CN103203563A - Strengthened composite lead-free solder containing nanometer TiO2 particles - Google Patents
Strengthened composite lead-free solder containing nanometer TiO2 particles Download PDFInfo
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- CN103203563A CN103203563A CN2013101189783A CN201310118978A CN103203563A CN 103203563 A CN103203563 A CN 103203563A CN 2013101189783 A CN2013101189783 A CN 2013101189783A CN 201310118978 A CN201310118978 A CN 201310118978A CN 103203563 A CN103203563 A CN 103203563A
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- free solder
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- composite lead
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Abstract
The invention relates to a strengthened composite lead-free solder containing nanometer TiO2 particles. The strengthened composite lead-free solder is used during soldering and surface packaging for electronic components. The strengthened composite lead-free solder is characterized in that a tin-based micrometer lead-free solder is used as a matrix, and the nanometer TiO2 particles are added into the matrix to strengthen the matrix. The strengthened composite lead-free solder comprises, by mass, from 98% to 99.5% of the micrometer lead-free solder and from 0.5% to 2% of the nanometer TiO2 particles. Compared with a common lead-free solder, the strengthened composite lead-free solder has the advantages of high mechanical strength and excellent fatigue resistance.
Description
Technical field
The present invention relates to a kind of lead-free solder for electronic devices and components welding and surface encapsulation, specifically a kind of nano-TiO
2The lead-free solder of particle strengthening is about to TiO
2Nano particle adds tin-base lead-free solder, forms the compound lead-free solder of reinforced by nanoparticles.
Background technology
Solder is a very ancient and practical technology, and mainly adopting leypewter is the system on basis, and this leypewter eutectic temperature is 183 ℃, is widely used in the electronics industry so have good physical property, mechanical property and metallurgical performance.The use of tin-lead solder alloy has a long history, and has accumulated a large amount of practical application experiences in the production, and cost of material is cheap simultaneously, and resource is extensive.Yet lead is a kind of toxic metals, and the lead of absorption of human body low dosage will cause lead poisoning.Being accompanied by electronic waste increases day by day, processing is discarded or buried to a large amount of waste and old electric devices, lead poisonous in the electronic waste is finally caused expendable environmental pollution to the soil in the natural environment, natural water body and animals and plants biological chain thereof by the burn into dissolving gradually of the aqueous solution in the natural environment, diffusion and enrichment.
Enter 20 th century later, along with modern industry and science and technology development, people are more and more stronger to the protection of environment consciousness, limit and ban use of the cry that contains the Pb scolder to grow to even greater heights.The later stage nineties 20th century, each developed country put into effect a series of policy and rules in succession, limited and forbid containing the use of Pb product.The high-performance Pb-free environment-friendly soldering of development of new is the important topic that electronics and information industry face.
At present, lead-free solder has obtained using widely.But along with Electronic Packaging density constantly increases, size constantly reduces, the trend that chip power constantly increases, and lead-free solder also needs further to improve its mechanical performance.In order to improve the mechanical performance of lead-free solder, wherein a kind of effective means are to use molecule that lead-free solder is strengthened, and form composite solder.Along with the continuous development of nanometer technology, the research that many use nano particles are strengthened scolder occurred, and some nano combined scolders occurred.
But composite solder is not widely used.Main cause be exactly between reinforcing particle and the matrix at calorifics, electricity, the mismatch of terms of mechanics causes solder joint failure or performance to descend very easily easily in application process.Typical example is the mismatch of thermal coefficient of expansion between reinforcing particle and matrix and the mismatch of hardness, easily cracks at the solder joint join domain in the equipment use easily, finally causes the hot machine fatigue failure of solder joint.
Summary of the invention
The objective of the invention is a kind of nano-TiO for electronic devices and components welding and surface encapsulation
2The lead-free solder of particle strengthening.Characteristics of the present invention are with nano-TiO
2Particle adds tin-base lead-free solder.
The objective of the invention is to be achieved through the following technical solutions.
A kind of nano-TiO
2The lead-free solder of particle strengthening is characterized in that: be that matrix adds nano particle with the micron lead-free solder, wherein a micron lead-free solder is Sn-Ag; Sn-Ag-Cu; Sn-Cu; A kind of in the Sn-Co-Cu lead-free solder, nano particle is TiO
2, nanometer powder size ￡ 100nm, the quality percentage composition of compound lead-free solder is:
Micron lead-free solder 98～99.5%,
Nano particle 0.5～2%.
Described nano particle is of a size of 1～50nm, and the content of nanometer powder is 0.5～2%.
Principle of the present invention is: add after the nanometer powder, played the effect of dispersion-strengtherning, solder performance improves.
Description of drawings
The solder joint angle of wetting of Fig. 1 scolder of the present invention (Sample O, A, B, C, the nano-TiO of D
2Content is respectively 0%, 0.5%, and 1.0%, 1.5%, 2.0%)
Shear strength value (Sample O, A, B, C, the nano-TiO of D after the shear strength value of Fig. 2 scolder of the present invention and 500 cold cycling
2Content is respectively 0%, 0.5%, and 1.0%, 1.5%, 2.0%).
The specific embodiment
Describe the present invention below in conjunction with embodiment.
1. scolder preparation
The nano-TiO of present embodiment
2The lead-free solder of particle strengthening is by eutectic micron lead-free solder Sn – Ag – Cu and nano particle TiO
2Form, nanoparticle size ￡ 100nm, gross weight is 25g, its composition is counted with weight fraction:
98 parts of micron lead-free solders
2 parts of nano particles
A. the nano particle that will be stored in the vasoliniment separates, and selects chloroform for separating solvent.
B. the nano particle after will separating mixes with the micron lead-free solder.
2. the detection of scolder
C. with the solder wire reticulated printing for preparing, reflux at 180 ℃ then, return time is 6min, forms good solder joint.
D. as shown in Figure 1, nano particle TiO
2The angle of wetting of solder joint that compound lead-free solder forms is lower than micron angle of wetting of lead-free solder Sn – Ag – Cu; As shown in Figure 2, nano particle TiO
2The shear strength of solder joint that compound lead-free solder forms all is higher than micron cutting performance of lead-free solder Sn – Ag – Cu, and the shear strength of all samples all descends to some extent after 500 thermal cycles
The nano particle TiO of present embodiment
2Strengthen compound lead-free solder, by eutectic micron lead-free solder Sn – Ag – Cu and nano particle TiO
2Form, nanoparticle size ￡ 100nm, gross weight is 25g, its composition is counted with weight fraction:
99 parts of micron lead-free solders
1 part of nano particle
Mix more than inciting somebody to action, carry out serigraphy then, reflux at 180 ℃, return time is 6min, forms good solder joint.Performance improves, as shown in Figure 1, 2.
Claims (1)
1. nano-TiO
2The compound lead-free solder of particle strengthening is characterized in that a micron lead-free solder belongs to tin based lead, and nano particle is TiO
2, the composition of this scolder is by percentage to the quality:
Micron lead-free solder 98～99.5%
Nano particle 0.5～2%
Wherein the micron lead-free solder is any in Sn-Ag, Sn-Ag-Cu, Sn-Bi, Sn-Zn, Sn-Co-Cu, the Sn-Cu lead-free solder, and nanometer powder is TiO
2, nanometer powder is of a size of 1 ~ 50nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101189783A CN103203563A (en) | 2013-04-08 | 2013-04-08 | Strengthened composite lead-free solder containing nanometer TiO2 particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101189783A CN103203563A (en) | 2013-04-08 | 2013-04-08 | Strengthened composite lead-free solder containing nanometer TiO2 particles |
Publications (1)
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| CN103203563A true CN103203563A (en) | 2013-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101189783A Pending CN103203563A (en) | 2013-04-08 | 2013-04-08 | Strengthened composite lead-free solder containing nanometer TiO2 particles |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105431253A (en) * | 2014-06-24 | 2016-03-23 | 播磨化成株式会社 | Solder alloy, solder composition, solder paste and electronic circuit board |
| CN105935845A (en) * | 2016-06-08 | 2016-09-14 | 上海无线电设备研究所 | Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof |
| CN106610355A (en) * | 2015-10-22 | 2017-05-03 | 中国科学院力学研究所 | Heat engine fatigue test method and device |
| CN106624432A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point tin bismuth solder alloy |
| CN110303270A (en) * | 2019-07-30 | 2019-10-08 | 广东省焊接技术研究所（广东省中乌研究院） | Lead-free brazing, preparation method, its application, solder profile and electronic component |
| CN110461535A (en) * | 2017-02-01 | 2019-11-15 | Hrl实验室有限责任公司 | Nanocomposites welding filling material and its production method |
| CN116174993A (en) * | 2023-02-24 | 2023-05-30 | 东莞市千岛金属锡品有限公司 | Nanometer titanium dioxide doped Sn-Ag-Cu-X quaternary solder and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0919793A (en) * | 1995-06-30 | 1997-01-21 | Samsung Electro Mech Co Ltd | Lead-free solder with excellent soldering property |
| CN1389326A (en) * | 2002-07-24 | 2003-01-08 | 北京工业大学 | Nano particle reinforced Sn-Pb based composite brazing alloy and its prepn. |
| CN101362259A (en) * | 2008-09-24 | 2009-02-11 | 上海大学 | Nano leadless soldering paste |
| CN101367158A (en) * | 2008-09-24 | 2009-02-18 | 上海大学 | Binary leadless soldering plaster |
| CN101934443A (en) * | 2010-09-17 | 2011-01-05 | 江西恒大高新技术股份有限公司 | Self-protective flux-cored soldering wire for surfacing of abrasion-resistant plate |
-
2013
- 2013-04-08 CN CN2013101189783A patent/CN103203563A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0919793A (en) * | 1995-06-30 | 1997-01-21 | Samsung Electro Mech Co Ltd | Lead-free solder with excellent soldering property |
| CN1389326A (en) * | 2002-07-24 | 2003-01-08 | 北京工业大学 | Nano particle reinforced Sn-Pb based composite brazing alloy and its prepn. |
| CN101362259A (en) * | 2008-09-24 | 2009-02-11 | 上海大学 | Nano leadless soldering paste |
| CN101367158A (en) * | 2008-09-24 | 2009-02-18 | 上海大学 | Binary leadless soldering plaster |
| CN101934443A (en) * | 2010-09-17 | 2011-01-05 | 江西恒大高新技术股份有限公司 | Self-protective flux-cored soldering wire for surfacing of abrasion-resistant plate |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105431253A (en) * | 2014-06-24 | 2016-03-23 | 播磨化成株式会社 | Solder alloy, solder composition, solder paste and electronic circuit board |
| CN106610355A (en) * | 2015-10-22 | 2017-05-03 | 中国科学院力学研究所 | Heat engine fatigue test method and device |
| CN105935845A (en) * | 2016-06-08 | 2016-09-14 | 上海无线电设备研究所 | Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof |
| CN105935845B (en) * | 2016-06-08 | 2018-06-19 | 上海无线电设备研究所 | A kind of bismuth telluride reinforced by nanoparticles tin-silver-copper solder and its application method |
| CN106624432A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point tin bismuth solder alloy |
| CN110461535A (en) * | 2017-02-01 | 2019-11-15 | Hrl实验室有限责任公司 | Nanocomposites welding filling material and its production method |
| CN110303270A (en) * | 2019-07-30 | 2019-10-08 | 广东省焊接技术研究所（广东省中乌研究院） | Lead-free brazing, preparation method, its application, solder profile and electronic component |
| CN116174993A (en) * | 2023-02-24 | 2023-05-30 | 东莞市千岛金属锡品有限公司 | Nanometer titanium dioxide doped Sn-Ag-Cu-X quaternary solder and preparation method thereof |
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Application publication date: 20130717 |