coupled structure, in order to realize larger bandwidth, all require coupled structure that stronger coupling is arranged; For interdigital coupled structure, close coupling means that the spacing between coupling band and band becomes very little, this can worsen the isolation effect of coupler on the one hand, cause isolation end to disperse the energy of straight-through end and coupled end, during the design coupler, need to suppress the isolation end ability, on the other hand production technology is had higher requirement, even cause common printed circuit board technique not reach required precision.
Defect grounding structure DGS refers to the cut-out of transmission line ground plate, is used for reducing the wavelength of transmission line or increases the characteristic impedance of transmission line.
Summary of the invention
Technical problem to be solved by this invention is in order to overcome the deficiencies in the prior art, provides a kind of defect grounding structure interdigital coupler.Described coupler is little for the interdigital coupler coupling in broadband band gap, thereby worsen isolation effect and to the problem of processing required precision harshness etc., aim to provide the interdigital coupler in broadband that a kind of isolation effect is good, reduce simultaneously the requirement to production technology.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
The interdigital coupler of a kind of defect grounding structure, comprise medium substrate, and the one side of described medium substrate is amplexiformed respectively first to fourth coupling metal band, first to fourth microstrip feed line; The another side of medium substrate amplexiforms micro-band ground plate and DGS defect sturcture; Described first to fourth coupling metal band is arranged at the centre position of medium substrate one side; Described DGS defect sturcture is positioned at described first to fourth coupling metal band correspondence position;
Described first to fourth coupling metal band is along the vertically parallel arranged successively of medium substrate;
One end of described the first coupling metal band is connected by the first metal jumper with homonymy one end of the 3rd coupling metal band, and the other end of the first coupling metal band is connected by the second metal jumper with the homonymy other end of the 3rd coupling metal band;
One end of described the second coupling metal band is connected by the 3rd metal jumper with homonymy one end of the 4th coupling metal band, and the other end of the second coupling metal band is connected by the 4th metal jumper with the homonymy other end of the 4th coupling metal band;
One end of described the first coupling metal band is held row level with both hands with one of the second microstrip feed line and is connected with vertical connection of an end of the first microstrip feed line, the other end of the first coupling metal band;
One end of described the 4th coupling metal band is held row level with both hands with one of the 4th microstrip feed line and is connected, the other end of the 4th coupling metal band and vertical connection of an end of the 3rd microstrip feed line;
The other end of described first to fourth microstrip feed line extends to respectively the medium substrate edge.
Described DGS structure is I font or rectangle or circular configuration.
Described DGS structure is single DGS unit or a plurality of DGS unit.
The invention has the beneficial effects as follows: the invention provides the interdigital coupler of a kind of defect grounding structure.Described coupler adopts the wire jumper cross-over connection to realize the interdigital coupling of four lines, thereby obtain larger bandwidth, introduce simultaneously the DGS defect sturcture at interdigital coupled structure ground plate place, change the CURRENT DISTRIBUTION of coupled structure, when guaranteeing the coupler close coupling, good isolation effect is arranged, and can effectively improve the bandwidth of operation of coupler.Simultaneously, coupler of the present invention has less volume, and simple structure is easy to miscellaneous part integratedly, reduces the requirement to processing technology.
The accompanying drawing explanation
Fig. 1 is the front schematic view of DGS structure Coupling device.
Fig. 2 is the reverse side schematic diagram of DGS structure Coupling device.
Fig. 3 is the frequency response of coupler.
Description of reference numerals, in Fig. 1 and Fig. 2,1 is the 4th microstrip feed line, 2 is the 3rd microstrip feed lines, 3 is second microstrip feed lines, and 4 is the firstth microstrip feed lines, and 5 is first coupling metal bands, 6 is second coupling metal bands, and 7 is the 3rd coupling metal bands, and 8 is the 4th coupling metal bands, 9 is first metal jumper, and 10 is second metal jumper, and 11 is the 3rd metal jumper, 12 is the 4th metal jumper, the 13rd, micro-band ground plate, the 14th, DGS defect grounding structure, the 15th, medium substrate.
Embodiment
The interdigital coupler of a kind of defect grounding structure provided by the invention, as depicted in figs. 1 and 2,
The interdigital coupler of a kind of defect grounding structure, comprise medium substrate 15, and the one side of described medium substrate 15 is amplexiformed respectively four coupling metal bands, four microstrip feed lines; The another side of medium substrate 15 amplexiforms micro-band ground plate 13 and DGS defect sturcture 14; Described four coupling metal bands are arranged at the centre position of medium substrate; Described DGS defect sturcture is positioned at described four coupling metal band correspondence positions;
Described four coupling metal bands are respectively first to fourth coupling metal bands; Described first to fourth coupling metal band is parallel arranged successively;
Described four microstrip feed lines are respectively first to fourth microstrip feed lines;
One end of described the first coupling metal band 5 is connected by the first metal jumper 9 with homonymy one end of the 3rd coupling metal band 7, and the other end of the first coupling metal band 5 is connected by the second metal jumper 10 with the homonymy other end of the 3rd coupling metal band 7;
One end of described the second coupling metal band 6 is connected by the 3rd metal jumper 11 with homonymy one end of the 4th coupling metal band 8, and the other end of the second coupling metal band 6 is connected by the 4th metal jumper 12 with the homonymy other end of the 4th coupling metal band 8;
One end of described the first coupling metal band 5 is held row level with both hands with one of the second microstrip feed line 3 and is connected with vertical connection of an end of the first microstrip feed line 4, the other end of the first coupling metal band 5;
One end of described the 4th coupling metal band 8 is held row level with both hands with one of the 4th microstrip feed line 1 and is connected, the other end of the 4th coupling metal band 8 and vertical connection of an end of the 3rd microstrip feed line 2;
The other end of described first to fourth microstrip feed line extends to respectively the medium substrate edge.
Described DGS structure 14 is I font or rectangle or circular configuration.
Described DGS structure 14 is single DGS unit or a plurality of DGS unit.
Described metal jumper is circular metal line or belt shape line, and the metal jumper height is selected differing heights according to use occasion, is 100um～300um herein.
What in Fig. 3, provide is that medium substrate 15 thickness are that 0.254mm, relative dielectric constant are 2.94, when DGS structure 14 is single I character form structure, the frequency response of adopting HFSS software to calculate, wherein S (1,1), S (2,1) are respectively that return loss and isolation respond, S (3,1), S (4,1) be respectively straight-through response and coupling response, as can be seen from the figure in the whole frequency band range provided, coupler all has result preferably.
Claims (3)
1. the interdigital coupler of defect grounding structure, is characterized in that, comprises medium substrate, and the one side of described medium substrate is amplexiformed respectively first to fourth coupling metal band, first to fourth microstrip feed line; The another side of medium substrate amplexiforms micro-band ground plate and DGS defect sturcture; Described first to fourth coupling metal band is arranged at the centre position of medium substrate one side; Described DGS defect sturcture is positioned at described first to fourth coupling metal band correspondence position;
Described first to fourth coupling metal band is along the vertically parallel arranged successively of medium substrate;
One end of described the first coupling metal band is connected by the first metal jumper with homonymy one end of the 3rd coupling metal band, and the other end of the first coupling metal band is connected by the second metal jumper with the homonymy other end of the 3rd coupling metal band;
One end of described the second coupling metal band is connected by the 3rd metal jumper with homonymy one end of the 4th coupling metal band, and the other end of the second coupling metal band is connected by the 4th metal jumper with the homonymy other end of the 4th coupling metal band;
One end of described the first coupling metal band is held row level with both hands with one of the second microstrip feed line and is connected with vertical connection of an end of the first microstrip feed line, the other end of the first coupling metal band;
One end of described the 4th coupling metal band is held row level with both hands with one of the 4th microstrip feed line and is connected, the other end of the 4th coupling metal band and vertical connection of an end of the 3rd microstrip feed line;
The other end of described first to fourth microstrip feed line extends to respectively the medium substrate edge.
2. the interdigital coupler of a kind of defect grounding structure as claimed in claim 1, is characterized in that, described DGS defect sturcture is I font or rectangle or circular configuration.
3. the interdigital coupler of a kind of defect grounding structure as claimed in claim 1, is characterized in that, described DGS defect sturcture is single DGS defective unit or a plurality of DGS defective unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103043837A CN103414003A (en) | 2013-07-18 | 2013-07-18 | Defected ground structure interdigital coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103043837A CN103414003A (en) | 2013-07-18 | 2013-07-18 | Defected ground structure interdigital coupler |
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| CN103414003A true CN103414003A (en) | 2013-11-27 |
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| CN2013103043837A Pending CN103414003A (en) | 2013-07-18 | 2013-07-18 | Defected ground structure interdigital coupler |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104466336A (en) * | 2014-10-24 | 2015-03-25 | 南京邮电大学 | Broadband directional coupler used for 4G mobile communication |
| CN110034367A (en) * | 2019-04-22 | 2019-07-19 | 南京理工大学 | High isolation broadband power divider based on vertical ellipse coupled structure |
| CN110085960A (en) * | 2019-04-24 | 2019-08-02 | 深圳市共进电子股份有限公司 | A kind of microstrip coupler and PCB circuit board |
| CN110797620A (en) * | 2019-10-22 | 2020-02-14 | 中国电子科技集团公司第十三研究所 | 3dB bridge and preparation method thereof |
| CN113422207A (en) * | 2021-05-08 | 2021-09-21 | 中国科学院空天信息创新研究院 | Butler matrix circuit and electronic device |
| CN113659299A (en) * | 2021-08-30 | 2021-11-16 | 中信科移动通信技术股份有限公司 | Electric bridge |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120112857A1 (en) * | 2010-11-10 | 2012-05-10 | Jongsik Lim | Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same |
-
2013
- 2013-07-18 CN CN2013103043837A patent/CN103414003A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120112857A1 (en) * | 2010-11-10 | 2012-05-10 | Jongsik Lim | Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same |
Non-Patent Citations (2)
| Title |
|---|
| SEN-KUEI HSU ET AL.: "Size-Reduction of 3 dB Microstrip Forward-Wave Coupler Using Defected Ground Structure", 《PROCEEDINGS OF THE ASIA-PACIFIC MICROWAVE CONFERENCE 2011》 * |
| 李勇 等: "S波段小型Lange 耦合器的应用设计", 《微波学报》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104466336A (en) * | 2014-10-24 | 2015-03-25 | 南京邮电大学 | Broadband directional coupler used for 4G mobile communication |
| CN110034367A (en) * | 2019-04-22 | 2019-07-19 | 南京理工大学 | High isolation broadband power divider based on vertical ellipse coupled structure |
| CN110085960A (en) * | 2019-04-24 | 2019-08-02 | 深圳市共进电子股份有限公司 | A kind of microstrip coupler and PCB circuit board |
| CN110085960B (en) * | 2019-04-24 | 2024-08-30 | 深圳市共进电子股份有限公司 | Microstrip coupler and PCB circuit board |
| CN110797620A (en) * | 2019-10-22 | 2020-02-14 | 中国电子科技集团公司第十三研究所 | 3dB bridge and preparation method thereof |
| CN110797620B (en) * | 2019-10-22 | 2022-08-02 | 中国电子科技集团公司第十三研究所 | 3dB bridge and preparation method thereof |
| CN113422207A (en) * | 2021-05-08 | 2021-09-21 | 中国科学院空天信息创新研究院 | Butler matrix circuit and electronic device |
| CN113659299A (en) * | 2021-08-30 | 2021-11-16 | 中信科移动通信技术股份有限公司 | Electric bridge |
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Application publication date: 20131127 |