CN103296468B - A kind of Super-material antenna and manufacture method thereof - Google Patents
A kind of Super-material antenna and manufacture method thereof Download PDFInfo
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- CN103296468B CN103296468B CN201210183134.2A CN201210183134A CN103296468B CN 103296468 B CN103296468 B CN 103296468B CN 201210183134 A CN201210183134 A CN 201210183134A CN 103296468 B CN103296468 B CN 103296468B
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Abstract
The invention discloses a kind of Super-material antenna and manufacture method thereof, the method comprises: provide a HIPS substrate; Adhesion metal paillon foil on the first surface of HIPS substrate; Etching metal paillon foil, to form metamaterial microstructure layer; The second surface relative with first surface of HIPS substrate adheres to reflector, and by the way, the present invention can obtain rollable formula Super-material antenna, improves the experience of user.
Description
Technical field
The present invention relates to Super-material antenna technical field, particularly relate to a kind of Super-material antenna and manufacture method thereof.
Background technology
" Meta Materials " refers to some artificial composite structures with the extraordinary physical property not available for natural material or composite material.By the structurally ordered design on the key physical yardstick of material, the restriction of some apparent natural law can be broken through, thus obtain the meta-materials function exceeding the intrinsic common character of nature.The character of Meta Materials and function primarily of the structure of its inside but not the material forming them determine.For design and synthesis Meta Materials, people have carried out a lot of research work.2000, the people such as the Smith of University of California pointed out that the metal wire of periodic arrangement and the composite construction of open loop resonator (SRR) can realize DIELECTRIC CONSTANT ε and magnetic permeability μ is negative two negative material simultaneously, also claim left-handed materials.Afterwards, they are again by achieving the two negative material of two dimension at printed circuit board (PCB) (PCB) upper making metal wire and SRR composite construction.The realization of current metamaterial structure mainly at rigidity PCB or PS(polystyrene, polystyrene) plate make metal wire complete.
But, not yet there is rollable Super-material antenna on the market at present.
Therefore, be necessary to utilize a kind of antenna of Meta Materials manufacture to solve the problems of the technologies described above.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of Super-material antenna and manufacture method thereof, can obtaining the Super-material antenna by specifying requirement curling, improving the experience of user.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the manufacture method providing a kind of Super-material antenna, and the method comprises: provide a HIPS substrate; Adhesion metal paillon foil on the first surface of HIPS substrate; Etching metal paillon foil, to form metamaterial microstructure layer; The second surface relative with first surface of HIPS substrate adheres to reflector.
Wherein, on the first surface of HIPS substrate, the step of adhesion metal paillon foil comprises:
The first surface of HIPS substrate adheres to hot melt adhesive layer;
Adhesion metal paillon foil on hot melt adhesive layer.
Wherein, HIPS substrate is by adding micron order rubber grain in polystyrene and connecting polystyrene and rubber grain acquisition in grafting mode, and HIPS substrate thickness is 0.01mm-2mm, and relative density is 1.04-1.06; water absorption is 0.10%-0.14%, and specific insulation is greater than 1016 Ω m.
Wherein, etching metal paillon foil, comprises with the step forming metamaterial microstructure layer:
Tinsel adheres to photoresist layer;
Photoresist layer is exposed;
Photoresist layer after exposure is developed, to expose the regional area of tinsel;
Etching solution is utilized to etch away the regional area of tinsel, to form metamaterial microstructure layer;
Remove remaining photoresist layer.
Wherein, etching metal paillon foil, to comprise further after the step forming metamaterial microstructure layer:
Use the diaphragm that the cold method of mounting of normal temperature is formed by PVC or PE material at surface attachment one deck of metamaterial microstructure layer.
Wherein, the step that the second surface relative with first surface of HIPS substrate adheres to reflector comprises: adhesion metal film on a second surface, or metal covering or metal device is fixed on second surface.
For solving the problems of the technologies described above, another technical solution used in the present invention is: provide a kind of Super-material antenna, and this Super-material antenna comprises: a HIPS substrate, metamaterial microstructure layer, diaphragm and reflector.Wherein, the second surface that HIPS substrate has first surface and is oppositely arranged with first surface, metamaterial microstructure layer is attached on this first surface, and diaphragm is attached on the surface of metamaterial microstructure layer, and reflector is attached on this second surface.
Wherein, metamaterial microstructure layer is obtained through etching by tinsel.
Wherein, hot melt adhesive layer is provided with between HIPS substrate and metamaterial microstructure layer.
Wherein, reflector is the metallic film be attached on second surface, or fixing metal covering on a second surface or metal device.
The invention has the beneficial effects as follows: the situation being different from prior art, the present invention is adhesion metal paillon foil on HIPS substrate, and etch this tinsel to form metamaterial microstructure layer, and then rollable Super-material antenna can be obtained, make this Super-material antenna can be curling by the requirement of specifying, improve the experience of user.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the Super-material antenna of the embodiment of the present invention;
Fig. 2 is the structural representation of the Super-material antenna of the embodiment of the present invention.
Embodiment
Refer to Fig. 1, Fig. 1 is the flow chart of the manufacture method of the Super-material antenna of the embodiment of the present invention, comprises the following steps:
Step 11: a HIPS substrate is provided;
Step 12: adhesion metal paillon foil on the first surface of HIPS substrate;
Step 13: etching metal paillon foil, to form metamaterial microstructure layer;
Step 14: adhere to reflector on the second surface relative with first surface of HIPS substrate.
Wherein, the HIPS(High impact polystyrene provided in step 11; high impact polystyrene) substrate obtains by adding micron order rubber grain in polystyrene and connecting polystyrene and rubber grain in grafting mode; this HIPS substrate thickness is 0.01mm-2mm; relative density is 1.04-1.06; water absorption is 0.10%-0.14%, and electrical insulating property is good, and specific insulation is greater than 1016 Ω m.When this HIPS substrate is subject to impacting, the point stresses of Crack Extension can be discharged by the rubber grain of flexible relative, and therefore the expansion of crackle is hindered, thus improves shock resistance.5-10 times more excellent in cushion effect than common PS of HIPS.
Wherein, first can adhere to a hot melt adhesive layer on the first surface of HIPS substrate in step 12, then on this hot melt adhesive layer, adhere to a tinsel.
Wherein, melting or softening temperature are that the PUR of 80 DEG C-110 DEG C is attached on this HIPS substrate as bonding agent by preferred employing press, and then on this hot melt adhesive layer, adhere to a tinsel by the method for press hot pressing.
PUR in the present embodiment can select polyamide, polyester, polyolefin, polyesteramide, preferred EVA and TPO PUR.Tinsel in the present embodiment is preferably copper foil, and its thickness is preferably 10um-70um.
Refer to table 1, table 1 is the model of adoptable PUR in the embodiment shown in Fig. 1 and corresponding melt temperature, color, adhesion and suitable application region.For different conditions, user can select the PUR of different model.
Table 1
| Model | Melt temperature | Color | Adhesion | Suitable application region |
| 5026 | 80 | Colourless | High | Low temperature arid area |
| 5306 | 80 | Yellowish | High | Low temperature arid area |
| 4005 | 110 | Colourless | Higher | Water-tolerant, hot and humid area |
| H075 | 80 | Colourless | High | Low temperature arid area |
Refer to table 2, table 2 is the model hot pressing parameterses corresponding to the PUR of 5026 adopted in the embodiment shown in Fig. 1.
Table 2
Wherein, step 13 comprises:
Tinsel adheres to photoresist layer;
Photoresist layer is exposed;
Photoresist layer after exposure is developed, to expose the regional area of tinsel;
Etching solution is utilized to etch away the regional area of tinsel, to form metamaterial microstructure layer;
Remove remaining photoresist layer.
Specifically, in this step, first use laminator to adhere to photoresist layer on tinsel, the pressure of laminator is 4-6kg, and wheel speeds is 1.7-2.3m/min, and hot plate temperature scope control is at 90-130 DEG C; Then the light shade cover of a subregion printing opacity is added at this photoresist layer upper area; Utilize this light shade cover of UV-irradiation, to make the transmission region of this light shade cover of UV light permeability to expose this photoresist layer.In the present embodiment, the progression exposed photoresist layer is 6-7 level (21 grades of lighting level chis), the preferred 85%-99% of vacuum degree.After photoresist layer end exposure, keep HIPS substrate to leave standstill a period of time and cool gradually to make this HIPS substrate, time of repose is preferably 15-30min.
Then, develop, the regional area through UV-irradiation is exposed to the photoresist layer after exposure, recycling etching solution etches away this regional area of this tinsel, to form metamaterial microstructure layer.
In this step 13, after the photoresist layer after exposure is developed, need to rinse to wash away surperficial dirt to HIPS substrate, and then carry out twice pressurization washing to rinse out the dirt on this HIPS substrate further, recycle clear water afterwards and one time is rinsed to HIPS substrate, and check whether HIPS substrate is rinsed well.After tinsel is rinsed, sulfuric acid solution is utilized to carry out pickling to the HIPS substrate forming metamaterial microstructure layer, with softening remaining photoresist layer, be beneficial to follow-up matting resistance layer (moving back film) operation, utilize twice overflow washing and a clear water to wash away sulfuric acid solution subsequently successively.Then, sodium hydroxide solution is utilized to be resigned from office from HIPS substrate by remaining photoresist layer; Then carry out successively three times pressurization washing and a clear water wash to be rinsed well by the HIPS substrate with metamaterial microstructure layer of photoresist layer of decorporating; Finally baking operation is carried out to HIPS substrate.
Refer to table 3, table 3 is the parameter of the solution that in the step 13 shown in Fig. 1, each step is corresponding and the operating condition of correspondence.
Table 3
After completing steps 13, usually carry out internal layer and bore target, namely be the round dot of 0.8-1.2mm at edge designs 3 diameters of HIPS substrate, adopt identification point drilling machine to be positioned on HIPS substrate limit with these 3 identification points, process hole that 4-12 diameter is 2.0-4.0mm so that be the location of follow-up plate.After completing internal layer brill target, usually use the profile of CNC milling machine processing HIPS substrate, then use the diaphragm that the cold method of mounting of normal temperature is formed by PVC or PE material at surface attachment one deck of metamaterial microstructure layer.
In this step 14; to adhere to diaphragm the HIPS substrate with metamaterial microstructure layer the second surface relative with first surface on adhesion metal film; this metallic film can be aluminium foil, Copper Foil, stainless steel foil, tinfoil paper etc.; or launch directly to be fixed on this second surface by metal covering or metal device when using at HIPS substrate, this metal covering or metal device can be steel plate, aluminium sheet, corrosion resistant plate, Copper Foil, tinfoil paper etc.
Refer to Fig. 2, Fig. 2 is the structural representation of the Super-material antenna of the embodiment of the present invention.As shown in Figure 2, the Super-material antenna of the present embodiment comprises HIPS substrate 21, hot melt adhesive layer 22, metamaterial microstructure layer 23, reflector 24 and diaphragm 25.
In the present embodiment, HIPS substrate 21 has first surface and the second surface relative with first surface, and metamaterial microstructure layer 23 is attached on the first surface of HIPS substrate 21, and hot melt adhesive layer 22 is arranged between HIPS substrate 21 and metamaterial microstructure layer 23.Wherein, metamaterial microstructure layer 23 is obtained through etching by tinsel, and its concrete etching process gives detailed description in the embodiment of the manufacture method of Super-material antenna, does not repeat them here.Reflector 24 is for being attached to the metallic film on the second surface of HIPS substrate 21, this metallic film can be aluminium foil, Copper Foil, stainless steel foil, tinfoil paper etc., or the metal covering be fixed on the second surface of HIPS substrate 21 or metal device, this metal covering or metal device can be steel plate, aluminium sheet, corrosion resistant plate, Copper Foil, tinfoil paper etc.Diaphragm 25 is attached on the surface of metamaterial microstructure layer 23, and wherein, diaphragm 25 is made up of materials such as PVC or PE.
In the present embodiment, PUR can select polyamide, polyester, polyolefin, polyesteramide, preferred EVA and TPO PUR, and wherein, the tinsel preferably copper paillon foil in the present embodiment, its thickness is preferably 10um-70um.
By the way, the present invention can obtain rollable Super-material antenna, improves the experience of user.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a manufacture method for Super-material antenna, is characterized in that, comprising:
One HIPS substrate is provided;
The first surface of described HIPS substrate adheres to hot melt adhesive layer, adhesion metal paillon foil on described hot melt adhesive layer;
Described tinsel adheres to photoresist layer;
Add the light shade cover of a subregion printing opacity at described photoresist layer upper area, utilize light shade cover described in UV-irradiation, to make the transmission region of light shade cover described in UV light permeability to expose described photoresist layer;
After described photoresist layer end exposure, keep described HIPS substrate to leave standstill a period of time and cool gradually to make this HIPS substrate;
Described photoresist layer after exposure is developed, the regional area of the described tinsel through UV-irradiation is exposed;
Etching solution is utilized to etch away the described regional area of described tinsel, to form described metamaterial microstructure layer;
Sulfuric acid solution is utilized to carry out pickling to the HIPS substrate forming metamaterial microstructure layer, with softening remaining photoresist layer;
Sodium hydroxide solution is utilized to be resigned from office from HIPS substrate by remaining photoresist layer;
The second surface relative with described first surface of described HIPS substrate adheres to reflector.
2. method according to claim 1; it is characterized in that; described HIPS substrate is by adding micron order rubber grain in polystyrene and connecting described polystyrene and the acquisition of described rubber grain in grafting mode; described HIPS substrate thickness is 0.01mm-2mm; relative density is 1.04-1.06; water absorption is 0.10%-0.14%, and specific insulation is greater than 1016 Ω m.
3. method according to claim 1, is characterized in that, is comprised further by remaining photoresist layer at the described sodium hydroxide solution that utilizes after step resigned from office by HIPS substrate:
Use the diaphragm that the cold method of mounting of normal temperature is formed by PVC or PE material at surface attachment one deck of described metamaterial microstructure layer.
4. method according to claim 1, it is characterized in that, described step of adhering to reflector on the second surface relative with described first surface of described HIPS substrate comprises: adhesion metal film on described second surface, or metal covering or metal device is fixed on described second surface.
5. adopt the Super-material antenna that the manufacture method of Super-material antenna according to claim 1 obtains, it is characterized in that, described Super-material antenna comprises:
One HIPS substrate, the second surface that described HIPS substrate has first surface and is oppositely arranged with described first surface;
Metamaterial microstructure layer, described metamaterial microstructure layer is attached on described first surface;
Hot melt adhesive layer is provided with between described HIPS substrate and described metamaterial microstructure layer;
Diaphragm, described diaphragm is attached on the surface of described metamaterial microstructure layer;
Reflector, described reflector is attached on described second surface;
Described metamaterial microstructure layer is obtained through etching by tinsel.
6. Super-material antenna according to claim 5, is characterized in that, described reflector is be attached to the metallic film on described second surface, or the metal covering be fixed on described second surface or metal device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210183134.2A CN103296468B (en) | 2012-03-02 | 2012-06-05 | A kind of Super-material antenna and manufacture method thereof |
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| CN201210053698.4 | 2012-03-02 | ||
| CN201210053698 | 2012-03-02 | ||
| CN201210183134.2A CN103296468B (en) | 2012-03-02 | 2012-06-05 | A kind of Super-material antenna and manufacture method thereof |
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| CN103296468A CN103296468A (en) | 2013-09-11 |
| CN103296468B true CN103296468B (en) | 2015-10-28 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0274592A1 (en) * | 1986-11-07 | 1988-07-20 | Yagi Antenna Co., Ltd. | Flat antenna apparatus |
| CN1425209A (en) * | 2000-01-19 | 2003-06-18 | 穆尔北美公司 | RF ID foil or film antennas |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | Focusing panel antenna |
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2012
- 2012-06-05 CN CN201210183134.2A patent/CN103296468B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0274592A1 (en) * | 1986-11-07 | 1988-07-20 | Yagi Antenna Co., Ltd. | Flat antenna apparatus |
| CN1425209A (en) * | 2000-01-19 | 2003-06-18 | 穆尔北美公司 | RF ID foil or film antennas |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | Focusing panel antenna |
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| CN103296468A (en) | 2013-09-11 |
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Effective date of registration: 20210707 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 18B, building a, CIC international business center, 1061 Xiangmei Road, Futian District, Shenzhen, Guangdong 518034 Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |
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