CN103232828A - High-adhesion and heat-resistant epoxy resin adhesive and using method thereof - Google Patents
High-adhesion and heat-resistant epoxy resin adhesive and using method thereof Download PDFInfo
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- CN103232828A CN103232828A CN2013101825401A CN201310182540A CN103232828A CN 103232828 A CN103232828 A CN 103232828A CN 2013101825401 A CN2013101825401 A CN 2013101825401A CN 201310182540 A CN201310182540 A CN 201310182540A CN 103232828 A CN103232828 A CN 103232828A
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Abstract
The invention relates to a high-adhesion and heat-resistant epoxy resin adhesive and a using method thereof. The high-adhesion and heat-resistant epoxy resin adhesive comprises two components of a primary agent and a curing agent, wherein the primary agent is bisphenol A and bisphenol F mixed epoxy resin, an epoxy diluent, an epoxy plasticizer, a dicyandiamide curing agent, and an inorganic padding; and the curing agent is bisphenol A and bisphenol F mixed epoxy resin, and a tertiary amine promoter. The high-adhesion and heat-resistant epoxy resin adhesive disclosed by the invention is good in adhesive strength, and strong in resistance to elevated temperature; and the using method is simple and suitable for large-scale popularization and application.
Description
Technical field
The present invention relates to the epoxyn technical field, particularly a kind of high bonding force thermostable epoxy resin adhesive and using method thereof.
Background technology
Along with the development of industrial technology and the raising of people's living standard, energy-saving design standard and the common people are more and more higher to the performance requriements of the hot comfort of exterior window, but, what the window glass of the building that present China major part is existing adopted is common transparent glass, the cold and hot conductive performance of this kind glass is better and ultraviolet ray transmissivity is higher, and summer is hotter, and winter is colder, therefore, this glass is more not energy-conservation also dangerous.Adhering film to glass is by sticking modes such as thin film or laminated film with viscose glue, pressure sensitive adhesive at glass surface, making door and window have multiple functions such as safety, sunshade, thermal insulation, decoration.Continuous development along with the glassy membrane development, the continual renovation of glassy membrane product and technology is regenerated, adhering film to glass progressively is converted to the civil area of automotive industry and construction industry by the space industry special use, the pressure-sensitive adhesive that is applied to this field at present mostly is common two-component epoxy resin adhesive.
Epoxyn has intensity height, but the good toughness pasta is bonding, adaptability is strong, technology is easy distinguishing feature, therefore, it is widely used in bonding, the smallclothes assembling of various structures in the industries such as aerospace, aviation, automobile, machinery, naval vessel, electronics, electrical equipment, instrument, building, furniture, toy, rail vehicle, civil engineering work, industrial art, big part assembling, emergent reparation, impervious leakage-stopping, nameplate stickup etc.Common epoxyn exists with to be pasted the material bonding strength little, and problems such as bonding bad adaptability have limited the fast development of related industries to a great extent.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of bonding force better, the epoxyn that resistance to elevated temperatures is stronger and using method thereof.
The technical solution adopted for the present invention to solve the technical problems is: a kind of high bonding force thermostable epoxy resin adhesive, comprise two components of host and solidifying agent, and the component of host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts, the epoxy toughening agent of 5-20 mass parts, the Dyhard RU 100 class solidifying agent of 10-30 mass parts, the mineral filler of 30-60 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts.
The preferred ingredient of described host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 13 mass parts, the epoxy toughening agent of 12 mass parts, the Dyhard RU 100 class solidifying agent of 20 mass parts, the mineral filler of 45 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 12 mass parts.
The mixing quality of bisphenol A epoxide resin and bisphenol F epoxy resin is than being 1:1 in the described mixed type Resins, epoxy; Epoxide diluent is that viscosity is the following low-molecular-weight epoxy resin of 500mPa.s; Described epoxy toughening agent is the pressed powder toughner with island structure; Dyhard RU 100 class solidifying agent is the Dyhard RU 100 of 3, the 5-disubstituted benzenes amine modification class solidifying agent of deriving; Tertiary amines promotor is trolamine.
Described mineral filler is nano-calcium carbonate, mica powder or silicon powder.
A kind of using method of high bonding force thermostable epoxy resin adhesive, it has following use step:
(1) by following prescription, prepare material:
Host component: the epoxide diluent of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts, the epoxy toughening agent of 5-20 mass parts, the Dyhard RU 100 class solidifying agent of 10-30 mass parts, the mineral filler of 30-60 mass parts;
Curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts;
(2) dihydroxyphenyl propane in the host and Bisphenol F mixed type Resins, epoxy, epoxide diluent, epoxy toughening agent, Dyhard RU 100 class solidifying agent, mineral filler are sequentially added into stirring tank, mix by planetary mixer, grind through twice three-roll grinder then, make fillers dispersed more even, and under the pressure of-0.1MPa, carry out deaeration handle the host compound;
Dihydroxyphenyl propane in the solidifying agent and Bisphenol F mixed type Resins, epoxy, tertiary amines promotor are sequentially added into the stirring tank stirring, mix by planetary mixer, grind through twice three-roll grinder then, make fillers dispersed more even, and under the pressure of-0.09MPa, carry out deaeration handle the solidifying agent compound;
(3) with host compound and solidifying agent compound according to mass ratio 1:1 configuration after, under 130 ℃ of-160 ℃ of conditions, apply the adherend surface, dry through 10min-40min and get final product.
Beneficial effect: the bonding force of epoxyn of the present invention is better, and resistance to elevated temperatures is stronger, and using method is comparatively simple, and suitable large-scale promotion is used.
Embodiment
The present invention is further elaborated below in conjunction with embodiment.
Embodiment one
A kind of high bonding force thermostable epoxy resin adhesive comprises two components of host and solidifying agent, and the component of host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 13 mass parts, the epoxy toughening agent of 12 mass parts, the Dyhard RU 100 class solidifying agent of 20 mass parts, the mineral filler of 45 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 12 mass parts.
A kind of using method of high bonding force thermostable epoxy resin adhesive, it has following use step:
(1) by above-mentioned prescription, prepare material:
(2) dihydroxyphenyl propane in the host and Bisphenol F mixed type Resins, epoxy, epoxide diluent, epoxy toughening agent, Dyhard RU 100 class solidifying agent, mineral filler are sequentially added into stirring tank, mix by planetary mixer, grind through twice three-roll grinder then, make fillers dispersed more even, and under the pressure of-0.1MPa, carry out deaeration handle the host compound;
Dihydroxyphenyl propane in the solidifying agent and Bisphenol F mixed type Resins, epoxy, tertiary amines promotor are sequentially added into the stirring tank stirring, mix by planetary mixer, grind through twice three-roll grinder then, make fillers dispersed more even, and under the pressure of-0.09MPa, carry out deaeration handle the solidifying agent compound;
(3) with host compound and solidifying agent compound according to mass ratio 1:1 configuration after, under 130 ℃ of-160 ℃ of conditions, apply the adherend surface, dry through 10min-40min and get final product.
Embodiment two
A kind of high bonding force thermostable epoxy resin adhesive comprises two components of host and solidifying agent, and the component of host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 95 mass parts and Bisphenol F mixed type Resins, epoxy, 20 mass parts, the epoxy toughening agent of 18 mass parts, the Dyhard RU 100 class solidifying agent of 25 mass parts, the mineral filler of 55 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 105 mass parts and Bisphenol F mixed type Resins, epoxy, 18 mass parts.
The using method of this high bonding force thermostable epoxy resin adhesive is with embodiment one.
Embodiment three
A kind of high bonding force thermostable epoxy resin adhesive comprises two components of host and solidifying agent, and the component of host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 105 mass parts and Bisphenol F mixed type Resins, epoxy, 8 mass parts, the epoxy toughening agent of 6 mass parts, the Dyhard RU 100 class solidifying agent of 12 mass parts, the mineral filler of 30 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 98 mass parts and Bisphenol F mixed type Resins, epoxy, 8 mass parts.
The using method of this high bonding force thermostable epoxy resin adhesive is with embodiment one.
Every test performance of the epoxyn of above-mentioned three routine embodiment gained is as follows:
Claims (7)
1. one kind high bonding force thermostable epoxy resin adhesive comprises two components of host and solidifying agent, and it is characterized in that: the component of described host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts, the epoxy toughening agent of 5-20 mass parts, the Dyhard RU 100 class solidifying agent of 10-30 mass parts, the mineral filler of 30-60 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts.
2. a kind of high bonding force thermostable epoxy resin adhesive according to claim 1, it is characterized in that: the preferred ingredient of described host and solidifying agent is as follows:
(1) host component: the epoxide diluent of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 13 mass parts, the epoxy toughening agent of 12 mass parts, the Dyhard RU 100 class solidifying agent of 20 mass parts, the mineral filler of 45 mass parts;
(2) curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 100 mass parts and Bisphenol F mixed type Resins, epoxy, 12 mass parts.
3. a kind of high bonding force thermostable epoxy resin adhesive according to claim 1 is characterized in that: the mixing quality of bisphenol A epoxide resin and bisphenol F epoxy resin is than being 1:1 in the described mixed type Resins, epoxy; Epoxide diluent is that viscosity is the following low-molecular-weight epoxy resin of 500mPa.s.
4. a kind of high bonding force thermostable epoxy resin adhesive according to claim 1, it is characterized in that: described epoxy toughening agent is the pressed powder toughner with island structure.
5. a kind of high bonding force thermostable epoxy resin adhesive according to claim 1 is characterized in that: described Dyhard RU 100 class solidifying agent is the Dyhard RU 100 of 3, the 5-disubstituted benzenes amine modification class solidifying agent of deriving; Tertiary amines promotor is trolamine.
6. a kind of high bonding force thermostable epoxy resin adhesive according to claim 1, it is characterized in that: described mineral filler is nano-calcium carbonate, mica powder or silicon powder.
7. the using method of a high bonding force thermostable epoxy resin adhesive is characterized in that: have following use step:
(1) by following prescription, prepare material:
Host component: the epoxide diluent of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts, the epoxy toughening agent of 5-20 mass parts, the Dyhard RU 100 class solidifying agent of 10-30 mass parts, the mineral filler of 30-60 mass parts;
Curing agent component: the tertiary amines promotor of the dihydroxyphenyl propane of 95-105 mass parts and Bisphenol F mixed type Resins, epoxy, 5-20 mass parts;
(2) dihydroxyphenyl propane in the host and Bisphenol F mixed type Resins, epoxy, epoxide diluent, epoxy toughening agent, Dyhard RU 100 class solidifying agent, mineral filler are sequentially added into stirring tank, by the mechanical stirring mode be stirred to the deaeration of even back handle the host compound;
Dihydroxyphenyl propane in the solidifying agent and Bisphenol F mixed type Resins, epoxy, tertiary amines promotor are sequentially added into stirring tank stir, by the mechanical stirring mode be stirred to even back deaeration handle the solidifying agent compound;
(3) with host compound and solidifying agent compound according to mass ratio 1:1 configuration after, under 130 ℃ of-160 ℃ of conditions, apply the adherend surface, dry through 10min-40min and get final product.
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| CN2013101825401A CN103232828A (en) | 2013-05-16 | 2013-05-16 | High-adhesion and heat-resistant epoxy resin adhesive and using method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709983A (en) * | 2013-12-23 | 2014-04-09 | 东莞市亚聚电子材料有限公司 | High temperature resisting bottom filler glue and preparation method thereof |
| CN103740060A (en) * | 2013-12-23 | 2014-04-23 | 东莞市亚聚电子材料有限公司 | Low-halogen underfill adhesive and preparation method thereof |
| CN103756612A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature setting underfill adhesive and preparation method thereof |
| CN109913089A (en) * | 2019-03-01 | 2019-06-21 | 海安南京大学高新技术研究院 | A kind of heat-resistant fireproof fiberglass sleeve coating preparation method of lotion |
| CN111909620A (en) * | 2020-08-21 | 2020-11-10 | 湖南创瑾科技有限公司 | Adhesive with anti-corrosion function |
| CN115181520A (en) * | 2022-05-25 | 2022-10-14 | 惠州市杜科新材料有限公司 | High-temperature-resistant single-component epoxy-structure inductor magnetic core bonding adhesive and preparation method thereof |
| CN115213995A (en) * | 2021-09-27 | 2022-10-21 | 江门市尚逸家居用品有限公司 | Process for manufacturing jigsaw puzzle component |
| CN117487475A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High-temperature-resistant pressure-sensitive adhesive tape and preparation method thereof |
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| CN101724368A (en) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | Anti-impact epoxy structural rubber and preparation method thereof |
| CN103057213A (en) * | 2012-12-31 | 2013-04-24 | 金安国纪科技股份有限公司 | Environment-friendly copper clad laminate for LED monochrome display, glue solution and preparation method |
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| CN1412244A (en) * | 2001-10-12 | 2003-04-23 | 中国石油化工股份有限公司 | Toughened thermosetting resin and its preparation method |
| CN101724368A (en) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | Anti-impact epoxy structural rubber and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709983A (en) * | 2013-12-23 | 2014-04-09 | 东莞市亚聚电子材料有限公司 | High temperature resisting bottom filler glue and preparation method thereof |
| CN103740060A (en) * | 2013-12-23 | 2014-04-23 | 东莞市亚聚电子材料有限公司 | Low-halogen underfill adhesive and preparation method thereof |
| CN103756612A (en) * | 2013-12-23 | 2014-04-30 | 东莞市亚聚电子材料有限公司 | Low-temperature setting underfill adhesive and preparation method thereof |
| CN103709983B (en) * | 2013-12-23 | 2015-12-30 | 东莞市亚聚电子材料有限公司 | A kind of high temperature resistant underfill and preparation method thereof |
| CN103756612B (en) * | 2013-12-23 | 2015-12-30 | 东莞市亚聚电子材料有限公司 | A kind of low-temperature curing underfill and preparation method thereof |
| CN109913089A (en) * | 2019-03-01 | 2019-06-21 | 海安南京大学高新技术研究院 | A kind of heat-resistant fireproof fiberglass sleeve coating preparation method of lotion |
| CN111909620A (en) * | 2020-08-21 | 2020-11-10 | 湖南创瑾科技有限公司 | Adhesive with anti-corrosion function |
| CN111909620B (en) * | 2020-08-21 | 2022-05-27 | 湖南创瑾科技有限公司 | Adhesive with anti-corrosion function |
| CN115213995A (en) * | 2021-09-27 | 2022-10-21 | 江门市尚逸家居用品有限公司 | Process for manufacturing jigsaw puzzle component |
| CN115181520A (en) * | 2022-05-25 | 2022-10-14 | 惠州市杜科新材料有限公司 | High-temperature-resistant single-component epoxy-structure inductor magnetic core bonding adhesive and preparation method thereof |
| CN117487475A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High-temperature-resistant pressure-sensitive adhesive tape and preparation method thereof |
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Owner name: CHANGZHOU BOGUANG THIN FILM TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHANGZHOU BOMEI NEW MATERIAL TECHNOLOGY CO., LTD. Effective date: 20131008 |
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Effective date of registration: 20131008 Address after: 213164, building B701, building 3, Changzhou science and Education City, No. 801 middle Wu Road, Wujin District, Jiangsu, Changzhou Applicant after: Changzhou Boguang Film Technology Co., Ltd. Address before: Hutang Town, Wujin District 213164 Jiangsu city in Changzhou Province Ming Huang industrial zone, New Road No. 136 Applicant before: Changzhou Bomei New Material Technology Co., Ltd. |
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Application publication date: 20130807 |