CN103219329A - Light-emitting diode device and manufacturing method thereof - Google Patents
Light-emitting diode device and manufacturing method thereof Download PDFInfo
- Publication number
- CN103219329A CN103219329A CN2013100916314A CN201310091631A CN103219329A CN 103219329 A CN103219329 A CN 103219329A CN 2013100916314 A CN2013100916314 A CN 2013100916314A CN 201310091631 A CN201310091631 A CN 201310091631A CN 103219329 A CN103219329 A CN 103219329A
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- light
- emitting diode
- substrate
- heat
- backlight unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light-emitting diode device and a manufacturing method thereof. By means of modularization manufacturing, a plurality of light-emitting diode chips are fixed on a large substrate, integral adhesive dispensing packaging and roasting are carried out on the light-emitting diode chips and the substrate, then cutting is carried out according to production demands, the side wall of the substrate is cut, and therefore the limitation to irritation angles of a light-emitting diode from the side wall of the substrate is avoided. According to the light-emitting diode which is produced in a modularization mode, production efficiency is high, and at the same time light-emitting diode modules can be cut and combined flexibly according to demands.
Description
Technical field
The present invention relates to photoelectric field, relate in particular to a kind of manufacture method and structure of light-emitting diode assembly.
Background technology
(Light Emitting Diode LED) as a kind of green light source, has that luminous efficiency height, power consumption are few, a long service life, safe and reliable and environmentally friendly advantage to light-emitting diode, is widely used in illumination and field of backlights.Along with development of science and technology, people are also more and more higher to the requirement of light-emitting diode assembly, and miniaturization, big rising angle and high brightness become the development trend of LED.
The light-emitting diode assembly of prior art comprises substrate, support, led chip and fluorescent glue; Support and substrate form the bowl cup structure, and led chip is arranged in bowl cup structure, and fluorescent glue applies led chip and fills the bowl cup structure.The light-emitting diode assembly of this structure, the bowl cup structure emits beam to have produced to led chip and stops, the light-emitting diode assembly rising angle is restricted.Simultaneously, in actual applications, usually run into the situation that needs a plurality of light-emitting diode assembly combinations, to satisfy the requirement of aspects such as luminosity, power, the light-emitting diode assembly of traditional structure is subjected to the influence of product type, and the easy assembleability of light-emitting diode assembly is restricted.
The light-emitting diode assembly manufacture method of conventional art, usually a light-emitting diode chip for backlight unit is fixed on the substrate and with substrate and is electrically connected, apply fluorescent glue then, after solidifying, fluorescent glue obtains light-emitting diode assembly, the single manufacturing of light-emitting diode assembly, production efficiency is low, and brightness, power are fixed, and uses limited.
In order to solve the defective of conventional art, be necessary to propose a kind of new method for manufacturing light-emitting and structure.
Summary of the invention
Technical problem to be solved by this invention provides a kind of production efficiency height, the light-emitting diode assembly manufacture method of applying flexible, and provide a kind of emitting brightness height, integrated good light-emitting diode assembly.
To achieve these goals, the present invention is by the following technical solutions: a kind of manufacture method of light-emitting diode assembly may further comprise the steps: 1) a kind of substrate is provided, described substrate comprises sidewall, a plurality of heat-conductivity conducting portion and a plurality of insulation division, described sidewall, heat-conductivity conducting portion and insulation division constitute the bowl cup structure, described a plurality of heat-conductivity conducting portion adopts the mode of grid to arrange, between the described heat-conductivity conducting portion by described insulation division at interval; 2) a plurality of light-emitting diode chip for backlight unit are fixed in substrate heat-conductivity conducting portion, light-emitting diode chip for backlight unit is electrically connected with heat-conductivity conducting portion; 3) put fluorescent glue in the bowl cup structure of substrate, fluorescent glue coats light-emitting diode chip for backlight unit and fills substrate bowl cup structure, adopts the mode of baking that the fluorescent glue in bowl cup structure is solidified; 4) will consolidate the substrate that glue finishes and cut, excision substrate sidewall.
As a kind of optimized technical scheme, described substrate cut becomes difform polygon, and described fluorescent glue cuts into corresponding polygon.
The light-emitting diode assembly that adopts above manufacture method to make comprises: substrate, and described substrate comprises heat-conductivity conducting portion and insulation division; Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are fixed in described substrate heat-conductivity conducting portion, and are electrically connected with described heat-conductivity conducting portion; Fluorescent glue, described fluorescent glue comprises packaging plastic and fluorescent material, described fluorescent glue coats described light-emitting diode chip for backlight unit; And: described substrate is a slab construction, and described light-emitting diode chip for backlight unit is fixed on the substrate of described slab construction.
As a kind of optimized technical scheme, in the described light-emitting diode assembly, described light-emitting diode chip for backlight unit is a plurality of, and described substrate heat-conductivity conducting portion also is a plurality of, is provided with by described insulation division insulation between the described a plurality of heat-conductivity conducting portion.
As further preferred, described a plurality of light-emitting diode chip for backlight unit adopt the mode of series, parallel or string and series-parallel connection to be electrically connected.
As another kind of optimized technical scheme, described light-emitting diode chip for backlight unit is a kind of in parallel pole chip, vertical electrode chip and the upside-down mounting electrode chip.
As another kind of optimized technical scheme, described heat-conductivity conducting portion is a metal.
Method for manufacturing light-emitting of the present invention adopts the modular product design, and a plurality of light-emitting diode (LED) modules encapsulate on a substrate, whole gluing during point glue, and encapsulation is cut after the baking as required, effectively enhances productivity.Light emitting diode construction disclosed by the invention, light-emitting diode chip for backlight unit is arranged on the substrate of slab construction, can effectively improve the light-emitting diode rising angle, the substrate of slab construction makes light-emitting diode assembly easier assembling when a plurality of respective outer side edges are used, and improves integrated.
Description of drawings
Fig. 1 is a light-emitting diode assembly overall package structure vertical view of the present invention.
Fig. 2 is light emitting diode construction cutaway view of light-emitting diode assembly of the present invention.
Fig. 3 is embodiment vertical view of light-emitting diode assembly of the present invention.
Fig. 4 is another embodiment vertical view of light-emitting diode assembly of the present invention.
Fig. 5 A to Fig. 5 D is a light-emitting diode assembly manufacture method schematic diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing, describe the present invention in detail.
As shown in Figures 1 to 4, light-emitting diode assembly of the present invention comprises: by the substrate that heat-conductivity conducting portion 11 and insulation division 12 constitute, heat-conductivity conducting portion 11 comprises two parts, and two parts heat-conductivity conducting portion 11 is provided with by insulation division 12 insulation; Light-emitting diode chip for backlight unit 2, light-emitting diode chip for backlight unit 2 are arranged in the heat-conductivity conducting portion 11, and two conductive electrodes of light-emitting diode chip for backlight unit 2 are electrically connected with two parts heat-conductivity conducting portion 11 respectively.As shown in Figure 2, light-emitting diode assembly of the present invention also comprises fluorescent glue 3, and fluorescent glue 3 is coated on the side that substrate is fixed with light-emitting diode chip for backlight unit 2, and fluorescent glue 3 coats light-emitting diode chip for backlight unit 2; Fluorescent glue 3 comprises fluorescent material and packaging plastic, the light that light-emitting diode chip for backlight unit 2 sends reflections from phosphor particles in fluorescent glue 3, and sending need be photochromic.As shown in Figures 1 to 4, light-emitting diode assembly substrate of the present invention is a planar structure, light-emitting diode chip for backlight unit is directly fixed on the substrate of planar structure, does not have the bowl cup structure of traditional structure light-emitting diode, can effectively improve the lighting angle of light-emitting diode assembly.
As shown in Figure 3, an embodiment of light-emitting diode assembly of the present invention, comprise a plurality of light-emitting diode chip for backlight unit 2, a plurality of light-emitting diode chip for backlight unit 2 are electrically connected by the mode of series connection, a plurality of light-emitting diode chip for backlight unit 2 correspondences are arranged in a plurality of substrate heat-conductivity conducting portion 11, are provided with by insulation division 12 insulation between a plurality of heat-conductivity conducting portion 11.
As shown in Figure 4, another embodiment of light-emitting diode assembly of the present invention, comprise a plurality of light-emitting diode chip for backlight unit 2, mode by parallel connection between a plurality of light-emitting diode chip for backlight unit 2 is electrically connected, a plurality of light-emitting diode chip for backlight unit 2 correspondences are arranged in a plurality of substrate heat-conductivity conducting portion 11, and heat-conductivity conducting portion 11 is provided with by insulation division 12 insulation.
As another kind of embodiment, light-emitting diode assembly of the present invention comprises a plurality of light-emitting diode chip for backlight unit, adopts the mode of string and series-parallel connection to be electrically connected between a plurality of light-emitting diode chip for backlight unit.
Light-emitting diode assembly is provided with a plurality of light-emitting diode chip for backlight unit, can satisfy the requirement of external circuit to light-emitting diode assembly voltage, electric current or power, improves the range of application of light-emitting diode assembly, satisfies in the practical application needs to light-emitting diode assembly.
The manufacture method of light-emitting diode assembly of the present invention comprises the steps:
1) shown in Fig. 5 A, a kind of substrate is provided, described substrate comprises the bottom of being made up of heat-conductivity conducting portion 11 and insulation division 12, and sidewall 4, sidewall 4 and bottom constitute the bowl cup structure; As shown in Figure 1, heat-conductivity conducting portion 11 adopts the mode of grid to arrange on the substrate, is separated by insulation division 12 insulation between the heat-conductivity conducting portion 11;
2) shown in Fig. 5 B, light-emitting diode chip for backlight unit 2 is fixed in the heat-conductivity conducting portion 11, and two conductive electrodes of light-emitting diode chip for backlight unit 2 are electrically connected with adjacent two heat-conductivity conducting portions 11 respectively.In the present embodiment, light-emitting diode chip for backlight unit 2 is the parallel pole chip, all adopt metal lead wire 5 to be electrically connected between light-emitting diode chip for backlight unit 2 and two the heat-conductivity conducting portions 11, should know, in actual manufacture process, light-emitting diode chip for backlight unit also may be vertical electrode chip or flip-chip, and light-emitting diode chip for backlight unit can adopt other corresponded manners to be electrically connected with heat-conductivity conducting portion, also belongs to light-emitting diode assembly of the present invention and scope that manufacture method disclosed thereof;
3) shown in Fig. 5 C, in substrate bowl cup structure, be coated with fluorescent glue 3, fluorescent glue 3 is mixed by fluorescent material and sealing shape according to the luminous needs of light-emitting diode assembly, and fluorescent glue 3 coats light-emitting diode chip for backlight unit 2 and fills substrate bowl cup structure; The light-emitting diode assembly that has applied fluorescent glue 3 is toasted, fluorescent glue 3 is solidified;
4) shown in Fig. 5 D, the substrate that solid glue is finished cuts, excision substrate sidewall, and produce needs according to light-emitting diode substrate is cut.
The manufacture method of light-emitting diode assembly of the present invention, the employing modularization is made, earlier a plurality of light-emitting diode chip for backlight unit are fixed on the big substrate, carry out the encapsulation of integral body point glue, baking then, cut as required afterwards, and excision substrate sidewall, avoid the restriction of sidewall to the lumination of light emitting diode angle.The light-emitting diode that modularization is produced, the production efficiency height can cut light-emitting diode (LED) module simultaneously as required neatly, and also easier when the light-emitting diode assembly that cutting forms carries out integrated combination mutually, product is integrated good.
The manufacture method of light-emitting diode assembly of the present invention, can be according to the luminous needs and the combination needs of light-emitting diode, light-emitting diode is cut into difformity, and difform packaging plastic makes light-emitting diode send the light of correspondingly-shaped, to satisfy the demand of different application occasion; This shape can be parallelogram, hexagon, and circle, ellipse, round rectangle, but be not limited to above several shape.
As a kind of optimized technical scheme, light-emitting diode assembly heat-conductivity conducting of the present invention portion is a metal structure, and light-emitting diode chip for backlight unit is fixed in the heat-conductivity conducting portion of metal structure, helps distributing of heat, improves the radiating effect of light-emitting diode assembly.
Be the invention process case only below, be not limited to the present invention,, all should include in the protection range of putting down in writing in claims as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed.
Claims (7)
1. the manufacture method of a light-emitting diode assembly is characterized in that, may further comprise the steps:
(1) provides a kind of substrate, described substrate comprises sidewall, a plurality of heat-conductivity conducting portion and a plurality of insulation division, described sidewall, heat-conductivity conducting portion and insulation division constitute the bowl cup structure, described a plurality of heat-conductivity conducting portion adopts the mode of grid to arrange, between the described heat-conductivity conducting portion by described insulation division at interval;
(2) a plurality of light-emitting diode chip for backlight unit are fixed in substrate heat-conductivity conducting portion, light-emitting diode chip for backlight unit is electrically connected with heat-conductivity conducting portion;
(3) put fluorescent glue in the bowl cup structure of substrate, fluorescent glue coats light-emitting diode chip for backlight unit and fills substrate bowl cup structure, adopts the mode of baking that the fluorescent glue in bowl cup structure is solidified;
(4) will consolidate the substrate that glue finishes and cut, excision substrate sidewall.
2. method for manufacturing light-emitting according to claim 1 is characterized in that: described substrate cut becomes difform polygon, and described fluorescent glue cuts into corresponding polygon.
3. light-emitting diode assembly comprises:
Substrate, described substrate comprises heat-conductivity conducting portion and insulation division;
Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are fixed in described substrate heat-conductivity conducting portion, and are electrically connected with described heat-conductivity conducting portion;
Fluorescent glue, described fluorescent glue comprises packaging plastic and fluorescent material, described fluorescent glue coats described light-emitting diode chip for backlight unit;
It is characterized in that: described substrate is a slab construction, and described light-emitting diode chip for backlight unit is fixed on the substrate of described slab construction.
4. light-emitting diode assembly according to claim 3 is characterized in that: described light-emitting diode chip for backlight unit is a plurality of, and described substrate heat-conductivity conducting portion also is a plurality of, is provided with by described insulation division insulation between the described a plurality of heat-conductivity conducting portion.
5. light-emitting diode assembly according to claim 4 is characterized in that: described a plurality of light-emitting diode chip for backlight unit adopt the mode of series, parallel or string and series-parallel connection to be electrically connected.
6. light-emitting diode assembly according to claim 3 is characterized in that: described light-emitting diode chip for backlight unit is a kind of in parallel pole chip, vertical electrode chip and the upside-down mounting electrode chip.
7. light-emitting diode assembly according to claim 3 is characterized in that: described heat-conductivity conducting portion is a metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100916314A CN103219329A (en) | 2013-03-21 | 2013-03-21 | Light-emitting diode device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100916314A CN103219329A (en) | 2013-03-21 | 2013-03-21 | Light-emitting diode device and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN103219329A true CN103219329A (en) | 2013-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013100916314A Pending CN103219329A (en) | 2013-03-21 | 2013-03-21 | Light-emitting diode device and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103413805A (en) * | 2013-08-29 | 2013-11-27 | 四川柏狮光电技术有限公司 | Manufacturing technology of LED lamp filament with adjustable light |
| WO2015172550A1 (en) * | 2014-05-12 | 2015-11-19 | 苏州东山精密制造股份有限公司 | Led lamp and manufacturing process therefor and backlight module |
| JP2020021784A (en) * | 2018-07-31 | 2020-02-06 | Ｅ＆Ｅ Ｊａｐａｎ株式会社 | Led and manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110250711A1 (en) * | 2010-04-13 | 2011-10-13 | Citizen Holdings Co., Ltd. | Method of manufacturing light-emitting device |
| CN102222625A (en) * | 2010-04-16 | 2011-10-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof |
| CN102468374A (en) * | 2010-11-11 | 2012-05-23 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode |
| CN203192796U (en) * | 2013-03-21 | 2013-09-11 | 歌尔声学股份有限公司 | Light emitting diode device |
-
2013
- 2013-03-21 CN CN2013100916314A patent/CN103219329A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110250711A1 (en) * | 2010-04-13 | 2011-10-13 | Citizen Holdings Co., Ltd. | Method of manufacturing light-emitting device |
| CN102222625A (en) * | 2010-04-16 | 2011-10-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof |
| CN102468374A (en) * | 2010-11-11 | 2012-05-23 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode |
| CN203192796U (en) * | 2013-03-21 | 2013-09-11 | 歌尔声学股份有限公司 | Light emitting diode device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103413805A (en) * | 2013-08-29 | 2013-11-27 | 四川柏狮光电技术有限公司 | Manufacturing technology of LED lamp filament with adjustable light |
| CN103413805B (en) * | 2013-08-29 | 2016-09-14 | 四川柏狮光电技术有限公司 | LED lamp filament with adjustable light manufacturing process |
| WO2015172550A1 (en) * | 2014-05-12 | 2015-11-19 | 苏州东山精密制造股份有限公司 | Led lamp and manufacturing process therefor and backlight module |
| JP2020021784A (en) * | 2018-07-31 | 2020-02-06 | Ｅ＆Ｅ Ｊａｐａｎ株式会社 | Led and manufacturing method |
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Application publication date: 20130724 |