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CN103354072B - display device and detection method thereof - Google Patents

display device and detection method thereof Download PDF

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Publication number
CN103354072B
CN103354072B CN201310173543.9A CN201310173543A CN103354072B CN 103354072 B CN103354072 B CN 103354072B CN 201310173543 A CN201310173543 A CN 201310173543A CN 103354072 B CN103354072 B CN 103354072B
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China
Prior art keywords
ground connection
dielectric film
display device
connection mark
ground
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CN201310173543.9A
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Chinese (zh)
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CN103354072A (en
Inventor
林彦腾
林能毅
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AU Optronics Corp
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AU Optronics Corp
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Abstract

A display device and a detection method thereof are provided, the display device comprises a display module, a circuit board and an insulating film. The circuit board is arranged on the display module and is provided with a grounding mark and a plurality of signal pads, wherein the grounding mark can surround the element area, and the signal pads are arranged in the element area. The insulating film covers the grounding mark and the element region.

Description

Display device and its detection method
Technical field
The present invention relates to a kind of display device and its detection method, particularly a kind of display device and detection method promoting yield rate.
Background technology
Refer to Fig. 1, known display device 1 has display module 10, circuit board 20 and dielectric film 30, and wherein circuit board 20 is arranged at display module 10, and dielectric film 30 is attached at circuit board 20.In order to avoid the signal pad 22 of circuit board 20 is when assembling or use, is subject to other elements affect and produces short circuit or electrostatic effect, therefore, dielectric film 30 can be attached on signal pad 22.
But in assembling or when drawing weldering element, often the situation that dielectric film 30 leakage is pasted or sticking position is bad can be there is, to reduce the rate of manufacturing a finished product because personnel's carelessness in display device 1.Because dielectric film 30 is close with the color of circuit board 20, as checked, confirm the attaching situation of dielectric film 30 by human eye, not only can labor intensive and production time, also have the situation generation of Lous sieve.
Summary of the invention
The invention reside in and a kind of display device and its detection method are provided, so as to promoting the rate that manufactures a finished product.
The display device of disclosed embodiment of this invention, comprises display module, circuit board and dielectric film.Circuit board is arranged at display module, and circuit board has ground connection mark and multiple signal pad, and wherein ground connection mark is around element area, and signal pad is arranged at element area.Dielectric film is then covered in ground connection mark and element area.
The detection method of embodiments of the invention, comprising provides ground signalling in ground signalling pad, provides ground signalling in the first input end of electrical surveying instrument, the second input end being electrically connected electrical surveying instrument and ground connection indicates and according to the measurement result of electrical surveying instrument, judge that dielectric film pastes situation.
According to the display device disclosed in the invention described above, indicate in circuit board by arranging ground connection, to increase the precision of dielectric film contraposition, the situation that detection dielectric film also can be assisted to paste, is beneficial to the lifting of the rate of manufacturing a finished product and acceleration production procedure.
Feature for the present invention, implementation and effect, hereby coordinate accompanying drawing to be described in detail as follows as most preferred embodiment.
Accompanying drawing explanation
Fig. 1 is the schematic diagram according to known display device;
Fig. 2 (a) is the schematic diagram of display device according to an embodiment of the invention;
Fig. 2 (b) is the schematic diagram of display device according to an embodiment of the invention;
Fig. 3 (a) is the schematic flow sheet of the detection method according to one embodiment of the invention;
Fig. 3 (b) is the operation chart of the detection method according to one embodiment of the invention;
Fig. 3 (c) is the operation chart of the detection method according to one embodiment of the invention;
Fig. 4 (a) is the schematic diagram of circuit board according to another embodiment of the present invention;
Fig. 4 (b) is the schematic diagram of circuit board according to another embodiment of the present invention;
Fig. 4 (c) is the schematic diagram of circuit board according to another embodiment of the present invention.
Wherein, Reference numeral
100 display device
110 display modules
120,220,320,420 circuit boards
122,222,322,422 ground connection marks
124,224,324,424 signal pads
128 ground signalling pads
130,230,330,430 dielectric films
150 electrical surveying instruments
152 first input ends
154 second input ends
156 measurement results
Embodiment
Please refer to Fig. 2 (a) to Fig. 2 (b), Fig. 2 (a) is the schematic diagram of display device according to an embodiment of the invention, and Fig. 2 (b) is the schematic diagram of the display device according to an embodiment of the invention with dielectric film.
The display device 100 of the present embodiment has display module 110, circuit board 120 and dielectric film 130, and wherein circuit board 120 arranges and is electrically connected at display module 110.Circuit board 120 has ground connection mark 122 and multiple signal pad 124, and wherein ground connection mark 122 can around element area 126, and multiple signal pad 124 is arranged in element area 126.In other words, multiple signal pad 124 can be grounded mark 122 around, make ground connection mark 122 be arranged at the periphery of multiple signal pad 124.In the present embodiment, circuit board 120 can be flexible circuit board (FPC, Flexibleprintedcircuitboard), but the present invention is not as limit.In the present embodiment, display device 100 has upper substrate and infrabasal plate, and circuit board 120 is then arranged at infrabasal plate periphery, and using as the signal communication with display device 100, but the present invention is not as limit.For example, circuit board 120 should can be and be applied to backlight module or touch-control module.
In the present embodiment, dielectric film 130 can be covered in ground connection mark 122 and element area 126.Specifically, dielectric film 130 can be covered on ground connection mark 122 and multiple signal pad 124, make multiple signal pad 124 can completely cover by dielectric film 130, directly do not contact with the external world.As shown in Fig. 2 (b), ground connection mark 122 is rectangular shaped, and the position of ground connection mark 122 corresponds to wherein one jiao of dielectric film 130.In other words, dielectric film 130 has four right angles, and four right angles correspond respectively to the ground connection mark 122 of diverse location, make each corner of dielectric film 130 all have overlapping area with ground connection mark 122 in vertical projection direction.Therefore, the area of dielectric film 130 is more than or equal to element area 126 and the summation area of ground connection mark 122, just can cover completely.When attaching dielectric film 130, being used as the mark of contraposition by ground connection mark 122, can yield rate being promoted, in detail, when dielectric film 130 can be covered in ground connection mark 122 completely, then dielectric film 130 also can be covered in element area 126, is covered on multiple signal pad 124.
In the present embodiment, multiple signal pad 124 has ground signalling pad 128.When display device 100 carries out detecting or using, ground signalling (ground voltage) can be connected to ground signalling pad 128.Ground connection mark 122 item is conductive material, as the metal material such as aluminium, copper, and is connected with ground signalling pad 128, for example, by the internal circuit layout of circuit board 120, is interconnected, ground connection mark 122 and ground signalling pad 128 to reach electric connection.For convenience of description, be only considered as ground signalling with the signal pad 128 being positioned at the corner of element area 126, but the present invention is not as limit, can have difference according to different circuit design, for example, ground signalling pad 128 also can be arranged at outside this element area 126.By the structural design of above-mentioned ground connection mark 122, make ground connection mark 122 singly not can be considered the contraposition mark of dielectric film 130, what also can be used to detection dielectric film 130 pastes situation.
Please refer to Fig. 3 (a) to Fig. 3 (c), Fig. 3 (a) is the schematic flow sheet of the detection method according to one embodiment of the invention, Fig. 3 (b) is the operation chart of the detection method according to one embodiment of the invention, and Fig. 3 (c) is the operation chart of the detection method according to one embodiment of the invention.
As shown in Fig. 3 (a), in the detection method of the present embodiment, for above-mentioned display device 100, having step S110 provides ground signalling to provide ground signalling to connect the second input end of electrical surveying instrument and ground connection indicates in the first input end of electrical surveying instrument, step S130 in ground signalling pad, step S120, and step S140 is according to the measurement result of electrical surveying instrument, what judge dielectric film pastes situation.
In step s 110, provide ground signalling in ground signalling pad 128.For example, when for carrying out lighting display device 100 to be confirmed whether defectiveness, then by ground signalling input grounding signal pad 128, and at the same time, also can carry out the detecting step that dielectric film pastes situation.And when step S110, because ground connection mark 122 can be interconnected conducting with ground signalling pad 128, therefore ground connection mark 122 is also ground voltage.
In step S120 and S130, provide ground signalling by the first input end 152 of electrical surveying instrument 150 respectively with the second input end 154 and be connected ground connection mark 122, and being detected by electrical surveying instrument 150.In the present embodiment, electrical surveying instrument 150 is ammeter, can be used to resistance or the electric current of test article, but the present invention is not as limit.
In step S140, according to the measurement result 156 of electrical surveying instrument 150, what judge dielectric film 130 pastes situation.Specifically, as shown in Fig. 3 (b), when dielectric film 130 is covered in ground connection mark 122 completely, then the second input end 154 touches dielectric film 130, but not be the ground connection mark 122 of ground voltage, make circuit between first input end 152 and the second input end 154 for open a way (OL_OpenLoop).When measurement result 156 is shown as OL, then represents that dielectric film 130 has and be covered in ground connection mark 122 completely.As shown in Fig. 3 (c), when dielectric film 130 is not covered in ground connection mark 122 completely, then the second input end 154 touches the ground connection mark 122 of ground voltage, but not dielectric film 130, make first input end 152 and the second input end 154 be all ground voltage, and form short circuit (Short).When measurement result 156 is shown as short or electrically surveying instrument 150 gives the alarm, then represent that dielectric film 130 is not covered in ground connection mark 122 completely.
After detecting each ground connection mark 122 one by one, then can judge the situation that dielectric film 130 pastes, as step S142 measurement result 156 for open circuit time, dielectric film 130 is covered in signal pad 124 completely, in detail, when measurement result 156 is for open circuit, represent that each ground connection mark 122 is covered by dielectric film 130 completely, then dielectric film 130 and the contraposition completely of ground connection mark 122, that is the position that dielectric film 130 pastes is correct.When step S144 measurement result 156 is for short circuit; dielectric film 130 is not covered in signal pad 124 completely; further illustrate; when measurement result 156 is for short circuit; represent in the ground connection mark 122 of one of them and do not covered completely by dielectric film 130; then dielectric film 130 and ground connection mark 122 misplace, that is the positional fault that dielectric film 130 pastes, and possibly cannot by all signal pad 124 complete preservations.Therefore, by arranging ground connection mark 122, not only can assist the contraposition of dielectric film 130, also by electrical surveying instrument 150 with detect dielectric film 130 paste situation, to promote the rate of manufacturing a finished product and economization manpower.In addition, detect dielectric film 130 paste situation time, can carry out with other testings simultaneously, not need to spend extra engineering, also can accelerate production procedure.
Fig. 4 (a) is the schematic diagram of circuit board according to another embodiment of the present invention, and in another embodiment of Fig. 4 (a), ground connection mark 222 is rectilinear form, and the position of ground connection mark 222 corresponds to wherein one jiao of dielectric film 230.In other words, dielectric film 230 has four limits, and four limits correspond respectively to the ground connection mark 222 of diverse location, makes each limit of dielectric film 230 all have overlapping area with ground connection mark 222 in vertical projection direction.Fig. 4 (b) is the schematic diagram of circuit board according to another embodiment of the present invention, in another embodiment of the 4th (b) figure, ground connection mark 322 is hollow, but not as limit, also enclosed pattern is, can by complete for multiple signal pad 324 around, make the shape of ground connection mark 322 corresponding with the shape of dielectric film 330.For example, when dielectric film 330 is circular, ground connection mark 322 also can be circle shape.In above-described embodiment, be all that rectangle illustrates with element area, but the present invention is not as limit, can change to some extent according to multiple signal pad 424 setting area difference, as shown in Fig. 4 (c), ground connection mark 422 around and form polygonal element area, and the corner of the corresponding dielectric film 430 of ground connection mark 422 setting position or border.
According to the display device of above-described embodiment, indicate in circuit board by arranging ground connection, to increase the precision of dielectric film contraposition, the situation that detection dielectric film also can be assisted to paste, is beneficial to the lifting of the rate of manufacturing a finished product and acceleration production procedure.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the present invention.

Claims (8)

1. a display device, is characterized in that, comprises:
One display module;
One circuit board, is arranged at this display module, and this circuit board has a ground connection mark and multiple signal pad, and wherein, this ground connection is masked as metal material, and this ground connection mark can around an element area, and these signal pads are arranged at this element area; And
One dielectric film, is covered in this ground connection mark and this element area;
Wherein, this circuit board has a ground signalling pad, and is made this ground connection mark be connected with this ground signalling pad by the internal circuit layout of circuit board.
2. display device according to claim 1, wherein the position of this ground connection mark corresponds to wherein one jiao of this dielectric film.
3. display device according to claim 1, wherein this ground connection mark position correspond to this dielectric film wherein.
4. display device according to claim 1, wherein this ground connection is masked as an enclosed pattern, and the shape of this ground connection mark may correspond to the shape in this dielectric film.
5. display device according to claim 1, wherein the area of this dielectric film is more than or equal to the summation area that this element area and this ground connection indicate.
6. a detection method, for the display module of a claim 1, comprises:
There is provided a ground signalling in this ground signalling pad;
There is provided a ground signalling in a first input end of an electrical surveying instrument;
One second input end and this ground connection that connect this electrical surveying instrument indicate;
According to a measurement result of this electrical surveying instrument, what judge this dielectric film pastes situation.
7. detection method according to claim 6, when wherein this measurement result is short circuit, then this dielectric film is not covered in these signal pads completely.
8. detection method according to claim 6, when wherein this measurement result is for open circuit, then this dielectric film can be covered in these signal pads completely.
CN201310173543.9A 2013-02-20 2013-05-13 display device and detection method thereof Active CN103354072B (en)

Applications Claiming Priority (2)

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TW102105917 2013-02-20
TW102105917A TWI484197B (en) 2013-02-20 2013-02-20 Display device and the test method thereof

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CN103354072B true CN103354072B (en) 2015-12-09

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102297284B1 (en) * 2014-06-23 2021-09-02 삼성전기주식회사 Circuit board and method for placement state test of electric component using the same
TWI566228B (en) * 2015-01-23 2017-01-11 友達光電股份有限公司 Active device array substrate and method of inspecting the same

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1417854A (en) * 2001-11-05 2003-05-14 扬智科技股份有限公司 Package structure of chip with pad array
TW200515036A (en) * 2003-10-17 2005-05-01 Au Optronics Corp Grounding device of liquid crystal display circuit board
CN201145800Y (en) * 2008-01-09 2008-11-05 上海广电光电子有限公司 TFT array substrate for liquid crystal display being easy to measure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3760945B2 (en) * 2004-04-01 2006-03-29 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof
JP2010054551A (en) * 2008-08-26 2010-03-11 Epson Imaging Devices Corp Display device and inspection probe for the display device
CN202632262U (en) * 2012-05-18 2012-12-26 榕增光电科技有限公司 Induced circuit structure of touch panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1417854A (en) * 2001-11-05 2003-05-14 扬智科技股份有限公司 Package structure of chip with pad array
TW200515036A (en) * 2003-10-17 2005-05-01 Au Optronics Corp Grounding device of liquid crystal display circuit board
CN201145800Y (en) * 2008-01-09 2008-11-05 上海广电光电子有限公司 TFT array substrate for liquid crystal display being easy to measure

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CN103354072A (en) 2013-10-16
TW201433800A (en) 2014-09-01

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