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CN103363363A - Light-emitting diode light bar - Google Patents

Light-emitting diode light bar Download PDF

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Publication number
CN103363363A
CN103363363A CN2012100897200A CN201210089720A CN103363363A CN 103363363 A CN103363363 A CN 103363363A CN 2012100897200 A CN2012100897200 A CN 2012100897200A CN 201210089720 A CN201210089720 A CN 201210089720A CN 103363363 A CN103363363 A CN 103363363A
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line layer
plate body
emitting diode
metal level
light bar
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CN2012100897200A
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CN103363363B (en
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林茗仪
张超雄
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to TW101112586A priority patent/TWI489059B/en
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Abstract

一种发光二极管灯条,包括基板及若干个装设于该基板上的发光二极管光源,该基板包括一板体和一线路层,该板体具有相对的一上表面和一下表面,该线路层设置在该板体的上表面上,该发光二极管光源与线路层形成电连接,该基板还包括设置于该板体的下表面上的金属层,该金属层与线路层受热时,该金属层所受的热应力与该线路层所受的热应力方向相反。

Figure 201210089720

A light emitting diode light bar, including a base plate and several light emitting diode light sources installed on the base plate, the base plate includes a plate body and a circuit layer, the plate body has an upper surface and a lower surface opposite to each other, the circuit layer It is arranged on the upper surface of the board, and the LED light source is electrically connected to the circuit layer. The substrate also includes a metal layer arranged on the lower surface of the board. When the metal layer and the circuit layer are heated, the metal layer The direction of thermal stress suffered is opposite to that of the circuit layer.

Figure 201210089720

Description

发光二极管灯条LED strip

技术领域 technical field

本发明涉及一种发光二极管灯条。 The invention relates to a light emitting diode light bar.

背景技术 Background technique

相比于传统的发光源,发光二极管(Light Emitting Diode,LED)具有重量轻、体积小、污染低、寿命长等优点,其作为一种新型的发光源,已经被越来越多地应用到各领域当中,如路灯、交通灯、信号灯、射灯及装饰灯等。 Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, they have been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights.

现有技术中发光二极管灯条通常包括有若干发光二极管光源、一板体和设置在该板体上表面的线路层,该若干发光二极管光源分别与线路层电性连接。然而,该板体一般为塑料材质,线路层一般为金属材质,金属受热时的形变大于塑料,因此,发光二极管灯条受热后,线路层容易发生弯翘使得发光二极管光源脱落。 The LED light bar in the prior art generally includes several LED light sources, a board body and a circuit layer arranged on the upper surface of the board body, and the several LED light sources are respectively electrically connected to the circuit layer. However, the board body is generally made of plastic, and the circuit layer is generally made of metal. Metal deforms more than plastic when heated. Therefore, after the LED light bar is heated, the circuit layer is prone to warp and the LED light source will fall off.

发明内容 Contents of the invention

有鉴于此,本发明旨在提供一种使发光二极管光源不易脱落的发光二极管灯条。 In view of this, the present invention aims to provide an LED light bar in which the LED light source is not easy to fall off.

一种发光二极管灯条,包括基板及若干个装设于该基板上的发光二极管光源,该基板包括一板体和一线路层,该板体具有相对的一上表面和一下表面,该线路层设置在该板体的上表面上,该发光二极管光源与线路层形成电连接,该基板还包括设置于该板体的下表面上的金属层,该金属层与线路层受热时,该金属层所受的热应力与该线路层所受的热应力方向相反。 A light emitting diode light bar, including a base plate and several light emitting diode light sources installed on the base plate, the base plate includes a plate body and a circuit layer, the plate body has an upper surface and a lower surface opposite to each other, the circuit layer It is arranged on the upper surface of the board, and the LED light source is electrically connected to the circuit layer. The substrate also includes a metal layer arranged on the lower surface of the board. When the metal layer and the circuit layer are heated, the metal layer The thermal stress suffered is opposite to that of the circuit layer.

本发明通过在板体的下表面上设置有金属层,从而使板体的上表面上的线路层和下表面上的金属层在受热时受到的热应力方向相反,基板达到热应变平衡从而不易变形,进而使得发光二极管光源不易脱落。 In the present invention, a metal layer is provided on the lower surface of the board, so that the thermal stress directions of the circuit layer on the upper surface of the board and the metal layer on the lower surface are opposite when heated, and the substrate reaches a thermal strain balance so that it is not easy to deformation, so that the LED light source is not easy to fall off.

附图说明 Description of drawings

图1为本发明的发光二极管灯条的第一实施例的剖面示意图。 FIG. 1 is a schematic cross-sectional view of the first embodiment of the LED light bar of the present invention.

图2为本发明的发光二极管灯条的第一实施例的俯视图。 FIG. 2 is a top view of the first embodiment of the LED light bar of the present invention.

图3为本发明的发光二极管灯条的第一实施例的仰视图。 FIG. 3 is a bottom view of the first embodiment of the LED light bar of the present invention.

图4为本发明的发光二极管灯条的第二实施例的剖面示意图。 FIG. 4 is a schematic cross-sectional view of a second embodiment of the LED light bar of the present invention.

图5为本发明的发光二极管灯条的第二实施例的仰视图。 FIG. 5 is a bottom view of the second embodiment of the LED light bar of the present invention.

主要元件符号说明 Description of main component symbols

发光二极管灯条LED strip 1、1a1, 1a 第一基板first substrate 1010 板体Board 1111 上表面upper surface 111111 下表面lower surface 112112 侧面side 113113 线路层line layer 1212 导电片Conductive sheet 121121 金属层metal layer 1313 金属片Metal sheets 131131 网状结构grid 1414 发光二极管光源LED light source 2020 第二基板second substrate 21twenty one 电极结构electrode structure 22twenty two 发光二极管芯片LED chip 23twenty three 反射层reflective layer 24twenty four 封装层encapsulation layer 2525

如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

具体实施方式 Detailed ways

如图1至图3所示,本发明第一实施例提供的发光二极管灯条1,其包括第一基板10和装设于第一基板10上的若干发光二极管光源20。 As shown in FIGS. 1 to 3 , the LED light bar 1 provided by the first embodiment of the present invention includes a first substrate 10 and a plurality of LED light sources 20 installed on the first substrate 10 .

第一基板10包括一板体11、设置于板体11上的线路层12和金属层13。 The first substrate 10 includes a board body 11 , a circuit layer 12 and a metal layer 13 disposed on the board body 11 .

板体11呈平板状,其具有一上表面111、一下表面112及两个连接在该上表面111和下表面112之间的侧面113。于本实施例中,板体11由树脂材料制成。 The plate body 11 is flat and has an upper surface 111 , a lower surface 112 and two side surfaces 113 connected between the upper surface 111 and the lower surface 112 . In this embodiment, the board body 11 is made of resin material.

线路层12由金属材料制成,用于与外部进行电性连接。线路层12包括若干间隔设置的导电片121,且若干导电片121从其中一侧面113至相对的另一侧面113呈线状排列。靠近该相对的两侧面113的两个导电片121从板体11的上表面111延伸至侧面113将该侧面113包覆,并继续延伸至下表面112。该导电片121沿垂直于线路层12延伸方向上的宽度小于板体11的宽度。于本实施方式中,当该线路层12受热时,该线路层12所受的热应力方向背离上表面111而向上。 The circuit layer 12 is made of metal material for electrical connection with the outside. The circuit layer 12 includes a plurality of conductive sheets 121 arranged at intervals, and the plurality of conductive sheets 121 are arranged in a line form from one side 113 to the opposite side 113 . The two conductive sheets 121 adjacent to the opposite side surfaces 113 extend from the upper surface 111 of the board body 11 to the side surface 113 covering the side surface 113 , and continue to extend to the lower surface 112 . The width of the conductive sheet 121 along the direction perpendicular to the extending direction of the circuit layer 12 is smaller than the width of the board body 11 . In this embodiment, when the circuit layer 12 is heated, the thermal stress direction of the circuit layer 12 is away from the upper surface 111 and upward.

金属层13包括若干间隔设置的金属片131,且该金属片131从板体11的其中一侧面113至另一侧面113呈线状排列,其沿垂直于金属层13延伸方向的宽度小于板体11的宽度。制成金属层13的材料与制成线路层12的材料的热膨胀系数相当,当该金属层13与线路层12受热时,该金属层13所受的热应力与该线路层12所受的热应力大小相同,方向相反。于本实施方式中,金属层13的热应力方向背离下表面112而向下,制成金属层13的材料与制成线路层12的材料相同。每个金属片131均呈矩形,且金属片131与线路层12间隔设置,金属层13的厚度与线路层12的厚度大致相同,金属层13的总面积与位于板体11的上表面111上的线路层12的面积大致相同,以使该金属层13与线路层12受热时所受的热应力大小大致相同。 The metal layer 13 includes a number of metal sheets 131 arranged at intervals, and the metal sheets 131 are arranged in a line from one side 113 to the other side 113 of the plate body 11, and the width along the direction perpendicular to the extension of the metal layer 13 is smaller than that of the plate body. 11 width. The material that makes metal layer 13 is equivalent to the thermal expansion coefficient of the material that makes circuit layer 12, when this metal layer 13 and circuit layer 12 are heated, the thermal stress that this metal layer 13 suffers is the same as the heat that this circuit layer 12 suffers. The stresses are of the same magnitude and opposite in direction. In this embodiment, the thermal stress direction of the metal layer 13 is away from the lower surface 112 and downward, and the metal layer 13 is made of the same material as the circuit layer 12 . Each metal sheet 131 is rectangular, and the metal sheet 131 is spaced apart from the circuit layer 12. The thickness of the metal layer 13 is approximately the same as that of the circuit layer 12. The areas of the circuit layer 12 are approximately the same, so that the thermal stresses received by the metal layer 13 and the circuit layer 12 are approximately the same when heated.

该多个发光二极管光源20间隔设置于板体11的上表面111上且分别与线路层12形成电连接。于本实施例中,发光二极管光源20为发光二极管封装结构,其对应金属片131设置。发光二极管光源20包括具有电极结构22的第二基板21,装设于电极结构22上且与电极结构22电性连接的发光二极管芯片23,围设发光二极管芯片23的反射层24,以及密封发光二极管芯片23的封装层25。电极结构22与两相邻的导电片121形成电连接,从而为该多个发光二极管光源20供电。 The plurality of LED light sources 20 are arranged at intervals on the upper surface 111 of the board body 11 and are respectively electrically connected to the circuit layer 12 . In this embodiment, the light emitting diode light source 20 is a light emitting diode packaging structure, which is disposed corresponding to the metal sheet 131 . The light emitting diode light source 20 includes a second substrate 21 having an electrode structure 22, a light emitting diode chip 23 mounted on the electrode structure 22 and electrically connected to the electrode structure 22, a reflective layer 24 surrounding the light emitting diode chip 23, and sealing the light emitting diode chip 23. The encapsulation layer 25 of the diode chip 23 . The electrode structure 22 is electrically connected to two adjacent conductive sheets 121 , so as to supply power to the plurality of LED light sources 20 .

发光二极管灯条1在工作过程中,该多个发光二极管光源20会产生大量的热量,本发明通过在板体11的下表面112上设置金属层13,且金属层13受到的热应力方向与线路层12受到的热应力方向相反,从而使得第一基板10在一定程度上热应力相抵消。当金属层13的面积与位于板体11的上表面111的线路层12的面积和厚度均相等时,板体11的上表面111上的线路层12和金属层13受到的热应力方向相反,且大小相同,进而使第一基板10达到热应变平衡而不易向上或向下弯曲变形,发光二极管光源20不易脱落;另外,可使发光二极管灯条1固定于其它装置(如散热装置)上时,第一基板10与其它装置之间不易形成间隙,使发光二极管灯条1产生的大量热量可快速传导至其它装置上,有利于热量的散发,提高发光二极管灯条1的使用寿命。 During the working process of the LED light bar 1, the plurality of LED light sources 20 will generate a large amount of heat. The present invention arranges the metal layer 13 on the lower surface 112 of the board body 11, and the thermal stress direction of the metal layer 13 is consistent with the The direction of thermal stress experienced by the circuit layer 12 is opposite, so that the thermal stress of the first substrate 10 can be offset to a certain extent. When the area of the metal layer 13 is equal to the area and thickness of the circuit layer 12 located on the upper surface 111 of the plate body 11, the direction of thermal stress received by the circuit layer 12 and the metal layer 13 on the upper surface 111 of the plate body 11 is opposite, And the size is the same, so that the first substrate 10 can reach the thermal strain balance and is not easy to bend upwards or downwards, and the LED light source 20 is not easy to fall off; in addition, when the LED light bar 1 can be fixed on other devices (such as heat sinks) , It is not easy to form a gap between the first substrate 10 and other devices, so that a large amount of heat generated by the LED light bar 1 can be quickly transferred to other devices, which is conducive to heat dissipation and improves the service life of the LED light bar 1 .

请同时参阅图4和图5,其所示为本发明第二实施例提供的发光二极管灯条1a,本发明第二实施例中的发光二极管灯条1a与第一实施例中发光二极管灯条1相似,其区别仅在于:在相邻的两金属片131之间和/或金属片131与导电片121之间的间隙中设置网状结构14,用以减缓由于发光二极管光源20散发的热量造成的第一基板10的形变。于本实施例中,网状结构14为金属材质,其厚度与金属片131的厚度相同,且网状结构14的热应力方向背离下表面112向下,且金属层13的总面积较位于板体11的上表面111上的线路层12的面积略小。可以理解地,网状结构14也可由其它材质制成。当然,该线路层12相邻的两导电片121之间也可设置绝缘的网状结构,用以进一步减缓由于发光二极管光源20散发的热量造成的第一基板10的形变。 Please refer to Figure 4 and Figure 5 at the same time, which shows the LED light bar 1a provided by the second embodiment of the present invention, the LED light bar 1a in the second embodiment of the present invention is the same as the LED light bar in the first embodiment 1, the only difference is that a mesh structure 14 is set between two adjacent metal sheets 131 and/or in the gap between the metal sheet 131 and the conductive sheet 121 to slow down the heat emitted by the LED light source 20 The deformation of the first substrate 10 is caused. In this embodiment, the mesh structure 14 is made of metal, and its thickness is the same as that of the metal sheet 131, and the thermal stress direction of the mesh structure 14 is away from the lower surface 112 downward, and the total area of the metal layer 13 is larger than that of the metal sheet 131. The area of the circuit layer 12 on the upper surface 111 of the body 11 is slightly smaller. Understandably, the mesh structure 14 can also be made of other materials. Of course, an insulating mesh structure may also be provided between two adjacent conductive sheets 121 of the circuit layer 12 to further slow down the deformation of the first substrate 10 caused by the heat emitted by the LED light source 20 .

本发明的技术内容及技术特点已揭露如上,然而本领域技术人员仍可能基于本发明的教示及揭示而作出种种不背离本发明精神的替换及修饰。因此,本发明的保护范围应不限于实施例所揭示的内容,而应包括各种不背离本发明的替换及修饰,并为所附的权利要求所涵盖。 The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various replacements and modifications that do not depart from the present invention, and should be covered by the appended claims.

Claims (10)

1. light-emitting diode light bar, comprise that substrate and several are installed in the LED source on this substrate, this substrate comprises a plate body and a line layer, this plate body has relative a upper surface and a lower surface, this line layer is arranged on the upper surface of this plate body, this LED source forms with line layer and is electrically connected, it is characterized in that: this substrate also comprises the metal level on the lower surface that is arranged at this plate body, when this metal level and line layer are heated, the thermal stress opposite direction that the thermal stress that this metal level is suffered and this line layer are suffered.
2. light-emitting diode light bar as claimed in claim 1 is characterized in that: when this metal level and line layer were heated, the suffered thermal stress size of this metal level and line layer was identical.
3. light-emitting diode light bar as claimed in claim 2, it is characterized in that: the thickness of this metal level equates that with the thickness of this line layer the area of this metal level equates with the area of this line layer on the upper surface of this plate body.
4. light-emitting diode light bar as claimed in claim 2 is characterized in that: the material of making this metal level is suitable with the thermal coefficient of expansion of the material of making this line layer.
5. light-emitting diode light bar as claimed in claim 4, it is characterized in that: this metal level is made by identical metal material with this line layer.
6. such as the described light-emitting diode light bar of claim 1 to 5 any one, it is characterized in that: this line layer comprises the conducting strip that some intervals arrange, the network structure of insulation is set between the two adjacent conducting strips, in order to slow down because the deformation of the substrate that the heat of this LED source heat radiation causes.
7. such as the described light-emitting diode light bar of claim 1 to 5 any one, it is characterized in that: this metal level comprises the sheet metal that some intervals arrange, be provided with network structure in the gap between the adjacent two metal sheets, in order to slow down because the deformation of the substrate that the heat of this LED source heat radiation causes.
8. light-emitting diode light bar as claimed in claim 7, it is characterized in that: this line layer is extended to the lower surface of plate body by the side of plate body from the upper surface of plate body, the sheet metal of this metal level and line layer interval arrange, be provided with network structure in adjacent sheet metal and the gap between the conducting strip, in order to slow down because the deformation of the substrate that the heat of this LED source heat radiation causes.
9. such as the described light-emitting diode light bar of claim 1 to 5 any one, it is characterized in that: the upper surface that the thermal stress direction of this line layer deviates from plate body upwards, it is downward that the thermal stress direction of this metal level deviates from the lower surface of plate body.
10. such as the described light-emitting diode light bar of claim 1 to 5 any one, it is characterized in that: this line layer is the linear alignment from an end to the other end of this plate body, and it is along perpendicular to the width of this line layer bearing of trend width less than this plate body, this metal level is the linear alignment from an end to the other end of this plate body, and it is along perpendicular to the width of this metal level bearing of trend width less than this plate body.
CN201210089720.0A 2012-03-30 2012-03-30 Light-emitting diode light bar Active CN103363363B (en)

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TW101112586A TWI489059B (en) 2012-03-30 2012-04-10 Led light bar

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CN102155634A (en) * 2010-02-11 2011-08-17 佰鸿工业股份有限公司 LED light emitting module and manufacturing method thereof

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CN104235661A (en) * 2013-06-19 2014-12-24 瑞轩科技股份有限公司 Light bar and direct type backlight module
CN111983849A (en) * 2020-08-10 2020-11-24 深圳市华星光电半导体显示技术有限公司 LED backlight module

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