CN103363363A - Light-emitting diode light bar - Google Patents
Light-emitting diode light bar Download PDFInfo
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- CN103363363A CN103363363A CN2012100897200A CN201210089720A CN103363363A CN 103363363 A CN103363363 A CN 103363363A CN 2012100897200 A CN2012100897200 A CN 2012100897200A CN 201210089720 A CN201210089720 A CN 201210089720A CN 103363363 A CN103363363 A CN 103363363A
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- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000008646 thermal stress Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
一种发光二极管灯条,包括基板及若干个装设于该基板上的发光二极管光源,该基板包括一板体和一线路层,该板体具有相对的一上表面和一下表面,该线路层设置在该板体的上表面上,该发光二极管光源与线路层形成电连接,该基板还包括设置于该板体的下表面上的金属层,该金属层与线路层受热时,该金属层所受的热应力与该线路层所受的热应力方向相反。
A light emitting diode light bar, including a base plate and several light emitting diode light sources installed on the base plate, the base plate includes a plate body and a circuit layer, the plate body has an upper surface and a lower surface opposite to each other, the circuit layer It is arranged on the upper surface of the board, and the LED light source is electrically connected to the circuit layer. The substrate also includes a metal layer arranged on the lower surface of the board. When the metal layer and the circuit layer are heated, the metal layer The direction of thermal stress suffered is opposite to that of the circuit layer.
Description
技术领域 technical field
本发明涉及一种发光二极管灯条。 The invention relates to a light emitting diode light bar.
背景技术 Background technique
相比于传统的发光源,发光二极管(Light Emitting Diode,LED)具有重量轻、体积小、污染低、寿命长等优点,其作为一种新型的发光源,已经被越来越多地应用到各领域当中,如路灯、交通灯、信号灯、射灯及装饰灯等。 Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, they have been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights.
现有技术中发光二极管灯条通常包括有若干发光二极管光源、一板体和设置在该板体上表面的线路层,该若干发光二极管光源分别与线路层电性连接。然而,该板体一般为塑料材质,线路层一般为金属材质,金属受热时的形变大于塑料,因此,发光二极管灯条受热后,线路层容易发生弯翘使得发光二极管光源脱落。 The LED light bar in the prior art generally includes several LED light sources, a board body and a circuit layer arranged on the upper surface of the board body, and the several LED light sources are respectively electrically connected to the circuit layer. However, the board body is generally made of plastic, and the circuit layer is generally made of metal. Metal deforms more than plastic when heated. Therefore, after the LED light bar is heated, the circuit layer is prone to warp and the LED light source will fall off.
发明内容 Contents of the invention
有鉴于此,本发明旨在提供一种使发光二极管光源不易脱落的发光二极管灯条。 In view of this, the present invention aims to provide an LED light bar in which the LED light source is not easy to fall off.
一种发光二极管灯条,包括基板及若干个装设于该基板上的发光二极管光源,该基板包括一板体和一线路层,该板体具有相对的一上表面和一下表面,该线路层设置在该板体的上表面上,该发光二极管光源与线路层形成电连接,该基板还包括设置于该板体的下表面上的金属层,该金属层与线路层受热时,该金属层所受的热应力与该线路层所受的热应力方向相反。 A light emitting diode light bar, including a base plate and several light emitting diode light sources installed on the base plate, the base plate includes a plate body and a circuit layer, the plate body has an upper surface and a lower surface opposite to each other, the circuit layer It is arranged on the upper surface of the board, and the LED light source is electrically connected to the circuit layer. The substrate also includes a metal layer arranged on the lower surface of the board. When the metal layer and the circuit layer are heated, the metal layer The thermal stress suffered is opposite to that of the circuit layer.
本发明通过在板体的下表面上设置有金属层,从而使板体的上表面上的线路层和下表面上的金属层在受热时受到的热应力方向相反,基板达到热应变平衡从而不易变形,进而使得发光二极管光源不易脱落。 In the present invention, a metal layer is provided on the lower surface of the board, so that the thermal stress directions of the circuit layer on the upper surface of the board and the metal layer on the lower surface are opposite when heated, and the substrate reaches a thermal strain balance so that it is not easy to deformation, so that the LED light source is not easy to fall off.
附图说明 Description of drawings
图1为本发明的发光二极管灯条的第一实施例的剖面示意图。 FIG. 1 is a schematic cross-sectional view of the first embodiment of the LED light bar of the present invention.
图2为本发明的发光二极管灯条的第一实施例的俯视图。 FIG. 2 is a top view of the first embodiment of the LED light bar of the present invention.
图3为本发明的发光二极管灯条的第一实施例的仰视图。 FIG. 3 is a bottom view of the first embodiment of the LED light bar of the present invention.
图4为本发明的发光二极管灯条的第二实施例的剖面示意图。 FIG. 4 is a schematic cross-sectional view of a second embodiment of the LED light bar of the present invention.
图5为本发明的发光二极管灯条的第二实施例的仰视图。 FIG. 5 is a bottom view of the second embodiment of the LED light bar of the present invention.
主要元件符号说明 Description of main component symbols
如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.
具体实施方式 Detailed ways
如图1至图3所示,本发明第一实施例提供的发光二极管灯条1,其包括第一基板10和装设于第一基板10上的若干发光二极管光源20。
As shown in FIGS. 1 to 3 , the LED light bar 1 provided by the first embodiment of the present invention includes a
第一基板10包括一板体11、设置于板体11上的线路层12和金属层13。
The
板体11呈平板状,其具有一上表面111、一下表面112及两个连接在该上表面111和下表面112之间的侧面113。于本实施例中,板体11由树脂材料制成。
The
线路层12由金属材料制成,用于与外部进行电性连接。线路层12包括若干间隔设置的导电片121,且若干导电片121从其中一侧面113至相对的另一侧面113呈线状排列。靠近该相对的两侧面113的两个导电片121从板体11的上表面111延伸至侧面113将该侧面113包覆,并继续延伸至下表面112。该导电片121沿垂直于线路层12延伸方向上的宽度小于板体11的宽度。于本实施方式中,当该线路层12受热时,该线路层12所受的热应力方向背离上表面111而向上。
The
金属层13包括若干间隔设置的金属片131,且该金属片131从板体11的其中一侧面113至另一侧面113呈线状排列,其沿垂直于金属层13延伸方向的宽度小于板体11的宽度。制成金属层13的材料与制成线路层12的材料的热膨胀系数相当,当该金属层13与线路层12受热时,该金属层13所受的热应力与该线路层12所受的热应力大小相同,方向相反。于本实施方式中,金属层13的热应力方向背离下表面112而向下,制成金属层13的材料与制成线路层12的材料相同。每个金属片131均呈矩形,且金属片131与线路层12间隔设置,金属层13的厚度与线路层12的厚度大致相同,金属层13的总面积与位于板体11的上表面111上的线路层12的面积大致相同,以使该金属层13与线路层12受热时所受的热应力大小大致相同。
The
该多个发光二极管光源20间隔设置于板体11的上表面111上且分别与线路层12形成电连接。于本实施例中,发光二极管光源20为发光二极管封装结构,其对应金属片131设置。发光二极管光源20包括具有电极结构22的第二基板21,装设于电极结构22上且与电极结构22电性连接的发光二极管芯片23,围设发光二极管芯片23的反射层24,以及密封发光二极管芯片23的封装层25。电极结构22与两相邻的导电片121形成电连接,从而为该多个发光二极管光源20供电。
The plurality of
发光二极管灯条1在工作过程中,该多个发光二极管光源20会产生大量的热量,本发明通过在板体11的下表面112上设置金属层13,且金属层13受到的热应力方向与线路层12受到的热应力方向相反,从而使得第一基板10在一定程度上热应力相抵消。当金属层13的面积与位于板体11的上表面111的线路层12的面积和厚度均相等时,板体11的上表面111上的线路层12和金属层13受到的热应力方向相反,且大小相同,进而使第一基板10达到热应变平衡而不易向上或向下弯曲变形,发光二极管光源20不易脱落;另外,可使发光二极管灯条1固定于其它装置(如散热装置)上时,第一基板10与其它装置之间不易形成间隙,使发光二极管灯条1产生的大量热量可快速传导至其它装置上,有利于热量的散发,提高发光二极管灯条1的使用寿命。
During the working process of the LED light bar 1, the plurality of
请同时参阅图4和图5,其所示为本发明第二实施例提供的发光二极管灯条1a,本发明第二实施例中的发光二极管灯条1a与第一实施例中发光二极管灯条1相似,其区别仅在于:在相邻的两金属片131之间和/或金属片131与导电片121之间的间隙中设置网状结构14,用以减缓由于发光二极管光源20散发的热量造成的第一基板10的形变。于本实施例中,网状结构14为金属材质,其厚度与金属片131的厚度相同,且网状结构14的热应力方向背离下表面112向下,且金属层13的总面积较位于板体11的上表面111上的线路层12的面积略小。可以理解地,网状结构14也可由其它材质制成。当然,该线路层12相邻的两导电片121之间也可设置绝缘的网状结构,用以进一步减缓由于发光二极管光源20散发的热量造成的第一基板10的形变。
Please refer to Figure 4 and Figure 5 at the same time, which shows the LED light bar 1a provided by the second embodiment of the present invention, the LED light bar 1a in the second embodiment of the present invention is the same as the LED light bar in the first embodiment 1, the only difference is that a
本发明的技术内容及技术特点已揭露如上,然而本领域技术人员仍可能基于本发明的教示及揭示而作出种种不背离本发明精神的替换及修饰。因此,本发明的保护范围应不限于实施例所揭示的内容,而应包括各种不背离本发明的替换及修饰,并为所附的权利要求所涵盖。 The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various replacements and modifications that do not depart from the present invention, and should be covered by the appended claims.
Claims (10)
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CN201210089720.0A CN103363363B (en) | 2012-03-30 | 2012-03-30 | Light-emitting diode light bar |
TW101112586A TWI489059B (en) | 2012-03-30 | 2012-04-10 | Led light bar |
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CN201210089720.0A CN103363363B (en) | 2012-03-30 | 2012-03-30 | Light-emitting diode light bar |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104235661A (en) * | 2013-06-19 | 2014-12-24 | 瑞轩科技股份有限公司 | Light bar and direct type backlight module |
CN111983849A (en) * | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | LED backlight module |
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CN1795567A (en) * | 2003-05-26 | 2006-06-28 | 松下电工株式会社 | Light-emitting device |
JP2005277137A (en) * | 2004-03-25 | 2005-10-06 | Feng Chia Univ | High-efficiency heat conduction circuit board and manufacturing method thereof |
CN101110408A (en) * | 2006-07-18 | 2008-01-23 | 启萌科技有限公司 | Light emitting diode module |
CN102155634A (en) * | 2010-02-11 | 2011-08-17 | 佰鸿工业股份有限公司 | LED light emitting module and manufacturing method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104235661A (en) * | 2013-06-19 | 2014-12-24 | 瑞轩科技股份有限公司 | Light bar and direct type backlight module |
CN111983849A (en) * | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | LED backlight module |
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CN103363363B (en) | 2016-03-23 |
TWI489059B (en) | 2015-06-21 |
TW201339490A (en) | 2013-10-01 |
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