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CN103294270A - Monolayer multiple-point touch conducting film and producing method thereof - Google Patents

Monolayer multiple-point touch conducting film and producing method thereof Download PDF

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Publication number
CN103294270A
CN103294270A CN2013102104265A CN201310210426A CN103294270A CN 103294270 A CN103294270 A CN 103294270A CN 2013102104265 A CN2013102104265 A CN 2013102104265A CN 201310210426 A CN201310210426 A CN 201310210426A CN 103294270 A CN103294270 A CN 103294270A
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CN
China
Prior art keywords
conducting film
module
multipoint mode
individual layer
control conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013102104265A
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Chinese (zh)
Inventor
张晟
顾滢
亢红伟
杨云良
郭胜波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN2013102104265A priority Critical patent/CN103294270A/en
Publication of CN103294270A publication Critical patent/CN103294270A/en
Priority to PCT/CN2014/072739 priority patent/WO2014190790A1/en
Priority to US14/265,313 priority patent/US9640294B2/en
Priority to EP14166652.9A priority patent/EP2808770B1/en
Priority to TW103117731A priority patent/TWI562048B/en
Priority to KR1020140064715A priority patent/KR101639255B1/en
Priority to JP2014112504A priority patent/JP5846457B2/en
Pending legal-status Critical Current

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Abstract

A monolayer multiple-point touch conducting film comprises a transparent glass substrate, bridging modules, a transparent polymer layer and conductive modules. The bridging modules made of linear metal conductive materials are arranged on a first surface of the transparent glass substrate, and linear width of the metal conductive materials ranges from 500nm (nautical miles) to 6mum (micrometers). The transparent polymer layer is arranged on the first surface of the transparent polymer layer, and covers on the bridging modules. First groove grids are formed on the surface of the transparent polymer layer, conductive materials are filled in the first groove grids, and first electrodes and multiple second electrode modules are respectively formed. The conductive modules are arranged on the transparent polymer layer so as to be directly electrically connected with the bridging modules. Each of the second electrode modules is electrically connected with the bridging modules through the conductive modules. The monolayer multi-point touch conducting film is thin, low in cost, simple in production process and good in visual effect. The invention further provides a producing method of the monolayer multiple-point touch conducting film.

Description

Individual layer multipoint mode touch-control conducting film and preparation method thereof
[technical field]
The present invention relates to a kind of touch-control conducting film, particularly relate to a kind of individual layer multipoint mode touch-control conducting film and preparation method thereof.
[background technology]
Nesa coating is the sensing element that receives input signals such as touch in the touch-screen.At present, ITO(tin indium oxide) layer is vital ingredient in the nesa coating.Though the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, be example with the projecting type capacitor screen, too big change does not take place in the basic manufacturing process of ITO layer in recent years, always inevitably needs the ITO plated film, and ITO is graphical.
Indium is a kind of metal material of costliness, therefore with the material of ITO as conductive layer, has promoted the cost of touch-screen to a great extent.Moreover the ITO conductive layer need carry out etching by whole the ITO film that plating is good in graphical technology, and to form the ITO pattern, in this technology, a large amount of ITO is etched, causes a large amount of noble metal waste and pollution.
Therefore, the cost of products that makes of ITO material and corresponding technology remains high, and causes the cost of traditional individual layer multipoint mode touch-control conducting film higher; And the bridging structure of traditional individual layer multipoint mode touch-control conducting film is formed at more than the conductive pattern; the plating layer protective layer is filled and led up and is protected in addition; increase product thickness and production link, cause the thickness of traditional individual layer multipoint mode touch-control conducting film big, production technology is comparatively complicated.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide that a kind of thinner thickness, cost are lower, production technology is comparatively simple, visual effect individual layer multipoint mode touch-control conducting film preferably.
A kind of individual layer multipoint mode touch-control conducting film, it comprises:
Clear glass substrate comprises first surface and the second surface that is oppositely arranged with described first surface;
The bridging module is located at the first surface of described clear glass substrate, and described bridging module is made of the metallic conduction material, and described metallic conduction material is wire, and live width is 500nm~6 μ m;
Transparent polymeric layer be located at the first surface of described clear glass substrate, and described transparent polymeric layer covers described bridging module; Be formed with the first channel form grid on the surface of described transparent polymeric layer, be filled with conductive material in the described first channel form grid, form first electrode and a plurality of second electrode module respectively, described first electrode extends setting along the first dimension direction, described a plurality of second electrode modules edge is spaced with the second dimension direction that the described first dimension direction intersects, described bridging module is used for being electrically connected adjacent two described second electrode modules, to form second electrode that row extend along the described second dimension direction; And
Conductive module is located at described transparent polymeric layer, and described conductive module runs through described transparent polymeric layer, and described conductive module directly is electrically connected with described bridging module; Each described second electrode module is electrically connected with described bridging module by described conductive module, thereby forms described second electrode.
Compared to traditional individual layer multipoint mode touch-control conducting film, above-mentioned individual layer multipoint mode touch-control conducting film has the following advantages at least:
(1) above-mentioned individual layer multipoint mode touch-control conducting film is provided with transparent polymeric layer earlier on clear glass substrate, be formed with the channel form grid on the transparent polymeric layer, be filled with conductive material in the channel form grid, to form electrode, thereby replace conventional I TO process structure with embedded network, thereby reduce cost simplified manufacturing technique.
(2) the bridging module of above-mentioned individual layer multipoint mode touch-control conducting film is formed on the clear glass substrate earlier; adopt the transparent polymeric layer covering afterwards the plough groove type grid to be set and to form conductive pattern again; so the bridging module is formed at transparent polymeric layer and clear glass substrate; need not be more extra protective seam is protected the bridging module; both reduce production link, reduced the thickness of individual layer multipoint mode touch-control conducting film again.
(3) above-mentioned individual layer multipoint mode touch-control conducting film comes metal-coated membrane with glass as transparent substrates, thereby forms the bridging module in clear glass substrate, therefore can utilize the good coating performance of glass to form the bridging module preferably.And the live width of the metallic conduction material of bridging module is 500nm~5um, can impel the visually-clear of metal wire, avoids influencing user's the visual effect that individual layer multipoint mode touch-control conducting film is watched that sees through.
Among embodiment, described bridging module is a line segment therein, perhaps connects the structure that line segment is connected to form by at least one between two line segments.
Among embodiment, when described bridging module was a line segment, described conductive module was located at the two ends of a described line segment therein; When described bridging module was the structure that is connected to form by at least one connection line segment between two line segments, described conductive module was located on described two line segments.
Among embodiment, described conductive module is the line segment shape therein, and the width of described conductive module is 500nm~5 micron.
Among embodiment, described conducting film also comprises light shield layer therein, and described light shield layer is positioned at described clear glass substrate edge, and described light shield layer is printing ink or black photoresistance.
Among embodiment, described first electrode is drive electrode therein, and described second electrode is induction electrode.
Among embodiment, described individual layer multipoint mode conducting film also comprises the lead-in wire electrode in the not visible zone of being located at described individual layer multipoint mode touch-control conducting film therein, and described lead-in wire conductive material of electrodes is electrically connected with conductive material in described first netted groove.
Among embodiment, the not visible zone of the corresponding described individual layer multipoint mode touch-control conducting film in the marginal surface place of described transparent polymeric layer is formed with the second channel form grid therein, and filled conductive material in the described second channel form grid forms described lead-in wire electrode.
Among embodiment, the described second channel form grid is regular grid or random grid therein.
Among embodiment, the groove width of the described second channel form grid is d1 therein, and the degree of depth is h, wherein, 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1〉1.
Therein among embodiment, described lead-in wire electrode is the conductive material that is formed at the latticed or linear at marginal surface described clear glass substrate or that be located at described transparent polymeric layer place, and described lead-in wire electrode pair answers the not visible zone of described individual layer multipoint mode touch-control conducting film to arrange.
Among embodiment, described transparent polymeric layer is UV glue, impression glue or polycarbonate therein.
Among embodiment, described individual layer multipoint mode touch-control conducting film also comprises the protective clear layer that covers on the described transparent polymeric layer therein, and described protective clear layer is UV glue, impression glue or polycarbonate.
Among embodiment, the channel bottom of the described first channel form grid is " V " font, " W " font, arc or corrugated micro-groove therein.
Among embodiment, the degree of depth of described micro-groove is 500nm~1 μ m therein.
Simultaneously, the present invention also provides a kind of manufacture method of individual layer multipoint mode touch-control conducting film.
A kind of manufacture method of above-mentioned individual layer multipoint mode touch-control conducting film, it comprises:
First surface in described clear glass substrate is laid conductive material, forms described bridging module;
Form described conductive module in described bridging module;
First surface in described clear glass substrate is laid the layer of transparent polymkeric substance, and the described conductive module of described transparent polymer landfill, forms described transparent polymeric layer;
Surface in described transparent polymeric layer forms the described first channel form grid; And
Filled conductive material in the described first channel form grid, described conductive material directly is connected with described conductive module, forms described first electrode and described second electrode.
Therein among embodiment, the described step that forms described conductive module in described bridging module comprises:
First surface in described clear glass substrate forms one deck photoresist layer, and described photoresist layer covers described bridging module;
Form the hole of corresponding described conductive module shape in described bridging module by the method for photoetching development;
Filled conductive material in described hole forms described conductive module; And
Described photoresist layer is exposed, to remove described photoresist layer.
Among embodiment, described transparent polymeric layer is impression glue therein, and described transparent polymeric layer forms described plough groove type grid by the mode of impression.
[description of drawings]
Fig. 1 is the vertical view of the individual layer multipoint mode touch-control conducting film of embodiment of the present invention one;
Fig. 2 is the sectional view of individual layer multipoint mode touch-control conducting film shown in Figure 1;
Fig. 3 (a) is the structural representation of different embodiment of the bridging module of individual layer multipoint mode touch-control conducting film shown in Figure 1 to Fig. 3 (c);
Fig. 4 (a) is the structural representation of different embodiment of channel bottom of the first channel form grid of the transparent polymeric layer of individual layer multipoint mode touch-control conducting film shown in Figure 1 to Fig. 4 (d);
Fig. 5 is the wherein shape of an embodiment of the second channel form grid of the transparent polymeric layer of individual layer multipoint mode touch-control conducting film shown in Figure 1;
Fig. 6 is the shape of second another embodiment of channel form grid of the transparent polymeric layer of individual layer multipoint mode touch-control conducting film shown in Figure 1;
Fig. 7 is the process flow diagram of manufacture method of the individual layer multipoint mode touch-control conducting film of embodiment of the present invention;
Fig. 8 (a) is the structural representation of each step of manufacture method of the individual layer multipoint mode touch-control conducting film of embodiment of the present invention to Fig. 8 (e);
Fig. 9 (a) to Fig. 9 (d) be embodiment of the present invention individual layer multipoint mode touch-control conducting film manufacture method form the structural representation of conducting film step in the bridging module;
Figure 10 is the sectional view of the individual layer multipoint mode touch-control conducting film of embodiment of the present invention two.
[embodiment]
For the ease of understanding the present invention, with reference to relevant drawings the present invention is described more fully below.Provided preferred embodiment of the present invention in the accompanying drawing.But the present invention can realize with many different forms, be not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present invention comprehensively thorough more.
Need to prove that when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be to be directly connected to another element or may to have element placed in the middle simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, the employed all technology of this paper are identical with the implication that belongs to those skilled in the art's common sense of the present invention with scientific terminology.Employed term is not intended to be restriction the present invention just in order to describe the purpose of specific embodiment in instructions of the present invention herein.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
See also Fig. 1 and Fig. 2, the individual layer multipoint mode touch-control conducting film 100 of embodiment of the present invention one comprises clear glass substrate 110, bridging module 120, transparent polymeric layer 130 and conductive module 140.
Clear glass substrate 110 comprises first surface and the second surface that is oppositely arranged with described first surface.The shape of clear glass substrate 110 can be set according to the shape of individual layer multipoint mode touch-control conducting film 100, and for example, clear glass substrate 110 is rectangle.
Bridging module 120 is located at the first surface of clear glass substrate 110, and bridging module 120 is made of the metallic conduction material.The metallic conduction material is wire, and live width is 500nm~6 μ m.The metallic conduction material can be the non-transparent metals conductive material, and the live width of metallic conduction material is 500nm~6 μ m, can reach the visually-clear purpose, avoids influencing user's vision.Bridging module 120 can be a line segment, and bridging module 120 also can be for connecting the structure that line segment is connected to form by at least one between two line segments.See also Fig. 3 (a) to Fig. 3 (c), for example, bridging module 120 shown in Fig. 3 (a) is a line segment, bridging module 120 shown in Fig. 3 (b) is to connect the H type structure that line segment is connected to form by one between two line segments, and the bridging module 120 shown in Fig. 3 (c) is to connect " mouth " font structure that line segment is connected to form by two between two line segments.Preferably, the width of the line segment of composition bridging module 120 is 1~6 micron.
Transparent polymeric layer 130 is located at the first surface of clear glass substrate 110, and transparent polymeric layer 130 covers bridging module 120.Be formed with on the surface of transparent polymeric layer 130 in the first channel form grid, 131, the first channel form grids 131 and be filled with conductive material, form first electrode 133 and a plurality of second electrode module 135a respectively.First electrode 133 extends setting along the first dimension direction, and the second dimension direction that a plurality of second electrode module 135a edge and the first dimension direction intersect is spaced.Bridging module 120 is used for being electrically connected adjacent two second electrode module 135a, to form second electrode 135 that row extend along the second dimension direction.
Specifically in illustrated embodiment, transparent polymeric layer 130 can be UV glue, impression glue or polycarbonate.First electrode 133 can be drive electrode, and second electrode 135 can be induction electrode.The first dimension direction can intersect vertically with the second dimension direction, also can oblique, and specifically in illustrated embodiment, the first dimension direction is Y-axis, second to tie up direction be X-axis, the form right angle coordinate system.
Further, the channel bottom of the first channel form grid 131 can be " V " font, " W " font, arc or corrugated micro-groove.See also Fig. 4 (a) to figure (d), the channel bottom of the first channel form grid 131 shown in Fig. 4 (a) is the micro-groove of " V " font, the channel bottom of the first channel form grid 131 shown in Fig. 4 (b) is the micro-groove of " W " font, the channel bottom of the first channel form grid 131 shown in Fig. 4 (c) is the micro-groove of arc, and the channel bottom of the first channel form grid 131 shown in Fig. 4 (d) is corrugated micro-groove.Preferably, the degree of depth of micro-groove is 500nm~1 μ m.
Conductive module 140 is located at transparent polymeric layer 130, and conductive module 140 runs through transparent polymeric layer 130, and conductive module 140 directly is electrically connected with bridging module 120.Each second electrode module 135a is electrically connected with bridging module 120 by conductive module 140, thereby forms second electrode 135.For example, when bridging module 120 was a line segment, conductive module 140 was located at the two ends of a line segment; When bridging module 120 was the structure that is connected to form by at least one connection line segment between two line segments, conductive module 140 was located on two line segments.
Specifically in illustrated embodiment, conductive module 140 is the line segment shape, and the width of conductive module 140 is 500nm~5 micron.
Further, individual layer multipoint mode conducting film also comprises the not visible zone lead-in wire electrode of being located at individual layer multipoint mode touch-control conducting film 100, and the lead-in wire conductive material of electrodes is electrically connected with conductive material in first netted groove.
Among the embodiment therein, the not visible zone of the marginal surface place of transparent polymeric layer 130 corresponding individual layer multipoint mode touch-control conducting film 100 is formed with the second channel form grid, filled conductive material in the first channel form grid and the second channel form grid forms the lead-in wire electrode.See also Fig. 5 and Fig. 6, the first channel form grid and the second channel form grid can be regular grid or random grid.Preferably, the groove width of the second channel form grid is d1, and the degree of depth is h, wherein, 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1〉1.
In other embodiments, the lead-in wire electrode is the conductive material that is formed at the latticed or linear at marginal surface place clear glass substrate 110 or that be located at transparent polymeric layer 130, and the lead-in wire electrode pair answers the not visible zone of individual layer multipoint mode touch-control conducting film 100 to arrange.
Further, individual layer multipoint mode touch-control conducting film 100 also comprises the protective clear layer that covers on the transparent polymeric layer 130, and protective clear layer can be UV glue, impression glue or polycarbonate.
Need to prove that all electrically conductive materials that embodiment of the present invention adopts preferably adopts transparent conductive material, certainly, in other embodiments, also can adopt nontransparent conductive material.
See also Figure 10, the individual layer multipoint mode touch-control conducting film 200 of embodiment of the present invention two is basic identical with the individual layer multipoint mode touch-control conducting film 100 of embodiment one, its difference is: individual layer multipoint mode touch-control conducting film 200 also comprises light shield layer 260, light shield layer 260 is positioned at the edge of clear glass substrate 110, is used to form described not visible zone.Light shield layer 260 can be printing ink or black photoresistance.
Compared to traditional individual layer multipoint mode touch-control conducting film, above-mentioned individual layer multipoint mode touch-control conducting film 100 has the following advantages at least:
(1) above-mentioned individual layer multipoint mode touch-control conducting film 100 is provided with transparent polymeric layer 130 in clear glass substrate 110, be formed with the channel form grid on the transparent polymeric layer 130, be filled with conductive material in the channel form grid, to form electrode, therefore, replace conventional I TO process structure with embedded network, thereby reduce cost simplified manufacturing technique.
(2) the bridging module 120 of above-mentioned individual layer multipoint mode touch-control conducting film 100 is formed on earlier on the clear glass substrate 110; adopt transparent polymeric layer 130 coverings afterwards the plough groove type grid to be set and to form conductive pattern again; so bridging module 120 is formed at transparent polymeric layer 130 and clear glass substrate 110; need not be more extra protective seam is protected bridging module 120; both reduce production link, reduced the thickness of individual layer multipoint mode touch-control conducting film 100 again.
(3) above-mentioned individual layer multipoint mode touch-control conducting film 100 comes metal-coated membrane with glass as transparent substrates, thereby forms bridging modules 120 in clear glass substrate 110, therefore can utilize the good coating performance of glass to form bridging module 120 preferably.And the live width of the metallic conduction material of bridging module 120 is 500nm~5um, can impel the visually-clear of metal wire, avoids influencing user's the visual effect that individual layer multipoint mode touch-control conducting film 100 is watched that sees through.
Simultaneously, the present invention also provides a kind of manufacture method of individual layer multipoint mode touch-control conducting film, for the manufacture of above-mentioned individual layer multipoint mode touch-control conducting film 100.
See also Fig. 7, the manufacture method of the individual layer multipoint mode touch-control conducting film 100 of present embodiment comprises the steps S201~S205:
Step S201 shown in Fig. 8 (a) and Fig. 8 (b), lays conductive material at the first surface of clear glass substrate 110, forms bridging module 120.Bridging module 120 is located at the first surface of clear glass substrate 110, and bridging module 120 is made of conductive material.Bridging module 120 can be a line segment, and bridging module 120 also can be for connecting the structure that line segment is connected to form by at least one between two line segments.For example, bridging module 120 can be a line segment, connects the H type structure that line segment is connected to form by one between two line segments, connects " mouth " font structure that line segment is connected to form by two between two line segments.Preferably, the width of the line segment of composition bridging module 120 is 1~6 micron.
Step S202 shown in Fig. 8 (c), forms conductive module 140 in bridging module 120.Conductive module 140 is located at transparent polymeric layer 130, and conductive module 140 runs through transparent polymeric layer 130, and conductive module 140 directly is electrically connected with bridging module 120.Each second electrode module 135a is electrically connected with bridging module 120 by conductive module 140, thereby forms second electrode 135.For example, when bridging module 120 was a line segment, conductive module 140 was located at the two ends of a line segment; When bridging module 120 was the structure that is connected to form by at least one connection line segment between two line segments, conductive module 140 was located on two line segments.For example, conductive module 140 is the line segment shape, and the width of conductive module 140 is 500nm~5 micron.
See also Fig. 9 (a) to Fig. 9 (d), specifically in illustrated embodiment, the step that forms conductive module 140 in bridging module 120 comprises:
Shown in Fig. 9 (a), at first surface formation one deck photoresist layer 200 of clear glass substrate 110, photoresist layer 200 covers bridging modules 120;
Shown in Fig. 9 (b), form the hole 201 of corresponding conductive module 140 shapes in bridging module 120 by the method for photoetching development;
Shown in Fig. 9 (c), filled conductive material in hole forms conductive module 140; And
Shown in Fig. 9 (d), photoresist layer 200 is exposed, to remove photoresist layer 200.
Step S203 shown in Fig. 8 (d), lays the layer of transparent polymkeric substance at the first surface of clear glass substrate 110, and transparent polymer landfill conductive module 140, forms transparent polymeric layer 130.Transparent polymeric layer 130 is located at the first surface of clear glass substrate 110, and transparent polymeric layer 130 covers bridging module 120.Be formed with on the surface of transparent polymeric layer 130 in the first channel form grid, 131, the first channel form grids 131 and be filled with conductive material, form first electrode 133 and a plurality of second electrode module 135a respectively.First electrode 133 extends setting along the first dimension direction, and the second dimension direction that a plurality of second electrode module 135a edge and the first dimension direction intersect is spaced.Bridging module 120 is used for being electrically connected adjacent two second electrode module 135a, to form second electrode 135 that row extend along the second dimension direction.
Step S204 shown in Fig. 8 (e), forms the first channel form grid 131 on the surface of transparent polymeric layer 130.Transparent polymeric layer 130 can be UV glue, impression glue or polycarbonate.The channel bottom of the first channel form grid 131 can be " V " font, " W " font, arc or corrugated micro-groove.For example, the channel bottom of the first channel form grid 131 can be the micro-groove of " V " font, the micro-groove of " W " font, the micro-groove of arc, perhaps corrugated micro-groove.Preferably, the degree of depth of micro-groove is 500nm~1 μ m.
Specifically in illustrated embodiment, transparent polymeric layer 130 is impression glue, and transparent polymeric layer 130 forms the plough groove type grid by the mode of impression.
Step S205, filled conductive material in the first channel form grid 131, conductive material directly is connected with conductive module 140, forms first electrode 133 and second electrode 135.For example, first electrode 133 can be drive electrode, and second electrode 135 can be induction electrode.
Need to prove, if need be when clear glass substrate forms light shield layer, before step S202, simultaneously or afterwards, the edge that also is included in clear glass substrate forms the step of light shield layer.Light shield layer can adopt the mode of printing ink spraying, coating to form on the clear glass substrate.Preferably, before step S202, the edge that also is included in clear glass substrate forms the step of light shield layer.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (19)

1. an individual layer multipoint mode touch-control conducting film is characterized in that, comprising:
Clear glass substrate comprises first surface and the second surface that is oppositely arranged with described first surface;
The bridging module is located at the first surface of described clear glass substrate, and described bridging module is made of the metallic conduction material, and described metallic conduction material is wire, and live width is 500nm~6 μ m;
Transparent polymeric layer be located at the first surface of described clear glass substrate, and described transparent polymeric layer covers described bridging module; Be formed with the first channel form grid on the surface of described transparent polymeric layer, be filled with conductive material in the described first channel form grid, form first electrode and a plurality of second electrode module respectively, described first electrode extends setting along the first dimension direction, described a plurality of second electrode modules edge is spaced with the second dimension direction that the described first dimension direction intersects, described bridging module is used for being electrically connected adjacent two described second electrode modules, to form second electrode that row extend along the described second dimension direction; And
Conductive module is located at described transparent polymeric layer, and described conductive module runs through described transparent polymeric layer, and described conductive module directly is electrically connected with described bridging module; Each described second electrode module is electrically connected with described bridging module by described conductive module, thereby forms described second electrode.
2. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that, described bridging module is a line segment, perhaps connects the structure that line segment is connected to form by at least one between two line segments.
3. individual layer multipoint mode touch-control conducting film as claimed in claim 2 is characterized in that when described bridging module was a line segment, described conductive module was located at the two ends of a described line segment; When described bridging module was the structure that is connected to form by at least one connection line segment between two line segments, described conductive module was located on described two line segments.
4. individual layer multipoint mode touch-control conducting film as claimed in claim 3 is characterized in that described conductive module is the line segment shape, and the width of described conductive module is 500nm~5 micron.
5. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that described conducting film also comprises light shield layer, and described light shield layer is positioned at described clear glass substrate edge, and described light shield layer is printing ink or black photoresistance.
6. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that described first electrode is drive electrode, and described second electrode is induction electrode.
7. individual layer multipoint mode touch-control conducting film as claimed in claim 1, it is characterized in that, described individual layer multipoint mode conducting film also comprises the lead-in wire electrode in the not visible zone of being located at described individual layer multipoint mode touch-control conducting film, and described lead-in wire conductive material of electrodes is electrically connected with conductive material in described first netted groove.
8. individual layer multipoint mode touch-control conducting film as claimed in claim 7, it is characterized in that, the not visible zone of the corresponding described individual layer multipoint mode touch-control conducting film in the marginal surface place of described transparent polymeric layer is formed with the second channel form grid, filled conductive material in the described second channel form grid forms described lead-in wire electrode.
9. individual layer multipoint mode touch-control conducting film as claimed in claim 8 is characterized in that, the described first channel form grid and the described second channel form grid are regular grid or random grid.
10. individual layer multipoint mode touch-control conducting film as claimed in claim 8 is characterized in that the groove width of the described first channel form grid and the described second channel form grid is d1, and the degree of depth is h, wherein, 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1〉1.
11. individual layer multipoint mode touch-control conducting film as claimed in claim 7, it is characterized in that, described lead-in wire electrode is the conductive material that is formed at the latticed or linear at marginal surface described clear glass substrate or that be located at described transparent polymeric layer place, and described lead-in wire electrode pair answers the not visible zone of described individual layer multipoint mode touch-control conducting film to arrange.
12. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that, described transparent polymeric layer is UV glue, impression glue or polycarbonate.
13. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that, described individual layer multipoint mode touch-control conducting film also comprises the protective clear layer that covers on the described transparent polymeric layer, and described protective clear layer is UV glue, impression glue or polycarbonate.
14. individual layer multipoint mode touch-control conducting film as claimed in claim 1 is characterized in that, the channel bottom of the described first channel form grid is " V " font, " W " font, arc or corrugated micro-groove.
15. individual layer multipoint mode touch-control conducting film as claimed in claim 14 is characterized in that, the degree of depth of described micro-groove is 500nm~1 μ m.
16. the manufacture method as each described individual layer multipoint mode touch-control conducting film of claim 1~15 is characterized in that, comprising:
First surface in described clear glass substrate is laid the metallic conduction material, forms described bridging module;
Form described conductive module in described bridging module;
First surface in described clear glass substrate is laid the layer of transparent polymkeric substance, and the described conductive module of described transparent polymer landfill, forms described transparent polymeric layer;
Surface in described transparent polymeric layer forms the described first channel form grid; And
Filled conductive material in the described first channel form grid, described conductive material directly is connected with described conductive module, forms described first electrode and described second electrode.
17. individual layer multipoint mode touch-control conducting film as claimed in claim 16 is characterized in that, described step at the described conductive module of described bridging module formation comprises:
First surface in described clear glass substrate forms one deck photoresist layer, and described photoresist layer covers described bridging module;
Form the hole of corresponding described conductive module shape in described bridging module by the method for photoetching development;
Filled conductive material in described hole forms described conductive module; And
Described photoresist layer is exposed, to remove described photoresist layer.
18. individual layer multipoint mode touch-control conducting film as claimed in claim 16 is characterized in that, described transparent polymeric layer is impression glue, and described transparent polymeric layer forms described plough groove type grid by the mode of impression.
19. individual layer multipoint mode touch-control conducting film as claimed in claim 16 is characterized in that described bridging module is formed on the first surface of described clear glass substrate by the mode of metal coating.
CN2013102104265A 2013-05-30 2013-05-30 Monolayer multiple-point touch conducting film and producing method thereof Pending CN103294270A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN2013102104265A CN103294270A (en) 2013-05-30 2013-05-30 Monolayer multiple-point touch conducting film and producing method thereof
PCT/CN2014/072739 WO2014190790A1 (en) 2013-05-30 2014-02-28 Single-layer multi-touch conductive film and manufacturing method thereof
US14/265,313 US9640294B2 (en) 2013-05-30 2014-04-29 Single-layer multi-point touch-control conductive film
EP14166652.9A EP2808770B1 (en) 2013-05-30 2014-04-30 Single-layer multi-point touch-control conductive film and method for producing the same
TW103117731A TWI562048B (en) 2013-05-30 2014-05-21 Single-layer multi-point touch-control conductive film and method for producing the same
KR1020140064715A KR101639255B1 (en) 2013-05-30 2014-05-28 Single-layer multi-point touch-control conductive film and method for producing the same
JP2014112504A JP5846457B2 (en) 2013-05-30 2014-05-30 Single layer multi-touch conductive film and manufacturing method thereof

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Application publication date: 20130911