CN103239202A

CN103239202A - Endoscopy with integrated light source

Info

Publication number: CN103239202A
Application number: CN2012100223231A
Authority: CN
Inventors: 周益成
Original assignee: Himax Imaging Inc
Current assignee: Himax Imaging Inc
Priority date: 2012-02-01
Filing date: 2012-02-01
Publication date: 2013-08-14

Abstract

An endoscopy with an integrated light source comprises a wafer level imaging module and the light source which are combined on a substrate. The endoscopy also comprises a clamping portion which enables the combined substrate, wafer level imaging module and light source to be attached to the clamping portion.

Description

The endoscope of integrated light source

[technical field]

The present invention is relevant a kind of endoscope, and particularly about a kind of endoscope, the wafer scale of its distal portion is module integrated semiconductor light sources.

[background technology]

Endoscope is a kind of instrument that inserts human organ, in order to inspect the inside of organ.Endoscope generally includes flexible pipe; Light source is positioned at the endoscope near-end, by optical fiber to transmit light; And lens combination, be positioned at the endoscope far-end, in order to obtain image, transmit this image by optical fiber again.

Because the size of endoscope is very little, makes the manufacturing of lens combination be difficult for, thereby improve whole cost, and cause being difficult in the use to popularize.In addition, if endoscope is not subjected to suitable cleaning, be easy to cause infection.Consider factors such as cost and infection, the disposable endoscope that single uses should slow down above-mentioned problem.

Higher or the risk of infection is arranged in view of traditional endoscope price, therefore need the endoscope that proposes a kind of novelty badly, in order to overcome the problems referred to above.

[summary of the invention]

In view of above-mentioned, the embodiment of the invention proposes a kind of endoscope, and the wafer scale of its distal portion is module integrated semiconductor light sources, in order to reduce the whole cost of endoscope.The endoscope of present embodiment is used applicable to disposable, infects to reduce.

According to the embodiment of the invention, endoscope comprises substrate, wafer scale image-forming module, light source, pipe fitting and clamping part.Wafer scale image-forming module and light source are incorporated into the first surface of substrate, and the far-end of pipe fitting is connected in the second surface of substrate.Substrate, wafer scale image-forming module and light source through combination then are attached to clamping part.

[description of drawings]

Figure 1A and Figure 1B show top view and the side cross-sectional, view of the endoscope distal portion of the embodiment of the invention respectively.

Fig. 1 C shows the substrate top view of Figure 1B.

Fig. 2 shows the perspective diagram of the image-forming module of Figure 1B.

Fig. 3 A and Fig. 3 B show top view and the side cross-sectional, view of the endoscope distal portion of another embodiment of the present invention respectively.

10 pipe fittings

11 substrates

12 wafer scale image-forming modules

121 wafer scale CISs

122 wafer scale optical elements

13 light sources

14 clamping parts

The 14A outer wall

Photoconduction in the 14B

The 14C perforate

The 14D barrier

140 medial walls

141 light exits

[specific embodiment]

Figure 1A and Figure 1B show top view and the side cross-sectional, view of the endoscope distal portion of the embodiment of the invention respectively.The distal portion of endoscope is connected in the far-end of the pipe fitting 10 of endoscope.

In the present embodiment, distal portion mainly comprises substrate 11, wafer scale image-forming module (abbreviation image-forming module) 12, light source 13 and clamping part 14.Wherein, image-forming module 12 and light source 13 be engaged in substrate 11 (for example printed circuit board (PCB)) first (on) surface, be attached to clamping part (holder) 14 again through substrate 11, image-forming module 12 and the light source 13 of combination.

Fig. 2 shows the perspective diagram of image-forming module 12.In the present embodiment, image-forming module 12 comprises wafer scale CIS 121 and wafer scale optical element 122.Wafer scale CIS 121 is towards substrate 11, and it can be complementary metal oxide semiconductor (CMOS) CIS (CMOS image sensor is called for short CIS), but is not limited to this.Wafer scale optical element 122 (for example lens) is away from substrate 11, and its material can be glass, but is not limited to this.Wafer scale CIS 121 and wafer scale optical element 122 can be bonded to each other by sticker.Compared to traditional endoscope, the endoscope of present embodiment uses semiconductor technology to make the imaging system of endoscope, can realize making in a large number cheaply, and applicable to the disposable endoscope, with the probability of avoiding infection.The wafer scale module is to use semiconductor technology to make the optical element of miniaturization, for example wafer scale lens module or camera module.Manufacturing details about wafer scale image-forming module 12 can be with reference to pertinent literature, the United States Patent (USP) the 7th that proposes of people such as Wolterink for example, 564, No. 496, be entitled as " photographic attachment, the manufacture method of photographic attachment; wafer-level packaging (Camera device; method of manufacturing a camera device, wafer scale package) ", its content is considered as the part of this description.

In the present embodiment, light source 13 comprises at least one semiconductor light sources (for example light emitting diode) around image-forming module 12, substrate 11 top views shown in Fig. 1 C, and four light emitting diodes equidistantly are located at the edge of substrate 11.In an example, light emitting diode 13 and image-forming module 12 are engaged in printed circuit board (PCB) 11 by refluxing (reflow) solder technology.Printed circuit board (PCB) 11 through refluxing is attached to the inner surface of clamping part 14 again.At last, the far-end of pipe fitting 10 is connected in second (descending) surface of printed circuit board (PCB) 11.

In the present embodiment, clamping part 14 comprises outer wall 14A and interior photoconduction 14B.Wherein, outer wall 14A forms the outside of clamping part 14, generally is to use transparent materials.Interior photoconduction 14B forms the inside of clamping part 14, generally is to use transparent material, for example plastic cement (for example acryl).The light of the interior photoconduction 14B guiding light source 13 of present embodiment penetrates its light exit 141 from distal portion.Clamping part 14 can have a perforate 14C, is positioned at image-forming module 12 tops and aims at it.Light source compared to traditional endoscope is the near-end that is positioned at endoscope, and to transmit light in whole pipe fitting, the endoscope of present embodiment has higher light emission efficient, and because has omitted optical fiber thereby had lower cost by optical fiber for it.The medial wall 140 alternative coating reflection materials of the outer wall 14A of present embodiment, the light transmission of photoconduction 14B in can more promoting.Similar situation, the lateral wall of image-forming module 12 be alternative coating reflection material also, with the light transmission of photoconduction 14B in promoting.

Present embodiment also can comprise barrier 14D, between interior photoconduction 14B and image-forming module 12, enters the wafer scale CIS 121 of image-forming module 12 in order to intercept diverging light.The barrier 14D of present embodiment can use antireflection or black material.

Fig. 3 A and Fig. 3 B show top view and the side cross-sectional, view of the endoscope distal portion of another embodiment of the present invention respectively.Present embodiment is similar to the embodiment of Figure 1B, and different places are that barrier 14D has sloped sidewall towards interior photoconduction 14B, thereby forms a lead angle between 12 the outer surface (supposing that it is perpendicular to substrate 11) in sloped sidewall in image-forming module.By this, interior photoconduction 14B is near the cross section less than light exit 141, the cross section at light source 13 places, thereby promoted the light emission uniformity.

The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of finishing under the spirit that invention discloses and changes or modify, and all should be included in the claim.

Claims

1. the endoscope of an integrated light source comprises:

One substrate;

One wafer scale image-forming module is incorporated into the first surface of this substrate;

One light source is incorporated into the first surface of this substrate;

One pipe fitting, its far-end is connected in the second surface of this substrate; And

One clamping part, the substrate of this combination, wafer scale image-forming module and light source are attached to this clamping part.

2. the endoscope of integrated light source according to claim 1, wherein this wafer scale image-forming module comprises:

One wafer scale CIS; And

One wafer scale optical element is engaged to this wafer scale CIS;

Wherein this wafer scale CIS is towards this substrate, and this wafer scale optical element is away from this substrate.

3. as the endoscope of integrated light source as described in the claim 2, wherein this wafer scale CIS comprises a complementary metal oxide semiconductor CIS.

4. as the endoscope of integrated light source as described in the claim 2, wherein this wafer scale optical element comprises lens.

5. as the endoscope of integrated light source as described in the claim 4, wherein these lens comprise glass.

6. the endoscope of integrated light source according to claim 1, wherein this light source comprises at least one semiconductor light sources.

7. as the endoscope of integrated light source as described in the claim 6, wherein this semiconductor light sources comprises a light emitting diode.

8. the endoscope of integrated light source according to claim 1, wherein this substrate comprises a printed circuit board (PCB).

9. the endoscope of integrated light source according to claim 1, wherein this clamping part comprises:

One outer wall; And

Photoconduction in one is positioned at this outer wall, and light of this light source of optical guide guides light makes it penetrate from a light exit in this.

10. as the endoscope of integrated light source as described in the claim 9, wherein this outer wall comprises transparent materials, and should in photoconduction comprise transparent material.

11. as the endoscope of integrated light source as described in the claim 9, wherein this clamping part has a perforate, is positioned at this wafer scale image-forming module top.

12. as the endoscope of integrated light source as described in the claim 9, wherein the medial wall of this outer wall is coated with the reflection material.

13. as the endoscope of integrated light source as described in the claim 9, wherein the lateral wall of this wafer scale image-forming module is coated with the reflection material.

14. the endoscope as integrated light source as described in the claim 9 wherein also comprises a barrier, between photoconduction and this wafer scale image-forming module, enters this wafer scale image-forming module in order to intercept diverging light in this.

15. as the endoscope of integrated light source as described in the claim 14, wherein this barrier comprises the antireflection material.

16. as the endoscope of integrated light source as described in the claim 14, wherein this barrier surface photoconduction in this has a sloped sidewall, makes photoconduction in this near the cross section less than this light exit, the cross section at this light source place.