CN103314286B - Soldering inspection method and soldering inspection machine and base plate inspection system - Google Patents
Soldering inspection method and soldering inspection machine and base plate inspection system Download PDFInfo
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- CN103314286B CN103314286B CN201180064881.8A CN201180064881A CN103314286B CN 103314286 B CN103314286 B CN 103314286B CN 201180064881 A CN201180064881 A CN 201180064881A CN 103314286 B CN103314286 B CN 103314286B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2509—Color coding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Soldering print inspection machine (10), carries out measurement inspection to the volume of the welding paste of the pad on substrate, the check result information containing measurement value is sent to and checks data administrator (102).Soldering print inspection machine (30), according to the image of the substrate after backflow, detect the characteristic at the scolding tin position of check object, and, by communicating with management data management devices (102), obtain the welding paste volume measured by the position that soldering print inspection machine (10) is corresponding to the scolding tin position with check object.Utilize this volume, infer the feature being difficult to the position measuring characteristic near part, this inferred results is augmented in characteristic, wetting forming height after calculating backflow, decision height good/bad.
Description
Technical field
The present invention relates in order to manufactured parts installation base plate and implement multiple operations in, with until the substrate that just terminates of reflow process carries out visual examination for object, thus judge check system and the soldering inspection machine of the methods and applications the method whether the soldering state of the various parts be arranged on substrate is appropriate.
Background technology
Each operation of the general printing process by welding paste (creamsolder, solder(ing) paste), part installation procedure and reflow process produces component mounting board.In production line in recent years, there is the production line having imported base plate inspection system, in this base plate inspection system, inspection machine is equipped with for each operation in these operations, the check result of each inspection machine is aggregated into signal conditioning package, thus can carry out confirming (for example, referring to patent documentation 1) for each same object.
With regard to the inspection at the soldering position after reflow process, widely use this inspection machine, this inspection machine utilizes the specular reflective of scolding tin, throw light on from oblique upper to the substrate of check object, directly over roughly, this substrate is taken simultaneously, the pattern of the reflected light picture in generated image is analyzed.Such as, such process is described: each color light of from the scope of incident angle different direction, substrate being irradiated to red, green, blue respectively in patent documentation 2, according to the COLOR COMPOSITION THROUGH DISTRIBUTION pattern corresponding with these illumination light, generate the image showing scolding tin heeling condition, based on having logged in this COLOR COMPOSITION THROUGH DISTRIBUTION pattern in advance, judge that whether the shape of the leg of scolding tin is appropriate.
And then, such improvement invention is described: in the soldering inspection machine that above-mentioned patent documentation 2 is recorded in patent documentation 3, focus is, is difficult to import camera by from the precipitous position of the inclination near the part in image or close to the reflected light of smooth position reflection.Specifically, in the invention that patent documentation 3 is recorded, on the basis of illumination light utilizing each color, from the direction along camera optical axis, infrared light (infrared ray) is irradiated to substrate, produce containing the image for the reflected light picture of this infrared light.In the inspection area corresponding with soldering position in the picture, extract the look region corresponding with each color light and the region corresponding with infrared light (region of ultra-red), further, extract because near part, position does not generate reflected light picture to which bundle illumination light bucket and the position of dark areas that causes.Then, extract interregional boundary position along the direction with each zones run parallel, the angle of the range boundary at the angle of inclination shown in the region corresponding with each illumination light to the application of these boundary positions, thus, determine the curve of approximation representing leg heeling condition.And then, by carrying out integration to this curve of approximation, obtaining the wetting forming height of scolding tin, judging that this is highly whether appropriate.
For the inspection after solder printing operation, adopt this inspection machine too, by this inspection machine, from directly over take substrate to carry out two dimensional image process, thus the area, printing position etc. of welding paste on each pad on measurement substrate.In addition, the 3D shape at check object position, the inspection machine (such as with reference to patent documentation 4) of volume is obtained by phase-shifting method in addition.
Prior art document
Patent documentation
Patent documentation 1:JP patent No. 3966336 publication
Patent documentation 2:JP patent No. 3599023 publication
Patent documentation 3:JP JP 2010-71844 publication
Patent documentation 4:JP JP 2010-91569 publication
Summary of the invention
The problem that invention will solve
In existing inspection after reflow process, prerequisite is, implements appropriate process in each operation before reflow process.But in fact, can there is uneven change in the installation site of the number to be printed of the welding paste in solder printing operation, printing position, part etc., the heeling condition of leg can be caused because of the change of this inequality to change because of the time.
Below, utilize Figure 10 ~ Figure 13 so that the problems referred to above to be described.Schematically show in the various figures, for the one-sided electrode of chip element 301, the situation that the leg shape of the scolding tin after reflow process is different because the state before reflow process is different.In the various figures, 300 is pads, and 301 is main bodys of part, and 302 is part electrodes (do not have illustrate the part electrode of not with pad 300 corresponding side) corresponding with pad 300.In addition, 303 is the welding pastes before backflow, and 304 is the scolding tin (hereinafter, referred to as " after backflow scolding tin ") solidified again after melting because of reflow process.
In Fig. 10, contrast table is shown in solder printing operation the relation between the amount of the welding paste 304 be printed on pad 300 and the leg of the rear scolding tin of backflow.As shown in Figure 10, usually, along with the amount of welding paste 303 increases, after backflow, the degree of tilt of the leg of scolding tin 304 becomes precipitous, and along with the amount of welding paste 303 reduces, after backflow, the degree of tilt of the leg of scolding tin 304 becomes mitigation.
Then, in fig. 11, the impact that the installation site of part 301 is brought the shape of scolding tin 304 after backflow is represented.In the example of 3 shown in this figure, the number to be printed of welding paste 303 is identical, but, because part 301 is different relative to the position of pad 300, cause producing uneven (difference) from the width of the part of electrode 302 to the ora terminalis in the outside of pad 300 of part 301 (below, this part is called " pad teat ").As shown in each example, usually, the width of pad teat is narrower, then after backflow, the degree of tilt of the leg of scolding tin 304 is more precipitous, and the width of pad teat is wider, then after backflow, the degree of tilt of the leg of scolding tin 304 more relaxes.
Then, in Figure 12 and Figure 13, the impact that the difference of the print range of welding paste 303 on pad 300 is brought leg shape is represented.In the example shown in Figure 12, the volume of welding paste 303 is identical, but in example at epimere, welding paste 303 almost spreads and is printed on whole pad 300, and the amount of the welding paste 303 corresponding with pad teat is relative few, because which form the leg comparing mitigation.On the other hand, in the example of hypomere, welding paste 303 is printed to the position that deflection becomes pad teat, and therefore, the degree of tilt of the leg formed is more precipitous than the example of epimere.
In the example of Figure 13, the volume of welding paste 303 is also identical, but in the example of epimere, welding paste 303 almost spreads and is printed onto on whole pad 300, therefore defines the leg comparing mitigation in the same manner as the example of the epimere of Figure 12.On the other hand, the welding paste 303 of the example of hypomere deflection is printed onto the central portion of pad 300, and the amount of the scolding tin below the scolding tin of pad teat and part electrode 302 less changes, and therefore, part 301 is configured in the position higher than the example of epimere.Its result, in reflow process, the space between part 301 and pad 300 can produce the phenomenon that scolding tin flows, and on pad teat, one of the scolding tin of melting can be inhaled into the below of part electrode 302.In addition, the scolding tin remained on soldering teat is also attracted by part 301, causes formation short and the leg that degree of tilt is precipitous.
As shown in above-mentioned each example, after backflow, the shape of the leg of scolding tin 304, has very large variation because of the printing state of welding paste 303 or the state of part 301.But, in general visual examination, throw light on from oblique upper to soldering position, utilization is located at the reflected light of camera shooting from soldering position in real estate front, the image checked is generated by this image pickup method, therefore, the reflected light picture of the scolding tin of the orientated at steep inclinations degree obtained near part is difficult to.Therefore, the leg shape at soldering position cannot likely correctly be identified.
In addition, as shown in the example of the example of the hypomere of Figure 11 and the hypomere of Figure 13, even if when there is no special problem in the connection via the rear scolding tin 304 that refluxes at part electrode 302 and pad 300, when the width of leg is short and precipitous, this leg that image shows is rendered as the dark areas producing reflected light picture hardly, therefore, also likely can be judged as bad with existing inspection benchmark.
In view of the above problems, problem is in the present invention, and high precision infers the feature of the position (part) being difficult to differentiation state in the image of the substrate after reflow process, reflects that this inferred results is to judge soldering state, thus improves the inspection precision of soldering state.
For the method for dealing with problems
The invention provides a kind of inspection method, face towards substrate configures camera, the image of the substrate utilizing this camera to generate is to check the soldering state of the part on this substrate, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, and in the multiple operations implemented this substrate, last operation is reflow process.
In inspection method of the present invention, in at least one operation in the multiple operations implemented before reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, for being difficult to the feature differentiating the position of state according to the image generated by camera in the soldering position of check object, pre-determine the cause-effect relationship between its with the measurement value obtained for position corresponding to this soldering position in the measurement process before reflow process, log in the cause-effect relationship information representing this relation.Then, for the soldering position of object becoming the inspection after reflow process, perform the first ~ four following step.
In a first step, the scope containing this soldering position in image is processed, obtains the characteristic representing scolding tin shape.
In the second step, the measurement value that the measurement process before obtaining by reflow process obtains for the position corresponding with this soldering position.
In third step, utilize the cause-effect relationship information logged in for this soldering position and the measurement value obtained in the second step, infer the feature being difficult to the position differentiating state according to image in this soldering position.
In the 4th step, by the inferred results in third step, augment in the characteristic obtained in a first step, thus judge the good/bad of soldering position.
Pass through said method, in the soldering position of check object, cause becoming in the picture the position of dark areas using the reflected light picture owing to cannot generate for illumination light, blocked by part and the position of None-identified etc. as object, log in cause-effect relationship information, to these positions application third step, thus this feature can be inferred.Thus, in the 4th step, in the characteristic obtained by image procossing, augment the result of above-mentioned inference process, thus the accuracy of identification of the shape at soldering position can be improved, improve and check precision.
In addition, with regard to this cause-effect relationship information, statistical treatment can be carried out, the relation between the state at the state at the object position of the measurement process before determining reflow process and the soldering position of check object by utilizing the sample quite counted, thus generate this cause-effect relationship information.Sample number is more, then the fiduciary level of cause-effect relationship information is higher, thus can improve the deduction precision in third step.With regard to cause-effect relationship information, such as, to the measurement value obtained by the measurement process before reflow process and represent that the data becoming the feature at the position of the object of inference process in third step are set up corresponding association and formed table, log in the function of this table or expression both sides relation.In addition, when using the measurement value of multiple parameter, the combination defined for being worth according to these measurements can be derived the program of the rule of characteristic, as cause-effect relationship information registration.
Above-mentioned inspection method preferred embodiment in, in solder printing operation, implement measurement for the welding paste that is printed on each pad of substrate, the measurement process in the operation before being used as reflow process.According to this embodiment, after the number to be printed or printing position etc. because of welding paste causes refluxing scolding tin variform situation under, also highly accurately can infer the feature at the position being difficult to differentiation state in the picture, thus the good/bad of soldering position can be judged.
Above-mentioned inspection method other preferred embodiment in, measurement process is implemented for the welding paste be printed on each pad of substrate in solder printing operation, and measurement process is implemented for the part be arranged on substrate in part installation procedure, measurement process in operation before being used as reflow process, as prerequisite, the causal cause-effect relationship information between the combination logging in the measurement value representing these measurement process and the feature being difficult to differentiate the position of state according to the image that generated by camera in the soldering position of check object.
According to this embodiment, based on the printing state of welding paste, but also based on the installment state of part, the feature at the position being difficult to differentiation state in the picture can not only can be inferred accurately.Such as, even if the measurement value of the volume of welding paste is identical, when the position, size, height etc. of part are different, inferred results can be made different.
Such as, can measure the volume of this welding paste, area, highly, printing position, at least one parameter in print range, be used as the measurement process carried out for the welding paste be printed on the pad of substrate.In addition, the position of this part, the position relationship between size and pad, at least one parameter in height can be measured, (reason of measurement part dimension is in the measurement process being used as carrying out for the part be arranged on substrate, even the part of same function, the likely different sizes because brand is different).
Above-mentioned inspection method other preferred embodiment in, in a first step, position near the part at soldering position in the picture, obtain although extract the region that characteristic cannot obtain characteristic, infer the feature in this region in third step.
According to this embodiment, can inferring near part because tilting precipitous and causing the feature at the position not manifesting the feature needed for inspection in image, by augmenting this inferred results, the leg shape of scolding tin can be identified accurately.
Next, soldering inspection machine of the present invention, take substrate as object, face towards substrate configures camera, utilize and take this substrate by this camera, check the soldering state of the part in the image generated, substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, the feature of this soldering inspection machine is, possesses following storage unit, graphics processing unit, measurement value input block, deduction means, judging means.
In the memory unit, log in the cause-effect relationship information set according to following cause-effect relationship, this cause-effect relationship obtains as follows, in the method, in at least one operation in the multiple operations implemented before reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, for being difficult to the feature differentiating the position of state according to the image generated by camera in the soldering position of check object, determine itself and the cause-effect relationship in the measurement process before reflow process for position corresponding to this soldering position and between the measurement value obtained.
Graphics processing unit, processes the scope at the soldering position containing check object in image, obtains the characteristic representing scolding tin shape.Measurement value input block, the measurement value that the measurement process before inputting by reflow process obtains for the position that the soldering position with check object is corresponding.
Deduction means, for the soldering position of check object, utilization logs in cause-effect relationship information in the memory unit and inputted by measurement value input block measurement value for this position, infers the feature being difficult to the position differentiating state according to image in this soldering position.
Judging means, by inferring the inferred results of unit, augmenting in the characteristic obtained by graphics processing unit, thus judging the good/bad of soldering position.
By said structure, the inspection method described in execution, can carry out high-precision inspection.In addition, such as can by carrying out communicating the measurement value of the measurement process before obtaining reflow process with signal conditioning package, in this signal conditioning package, preserve the check result information of inspection machine or this inspection machine output arranged from the operation before reflow process.
The soldering inspection machine of an embodiment of the invention, also possesses: lighting device, and it is for the substrate of check object, and the multiple directions different from incident angle irradiate light; Shooting control module, it makes camera work under the illumination of this lighting device, generates the image checked.
And then, in this embodiment, in the memory unit, login is expressed as follows causal cause-effect relationship information, this cause-effect relationship refers to, in the soldering position of check object, and the position near part, owing to obtaining the reflected light picture of the light of lighting device in the picture and causing becoming the angle of inclination at the position of dark areas, and implement to measure for the welding paste be printed on pad in solder printing operation and process and cause-effect relationship between the measurement value obtained.Graphics processing unit, from the scope at the soldering position containing check object image, according to the direction of each illumination light, extracts the region showing the reflected light picture corresponding with illumination light, and, extract the dark areas produced near part in image.Infer unit, utilize the soldering position for check object and the cause-effect relationship information that logs in the memory unit and the measurement value inputted by measurement value input block, infer the angle of inclination at the position corresponding with dark areas.Judging unit, the angle of inclination of being inferred by deduction unit is augmented in dark areas, and, for the reflected light picture corresponding with the illumination light from all directions, be suitable for the incident angle according to corresponding illumination light respectively and the angle of inclination of the scolding tin of inferring, utilize these angles of inclination to judge the wetting shaping whether appropriate of the leg at soldering position.
In addition, lighting device is such as respectively from the light of the incident multiple color in the direction that incident angle is different.Or, the light alternately irradiated from all directions can be switched in order.
According to above-mentioned embodiment, take under the illumination of the light of the different multiple directions of incident angle, for the reflected light picture that the soldering position in generated image produces, be suitable for the incident angle according to each self-corresponding illumination light and infer (calculating) angle of inclination out, thus identify the leg shape of scolding tin, now, even be difficult to the position of the dark areas producing reflected light picture near part in the picture, the angle of inclination of this position can also be inferred accurately.Thus, by augmenting the angle of inclination that this is inferred, the shape of the roughly whole leg at soldering position can be identified, this wetting forming height can be judged accurately.
The solder printing inspection machine of other embodiment of the present invention, also possesses: projection arrangement, and it is for the pattern image of the substrate projected fringe shape to check object; Shooting control module, it controls projection arrangement makes pattern image periodically move pattern along the arrangement of striped to project, and, coordinate the opportunity at every turn projected, make camera work.
And then, in this embodiment, in the memory unit, login is expressed as follows causal cause-effect relationship information, this cause-effect relationship refers to, in the soldering position of check object, and the height of the privileged site near part and carry out measuring for the welding paste be printed on pad in solder printing operation and process and cause-effect relationship between the measurement value obtained, privileged site refers to, cannot obtain the position of the reflected light picture of pattern image.Graphics processing unit, multiple images of shooting in during utilizing the pattern image of projection one-period, for each pixel in the scope at the soldering position containing check object, based on the phase place of the brightness change that this pixel in during the projection in a cycle produces, measure the height corresponding with this pixel, the pixel groups of the foot welding height representing scolding tin is extracted based on this measurement result, further, extract because near part, position cannot obtain brightness change and causes measuring the pixel groups of height.Infer unit, utilize the soldering position for check object and log in cause-effect relationship information in the memory unit and measurement value input by measurement value input block, inferring the height that cannot measure pixel groups highly.
Judging unit, by the height of being inferred by deduction unit, augment in the pixel groups that cannot measure height, utilize the value of each height in the pixel groups of the foot welding height of this pixel groups and expression scolding tin, judge the wetting shaping whether appropriate of the leg at soldering position.
The solder printing machine of above-mentioned embodiment, based on the method for phase-shifting method, the pattern image of projected fringe shape on the surface at soldering position, the mobile pattern in each one side is while project, and, projection when coordinating per and taking, thus the altitude information obtained in each point of leg according to the phase place of the brightness change in pixel unit.With regard to the precipitous position of the inclination near the part in leg, be difficult to generate the reflected light picture of the pattern image projecting to this position, therefore height cannot likely be measured, but according to this embodiment, utilize the measurement value obtained by the measurement process before reflow process, the height at the position that cannot measure height can be inferred.Thus, by augmenting this inferred results, thus obtain the altitude information of whole leg at soldering position, thus high precision can judge the wetting completed state of leg.
System of the present invention, possesses: be provided in the reflow process in the multiple operations implemented in order to manufactured parts installation base plate, for checking the inspection machine of the substrate after reflow process; In at least one operation before being provided in reflow process, for checking the inspection machine of the substrate after this operation; Apparatus for management of information, it reads in check result information by communicating from each inspection machine, can read according to each substrate and each check object position and manage the check result information of each inspection machine.
The inspection machine of reflow process possesses: camera, and it is configured to the face of the substrate towards check object; Graphics processing unit, it processes the scope at the soldering position containing check object in the image generated by this camera, thus obtains the characteristic of the shape representing scolding tin.
Apparatus for management of information possesses: storage unit, it logs in the cause-effect relationship information set according to following cause-effect relationship, this cause-effect relationship obtains as follows, in the method, in the soldering position of the check object of the inspection machine of reflow process, for being difficult to the feature differentiating the position of state according to the image that generated by camera, determining that itself and the inspection machine pair position corresponding with this soldering position of the operation before reflow process carry out measuring and processing and cause-effect relationship between the measurement value that obtains; Measurement value input block, it inputs the measurement value obtained for the position that the soldering position with check object is corresponding by the inspection machine of the operation before reflow process; Infer unit, it is for the soldering position of check object, utilization logs in cause-effect relationship information in the memory unit and inputted by measurement value input block measurement value for this position, infers the feature being difficult to the position differentiating state according to image in this soldering position; Transmitting element, it will infer that the inferred results of unit is sent to the inspection machine of reflow process.
The inspection machine of reflow process also possesses judging unit, the inferred results that this judging unit will send from apparatus for management of information, augments in the characteristic obtained by graphics processing unit, thus judges the good/bad of soldering position.
By the system of said structure, based on the measurement result measured by the soldering position of the inspection machine before reflow process to check object, infer the feature being difficult to the position differentiating state according to image in the soldering position of check object, the process carrying out this deduction is shared by apparatus for management of information, therefore, it is possible to cut down the computation burden of soldering inspection machine and implement high-precision inspection.In addition, before the inspection in soldering inspection machine starts, inference process can be implemented in apparatus for management of information, therefore, it is possible to shorten the time of soldering inspection.
The effect of invention
According to the present invention, for the soldering position of check object, based on the state of the welding paste before reflow process and/or the state of part, infer the feature at the position being difficult to differentiation state in the picture, for the characteristic obtained by image procossing, augment the characteristic inferred by above-mentioned inference process, judge the good/bad of soldering position thus, thus inspection precision can be provided for soldering position.
Accompanying drawing explanation
Fig. 1 represents corresponding with the entire infrastructure of the production line of component mounting board for the structure of the base plate inspection system figure associated.
Fig. 2 is the block diagram of the structure representing soldering inspection machine.
Fig. 3 is the block diagram of the structure representing solder printing inspection machine.
Fig. 4 be soldering check the figure of the information flow between the device of being correlated with.
Fig. 5 is the figure of each group of relation schematically illustrated in structure and table that the deduction as an example shows
Fig. 6 is the figure for illustration of the method for the wetting forming height of scolding tin after measurement backflow.
Fig. 7 is the process flow diagram of the step of the process represented in soldering inspection machine.
Fig. 8 is the process flow diagram of the inspection step representing the situation of restoring based on the 3D shape of phase-shifting method to soldering position
Fig. 9 represents the figure when checking in data administrator the information flow between each device when carrying out inference process.
Figure 10 is that the difference of the amount representing welding paste is on the figure of the impact that leg shape is brought.
Figure 11 represents figure on impact that leg shape bring different from the width of the pad teat accompanied in part installation site.
Figure 12 is that the skew of the printing representing welding paste is on the figure of the impact that leg shape is brought.
Figure 13 is that the skew of the printing representing welding paste is on the figure of the impact that leg shape is brought.
Embodiment
In FIG, the structure of an embodiment of base plate inspection system and the entire infrastructure of the production line of component mounting board is represented in the mode of correspondence association.
In illustrated production line, comprise solder printing operation, part installation procedure and reflow process.In solder printing operation, be provided with solder printing device 11 and solder printing inspection machine 10, this solder printing device 11 is for applying welding paste to each pad on substrate, and this solder printing inspection machine 10 is for checking the result of this device 11.In part installation procedure, be provided with assembly machine (Mounter) 21 and part inspection machine 20, this assembly machine 21 is for the substrate mounting parts after solder printing, and this part inspection machine 20 is for checking the installment state of part.In reflow process, be provided with reflow ovens 31 and soldering inspection machine 30, this reflow ovens 31 is for the welding paste of the substrate after the installation of melting part, and this soldering inspection machine 30 is for checking the substrate after backflow.As shown in thick arrows in FIG., substrate is processed by sending into each device in order, thus completes the component mounting board corresponding with regulatory specifications.
The inspection machine 10,20,30 of each operation is respectively via LAN(LAN (Local Area Network)) loop 100 and being interconnected.On LAN loop 100, be also connected with scrutiny program management devices 101 and check data administrator 102.In scrutiny program management devices 101, log in advance for each inspection machine 10,20,30 and have database, the scrutiny program of this centralized database for performing inspection based on the inspection benchmark predetermined, is used as the database data (librarydata) of often kind of part.
In inspection data administrator 102, preserve the check result information of sending from each inspection machine 10,20,30.In this check result information, the judged result of the quality containing each check object position and implement the measurement result of (measurement) in order to this judgement.Check result information, is configured to each part that can read on each substrate and substrate for each inspection machine 10,20,30.Such as, using the cognizance code of inspection machine as upper, according to the order of the cognizance code of substrate, the cognizance code of mounting parts, the cognizance code of inspection area, form the information of hierarchical structure.
In addition, scrutiny program management devices 101 also need not separate with inspection data administrator 102, and a computing machine also can be made to have the function of each management devices 101,102.On the contrary, also each management devices 101,102 can be formed by multiple computing machine.
In each inspection machine 10,20,30, be handled as follows before an examination: input represents the data (such as cad data) of the structure of check object substrate, read the database data adapted with the part kind of information of each part shown in these input data from scrutiny program management devices 101, the positional information of each part is associated with database data.Thus, each inspection machine 10,20,30 is set to the environment needed for inspection of check object substrate.In addition, based on the content of the program of database data, also can suitably be changed by setting operation by user.
Fig. 2 represents the structure of soldering inspection machine 30.
The soldering inspection machine 30 of this embodiment has control treatment portion 1, camera (camera) 2, lighting device 3, Substrate table 4 etc.Substrate table 4, can support the substrate S of check object, and this substrate S is being moved up along the side on each limit with this posture with flat-hand position.Camera 2 can generate coloured image, and is provided in the top of Substrate table 4, and its optical axis is towards roughly vertical direction (camera 2 is configured to the state of the substrate S on platform 4 being carried out to front observation).Lighting device 3 is provided between camera 2 and Substrate table 4.
Lighting device 3 comprises ring-type light source 3R, 3G, 3B of sending red light, green light, blue light respectively.Each light source 3R, 3G, 3B are configured to the respective central part state consistent with the optical axis position of camera 2.In addition, the diameter (aperture) of each light source 3R, 3G, 3B is different, and the red light source 3R of minimum diameter is configured in and goes up most, and the blue-light source 3B of maximum gauge is configured in, and green light source 3G configures between which.By this configuration, make the scope of each color to the incident angle of substrate S incident light different, by camera 2, the COLOR COMPOSITION THROUGH DISTRIBUTION pattern that can generate utilization three looks corresponding with each color light represents the image of the heeling condition of the dip plane of the rear scolding tin that refluxes.Specifically, the red area that the red light that in three looks, incident angle range is minimum produces represents the inclination of mitigation, and the blue region that the blue light that in three looks, incident angle is maximum generates represents very precipitous inclination.In addition, the green area generated from the green light of the range illumination between red light and blue light represents the angular range between the angular range shown in red area and blue region.
In control treatment portion 1, comprise by computer implemented control part 110, image input unit 111, shooting control part 112, lighting control section 113, platform control part 114, storer 115, hard disk unit 116, communication interface 117, input part 118, display part 119 etc.Control part 110, by shooting control part 112, lighting control section 113, platform control part 114, controls the action of camera 2, lighting device 3, Substrate table 4.The image that camera 2 generates, after being carried out digital conversion, inputs to control part 110 in image input unit 111.
In storer 115, except storing the program relevant to above-mentioned control, the also view data, result of calculation etc. of temporary transient specimens preserving object.In hard disk unit 116, preserve based on the scrutiny program group of the database data provided from scrutiny program management devices 101, the measurement data obtained in checking process and check result, image etc. for checking.
Communication interface 117 is for communicating with other device via described LAN loop 100.Input part 118 is specified the operation of beginning and the end checked for carrying out and inputs various setting data.Display part 119 is for showing check result and the image for checking.
Next, Fig. 3 represents the structure of solder printing inspection machine 10.In addition, in this Fig. 3, for the structure corresponding with Fig. 2, the Reference numeral after being used in the Reference numeral identical with Fig. 2 after additional A represents.
This solder printing inspection machine 10, measure based on the height of phase shift ratio juris to the welding paste be printed on the pad of substrate S, it comprises control treatment portion 1A, camera 2A, lighting device 3A, Substrate table 4A, in addition also comprise projector (projector) 5, this projector 5 is for the pattern image to substrate projected fringe shape.In addition, the lighting device 3A of this inspection machine 10 is made up of the ring-type light source 3M sending white light.Control treatment portion 1A, except having the structure identical with the control treatment portion 1 of soldering inspection machine 30, is also provided with projector's control part 120.
With regard to part inspection machine 20, there is the structure roughly the same with soldering inspection machine 30, therefore omit diagram.But, in part inspection machine 10, also can be used as the light source of lighting device 3 with white light source.
In part inspection machine 20, detect the part on substrate according to the image of the substrate S of check object, measure its position, degree of tilt etc., judge that whether the installment state of part is appropriate based on this measurement result.
In addition, as part inspection machine 20, the device of the structure same with the solder printing inspection machine 10 shown in Fig. 3 also can be used.In this case, except the inspection of the installation site of part, posture, the height of part and part electrode, degree of tilt etc. relative to the part of vertical direction can also be checked.
In above-mentioned three kinds of inspection machines 10,20,30, solder printing inspection machine 10 and part inspection machine 20 are for performing the inspection in intermediate step, even if but they are judged as that (substrate) is bad sometimes, also (substrate) quality can be improved by the process of operation afterwards.Therefore, in a lot of workshop, can not take out from production line and be judged as bad substrate by scolding tin print inspection machine 10 or part inspection machine 20, but run them and flow to back segment.
On the other hand, be placed in the soldering inspection machine 30 of final reflow process, need to carry out strict judgement to not miss bad, but, the structure of the optical system of the soldering inspection machine 30 according to Fig. 2, with regard to the dip plane that the range of tilt angles shown with regard to the blue light more maximum than incident angle is more precipitous, cannot obtain the reflected light picture representing this angle of inclination, therefore it becomes dark areas, is difficult to the shape of the whole leg identifying the rear scolding tin of backflow.Especially, for the part that the dark areas of position near part is large, or because leg is short and tilt precipitous and cause producing hardly at soldering position the part of COLOR COMPOSITION THROUGH DISTRIBUTION, even if real-time soldering is in good condition, also can be judged as bad in the judgement only according to the result of image procossing.
Therefore, in this example embodiment, when utilizing soldering inspection machine 30 to check, reading in the result of the measurement process implemented for the position corresponding with soldering position of check object by other inspection machine 10,20, inferring the angle of inclination of the dark areas at soldering position based on this measurement value.In order to carry out this inference process, in the storer 115 or hard disk unit 116 of solder printing inspection machine 30, log in deduction table in advance, this deduction table utilizes the sample of a great deal of to derive for often kind of part.This deduction table is comprised in the database data of described often kind of part, is provided by scrutiny program management devices 101.
Represent together in the diagram soldering check relation between the device of be correlated with and information flow, be used as solder printing inspection machine 10 and utilize and measure the example that result carries out above-mentioned inference process.In this example embodiment, not only soldering inspection machine 30 and solder printing inspection machine 10 participate in soldering inspection, and scrutiny program management devices 101 and inspection data administrator 102 also participate in soldering inspection.
Scrutiny program management devices 101, for each inspection machine 10,30, provides the scrutiny program corresponding with respective machine.Based on the part belonging to this part kind, these programs check that benchmark generates for often kind of part, log in scrutiny program management devices 101 as database data.Specifically, in this example embodiment, for solder printing inspection machine 10, the scrutiny program ((a) of Fig. 4) volume of the welding paste be printed on pad being implemented to inspection is provided for; For soldering inspection machine 30, after being provided for the backflow to soldering position, the wetting forming height of scolding tin implements the program ((b) of Fig. 4) checked.And then, for soldering inspection machine 30, be provided for deduction table (Fig. 4 (c)) used in the inference process when measuring wetting forming height.
Solder printing inspection machine 10, based on providing the scrutiny program come, measuring the volume of the welding paste printed on each pad of the substrate S of check object, judging the good/bad of measurement value.Then, the check result information of the measurement value containing each pad is sent to (d) that check data administrator 102(Fig. 4).Check that data administrator 102 accumulates above-mentioned check result information with the form that can read according to each substrate and each part
Soldering inspection machine 30 is also based on received (being provided) scrutiny program, the wetting forming height of scolding tin after backflow in each pad of the substrate S of measurement check object, thus judge the good/bad of measurement value, the check result information containing measurement value is sent to (e) that check data administrator 102(Fig. 4).But, in the measurement process of soldering inspection machine 30, from the image of handling object, not only detect assorted region or the part of red, green, blue, also detect the dark areas be positioned near part, infer the angle of inclination at the position corresponding with this dark areas.Then, this inferred results is augmented to dark areas, and, for assorted region, be suitable for the incident angle according to each self-corresponding color light and infer the angle of inclination that (calculating) goes out, according to the relation comprised between the distribution in each region of dark areas and the angle of inclination corresponding with each region, measure the wetting forming height of scolding tin after backflow.
For in the inference process of dark areas, access checking data administrator 102, reads in the welding paste volume ((f) of Fig. 4) obtained when solder printing inspection machine 10 checks the pad corresponding with soldering position in the process of the substrate S of check object.In addition, based on the testing result of the part in own device and/or pad, the width (distance the ora terminalis in the outside from the ora terminalis of part to pad of pad teat is obtained.Hereinafter, referred to as " pad gives prominence to width "), and, utilize this pad to give prominence to width and from checking the welding paste volume obtained data administrator 102, contrasting deduction table, thus inferring the angle of inclination at the position corresponding with dark areas.
Fig. 5 (1) is the schematic diagram of the structure representing the deduction table logged in soldering inspection machine 30.This deduction table utilizes the sample of a great deal of to carry out statistical treatment for often kind of part and generates, be stored in simultaneously in database data with scrutiny program.In the deduction table of the example of Fig. 5 (1), the more precipitous leg of the angular range corresponding with blue region is compared for object with the dip plane near part, angle of inclination near each part is divided into g1 ~ g5 these five groups, for the often group in group g1 ~ g5, illustrate that belonging to welding paste volume in the sample of this group and pad gives prominence to the combined distribution of the value of width.In other words, the combination giving prominence to each value of width according to the volume of welding paste and pad is shown with reference to this deduction, thus which group in angle of inclination deflection group g1 ~ g5 near the part can knowing the leg produced by this combination.
In addition, as shown in Fig. 5 (2), in each group of g1 ~ g5, comprise the angular range of Rack respectively, the angle belonging to group g1 is maximum, and below according to the order of group g2, g3, g4, g5, angle diminishes.
For generating the sample of above-mentioned deduction table, being based on the data obtained from substrate in kind, but being not limited in this.Such as, by the method for fluid simulation, the leg shape obtained from the welding paste of various volume can also being obtained, by measuring the angle of inclination of the scope that can become dark areas in this leg in image, obtaining multiple sample.
Below, the particular content of the inspection implemented in each inspection machine 10,30 by the scrutiny program shown in Fig. 4 is described.
First, in the inspection in solder printing inspection machine 10, by the process based on the 3 d measurement based on phase-shifting method principle in solder printing inspection machine 10, calculate the volume of welding paste.In 3 d measurement, be a circulation with multiple projections, perform and make move of stripe ormal weight while from the pattern image process of projector's 5 pairs of substrate S projected fringe shapes at every turn, and, coordinate the opportunity of each projection and taken by camera 2A.If finish projection and the shooting of a circulation, then one by one with each time shooting gained image in inspection area (setting for each pad) in each pixel for object, detect the change of the brightness in each shooting, using the sine wave of this change as one-period, obtain sinusoidal wave phase place.And then, the phase place calculated based on the pixel for handling object, the projecting plane of pattern image and the relation between camera 2A with the reference field preset (face of such as corresponding with substrate height) carry out triangulation, thus the distance calculating from reference field to the point corresponding with the pixel of handling object.This distance represents the height of the point corresponding with the pixel of handling object.
In addition, different from above-mentioned process, in solder printing inspection machine 10, take under the white illumination of Lighting Division 3, detect the color of welding paste according to the inspection area in generated image.Then, the pixel for the color detecting this scolding tin calculates altitude information, carries out integration to this altitude information, thus obtains the volume of welding paste.
If calculated the volume of welding paste by said method, then in solder printing inspection machine 10, this volume and the standard value logged in for each test zone are compared, thus separates a certain group that belongs in " appropriately " " scolding tin is too much " " scolding tin is very few " these 3 groups.But, be also carried the welding paste substrate being judged as " scolding tin is too much " or " scolding tin is very few " to flow into subsequent handling.
Next, be described for the measurement process for carrying out checking in soldering inspection machine 30.
In the soldering inspection machine 30 of this embodiment, the each color light of red, green, blue is irradiated from the different direction substrate S of incident angle respectively, therefore, because of the light being incident to camera 2 in the normal reflection light of each color light of irradiating the dip plane of the rear scolding tin that refluxes, and the image of the heeling condition being represented the rear scolding tin of backflow by each color distribution patterns of red, green, blue can be generated.Assorted region in image, shows the angle of inclination roughly the same with the incident angle of each self-corresponding illumination light.In this embodiment, utilize and infer angle of inclination according to the relation between assorted region and range of tilt angles for dark areas, utilize this angle of inclination, measured the wetting forming height of the rear scolding tin of backflow by the method shown in Fig. 6.In addition, in this example embodiment, the range of tilt angles shown in red area is set to 8 ~ 15 degree, and the range of tilt angles shown in green area is set to 15 ~ 25 degree, and the range of tilt angles shown in blue region is set to 25 ~ 38 degree.
In this Fig. 6, for chip element 200, the schematic diagram of the leg 202 of scolding tin after the backflow that the electrode 201 of this chip element 200 is connected with pad 203 will be represented, with this leg 202 of shooting and the schematic diagram of image that obtains is upper and lower corresponding associates.In the schematic diagram of image, represent assorted region with different pattern respectively.
In this embodiment, range set containing whole part 200 in image is the inspection area (not shown) of part thus detects part 200, further, inspection area F is set to each pad 203, thus detect red sector territory in the F of this inspection area, territory, Green Zone, territory, blue area.In the image of the leg of the shape shown in Fig. 5, usually, along the place near the outside ora terminalis from the pad 202 in image towards the direction of part electrode 201, distribute red, green, blue in order.In addition, the place near part 200, produces the dark areas representing orientated at steep inclinations face sometimes, and this dark areas exceeds the scope can using blue area domain representation.
Utilize the feature of above-mentioned image, in this embodiment, distinguish the direction of four the look areal distribution comprising dark areas in the F of inspection area, along this direction setting measurement line L, on this measurement line L, extract and be positioned at A2, A3, the A4 in assorted region and the intersection point A1 crossing with the outside ora terminalis in red sector territory at borderline.And then, based on the testing result of part, extract the end points of the intersection point A5(dark areas of the ora terminalis of measurement line L and part electrode 201).
Next, in extracted point, to each point except an A5, the angle of inclination corresponding with this point is suitable for.Although the angle of inclination shown in assorted region has width to a certain degree respectively, can think that adjacent look interregional boundary position represents the angle near the boundary value of the respective range of tilt angles shown in look region.Thus, in this embodiment, based on previous illustrative range of tilt angles, 8 degree are suitable for an A1,15 degree are suitable for an A2,25 degree are suitable for an A3,38 degree are suitable for an A4.
And then, in this example embodiment, obtain the distance the outside ora terminalis from an A5 to pad, be used as pad and give prominence to width.Then, by the measurement value of this pad being given prominence to width with in advance from checking that welding paste volume that data administrator 102 reads in (drawing when being measured the pad corresponding with soldering position by solder printing inspection machine 10 pre-treatment) is combined, and contrast with the deduction table shown in Fig. 5 (1), thus determine that matched angle θ x(such as with this combination, the intermediate value of welding paste volume and pad being given prominence in the angular range shown in the group corresponding to combination of width is set to θ x, maybe the lower limit of this angular range is set to θ x).Then, this angle θ x is applicable to an A5.
Further, as shown in the curve map on the right side of Fig. 6, according to the relation between the coordinate of each point A1 ~ A5 and the angle be suitable for each point A1 ~ A5, the curve of approximation M along the angle change representing measurement line L is derived.And then, integration is carried out to each point in the scope of the some A1 a to A5 from this curve of approximation M, thus, calculates the height of the scolding tin corresponding with an A5, it can be used as the wetting forming height of the rear scolding tin of backflow.
Although the angle of inclination shown in assorted region has the width of prescribed level respectively, but with regard to the boundary position between look region, due to the high angle of inclination of fiduciary level can be obtained, therefore, to think according to the relation between the coordinate of each point A1 ~ A4 and angle of inclination and the curve of approximation obtained can show tilt variation along measuring line rightly.In addition, for the dark areas that cannot measure heeling condition, the measured data that the deduction generated according to sample data table and welding paste volume and pad give prominence to width can be contrasted, thus can roughly infer this angle of inclination, therefore, by augmenting this inferred results, the wetting forming height of whole leg can be obtained.
Thus, due to the volume of the welding paste before reflow process and/or pad, to give prominence to width uneven, therefore, leg shape on the same position of substrate of the same race sometimes also uneven (different), even if but in this case, the measurement error for each leg also can be made by the way to be less than measurement error in existing skill.
In addition, due to the reason of part, cause the leg of scolding tin after refluxing short and precipitous, therefore, manifest red, green look region in the picture hardly, even if but in this case, the angle of inclination utilizing the range of tilt angles in territory, blue area and infer for dark areas, also can implement measurement similar to the above process.
In addition, be not limited to specific value according to the angle of inclination that deduction table is inferred, also can derive multiple angle, implement above-mentioned measurement process for each angle.Such as, welding paste volume and pad can be utilized respectively to give prominence to upper limit angle and the lower limit angle of the angular range shown in the group corresponding to combination of width, perform above-mentioned measurement, thus obtain the numerical range of the value of the wetting forming height that can obtain the rear scolding tin of backflow.
In addition, in above-mentioned soldering inspection machine 30, irradiate each color light of red, green, blue from the direction that incident angle is different respectively simultaneously and take, assorted region is extracted to implement the calculating shown in Fig. 6 from generated image, but be not limited only to this, also such inspection machine can be used: light the light source corresponding with all directions in order, take during each lighting.Now, from the soldering position at every turn taken the image that generates, extract the high region of brightness, the relation based on these regions implements the process same with Fig. 6.
In addition, in above-mentioned, describe the example volume of the welding paste calculated by solder printing inspection machine 10 being used for inference process, but be not limited in this for the measurement parameter of operation before inferring.Such as, welding paste can be used relative to the mean value etc. of the height of the relative position of pad or print range, welding paste, carry out inference process.
In addition, in the above example, measure pad by soldering printing machine 30 and give prominence to width, but the result of the measurement process of part inspection machine 20 also can be utilized to give prominence to width to obtain pad.Such as, for the scolding tin likely wetting part being molded into part electrode upper, pad can be obtained based on the state of the part before reflow process and give prominence to width.
In addition, if use the inspection machine with 3 d measurement function to be used as part inspection machine 20, then the height of part or part electrode also can be utilized to carry out inference process.Such as, based on the height of welding paste volume and part electrode, the amount flowing into the scolding tin between part electrode and pad in reflow process can be inferred, based on this inferred results, revise the measurement value of wetting forming height.
Fig. 7 represents the broad steps that above-mentioned soldering inspection is relevant.In addition, in this case illustrate simple, illustrate only the process of a substrate, and, the shooting number of times for this substrate is set to once, the number at the soldering position of carrying out processing for each part is set to one.In addition, in soldering checks, the wetting forming height of the rear scolding tin of backflow is measured by the method shown in Fig. 6, but inferring that the measurement parameter of other operation used in the process of the angle θ x corresponding with dark areas is not limited in the volume of welding paste, but the measurement parameter of any kind can used.
First, the substrate S(step S1 of shooting check object), implement following circular treatment LP1 for each part.Below, the process in circular treatment LP1 is described.
In step s 2, based on logged in setting data, be the region detected in the picture by the range set of the part and corresponding pad that comprise check object, in the middle of this region, survey pad and part.Detect pad by the method extracting the high pixel groups of brightness, detect part by the method for the color logged in extracting part.
Then in step s3, based on the testing result in step S2, be the inspection area F shown in Fig. 6 by the range set containing pad and part electrode, the outstanding width of measurement pad.In step s 4 which, from the F of inspection area, assorted region and dark areas is detected.
In step s 5, the testing result based on each region sets measurement line L, and this line measures the coordinate of the end points (some A1, A5) in the region of each interregional end points (some A2, A3, A4) and both sides.In addition, when the look region detected is few, the point of adjustment measurement object is to adapt to this situation.
In step s 6, access checking data administrator 102, reads in the measurement data (the measurement value for the parameter of inference process) obtained for carrying out measuring with position corresponding to part in process by other inspection machine 10,20.In the step s 7, the measurement data of reading in step s 6 are utilized to infer the tilt angle theta x corresponding with dark areas.
In step s 8, for each coordinate measured in step s 5, be suitable for corresponding angle of inclination respectively, thus obtain the curve M shown in Fig. 6, and then, by carrying out integration to calculate the wetting forming height of the rear scolding tin of backflow to it.In step s 9, this height is contrasted with determining reference value, judge the good/bad of soldering position.
Below, above-mentioned circular treatment LP1 implemented by each part for check object.In addition, in fact, part nearly all has multiple soldering position, and therefore, the number of times performing circular treatment LP1 is the number at soldering position.
If execute process for whole part, then the judged result of these process is concentrated to judge the good/bad of whole substrate, to object information such as outgoing inspection such as inspection data administrator 102 grade.In this check result information, not only comprise whole judged results, when can also comprise per (per hour) circular treatment LP1 in judged result, measurement result.
In addition, in the inspection of above-described embodiment, obtain wetting forming height to differentiate the wetting completed state of the rear scolding tin of backflow, but be not limited only to this, also can carry out the curve M shown in analysis chart 6 based on regulation judgment standard, judge that whether the tilt variation of leg is appropriate.
And then, the structure of soldering inspection machine 30 be also not limited to above-mentioned shown in, also can use the inspection machine with solder printing inspection machine 10 same structure shown in Fig. 3.During soldering in this case checks, obtain the altitude information of each point of scolding tin after backflow based on phase shift ratio juris after, can associate corresponding with altitude information for the coordinate of each pixel thus restore the 3D shape of the scolding tin afterwards of refluxing, judge that whether it is appropriate.But, in the inspection machine of this structure, also there are the following problems: owing to being the oblique direction projected fringe shape pattern from substrate, therefore the position that the inclination of the leg of scolding tin is precipitous upon reflowing, the reflected light of projection pattern cannot be incident to camera 2A, cannot calculate altitude information.
Given this point, in the example shown in Fig. 8, when soldering inspection uses the inspection machine based on phase-shifting method, with the privileged site near part for object, the measurement data obtained based on the inspection machine by other operation infer height, described ad-hoc location refers to, causes measuring position highly owing to there is no the reflected light picture of projection pattern.
Below, with reference to Fig. 8, the inspection step of this embodiment is described.In addition, in this example embodiment, also in the same manner as the example of previous Fig. 7, the treatment step for a substrate is only shown, the soldering position of each part is also defined as one.
First, in the step s 21, carry out repeatedly projection process and the shooting of striped design, generate the image of 3 d measurement.Then in step S22, take under the white illumination of lighting device 2A, thus generate the image of outward appearance measurement.
Then, the part for each check object performs circular treatment LP2.
First, in the initial step S23 of circular treatment LP2, utilize the outward appearance measurement image obtained in step s 2 to measure pad and part.The method detected is roughly the same with the step S2 of Fig. 7, therefore detailed.
Next, in step s 24 which, particular range is set as inspection area, described particular range refers to, is included in the scope of a part for pad and the part detected in step S23.Camera 2A is shared, and therefore this inspection area is also applicable to 3 d measurement image.
Thus, in step S25 below, to the above-mentioned inspection area of 3 d measurement image applications, for each pixel in this region, implement the 3 d measurement based on phase-shifting method, thus calculate altitude information.This process and welding paste height identical obtaining soldering inspection machine 10, therefore detailed.
Then in step S26, the scope of the pad detected in step S23 and/or part is contrasted with 3 d measurement result, thus, determine there is the pixel groups of the altitude information corresponding with part and there is the pixel groups of the altitude information that rear scolding tin is corresponding with backflow.
In step s 27, extract the particular pixel group near part, the scope comprising these particular pixel group is defined as non-measurement region, and this particular pixel group refers to, causes calculating the pixel groups of altitude information owing to not detecting the change of brightness phase place.Then, from inspection data administrator 102, read in and carried out measuring process for the part of check object by other inspection machine and the measurement data (step S28) that obtain, contrasting deduction according to read in measurement data shows, thus infers the altitude information (step S29) of non-measurement region.Thereby, it is possible to the altitude information in orientated at steep inclinations face near acquisition part.In addition, in this inference process, the measurement result that can add own device in the measurement data of the inspection machine of other operation is inferred.Such as, the pixel groups of the altitude information after the backflow having and determine in step S26 corresponding to scolding tin can be utilized, obtain the volume of the scolding tin corresponding with these pixel groups and/or curve akin with the inclination of leg, utilize the measurement data of the inspection machine of these results and other operation to carry out inference process.
In step s 30, utilize the altitude information in the respective pixel with the pixel groups of altitude information corresponding with scolding tin after backflow and the pixel groups of non-measurement region, restore the 3D shape of the leg of the rear scolding tin of backflow.In step S31, for the 3D shape after recovery, implement various measurement process.Such as, the girth etc. of scolding tin after volume, the angle change of dip plane of leg, the length of leg or width, backflow can be calculated.
In step s 32, utilize each measurement value to judge the good/bad of soldering position.
Below, similarly, in order the part of check object is performed to the process of circular treatment LP2.Finally in step S33, judge the good/bad of whole substrate, export judged result.
By above-mentioned process, can obtain the altitude information at the precipitous position of the inclination that cannot obtain by means of only common 3 d measurement, high precision restores the 3D shape of whole leg, therefore, it is possible to increase substantially inspection precision.
In the example of above-mentioned Fig. 7 and Fig. 8, all from checking the measurement data reading the inspection machine 10,20 in other operation data administrator 102, but being not limited only to this, also can directly receiving from the inspection machine 10,20 implementing measurement the measurement data provided.
In addition, in each example, log in the information of the form of table, be used as representing the causal information between the measurement data in the feature at the position that cannot directly measure in image procossing and other operation, but be not limited only to this, also can derive and log in the causal function of both expressions.In addition, when logging in deduction table, being also not limited to directly derive the feature being difficult to the position measured near part, also can logging in the deduction table of the structure for deriving whole leg feature.In inference process at this moment, such as, the result of the measurement process in other operation that position that can be corresponding based on the soldering position to check object is relevant, from deduction table, extract the candidate of the shape data of whole leg, select wherein and the immediate data of the shape shown in measured data in soldering inspection machine 30.
Next, device for carrying out inference process is also not limited to soldering inspection machine 30, such as, in inspection data administrator 102, the measurement data received from inspection machine 10,20 can be utilized to perform inference process, this inferred results is provided to soldering inspection machine 30.So, the calculated load in soldering inspection machine 30 can be cut down.In addition, as long as implemented inference process before soldering inspection, just can improve checking efficiency, reduce the line production time (tacttime).
Fig. 9 represents the information flow by checking between each device that data administrator 102 is implemented in the example of inference process.In addition, in this example embodiment, which structure in soldering inspection machine 10 application drawing 2 and Fig. 3 can, the content that soldering checks and inference process measurement data used neither be specific.
Scrutiny program management devices 101, provides the scrutiny program ((I) (RO) (HA) of Fig. 9) corresponding with respective machine to each inspection machine 10,20,30.Based on the part belonging to this part kind, these programs check that benchmark generates for often kind of part, log in scrutiny program management devices 101 as database data.Each inspection machine 10,20,30, based on the design data of the substrate of check object, read in the database data of required part kind from scrutiny program management devices 101, make that these data are corresponding with the positional information of part to be associated, in this case editor is carried out to it and use.
Solder printing inspection machine 10 and part inspection machine 20, respectively based on received scrutiny program, for setting inspection area, each check object position, to specify that parameter processes for object performs measurement, thus judge the good/bad of measurement value.Then, the check result information of the measurement data containing each inspection area is sent to (NI) that check data administrator 102(Fig. 9).
Check data administrator 102, can read the form of the information that these send according to each inspection machine, each substrate and each part, accumulate the information that these send.In addition, in inspection data administrator 102, receive the deduction table of often kind of part or/and the program ((HO) of Fig. 9) of inference process from scrutiny program management devices 101 in advance.Check data administrator 102, based on these tables or/and program and the check result information that obtains from solder printing inspection machine 10 and part inspection machine 20, with the substrate finishing to check in these inspection machines 10,20 for object, for each part on this substrate, infer the characteristic (angle of inclination near part, altitude information etc.) needed for measurement process being used for soldering and checking.
On the other hand, soldering inspection machine 30 is based on providing the scrutiny program come from scrutiny program management devices 101, the image at the soldering position of check object is processed, extract the characteristic needed for checking, and, access checking data administrator 102, receives the characteristic ((HE) of Fig. 9) inferred for the soldering position in process by inspection data administrator 102 provided.Then, based on this characteristic and the characteristic obtained by own device, perform final measurement process, this measurement value and determining reference value are compared, judge the good/bad of soldering position thus.Then, by summarizing this judged result and/or being used for the check result information of the measurement data judged, be sent to (TO) that check data administrator 102(Fig. 9).
In addition, in above-mentioned each example, by not manifesting the position of the feature needed for measurement near the part in soldering position, as the object of inference process, but being not limited only to this, also feature can being manifested unconspicuous position and comprising and interiorly carry out inference process.In addition, also can by the position not having to show in the substrate image of possibility after reflow process completely of the scolding tin between part and pad etc., as the object of inferring.Such as, as an example, based on scolding tin after the volume of the welding paste measured in soldering inspection machine 10 and the backflow that measures in soldering inspection machine 30 volume between relation, infer the amount of scolding tin after the backflow under part.
The explanation of Reference numeral
S substrate,
1 control treatment portion,
2 cameras,
3 Lighting Divisions,
4 Substrate tables,
10 solder printing inspection machines,
11 solder printing devices,
20 part inspection machines,
21 assembly machines,
30 soldering inspection machines,
31 reflow ovens,
102 check data administrator.
Claims (9)
1. a soldering inspection method, face towards substrate configures camera, utilize the image of the described substrate generated by this camera to check the soldering state of the part on this substrate, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, in the multiple operations implemented this substrate, last operation is reflow process, the feature of this soldering inspection method is
In at least one operation in the multiple operations implemented before described reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, for being difficult to the feature differentiating the position of state according to the image generated by described camera in the soldering position of check object, pre-determine the cause-effect relationship between its with the measurement value obtained for position corresponding to this soldering position in the measurement process before described reflow process, log in the cause-effect relationship information representing this relation
Perform following steps:
First step, for the soldering position of the check object become after described reflow process, processes the scope containing this soldering position in described image, obtains the characteristic representing scolding tin shape,
Second step, the measurement value that the measurement process before obtaining by reflow process obtains for the position corresponding with this soldering position,
Third step, utilizes the cause-effect relationship information logged in for this soldering position and the measurement value obtained in described second step, infers the feature being difficult to the position differentiating state according to image in this soldering position,
4th step, by the inferred results in third step, augments in the characteristic obtained in described first step, thus judges the good/bad of described soldering position;
Also have:
Illumination step, for the substrate of check object, the multiple directions different from incident angle irradiate light,
Shooting rate-determining steps, makes described camera work under the illumination of this illumination step, generates the image checked;
Described cause-effect relationship refers to, in the soldering position of described check object, position near part, owing to obtaining the reflected light picture of the light of described illumination step in the picture and causing becoming the angle of inclination at the position of dark areas, and implement to measure in operation before described reflow process and process and cause-effect relationship between the measurement value obtained;
In described first step, from the scope at the soldering position containing check object image, according to the direction of each illumination light, extract the region showing the reflected light picture corresponding with illumination light, and, extract the dark areas produced near part in image,
In described third step, utilize the soldering position for described check object and the described cause-effect relationship information logged in and the measurement value inputted by described second step, infer the angle of inclination at the position corresponding with described dark areas,
In described 4th step, the angle of inclination of being inferred by described third step is augmented in described dark areas, and, for the reflected light picture corresponding with the illumination light from all directions, be suitable for the incident angle according to corresponding illumination light respectively and the angle of inclination of the scolding tin of inferring, utilize these angles of inclination to judge the wetting shaping whether appropriate of the leg at soldering position.
2. soldering inspection method as claimed in claim 1, is characterized in that,
In solder printing operation, implement measurement for the welding paste be printed on each pad of substrate, be used as the measurement process in the operation before described reflow process.
3. soldering inspection method as claimed in claim 1, is characterized in that,
Measurement process is implemented for the welding paste be printed on each pad of substrate in solder printing operation, and measurement process is implemented for the part be arranged on substrate in part installation procedure, be used as the measurement process in the operation before described reflow process, as prerequisite, the causal cause-effect relationship information between the combination logging in the measurement value representing these measurement process and the feature being difficult to differentiate the position of state according to the image that generated by described camera in the soldering position of described check object.
4. soldering inspection method as claimed in claim 2 or claim 3, is characterized in that,
Measure the volume of this welding paste, area, highly, printing position, at least one parameter in print range, be used as the measurement process carried out for the welding paste be printed on the pad of described substrate.
5. soldering inspection method as claimed in claim 3, is characterized in that,
Measure the position of this part, the position relationship between size and pad, at least one parameter in height, be used as the measurement process carried out for the part installed on the substrate.
6. soldering inspection method as claimed in claim 1, is characterized in that,
In described first step, the position near the part at the soldering position in described image, obtain although extract the region that described characteristic cannot obtain described characteristic, infer the feature in this region in described third step.
7. a soldering inspection machine, take substrate as object, face towards substrate configures camera, utilize and take this substrate by this camera, check the soldering state of the part in the image generated, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, and in the multiple operations implemented this substrate, last operation is reflow process, the feature of this soldering inspection machine is to possess:
Storage unit, it logs in the cause-effect relationship information set according to following cause-effect relationship, this cause-effect relationship obtains as follows, in the method, in at least one operation in the multiple operations implemented before described reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, for being difficult to the feature differentiating the position of state according to the image generated by described camera in the soldering position of check object, determine itself and the cause-effect relationship in the measurement process before described reflow process for position corresponding to this soldering position and between the measurement value obtained,
Graphics processing unit, it processes the scope at the soldering position containing check object in described image, obtains the characteristic representing scolding tin shape,
Measurement value input block, it inputs the measurement value obtained for the position that the soldering position with described check object is corresponding by the measurement process before reflow process,
Infer unit, it is for the soldering position of described check object, utilization logs in cause-effect relationship information in the memory unit and inputted by described measurement value input block measurement value for this position, infers the feature being difficult to the position differentiating state according to described image in this soldering position
Judging unit, by the inferred results of described deduction unit, augments in the characteristic obtained by described graphics processing unit, thus judges the good/bad of described soldering position;
Also possess:
Lighting device, it is for the substrate of check object, and the multiple directions different from incident angle irradiate light,
Shooting control module, it makes described camera work under the illumination of this lighting device, generates the image checked;
In described storage unit, login is expressed as follows causal cause-effect relationship information, this cause-effect relationship refers to, in the soldering position of described check object, position near part, owing to obtaining the reflected light picture of the light of described lighting device in the picture and causing becoming the angle of inclination at the position of dark areas, and implement to measure in operation before described reflow process and process and cause-effect relationship between the measurement value obtained
Described graphics processing unit, from the scope at the soldering position containing check object image, according to the direction of each illumination light, extracts the region showing the reflected light picture corresponding with illumination light, and, extract the dark areas produced near part in image,
Described deduction unit, utilizes the soldering position for described check object and the cause-effect relationship information that logs in the memory unit and the measurement value inputted by described measurement value input block, infers the angle of inclination at the position corresponding with described dark areas,
Described judging unit, the angle of inclination of being inferred by described deduction unit is augmented in described dark areas, and, for the reflected light picture corresponding with the illumination light from all directions, be suitable for the incident angle according to corresponding illumination light respectively and the angle of inclination of the scolding tin of inferring, utilize these angles of inclination to judge the wetting shaping whether appropriate of the leg at soldering position.
8. a soldering inspection machine, take substrate as object, face towards substrate configures camera, utilize and take this substrate by this camera, check the soldering state of the part in the image generated, described substrate is the substrate being implemented multiple operation in order to manufactured parts installation base plate, and in the multiple operations implemented this substrate, last operation is reflow process, the feature of this soldering inspection machine is to possess:
Storage unit, it logs in the cause-effect relationship information set according to following cause-effect relationship, this cause-effect relationship obtains as follows, in the method, in at least one operation in the multiple operations implemented before described reflow process, the structure be attached on substrate is measured before next operation starts, as prerequisite, for being difficult to the feature differentiating the position of state according to the image generated by described camera in the soldering position of check object, determine itself and the cause-effect relationship in the measurement process before described reflow process for position corresponding to this soldering position and between the measurement value obtained,
Graphics processing unit, it processes the scope at the soldering position containing check object in described image, obtains the characteristic representing scolding tin shape,
Measurement value input block, it inputs the measurement value obtained for the position that the soldering position with described check object is corresponding by the measurement process before reflow process,
Infer unit, it is for the soldering position of described check object, utilization logs in cause-effect relationship information in the memory unit and inputted by described measurement value input block measurement value for this position, infers the feature being difficult to the position differentiating state according to described image in this soldering position
Judging unit, by the inferred results of described deduction unit, augments in the characteristic obtained by described graphics processing unit, thus judges the good/bad of described soldering position;
Also possess:
Projection arrangement, it is for the pattern image of the substrate projected fringe shape to check object,
Shooting control module, it controls projection arrangement makes described pattern image periodically move pattern along the arrangement of striped to project, and, coordinate the opportunity at every turn projected, make described camera work;
In described storage unit, login is expressed as follows causal cause-effect relationship information, this cause-effect relationship refers to, in the soldering position of described check object, carry out measuring in the height of the privileged site near part and the operation before described reflow process and process and cause-effect relationship between the measurement value obtained, described privileged site refers to, cannot obtain the position of the reflected light picture of described pattern image
Described graphics processing unit, multiple images of shooting in during utilizing the described pattern image of projection one-period, for each pixel in the scope at the soldering position containing check object, based on the phase place of the brightness change that this pixel in during the projection in a described cycle produces, measure the height corresponding with this pixel, the pixel groups of the foot welding height representing scolding tin is extracted based on this measurement result, and, extract because near part, position cannot obtain described brightness change and causes measuring the pixel groups of height
Described deduction unit, utilizes the soldering position for described check object and logs in cause-effect relationship information in the memory unit and measurement value input by described measurement value input block, infers the described height that cannot measure pixel groups highly,
Described judging unit, by the height of being inferred by described deduction unit, augment described cannot measurement in the pixel groups of height, utilize this pixel groups and represent described scolding tin foot welding height pixel groups in the value of each height, judge the wetting shaping whether appropriate of the leg at soldering position.
9. a base plate inspection system, is characterized in that,
Possess:
Be provided in the reflow process in the multiple operations implemented in order to manufactured parts installation base plate, for checking the inspection machine of the substrate after reflow process,
In at least one operation before being provided in reflow process, for checking the inspection machine of the substrate after this operation,
Apparatus for management of information, it reads in check result information by communicating from each inspection machine, can read according to each substrate and each check object position and manage the check result information of each inspection machine;
The inspection machine of described reflow process possesses:
Camera, it is configured to the face of the substrate towards check object,
Graphics processing unit, it processes the scope at the soldering position containing check object in the image generated by this camera, thus obtains the characteristic of the shape representing scolding tin;
Described apparatus for management of information possesses:
Storage unit, it logs in the cause-effect relationship information set according to following cause-effect relationship, this cause-effect relationship obtains as follows, in the method, in the soldering position of the check object of the inspection machine of described reflow process, for being difficult to the feature differentiating the position of state according to the image that generated by described camera, determining that itself and the inspection machine pair position corresponding with this soldering position of the operation before described reflow process carry out measuring and processing and cause-effect relationship between the measurement value that obtains
Measurement value input block, it inputs the measurement value obtained for the position that the soldering position with described check object is corresponding by the inspection machine of the operation before reflow process,
Infer unit, it is for the soldering position of described check object, utilization logs in cause-effect relationship information in the memory unit and inputted by described measurement value input block measurement value for this position, infers the feature being difficult to the position differentiating state according to described image in this soldering position
Transmitting element, it will infer that the inferred results of unit is sent to the inspection machine of reflow process;
The inspection machine of described reflow process also possesses judging unit, the inferred results that this judging unit will send from described apparatus for management of information, augments in the characteristic obtained by described graphics processing unit, thus judges the good/bad of described soldering position;
Also possess:
Lighting device, it is for the substrate of check object, and the multiple directions different from incident angle irradiate light,
Shooting control module, it makes described camera work under the illumination of this lighting device, generates the image checked;
In described storage unit, login is expressed as follows causal cause-effect relationship information, this cause-effect relationship refers to, in the soldering position of described check object, position near part, owing to obtaining the reflected light picture of the light of described lighting device in the picture and causing becoming the angle of inclination at the position of dark areas, and implement to measure for the welding paste be printed on pad in solder printing operation and process and cause-effect relationship between the measurement value obtained
Described graphics processing unit, from the scope at the soldering position containing check object image, according to the direction of each illumination light, extracts the region showing the reflected light picture corresponding with illumination light, and, extract the dark areas produced near part in image,
Described deduction unit, utilizes the soldering position for described check object and the cause-effect relationship information that logs in the memory unit and the measurement value inputted by described measurement value input block, infers the angle of inclination at the position corresponding with described dark areas,
Described judging unit, the angle of inclination of being inferred by described deduction unit is augmented in described dark areas, and, for the reflected light picture corresponding with the illumination light from all directions, be suitable for the incident angle according to corresponding illumination light respectively and the angle of inclination of the scolding tin of inferring, utilize these angles of inclination to judge the wetting shaping whether appropriate of the leg at soldering position.
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JP2011-004770 | 2011-01-13 | ||
JP2011004770A JP5365644B2 (en) | 2011-01-13 | 2011-01-13 | Soldering inspection method, soldering inspection machine, and board inspection system |
PCT/JP2011/056437 WO2012096004A1 (en) | 2011-01-13 | 2011-03-17 | Solder-attachment inspection method, solder-attachment inspection device, and pcb-inspection system |
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CN103314286B true CN103314286B (en) | 2016-01-06 |
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JP5365644B2 (en) | 2013-12-11 |
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