CN103250081A - Wafer level optical elements and applications thereof - Google Patents
Wafer level optical elements and applications thereof Download PDFInfo
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- CN103250081A CN103250081A CN2011800576152A CN201180057615A CN103250081A CN 103250081 A CN103250081 A CN 103250081A CN 2011800576152 A CN2011800576152 A CN 2011800576152A CN 201180057615 A CN201180057615 A CN 201180057615A CN 103250081 A CN103250081 A CN 103250081A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
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- Led Device Packages (AREA)
Abstract
In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.
Description
The cross reference of related application
The application requires the novel patented claim No.12/957 of U.S. utility of " wafer scale optical element and the application thereof " by name of submission on November 30th, 2010, and 112 right of priority is incorporated its full content into as a reference at this.
Technical field
The assembly that the present invention relates to the wafer scale optical element and incorporate this wafer scale optical element into.
Background technology
The optical imaging apparatus of incorporating the wafer scale optical element into all obtains to use in comprising the numerous areas of consumption electronic product.For example, comprise that the solid state cameras of wafer scale optical element is used for many consumption electronic products, such as mobile phone, digital camera, computing machine, toy and motor-driven vehicle going monitoring.In order to satisfy the demands, need wafer scale optical element and the optical module made in enormous quantities.Therefore, the efficient manufacturing of wafer scale optical element and assembly is very important.
But compound yield problem proposes significant challenge to the optical module that piles up by wafer to wafer integrated technology structure, and this causes occurring waste and improves inefficiency.And the misalignment meeting of wafer to wafer involves the misalignment of the optical element in a large amount of optical modules, further reduces yield thus.
Summary of the invention
In view of this, the invention provides the method for wafer scale optical element and assembled wafers level optical element, it can relax the misalignment of compound yield problem and the optical element in optical module in certain embodiments.
On the one hand, the invention provides a kind of wafer scale optical module, comprising: first optical element, it is from the first array singualtion (singulated) of optical element, and first optical element comprises first align structures; And second optical element, this second optical element comprises second align structures, wherein first align structures contacts with second align structures.In certain embodiments, second optical element is from the second array singualtion of optical element.In certain embodiments, second array of first array of optical element and optical element is different.In certain embodiments, second array of first array of optical element and optical element is same an array.
In certain embodiments, first optical element and/or second optical element comprise at least one flat surface.In certain embodiments, first optical element and/or second optical element comprise a plurality of flat surface.In certain embodiments, one or more flat surface are positioned at the periphery of first optical element and/or second optical element.In certain embodiments, the periphery of first optical element and/or second optical element has polygonal shape.
As described herein, in certain embodiments, first optical element and/or second optical element are from the array singualtion of wafer or optical element, and singualtion is treated to first and/or second optical element one or more flat surface are provided.
In addition, in certain embodiments, wafer scale optical module as herein described comprises one or more flat surface of the periphery that is positioned at assembly.In certain embodiments, the periphery of wafer scale optical module as herein described has polygonal shape.
In certain embodiments, first align structures of first optical element is positioned at the outside of the clear aperature of first optical element.In certain embodiments, second align structures of second optical element is positioned at the outside of the clear aperature (clear aperture) of second optical element.
In certain embodiments, first align structures is continuous around the clear aperature of first optical element.In certain embodiments, first align structures is discontinuous around the clear aperature of first optical element.In more discontinuous embodiment around the clear aperature of first optical element, first align structures comprises a plurality of discrete align structures of second align structures that can operate to contact second optical element at first align structures.
In addition, in certain embodiments, second align structures is continuous around the clear aperature of second optical element.In certain embodiments, second align structures is discontinuous around the clear aperature of second optical element.In more discontinuous embodiment around the clear aperature of second optical element, second align structures comprises a plurality of discrete align structures of first align structures that can operate to contact first optical element at second align structures.
In some embodiment of wafer scale optical module, first optical element comprises discontinuous first align structures, and this first align structures comprises a plurality of discrete align structures that contacts with the second continuous align structures of second optical element.In some embodiment of wafer scale optical module, first optical element comprises the first continuous align structures that contacts with a plurality of discrete align structures of discontinuous second align structures of second optical element.In some embodiment of wafer scale optical module, first optical element comprises discontinuous first align structures, and this first align structures comprises a plurality of discrete align structures that contacts with a plurality of discrete align structures of discontinuous second align structures of second optical element.
In certain embodiments, wafer scale optical module as herein described is positioned at the top of electrooptic cell, thereby optical imaging apparatus is provided.In certain embodiments, electrooptic cell comprises the electromagnetic radiation sensing element.In certain embodiments, the electromagnetic radiation that will be provided by optical imaging apparatus is provided electrooptic cell.
On the other hand, the invention provides the method for making optical imaging apparatus.In certain embodiments, the method for manufacturing optical imaging apparatus comprises: provide the singualtion that comprises align structures the first object side optical element; And, picture side wafer is provided, this comprises the first picture sidelight element with align structures as the side wafer.The singualtion first object side optical element is positioned at the top that the first picture sidelight is learned element, and the align structures that the align structures by making the first object side optical element and the first picture sidelight are learned element contact and learns element alignment with the first picture sidelight at least in part, thereby is providing first optical module as the primary importance place on the side wafer.In certain embodiments, the first picture sidelight learn element above determine that the first object side optical element and/or the first picture sidelight learn one or more optical properties of element before the singualtion first object side optical element of location.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining first optical module; Calculate first optical module with respect to the focus-compensating on picture plane; And adjust the height as the side wafer in the position of first optical module, thus with the focal point settings of first optical module near place, picture plane or picture plane.In certain embodiments, the method for making optical imaging apparatus further comprises first electrooptic cell is coupled to first optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises to be provided the singualtion second object side optical element that comprises align structures and provides the second picture sidelight of picture side wafer to learn element, and second learns element as sidelight comprises align structures.In certain embodiments, the singualtion second object side optical element is positioned at the top that the second picture sidelight is learned element, and the align structures by making the second object side optical element and the second picture sidelight align structures of learning element contact and learns element alignment with the second picture sidelight at least in part, thereby providing second optical module as the second place place on the side wafer.In certain embodiments, the second picture sidelight learn element above determine that the second object side optical element and/or the second picture sidelight learn one or more optical properties of element before the second object side optical element of location.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining second optical module; Calculate second optical module with respect to the focus-compensating on picture plane; And adjust the height as the side wafer in the position of second optical module, thus with the focal point settings of second optical module near place, picture plane or picture plane.
In certain embodiments, will be different from the position of second optical module height that will adjust to as the side wafer as the height that the side wafer is adjusted in the position of first optical module.In certain embodiments, will will be identical or basic identical as the height that the side wafer is adjusted to the position at second optical module as the height that the side wafer is adjusted in the position of first optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises second electrooptic cell is coupled to second optical module.
Alternatively, in certain embodiments, the method for making optical imaging apparatus comprises: provide the singualtion first picture sidelight that comprises align structures to learn element; And the image sidelight that provides object side wafer, this object side wafer to comprise to have align structures is learned element.Singualtion first is learned the top that element is positioned at the first object side optical element as sidelight, and by the align structures that makes the first picture sidelight learn element contact with the align structures of the first object side optical element and at least in part with the first object side optic alignment, thereby the primary importance place on the object side wafer provides first optical module.In certain embodiments, before locating the singualtion first picture sidelight element above the first object side optical element, determine one or more optical properties of the first picture sidelight element and/or the first object side optical element.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining first optical module; Calculate first optical module with respect to the focus-compensating on picture plane; And adjust the height of object side wafer in the position of first optical module, thus with the focal point settings of first optical module near place, picture plane or picture plane.In certain embodiments, the method for making optical imaging apparatus further comprises first electrooptic cell is coupled to first optical module.
In certain embodiments, the second object side optical element that provides the singualtion second that comprises align structures to learn element and the object side wafer is provided as sidelight further is provided the method for making optical imaging apparatus, and the second object side optical element comprises align structures.In certain embodiments, singualtion second is learned the top that element is positioned at the second object side optical element as sidelight, and by the align structures that makes the second picture sidelight learn element contact with the align structures of the second object side optical element and at least in part with the second object side optic alignment, thereby the second place place on the object side wafer provides second optical module.In certain embodiments, before locating the second picture sidelight element above the second object side optical element, determine one or more optical properties of the second picture sidelight element and/or the second object side optical element.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining second optical module; Calculate second optical module with respect to the focus-compensating on picture plane; And adjust the height of object side wafer in the position of second optical module, thereby the focus place of second optical module is arranged on as near place, plane or the picture plane.
In certain embodiments, the height of the object side wafer being adjusted in the position of first optical module is different from the height of the object side wafer being adjusted in the position of second optical module.In certain embodiments, the height of object side being adjusted in the position of first optical module is identical or basic identical with the height of the object side wafer being adjusted in the position of second optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises second electrooptic cell is coupled to second optical module.
Above-mentioned and other embodiment of more detailed description in the detailed description hereinafter.
Description of drawings
Fig. 1 illustrates the sectional view of wafer scale optical module according to an embodiment of the invention.
Fig. 2 illustrates the sectional view of wafer scale optical module according to an embodiment of the invention.
Fig. 3 illustrates the sectional view of optical imaging apparatus according to an embodiment of the invention.
Fig. 4 illustrates the sectional view that the singualtion first object side wafer scale optical element and the singualtion second object side wafer scale optical element are provided according to one embodiment of the invention.
Fig. 5 illustrates according to an embodiment of the invention the sectional view as the side wafer.
Fig. 6 illustrates according to one embodiment of the invention, the sectional view of location singualtion object side wafer scale optical element above picture side wafer scale optical element.
Fig. 7 illustrates according to one embodiment of the invention, by the sectional view of align structures with singualtion object side wafer scale optical element and picture side wafer scale optic alignment.
Fig. 8 illustrates according to one embodiment of the invention, adjusts sectional view as the height of side wafer according to the focus-compensating leg that calculates of first optical module and second optical module.
Fig. 9 illustrates according to one embodiment of the invention, singualtion as the side wafer so that the sectional view of discrete optical module to be provided.
Figure 10 illustrates according to one embodiment of the invention, the sectional view that singualtion first optical module is coupled to first electrooptic cell and singualtion second optical module is coupled to second electrooptic cell.
Figure 11 illustrates the sectional view of the wafer scale optical module that comprises monolithic (monolithic) optical element according to an embodiment of the invention.
Figure 12 illustrates the sectional view of optical module according to an embodiment of the invention, and wherein the object side optical element has the pitch different with picture sidelight element.
Figure 13 illustrates wafer scale optical module according to an embodiment of the invention.
Figure 14 illustrates the vertical view of first optical element that comprises discontinuous first align structures according to an embodiment of the invention.
Figure 15 illustrates the sectional view of wafer scale optical module according to an embodiment of the invention.
Embodiment
On the one hand, the invention provides a kind of wafer scale optical module, it comprises: first optical element, and it is from the array of optical elements singualtion, and first optical element comprises first align structures; And second optical element, second optical element comprises second align structures, wherein first align structures and second align structures contact with each other.In certain embodiments, second optical element is from the second array singualtion of optical element.In certain embodiments, second array of first array of optical element and optical element is different.In certain embodiments, second array of first array of optical element and optical element is same an array.
In some embodiment of optical module, first optical element and/or second optical element comprise at least one flat surface.In certain embodiments, first optical element and/or second optical element comprise a plurality of flat surface.In certain embodiments, one or more flat surface are positioned at the periphery of first optical element and/or second optical element.In certain embodiments, the periphery of first optical element and/or second optical element has polygonal shape, includes but not limited to triangle, square, rectangle, pentagon or hexagon.
In certain embodiments, for example, first optical element and/or second optical element are from the optical crystal chip singualtion, and singualtion is treated to first and/or second optical element one or more flat surface are provided.
And in certain embodiments, wafer scale optical module as herein described comprises the one or more flat surface that are positioned at the assembly periphery.In certain embodiments, the periphery of wafer scale optical module as herein described has polygonal shape, includes but not limited to triangle, square, rectangle, pentagon or hexagon.
Figure 13 illustrates wafer scale optical module according to an embodiment of the invention.Wafer scale optical module (130) comprises the optical element (131,132,133) of stacked structure, and is wherein as described herein, and at least two in the optical element (131,132,133) have the align structures (not shown) that contacts with each other.Optical element (131,132,133) has the flat surface (134,135,136) that is positioned at the element periphery, and square exterior perimeter is provided thus.As described herein, in certain embodiments, optical element (131,132,133) is from the array singualtion of optical element, and monolithic turns to optical element (131,132,133) one or more flat surface and polygonal shape are provided.And the periphery of wafer scale optical module (130) has square shape.In some embodiment of wafer scale optical module as herein described, first align structures of first optical element is positioned at the outside of the clear aperature of first optical element.In certain embodiments, second align structures of second optical element is positioned at the outside of the clear aperature of second optical element.
In certain embodiments, first align structures is continuous around the clear aperature of first optical element.In certain embodiments, first align structures is discontinuous around the clear aperature of first optical element.In more discontinuous embodiment around the clear aperature of first optical element, first align structures comprises the one or more discrete align structures of second align structures that can operate to contact second optical element at first align structures.In certain embodiments, discontinuous first align structures can comprise the discrete align structures of arbitrary number.In certain embodiments, discontinuous first align structures comprise at least one, at least two or at least three discrete align structures.In certain embodiments, discontinuous first align structures comprises at least four or at least five discrete align structures.
In certain embodiments, first align structures comprises projection.In certain embodiments, protruding first align structures has and is suitable for and second align structures coupling of the depression of second optical element or the size that cooperates.In certain embodiments, first align structures comprises around the continuous projection of the clear aperature of first optical element.In certain embodiments, first align structures comprises and can operate to be used for and second align structures coupling of one or more depressions of second optical element or the one or more discontinuous or discrete projection that cooperates.
In certain embodiments, first align structures comprises depression.In certain embodiments, first align structures of depression has and is suitable for and one or more protruding second align structures coupling of second optical element or the size that cooperates.In certain embodiments, first align structures comprises around the continuous depression of the clear aperature of first optical element.In certain embodiments, first align structures comprises and can operate to be used for and one or more protruding second align structures coupling of second optical element or the one or more discontinuous or discrete depression that cooperates.
Figure 14 illustrates according to an embodiment of the invention, comprises first optical element of discontinuous first align structures, and discontinuous first align structures comprises a plurality of discrete align structures.In the embodiment shown in Figure 14, discontinuous first align structures of first optical element (140) comprises four discrete protruding align structures (141).
In addition, in certain embodiments, second align structures is continuous around the clear aperature of second optical element.In certain embodiments, second align structures is discontinuous around the clear aperature of second optical element.In more discontinuous embodiment around the clear aperature of second optical element, second align structures comprises the one or more discrete align structures of first align structures that can operate to contact first optical element at second align structures.In certain embodiments, discontinuous second align structures can comprise the discrete align structures of arbitrary number.In certain embodiments, discontinuous second align structures comprises at least two or at least three discrete align structures.In certain embodiments, discontinuous second align structures comprises at least four or at least five discrete align structures.
In certain embodiments, second align structures comprises projection.In certain embodiments, protruding second align structures has and is suitable for and first align structures coupling of the depression of first optical element or the size that cooperates.In certain embodiments, second align structures comprises around the continuous projection of the clear aperature of second optical element.In certain embodiments, second align structures comprises and can operate to be used for and first align structures coupling of one or more depressions of first optical element or the one or more discontinuous or discrete projection that cooperates.
In certain embodiments, second align structures comprises depression.In certain embodiments, second align structures of depression has and is suitable for and one or more protruding first align structures coupling of first optical element or the size that cooperates.In certain embodiments, second align structures comprises around the continuous depression of the clear aperature of second optical element.In certain embodiments, second align structures comprises and can operate to be used for and one or more protruding first align structures coupling of first optical element or the one or more discontinuous or discrete depression that cooperates.
In some embodiment of wafer scale optical module, first optical element comprises discontinuous first align structures, and this first align structures comprises a plurality of discrete align structures that contacts with the second continuous align structures of second optical element.In some embodiment of wafer scale optical module, first optical element comprises the first continuous align structures of a plurality of discrete align structures that contacts with discontinuous second align structures of second optical element.In some embodiment of wafer scale optical module, first optical element comprises discontinuous first align structures, and this first align structures comprises a plurality of discrete align structures that contacts with a plurality of discrete align structures of discontinuous second align structures of second optical element.
In certain embodiments, the discrete align structures of first and/or second optical element can reduce the friction between first and second optical elements when first and second optical elements contact with each other.And in certain embodiments, the surface in contact that the discrete align structures of first and/or second optical element can reduce between first and second optical elements is long-pending, reduces the trend of excessively oppressing first and second optical elements when contacting with each other thus.
Figure 15 illustrates the sectional view of wafer scale optical module according to an embodiment of the invention.Wafer scale optical module (150) among the embodiment of Figure 15 comprises singualtion first optical element (151) with continuous first align structures (152) and singualtion second optical element (140) with discontinuous second align structures, and this discontinuous second align structures comprises discrete align structures (141) as shown in Figure 14.The discrete align structures (141) of the continuous align structures (152) of first optical element (151) contact second optical element (140), auxiliary required aligning that realizes first optical element (151) and second optical element (140) at least in part thus.And in the embodiment shown in Figure 15, the continuous align structures (152) of first optical element (151) comprises near flat surface or the flat surfaces (155) in place, summit or summit that is positioned at align structures (152).In certain embodiments, flat surface or flat surfaces (155) can operate to contact the surface (156) of second optical element (140), thus inclination and/or the axial height of auxiliary control first optical element (151) when contact second optical element (141).
Alternatively, in certain embodiments, first optical element comprises discontinuous first align structures with discrete align structures, and second optical element comprises the second continuous align structures.In certain embodiments, the discrete align structures of first optical element comprises place, summit or near flat surface or the flat surfaces the summit, inclination and/or the axial height of auxiliary control first optical element when contact second optical element thus of the structure that is positioned at the respective surfaces that can operate to contact second optical element.
In certain embodiments, first optical element of optical module as herein described comprises radiation transmission substrate and first align structures with at least one optical surface.In certain embodiments, second optical element comprises radiation transmission substrate and second align structures with at least one optical surface.
In certain embodiments, the radiation transmission substrate of first and/or second optical element comprises not the glass with any type of the object of the invention contradiction.In certain embodiments, the radiation transmission substrate comprises not any polymkeric substance or the sol gel film with the object of the invention contradiction.In certain embodiments, for example, the radiation transmission polymeric material comprises polycarbonate or polyacrylate, such as polyacrylic acid, polymethacrylate, polymethylmethacrylate or its potpourri.
As described herein, the radiation transmission substrate comprises one or more optical surfaces.In certain embodiments, optical surface comprise can operate with the interactional lens of electromagnetic radiation or other refraction optical elements.
For example, in certain embodiments, optical surface comprises convex surface, concave surface, sphere or aspherical shape, comprises simultaneously being convex surface in some zones for concave surface and in other zones.Opposition side at the radiation transmission substrate comprises that this opposition side is formed in combination biconvex lens, biconcave lens, plano-convex lens, plano-concave lens, positive meniscus lens or diverging meniscus lens among some embodiment of optical surface.
In certain embodiments, the optical surface of first and/or second optical element comprises one or more polymeric materials.In certain embodiments, optical surface comprises one or more epoxide, oxetanes, acrylate, methacrylate, maleate, thiol-ene, vinethene or its potpourri or multipolymer.In certain embodiments, optical surface comprises one or more fluoropolymers, comprises perfluorocyclobutanearyl (PFCB) based polyalcohol.
Comprise among some embodiment of a plurality of optical surfaces the independent material of selecting to be used for each optical surface at optical element.Alternatively, in certain embodiments, with reference to the material of selecting each other for the optical surface of optical element.
In addition, in certain embodiments, optical surface comprise can operate with selectivity by or selectivity stop the filtering material in electromagnetic wave spectrum zone.
In certain embodiments, optical surface is formed directly on the radiation transmission substrate.In certain embodiments, for example, optical surface can copy ground or the manufacturing of photoetching ground at the radiation transmission substrate.In certain embodiments, optical surface is independent of the radiation transmission substrate and forms and be coupled subsequently or be deposited on the radiation transmission substrate.
Fig. 1 illustrates the sectional view of wafer scale optical module according to an embodiment of the invention.Optical module among the embodiment of Fig. 1 (10) comprises first optical element (11) with first align structures (12) and second optical element (13) that comprises second align structures (14), and wherein first align structures (12) and second align structures (14) contact with each other.
First optical element (11) further comprises radiation transmission substrate (15), and radiation transmission substrate (15) comprises optical surface (7,16).As shown in fig. 1, first align structures (12) is coupled to radiation transmission substrate (15) and continuous with optical surface (7).In certain embodiments, first align structures (12) is discontinuous with the optical surface (7) of radiation transmission substrate (15).The first wafer scale optical element (11) also comprises flat surface (17).The flat surface (17) of the first wafer scale optical element (11) is provided by singualtion optical element (11) from the wafer of optical element or array in certain embodiments.
Second optical element (13) further comprises radiation transmission substrate (18), and radiation transmission substrate (18) comprises optical surface (3,19).Second align structures (14) is coupled to radiation transmission substrate (18) and continuous with optical surface (3).In certain embodiments, second aligning guide (14) is discontinuous with the optical surface (3) of radiation transmission substrate (18).Second optical element (13) of Fig. 1 also comprises flat surface (5).The flat surface (5) of second optical element (13) is provided by singualtion optical element (13) from the wafer of optical element or array in certain embodiments.
In certain embodiments, first of optical module as herein described and/or second optical element has the single chip architecture that comprises one or more optical surfaces.When having single chip architecture, in certain embodiments, first and/or second optical element does not comprise support radiation transmission substrate.In certain embodiments, the optical surface of monolithic optical element comprises convex surface, concave surface, sphere or aspherical shape, comprises simultaneously being convex surface in some zones for concave surface and in other zones.Opposition side at the monolithic optical element comprises that this opposition side is formed in combination biconvex lens, biconcave lens, plano-convex lens, plano-concave lens, positive meniscus lens or diverging meniscus lens among some embodiment of optical surface.
In certain embodiments, the monolithic optical element comprises not the glass with any type of the object of the invention contradiction.In certain embodiments, the monolithic optical element comprises one or more polymeric materials.In certain embodiments, for example the monolithic optical element comprises one or more epoxide, oxetanes, acrylate, methacrylate, maleate, thiol-ene, vinethene or its potpourri or multipolymer.In certain embodiments, the monolithic optical element comprises one or more fluoropolymers, comprises perfluorocyclobutanearyl (PFCB) based polyalcohol.
Fig. 2 illustrates the sectional view of the wafer scale optical module that comprises the monolithic optical element according to an embodiment of the invention.The wafer scale optical module (20) of Fig. 2 comprises the first monolithic optical element (22) with first align structures (23) and the second single-wafer level optical element (24) with second align structures (25), and wherein first align structures (23) and second align structures (25) contact with each other.
The first monolithic optical element (22) shown in Fig. 2 is at least partially disposed in the hole or perforation of wafer (26).In certain embodiments, wafer (26) is that the first monolithic optical element (22) provides one or more flat surface (27).As further described herein, in certain embodiments, wafer (26) by from than wafer (not shown) singualtion so that the first monolithic optical element (22) and other optical elements that are arranged on than the hole of wafer or the perforation are isolated.In certain embodiments, the monolithic of wafer (26) turns to first optical element (22) one or more flat surface (27) is provided.
And the second monolithic optical element (24) shown in Fig. 2 is at least partially disposed in the hole or perforation of wafer (28).In certain embodiments, wafer (28) is that the second single-wafer level optical element (24) provides one or more flat surface (29).In certain embodiments, wafer (28) by from than wafer (not shown) singualtion so that the second monolithic optical element (22) and other optical elements that are arranged on than the hole of wafer or the perforation are isolated.In certain embodiments, the monolithic of wafer (28) turns to second optical element (24) one or more flat surface (30) is provided.
In the embodiment of Fig. 2, first align structures (23) contacts and assists at least in part the required aligning of realizing first optical element (22) and second optical element (24) with second align structures (25).The wafer (26) of first optical element (22) also is coupled to the wafer (28) of second optical element (24).
In certain embodiments, optical module as herein described further comprise one or more focus-compensating legs with the focal point settings of optical module near place, required picture plane or picture plane.In certain embodiments, one or more focus-compensating legs can be positioned at the optional position of optical module.In certain embodiments, the focus-compensating leg is related with first optical element.In certain embodiments, the focus-compensating leg is related with second optical element.In certain embodiments, the focus-compensating leg is related with first and second optical elements.
Refer again to Fig. 2, the wafer (28) that focus-compensating leg (32,33) is arranged on the second monolithic optical element (24) go up with the focal point settings of optical module (20) near place, required picture plane or picture plane.
Figure 11 illustrates the sectional view of the wafer scale optical module that comprises the monolithic optical element according to an embodiment of the invention.The optical module of Figure 11 (110) comprises the first single-wafer level optical element (111) with first align structures (112) and the second single-wafer level optical element (113) that comprises second align structures (114), and wherein first align structures (112) and second align structures (114) contact with each other.The first single-wafer level optical element (111) and the second single-wafer level optical element (113) further comprise flat surface (115,116).
In certain embodiments, wafer scale optical module as herein described is positioned at the top of electrooptic cell so that optical imaging apparatus to be provided.In certain embodiments, electrooptic cell comprises the electromagnetic radiation sensing element.In certain embodiments, the electromagnetic radiation sensing element comprises the photosensitive area that can operate to detect the electromagnetic radiation that is received by optical imaging apparatus.
In certain embodiments, the sensing element that comprises the photosensitive area comprises semiconductor.Can be as the sensing element that comprises the photosensitive area with any suitable semiconductor of the object of the invention contradiction.In certain embodiments, semiconductor comprises IV family semiconductor, comprises the combination in any of silicon or IV family element.In another embodiment, semiconductor comprises III/V family semiconductor or II/VI family semiconductor.
In certain embodiments, the photosensitive area of sensing element comprises focal plane arrays (FPA).In certain embodiments, focal plane arrays (FPA) is the VGA sensor that comprises 640 * 480 pixels.In certain embodiments, sensor comprises still less pixel (for example CIF, QCIF) or more pixel (1,000,000 or more pixel).
In one embodiment, the sensing element that comprises the photosensitive area comprises charge-coupled device (CCD).In another embodiment, the sensing element that comprises the photosensitive area comprises complementary metal oxide semiconductor (CMOS) (CMOS) framework.
In certain embodiments, the electromagnetic radiation that will be provided by optical imaging apparatus is provided electrooptic cell.Can use not any required element for generation of electromagnetic radiation with purpose contradiction of the present invention.In certain embodiments, the electrooptic cell of generation electromagnetic radiation comprises one or more light emitting diodes (LED).In certain embodiments, LED comprises the inorganic material such as inorganic semiconductor.In other embodiments, LED comprises such as the organic semi-conductor organic material that comprises polymer semiconductor.In a further embodiment, LED comprises organic and potpourri inorganic material.
Fig. 3 illustrates the optical module of the Fig. 2 that is coupled to electrooptic cell according to an embodiment of the invention.In the embodiment shown in Fig. 3, optical module (20) is coupled to electrooptic cell (31) by focus-compensating leg (32,33), thereby optical imaging apparatus (30) is provided.In certain embodiments, electrooptic cell (31) is by singualtion from other electrooptic cell (not shown) of electrooptic cell wafer.
On the other hand, the invention provides the method for making optical imaging apparatus.In certain embodiments, the method for manufacturing optical imaging apparatus comprises: provide the singualtion that comprises align structures the first object side optical element; And picture side wafer is provided, this comprises the first picture sidelight element with align structures as the side wafer.The singualtion first object side optical element is positioned at the top that the first picture sidelight is learned element, and the align structures that the align structures by making the first object side optical element and the first picture sidelight are learned element contact and learns element alignment with the first picture sidelight at least in part, thereby is providing first optical module as the primary importance place on the side wafer.In certain embodiments, the first picture sidelight learn element above determine that the first object side optical element and/or the first picture sidelight learn one or more optical properties of element before the singualtion first object side optical element of location.
In certain embodiments, determine object side optical element and/or allow before optical element further is processed into optical module and/or optical imaging apparatus identification not satisfy the optical element of specification or performance requirement as one or more optical properties that sidelight is learned element.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining first optical module; Calculate first optical module with respect to the focus-compensating on picture plane; And adjust the height of the picture side wafer be positioned at the first optical module position, thus locate as the plane or as the plane near the focus of first optical module is provided.In certain embodiments, the method for making optical imaging apparatus further comprises first electrooptic cell is coupled to first optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises to be provided the singualtion second object side optical element that comprises align structures and provides the second picture sidelight of picture side wafer to learn element, and second learns element as sidelight comprises align structures.In certain embodiments, the singualtion second object side optical element is positioned at the top that the second picture sidelight is learned element, and the align structures by making the second object side optical element and the second picture sidelight alignment member of learning element contact and learns element alignment with the second picture sidelight at least in part, thereby providing second optical module as the second place place on the side wafer.In certain embodiments, the second picture sidelight learn element above determine that the second object side optical element and/or the second picture sidelight learn one or more optical properties of element before the second object side optical element of location.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining second optical module; Calculate second optical module with respect to the focus-compensating on picture plane; And adjust the height as the side wafer in the position of second optical module, thus with the focal point settings of second optical module near place, picture plane or picture plane.
In certain embodiments, will be different from the position of second optical module height that will adjust to as the side wafer as the height that the side wafer is adjusted in the position of first optical module.In certain embodiments, will will be identical or basic identical as the height that the side wafer is adjusted to the position at second optical module as the height that the side wafer is adjusted in the position of first optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises second electrooptic cell is coupled to second optical module.
Fig. 4 illustrates the sectional view that the singualtion first object side optical element and the singualtion second object side optical element are provided according to an embodiment of the invention.In the embodiment of Fig. 4 (a), provide the wafer (41) that comprises the first object side optical element (42) and the second object side optical element (43).The first and second object side optical elements (42,43) are arranged in hole or the perforation (44,45) of wafer (41).The first and second object side optical elements (42,43) show the bent moon structure and comprise align structures (46,47).In the embodiment shown in Fig. 4, align structures (46,47) is continuous with the optical surface of the first and second object side optical elements (42,43).
In certain embodiments, the first and second object side optical elements (42,43) are molded in the hole or perforation (44,45) of wafer (41).In certain embodiments, for example, perforated wafer (41) can be placed in the mould, wherein the feature of mould is responsible for providing the framework of the first and second object side optical elements of aiming at bore a hole (44,45) (42,43), and optical element (42,43) is formed in the perforation (44,45).
As shown in Fig. 4 (b), comprise the wafer (41) of the first and second object side optical elements (42,43) by singualtion, thereby the singualtion first object side optical element (42) and the singualtion second object side optical element (43) are provided.
Fig. 5 illustrates according to an embodiment of the invention the sectional view as the side wafer.Picture side wafer (50) comprises that the first picture sidelight is learned element (51) and the second picture sidelight is learned element (52).The first and second picture sidelights are learned element (51,52) and are comprised align structures (53,54).In the embodiment of Fig. 5, the first and second picture sidelights are learned hole or the perforation (55,56) that element (53,54) is arranged in picture side wafer (50).In certain embodiments, the first and second picture sidelights elements (51,52) are molded in the hole or perforation (55,56) of picture side wafer (50).In certain embodiments, according to method as herein described the first and second picture sidelights elements (51,52) are molded in the hole or perforation (55,56) of picture side wafer (50).
Fig. 6 illustrates according to one embodiment of the invention, the sectional view of location singualtion object side optical element above picture side wafer scale optical element.As shown in Figure 6, the singualtion first object side optical element (42) is positioned at the top that the first picture sidelight is learned element (51).In certain embodiments, bonding agent (61) is arranged on the singualtion wafer (41) of object side optical element (42) and learns at the first picture sidelight between the picture side wafer (50) of position of element (51).
In the embodiment of Fig. 6, the singualtion second object side optical element (43) is positioned at the top that the second picture sidelight is learned element (52).In certain embodiments, bonding agent (62) is arranged on the singualtion wafer (41) of the second object side optical element (43) and learns at the second picture sidelight between the picture side wafer (50) of position of element (52).
Fig. 7 illustrates according to one embodiment of the invention, learns the sectional view of element as sidelight by align structures aligning singualtion object side optical element and wafer scale.As shown in Figure 7, align structures (46) the contact first picture sidelight of the singualtion first object side optical element (42) is learned the align structures (53) of element (51), assist the required aligning that is provided between the singualtion first object side optical element (42) and the first picture sidelight element (51) thus, thereby first optical module (70) is provided.And, align structures (47) the contact second picture sidelight of the singualtion second object side optical element (43) is learned the align structures (54) of element (52), assist the required aligning that is provided between the singualtion second object side optical element (43) and the second picture sidelight element (52) thus, thereby second optical module (71) is provided.
In certain embodiments, in case learn the required aligning of realization between the element (51) at the singualtion first object side optical element (42) and the first picture sidelight, bonding agent (61) between the singualtion wafer (41) of object side optical element (42) and picture side wafer (50) is solidified or sclerosis, thus locked alignment on the spot.In certain embodiments, in case learn the required aligning of realization between the element (52) at the singualtion second object side optical element (43) and the second picture sidelight, then the bonding agent (62) between the singualtion wafer (41) of object side optical element (43) and picture side wafer (50) is solidified or sclerosis, thus locked alignment on the spot.In certain embodiments, the curing of the bonding agent of locating at first optical module (70) (61) or sclerosis with in curing or the sclerosis while of the bonding agent (62) of second optical module (71) or carry out substantially simultaneously.In certain embodiments, the curing of the bonding agent of locating at first optical module (70) (61) or sclerosis are carried out in proper order with respect to curing or sclerosis at the bonding agent (62) of second optical module (71).
Fig. 8 illustrates according to one embodiment of the invention, according to the focus-compensating adjustment of calculating of first optical module and second optical module sectional view as the height of side wafer.In the embodiment of Fig. 8, be adjusted at the height of picture side wafer (50) of the position of first optical module (70), thus provide can operate with required as the place, plane or the focus-compensating leg (81) of the focus of first optical module (70) is provided near as the plane.In addition, be adjusted at the height of picture side wafer (50) of the position of second optical module (71), thus provide can operate with required as the place, plane or the focus-compensating leg (82) of the focus of second optical module (71) is provided near as the plane.
In certain embodiments, focus-compensating leg (81) has the height different with focus-compensating leg (82).In certain embodiments, focus-compensating leg (81) has and the identical or essentially identical height of focus-compensating leg (82).
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises singualtion first optical module from second optical module.In certain embodiments, singualtion is learned wafer so that the first and second discrete optical modules to be provided as sidelight.Fig. 9 illustrates according to one embodiment of the invention, singualtion as the side wafer so that the sectional view of discrete optical module to be provided.As shown in Figure 9, singualtion as side wafer (50) so that first optical module that is independent of second optical module (71) (70) to be provided.Because being independent of the singualtion of the wafer (41) of object side optical element (42,43), the singualtion of picture side wafer (50) carries out, therefore in certain embodiments, as the side wafer can have less than or greater than the width (91) of the width (92) of wafer (41).In certain embodiments, basic identical with the width (92) of the wafer (41) of object side optical element (42,43) as the width (91) of side wafer (50).
And in certain embodiments, singualtion object side optical element has with the picture sidelight learns the different pitch of element.Figure 12 illustrates according to an embodiment of the invention, the object side optical element has and the optical module of learning the different pitch of element as sidelight.As shown in Figure 12, object side optical element (42,43) has the pitch (120) that the picture sidelight that is different from picture side wafer (50) is learned the pitch (121) of element (51,52).In certain embodiments, utilize jointing material (61,62) lock the aligning of object side optical element (42,43) on the spot after singualtion as side wafer (50).As described herein, in certain embodiments, provide discrete or optical module (71,72) independently as the singualtion of side wafer (50).In the embodiment of Figure 12, the width of the picture side wafer (50) of optical module (71,72) is greater than the width of the wafer (41) of object side optical element (42,43).In certain embodiments, jointing material (61,62) spills into not by on the width (63,64) of the picture side wafer of the wafer (41) of object side optical element (42,43) covering.
Figure 10 illustrates according to one embodiment of the invention, the sectional view that singualtion first optical module is coupled to first electrooptic cell and singualtion second optical module is coupled to second electrooptic cell.As shown in Figure 10, singualtion first optical module (70) is coupled to singualtion first electrooptic cell (100) so that first optical imaging apparatus (101) to be provided, and singualtion second optical module (71) is coupled to singualtion second electrooptic cell (102) so that second optical imaging apparatus (103) to be provided.In the embodiment of Figure 10, singualtion first (70) and second (71) optical module are coupled to singualtion first (100) and second (102) electrooptic cell by focus-compensating leg (81,82).
In certain embodiments, optical module as herein described is coupled to electrooptic cell by the structure except the focus-compensating leg.Be not coupled to by the focus-compensating leg among some embodiment of electrooptic cell at optical module, optical module can not comprise the focus-compensating leg, or the focus-compensating leg in optical module the placement eliminating and the combination of electrooptic cell.
In addition, in certain embodiments, fill the singualtion optical module at the wafer that comprises a plurality of electrooptic cells, the optical imaging apparatus of a plurality of joints is provided thus.Can be with the electrooptic cell singualtion so that a plurality of discrete optical imaging apparatus to be provided.
Alternatively, in certain embodiments, the method for making optical imaging apparatus comprises: provide the singualtion first picture sidelight that comprises align structures to learn element; And the image sidelight that provides object side wafer, this object side wafer to comprise to have align structures is learned element.Singualtion first is learned the top that element is positioned at the first object side optical element as sidelight, and by the align structures that makes the first picture sidelight learn the align structures of element and the first object side optical element contact and at least in part with the first object side optic alignment, thereby the primary importance place on the object side wafer provides first optical module.In certain embodiments, before locating the singualtion first picture sidelight element above the first object side optical element, determine one or more optical properties of the first picture sidelight element and/or the first object side optical element.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining first optical module; Calculate first optical module with respect to the focus-compensating on picture plane; And adjust the height of object side wafer in the position of first optical module, thus with the focal point settings of first optical module near place, picture plane or picture plane.In certain embodiments, the method for making optical imaging apparatus further comprises first electrooptic cell is coupled to first optical module.
In certain embodiments, the second object side optical element that provides the singualtion second that comprises align structures to learn element and the object side wafer is provided as sidelight further is provided the method for making optical imaging apparatus, and the second object side optical element comprises align structures.In certain embodiments, singualtion second is learned the top that element is positioned at the second object side optical element as sidelight, and by the align structures that makes the second picture sidelight learn element contact with the align structures of the second object side optical element and at least in part with the second object side optic alignment, thereby the second place place on the object side wafer provides second optical module.In certain embodiments, before locating the second picture sidelight element above the second object side optical element, determine one or more optical properties of the second picture sidelight element and/or the second object side optical element.
In certain embodiments, the method for manufacturing optical imaging apparatus further comprises: the focal length of determining second optical module; Calculate second optical module with respect to the focus-compensating on picture plane; And adjust the height of object side wafer in the position of second optical module, thereby the focus place of second optical module is arranged on as near place, plane or the picture plane.
In certain embodiments, the height of the object side wafer being adjusted in the position of first optical module is different from the height of the object side wafer being adjusted in the position of second optical module.In certain embodiments, the height of the object side wafer being adjusted in the position of first optical module is identical or basic identical with the height of the object side wafer being adjusted in the position of second optical module.
In certain embodiments, the method for making optical imaging apparatus further comprises second electrooptic cell is coupled to second optical module.
Illustrated that each embodiment of the present invention is to realize each purpose of the present invention.Will be appreciated that these embodiment only are the examples of principle of the present invention., under the situation that does not break away from the spirit and scope of the present invention, multiple modification and its adaptation it will be apparent to those skilled in the art that.
Claims (26)
1. wafer scale optical module comprises:
First optical element, described first optical element are from the array singualtion of optical element, and described first optical element comprises first align structures; And
Second optical element, described second optical element comprises second align structures, wherein said first align structures contacts with described second align structures.
2. wafer scale optical module according to claim 1, the periphery of wherein said first optical element comprises at least one flat surface.
3. wafer scale optical module according to claim 1, the periphery of wherein said first optical element has polygonal shape.
4. wafer scale optical module according to claim 1, wherein said first align structures is positioned at the outside of the clear aperature of described first optical element.
5. wafer scale optical module according to claim 4, wherein said first align structures around the clear aperature of described first optical element continuously.
6. wafer scale optical module according to claim 4, wherein said first align structures is discontinuous around the clear aperature of described first optical element.
7. wafer scale optical module according to claim 6, wherein said first align structures comprises a plurality of discrete align structures.
8. wafer scale assembly according to claim 2, the periphery of wherein said second optical element comprises at least one flat surface.
9. wafer scale assembly according to claim 8, the periphery of wherein said second optical element has polygonal shape.
10. wafer scale optical module according to claim 5, wherein said second align structures around the clear aperature of described second optical element continuously.
11. wafer scale optical module according to claim 5, wherein said second align structures is discontinuous around the clear aperature of described second optical element.
12. wafer scale optical module according to claim 6, wherein said second align structures is discontinuous around the clear aperature of described second optical element.
13. wafer scale optical module according to claim 1, wherein said first optical element is at least partially disposed in the perforation of first wafer.
14. wafer scale optical module according to claim 13, wherein said second optical element is at least partially disposed in the perforation of second wafer.
15. wafer scale optical module according to claim 14, wherein said first wafer is coupled to described second wafer.
16. a method of making optical imaging apparatus comprises:
Provide singualtion the first object side optical element, the described singualtion first object side optical element comprises align structures; And
Picture side wafer is provided, describedly comprises that as the side wafer the first picture sidelight learns element, described first learns element as sidelight comprises align structures.
17. method according to claim 16, the wherein said singualtion first object side optical element comprises the periphery with polygonal shape.
18. method according to claim 16 further is included in described first top of learning element as sidelight and locatees the described singualtion first object side optical element; And
Contact and make at least in part the described singualtion first object side optical element and the described first picture sidelight to learn element alignment by the align structures that makes the described singualtion first object side optical element with described first align structures as sidelight element, thereby provide first optical module described as the primary importance place on the side wafer.
19. method according to claim 18, wherein one or more optical properties of definite described singualtion first object side optical element before the described singualtion first object side optical element in location above the described first picture sidelight element.
20. method according to claim 18 further comprises: the focal length of determining described first optical module; Calculate described first optical module with respect to the focus-compensating on picture plane; And, adjust the height of described picture side wafer in the position of described first optical module, thus with the focal point settings of described first optical module near place, picture plane or picture plane.
21. method according to claim 20 further comprises first electrooptic cell is coupled to described first optical module.
22. method according to claim 18 further comprises: provide the singualtion that comprises align structures the second object side optical element; Provide the second picture sidelight that comprises align structures to learn element; And the described singualtion second object side optical element in location above the described second picture sidelight element on the described picture side wafer.
23. method according to claim 22, comprise that further the align structures by making the described singualtion second object side optical element contacts and make at least in part the described singualtion second object side optical element and the described second picture sidelight to learn element alignment with described second align structures as sidelight element, thereby provide second optical module described as the second place place on the side wafer.
24. method according to claim 23, wherein one or more optical properties of definite described singualtion second object side optical element before the described singualtion second object side optical element in location above the described second picture sidelight element.
25. method according to claim 23 further comprises: the focal length of determining described second optical module; Calculate described second optical module with respect to the focus-compensating on picture plane; And adjust the height of described picture side wafer in the position of described second optical module, thus with the focal point settings of described second optical module near place, picture plane or picture plane.
26. method according to claim 25 further comprises second electrooptic cell is coupled to described second optical module.
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| CN105589165A (en) * | 2014-11-11 | 2016-05-18 | 弗兰克公司 | Self-Aligning Doublet Lens Assembly |
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| CN112764183B (en) * | 2021-01-11 | 2022-07-08 | 业成科技（成都）有限公司 | Lens combination structure |
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| CN105589165A (en) * | 2014-11-11 | 2016-05-18 | 弗兰克公司 | Self-Aligning Doublet Lens Assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120133916A1 (en) | 2012-05-31 |
| TWI594021B (en) | 2017-08-01 |
| TW201232046A (en) | 2012-08-01 |
| WO2012074748A1 (en) | 2012-06-07 |
| US9910239B2 (en) | 2018-03-06 |
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