CN103200775B - For the preparation method of the ceramic base printed circuit board that LED installs - Google Patents
For the preparation method of the ceramic base printed circuit board that LED installs Download PDFInfo
- Publication number
- CN103200775B CN103200775B CN201310096508.1A CN201310096508A CN103200775B CN 103200775 B CN103200775 B CN 103200775B CN 201310096508 A CN201310096508 A CN 201310096508A CN 103200775 B CN103200775 B CN 103200775B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- ceramic substrate
- printed circuit
- base printed
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides a kind of preparation method of ceramic base printed circuit board installed for LED, it comprises the following steps: S1, provide ceramic substrate, be formed with the organic material circuit board of the first through hole and be formed with the adhesive layer of the second through hole; S2, by superimposed successively to ceramic substrate, adhesive layer and organic material circuit board, ensure the first through hole and the second through hole one_to_one corresponding in lamination process, form the blind slot being used for LED and installing, the bottom surface of this blind slot is the surface of described ceramic substrate; S3, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, during hot pressing, be placed with the cushioned material layer of resistance to hot pressing temperature in ceramic substrate side.It is cracked that the cushioned material layer of placing resistance to hot pressing temperature during hot pressing of the present invention in ceramic substrate side can suppress ceramic substrate to occur because local pressure is uneven, improves the product quality of ceramic base printed circuit board.
Description
Technical field
The present invention relates to LED applied technical field, be specifically related to a kind of preparation method of the ceramic base printed circuit board for LED installation.
Background technology
In recent years, LED light source, due to the remarkable advantage that its life-span is long, light efficiency is high, radiation is low with low in energy consumption, is widely applied in various fields.
Along with in recent years to the requirement of LED light device miniaturization, the size of the printed circuit board (PCB) installed for LED pursues miniaturization.The miniaturization of LED light device is had higher requirement to the heat radiation of the printed circuit board (PCB) installed for LED and electric property simultaneously.For this reason, propose the technical scheme adopting ceramic base printed circuit board as LED installation base plate, wherein, ceramic base printed circuit board comprises ceramic substrate, organic material circuit board, and the adhesive layer for ceramic substrate and organic material circuit board being bonded as one.
When preparing above-mentioned ceramic base printed circuit board, for making adhesive layer and ceramic substrate and organic material circuit board bond, need sequentially superimposed good ceramic substrate, adhesive layer and organic material circuit board carry out hot pressing.But ceramic substrate is very easy to cracked when hot pressing, cause that the preparation efficiency of ceramic base printed circuit board is low, poor product quality.
Summary of the invention
In view of this, be necessary the problem mentioned for background technology, the preparation method of high-quality ceramic base printed circuit board while of providing a kind of preparation efficiency higher, can be obtained.
The object of the invention is to be achieved through the following technical solutions:
For a preparation method for the ceramic base printed circuit board that LED installs, it comprises the following steps:
S1, ceramic substrate is provided, is formed with the organic material circuit board of the first through hole and is formed with the adhesive layer of the second through hole;
S2, by superimposed successively to ceramic substrate, adhesive layer and organic material circuit board, ensure the first through hole and the second through hole one_to_one corresponding in lamination process, form the blind slot being used for LED and installing, the bottom surface of this blind slot is the surface of described ceramic substrate;
S3, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, during hot pressing, be placed with the cushioned material layer of resistance to hot pressing temperature in ceramic substrate side.
Preferably, the preparation method of the described ceramic base printed circuit board for LED installation also comprises:
S4, to offer on described ceramic base printed circuit board for hard-wired installation through hole.
Concrete, described cushioned material layer is silicagel pad.
Preferably, in described S3, hot pressing pressure controls at 8-10kg/cm
2in scope.
Preferably, in described S3, described press equipment is laminating machine or fast press.
Preferably, described ceramic substrate to have the reflecting rate of more than 88% to visible ray for the surface of installing LED.
Preferred, described ceramic substrate to have the reflecting rate of more than 90% for the surface of installing LED to visible ray.
Concrete, described organic material circuit board is individual layer, bilayer or multilayer board.
Compared with prior art, the present invention possesses following advantage:
It is cracked that the cushioned material layer of placing resistance to hot pressing temperature during hot pressing of the present invention in ceramic substrate side can suppress ceramic substrate to occur because local pressure is uneven, improves the product quality of ceramic base printed circuit board.Can solve by optimizing pressing parameter the problem that in bonding processes, ceramic wafer is cracked, improving the product quality of ceramic base printed circuit board further; Adopt traditional laminating machine or fast press not only to substantially increase the production efficiency of ceramic base printed circuit board, and reduce the production cost of ceramic base printed circuit board.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the ceramic base printed circuit board adopting the method for the embodiment of the present invention to make;
Fig. 2 is the cross-sectional view of the ceramic base printed circuit board adopting the method for the embodiment of the present invention to make;
Fig. 3 is the cross-sectional view of ceramic substrate in the S1 of the embodiment of the present invention, organic material circuit board and adhesive layer.
Fig. 4 is in the S2 of the embodiment of the present invention, the cross-sectional view that ceramic substrate, adhesive layer and organic material circuit board are superimposed successively;
Fig. 5 is that in the S3 of the embodiment of the present invention, superimposed good ceramic substrate, adhesive layer, organic material circuit board and the cushioned material layer that is positioned over ceramic substrate side put into the cross-sectional view that press equipment carries out hot pressing.
Embodiment
As shown in Figures 1 and 2, the ceramic base printed circuit board for LED installation of the present embodiment comprises: the ceramic substrate 1 be combined as a whole by adhesive layer 2 and organic material circuit board 3, described organic material circuit board 3 is formed with some first through holes 31, described adhesive layer 2 is formed with some second through holes 21, the shape of described first through hole 31 and the second through hole 21 and size one_to_one corresponding respectively, described ceramic substrate 1 is exposed by the first through hole 31 and the second through hole 21, thus on ceramic base printed circuit board described in the present embodiment, form some blind slots 4 for installing LED.Described LED can be arranged on the surface of the described ceramic substrate 1 bottom as described blind slot 4, and the heat that LED is produced can conduct to described ceramic substrate 1 in time and realize heat radiation.
As shown in Figure 1, ceramic base printed circuit board is rectangle, and its a pair across corner is offered one respectively and installed through hole 5, for passing for secure components such as screws thus being fixed by this ceramic base printed circuit board.In fact, the correct position of the ceramic base printed circuit board of the present invention all can be offered at least one and install through hole, and described ceramic base printed circuit board can be fixed installation by the cooperation of the secure components such as screw and described installation through hole.Certainly, ceramic base printed circuit board also can be other shapes such as circle, hexagon.
Described ceramic substrate 1 can be the ceramic substrate that aluminium oxide ceramic substrate, aluminum nitride ceramic substrate etc. have excellent thermal conductivity and reflectivity.And described ceramic substrate 1 to have the reflecting rate of more than 88% for the surface of installing LED to visible ray, preferably there is the reflecting rate of more than 90%, make the ceramic base printed circuit board of the present embodiment have excellent reflective function thus, thus the light that the LED be mounted thereon is launched can be fully utilized.Described adhesive layer 2 is epoxy glue layer in the present embodiment, it is easily understood that this adhesive layer 2 also can be the adhesive material that organic material circuit board and ceramic substrate combine can be prepared from by any other.Described organic material circuit board 3 is single layer board, comprises organic material substrate 32, is formed in the layers of copper circuit 33 of this organic material substrate 32 outer surface and covers the outer surface of described organic material substrate 32 and the solder mask 34 of corresponding layers of copper circuit 33.Wherein, described organic material substrate 32 is prepared from by the organic material of such as FR4 or BT etc.Be understandable that, organic material circuit board can also be double-deck or multilayer circuit board.
The method preparing the above-mentioned ceramic base printed circuit board for LED installation comprises the following steps:
S1, as shown in Figure 3, provides ceramic substrate 1, is formed with the organic material circuit board 3 of the first through hole 31 and is formed with the adhesive layer 2 of the second through hole 21;
S2, as shown in Figure 4, by superimposed successively to ceramic substrate 1, adhesive layer 2 and organic material circuit board 3, the first through hole 31 and the second through hole 21 one_to_one corresponding is ensured in lamination process, form the blind slot 4 for installing LED, the bottom surface of blind slot 4 is the surface of ceramic substrate 1, and LED can be installed on the bottom surface of blind slot 4;
S3, as shown in Figure 5, superimposed good ceramic substrate 1, adhesive layer 2 and organic material circuit board 3 are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, wherein, be placed with the cushioned material layer 8 of resistance to hot pressing temperature during hot pressing in ceramic substrate 1 side, this cushioned material layer 8 can be silicagel pad.Described ceramic substrate 1 is easily chipping because local pressure is uneven when hot pressing, and cushioned material layer 8 has suitable elasticity, the uniformity of the pressure that ceramic substrate 1 bears when can improve hot pressing.Therefore, it is cracked that the cushioned material layer 8 of placing resistance to hot pressing temperature during hot pressing in ceramic substrate 1 side can suppress ceramic substrate to occur because local pressure is uneven, improves the product quality of ceramic base printed circuit board.
Preferably, for improving product quality and the pressing ceramic base printed circuit board expeditiously of ceramic base printed circuit board further, hot pressing pressure is controlled at 8-10kg/cm
2in scope.The reason of choosing of this scope is: when pressure is less than 8kg/cm
2, described adhesive layer 2 can not be formed with ceramic substrate 1 and organic material circuit board 3 and firmly be combined; And when pressure is greater than 10kg/cm
2time, ceramic substrate 1 is excessive and easily produce cracked because bearing pressure.
Described press equipment can select traditional laminating machine or fast press, and the temperature and time of hot pressing is substantially suitable with the time with hot pressing temperature when preparing organic material circuit board.
Due to the ceramic base printed circuit board made being provided with, through hole 5 is installed, therefore the preparation method of ceramic base printed circuit board is also included in step ceramic base printed circuit board offered and installs through hole 5, and this step is preferably carried out after ceramic base printed circuit board hot pressing.
Claims (7)
1., for a preparation method for the ceramic base printed circuit board of LED installation, it is characterized in that: comprise the following steps:
S1, ceramic substrate is provided, is formed with the organic material circuit board of the first through hole and is formed with the adhesive layer of the second through hole;
S2, by superimposed successively to ceramic substrate, adhesive layer and organic material circuit board, ensure the first through hole and the second through hole one_to_one corresponding in lamination process, form the blind slot being used for LED and installing, the bottom surface of this blind slot is the surface of described ceramic substrate;
S3, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out hot pressing and obtain ceramic base printed circuit board, during hot pressing, be placed with the cushioned material layer of resistance to hot pressing temperature in ceramic substrate side;
Described ceramic substrate to have the reflecting rate of more than 88% for the surface of installing LED to visible ray;
Described ceramic substrate is aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
2. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: described cushioned material layer is silicagel pad.
3. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: in described S3, hot pressing pressure controls at 8-10kg/cm
2in scope.
4. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: in described S3, and described press equipment is laminating machine or fast press.
5. the preparation method of ceramic base printed circuit board installed for LED according to claim 1, is characterized in that: described ceramic substrate to have the reflecting rate of more than 90% for the surface of installing LED to visible ray.
6. the preparation method of the ceramic base printed circuit board for LED installation according to any one of claim 1 to 5, is characterized in that: described organic material circuit board is individual layer, bilayer or multilayer board
7. the preparation method of the ceramic base printed circuit board for LED installation according to any one of claim 1 to 5, is characterized in that: also comprise:
S4, to offer on described ceramic base printed circuit board for hard-wired installation through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096508.1A CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096508.1A CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103200775A CN103200775A (en) | 2013-07-10 |
| CN103200775B true CN103200775B (en) | 2016-03-23 |
Family
ID=48723080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310096508.1A Active CN103200775B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103200775B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10014450B1 (en) * | 2017-02-09 | 2018-07-03 | Asm Technology Singapore Pte Ltd | Method for manufacturing a light emitting diode device and the light emitting diode device so manufactured |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic element component having compound material base |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
-
2013
- 2013-03-25 CN CN201310096508.1A patent/CN103200775B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic element component having compound material base |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| CN102074518A (en) * | 2009-11-11 | 2011-05-25 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and conductive trace |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103200775A (en) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1890340B1 (en) | Method for producing a porcelain enameled substrate for light-emitting device mounting. | |
| CN103722807A (en) | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof | |
| CN101841974A (en) | High-thermal conductivity circuit board and method for producing same by using electroplating method | |
| CN101841975A (en) | Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board | |
| CN108322993A (en) | A kind of the pcb board part and its processing method of thermoelectricity separation | |
| CN102098870A (en) | Composite printed circuit board (PCB) and manufacturing method thereof | |
| CN103200775B (en) | For the preparation method of the ceramic base printed circuit board that LED installs | |
| CN207744224U (en) | A kind of pcb board part of thermoelectricity separation | |
| US20040229391A1 (en) | LED lamp manufacturing process | |
| CN103152990B (en) | For the preparation method of the ceramic base printed circuit board that LED installs | |
| KR100797716B1 (en) | Light Emitting Diodes-Backlight Unit without printed circuit boards and Manufacturing method thereof | |
| CN105555033A (en) | Via hole method for LED (Light-Emitting Diode) aluminium substrate | |
| CN103152976B (en) | For the ceramic base printed circuit board that LED installs | |
| CN104470215B (en) | The preparation method and products obtained therefrom of printed circuit board (PCB) with micro- radiator | |
| KR20130128897A (en) | Method for manufacturing metal copper clad lamination | |
| JP2014103354A (en) | Circuit board, led module, and manufacturing method for circuit board | |
| CN102856466A (en) | LED radiating substrate | |
| CN214688314U (en) | High-heat-dissipation low-dielectric-constant copper-clad plate | |
| CN201758491U (en) | High heat-conducting circuit board manufactured by oil printing method | |
| CN203151859U (en) | A ceramic-based printed circuit board used for installing LEDs | |
| CN204054782U (en) | Double face copper | |
| CN109451662A (en) | A kind of composite aluminum base LED printed circuit board preparation process | |
| CN110557892A (en) | Manufacturing process of heat dissipation structure combining PCB and metal substrate | |
| CN105792534A (en) | Manufacturing method of unetched circuit board and unetched circuit board | |
| CN201475950U (en) | Heat dissipation substrate of LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |