CN103196593B - Resonance type micro-machinery pressure sensor and low-stress assembling method of resonance type micro-mechanical pressure sensor chip - Google Patents
Resonance type micro-machinery pressure sensor and low-stress assembling method of resonance type micro-mechanical pressure sensor chip Download PDFInfo
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- CN103196593B CN103196593B CN201310092955.XA CN201310092955A CN103196593B CN 103196593 B CN103196593 B CN 103196593B CN 201310092955 A CN201310092955 A CN 201310092955A CN 103196593 B CN103196593 B CN 103196593B
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Abstract
The invention discloses a resonance type micro-machinery pressure sensor and a low-stress assembling method of a resonance type micro-machinery pressure sensor chip. The resonance type micro-machinery pressure sensor comprises a tube socket, the resonance type micro-machinery pressure sensor chip, a fixed press strip and a tube cap, wherein a cavity which is used for placing the resonance type micro-machinery pressure sensor chip is formed in the middle of the tube socket, a plurality of tube needles which are used for being electrically connected with the resonance type micro-machinery pressure sensor chip are distributed on the edge of the tube socket, the resonance type micro-machinery pressure sensor chip comprises a differential detection resonance beam which is arranged along a diagonal line of the resonance type micro-machinery pressure sensor chip, and is used for pressure detection, the fixed press strip is crosswise arranged on the differential detection resonance beam of the resonance type micro-machinery pressure sensor chip, and is used for fixing the resonance type micro-machinery pressure sensor chip on the tube socket, the tube cap covers the tube socket, and the edge of the tube cap is fixedly connected with the edge of the tube socket. Flexible connecting assembly of the resonance type micro-machinery pressure sensor chip and a tube shell is achieved in a mechanical fixation mode, residual stress does not exist after assembly, and influence of mechanical stress and thermal stress caused by assembly of sensors are effectively reduced.
Description
Technical field
The present invention relates to micro mechanical pressure sensor field and sensor package/package technique field, particularly relate to the low stress assemble method of a kind of resonance type micromechanical pressure transducer and sensor chip.
Background technology
Microelectromechanical systems (Micro-Electro-Mechanical Systems is called for short MEMS) technology is based upon a kind of cutting edge technology on microelectric technique and micro mechanical technology basis.Adopt the sensor that processes of MEMS technology have volume little, lightweight, the technical advantage such as to can be mass, be subject to more and more studying concern.
Pressure transducer based on MEMS technology is mainly divided into pressure resistance type, condenser type and resonant mode three major types.Compare other two classes pressure transducers, resonance type pressure sensor has the outstanding advantages such as precision is high, good stability, is described as pressure transducer of new generation.
Resonance type micromechanical pressure transducer is a kind of high-precision pressure sensor, and it is based on mechanical resonant technology, realizes the sensor of pressure detection using resonant element (as resonance beam) as sensitive element.Resonance type pressure sensor principle of work is exactly the resonance frequency utilizing the change of pressure to change harmonic oscillator, carrys out indirect inspection pressure by the change of survey frequency.
Because resonance type pressure sensor has high sensitivity, it is very responsive to causing the factor of resonance beam STRESS VARIATION (as environment temperature, encapsulation stress, assembling stress etc.), and the Method and process such as the therefore encapsulation of resonance type pressure sensor chip on base, assembling become the principal element of restriction sensor combination property.Yokogawa company of Japan is that the silicon chip of chip several times realizes chip assembling by introducing thickness between sensor chip and base, Druck company of Britain adopts length to be that the long glass tube of sensor chip thickness several times welds with base and realizes chip and assemble, and application for a patent for invention (CN201010218423.2) realizes chip by cantilever beam structure and assembles.The assembling that these methods still need the techniques such as bonding or welding to realize between sensor chip and base, make to assemble rear sensor chip and still there is assembling unrelieved stress, and the change of the release of unrelieved stress and environment temperature all will cause the long-term output stability of sensor and temperature characterisitic.
The topmost technological deficiency existed in prior art: existing sensor chip assemble method or adopt long glass tube to weld with base or adopt thick silicon chip bonding or adopt cantilever beam structure to bond, these methods still cannot avoid the residual stress problems after sensor chip and base assembling.
The secondary technological deficiency existed in prior art: existing sensor chip assemble method technique is all comparatively complicated, and is subject to the impact of packaging technology, after chip assembling, sensor unrelieved stress may be inconsistent, causes the consistance of sensor performance to be deteriorated.
Summary of the invention
The object of this invention is to provide a kind of based on the silicon resonance type pressure transducer of MEMS technology and the low stress assemble method of chip thereof, improve the combination property of resonance type pressure sensor further.
The invention discloses a kind of resonance type pressure sensor, it comprises:
Base, have the cavity for placing sensor chip in the middle of it, its edge is distributed with many bobbins for being electrically connected with described sensor chip;
Sensor chip, it comprises the Differential Detection resonance beam of placing along this sensor chip diagonal line, for pressure detection;
Fixing press strip, it is horizontally placed in the Differential Detection resonance beam of described sensor chip, is fixed on described base for by described sensor chip;
Pipe cap, it is placed on described base, and its edge is fixedly connected with the edge of described base.
The invention also discloses a kind of low stress assemble method of resonance type pressure sensor chip, it comprises:
Step 1, on base, process the cavity matched with described sensor chip size, and described sensor chip is embedded in described cavity;
Step 2, by described sensor chip one jiao of fixing press strip contact, and by screw, described fixing press strip is fixed on described base, described sensor chip is fixed in the cavity of described base;
Step 3, by lead-in wire the bobbin that described base edge distributes is electrically connected with the electrode pad on described sensor chip edge;
Step 4, the pipe cap matched with described base to be covered on described base, and linked together by bonding or welding method.
The invention has the beneficial effects as follows: (1) resonance type pressure sensor chip is achieved and the assembling without Hard link of shell by the mode that machinery is fixing, without unrelieved stress after assembling, effectively reduce sensor and assemble the mechanical stress and thermal stress impact that cause; (2) compared with existing assembling mode, packaging technology only adopts the method for mechanical fasteners, and assembling process is simple, easy, efficient.
Accompanying drawing explanation
Fig. 1 is the structural representation of resonance type micromechanical pressure transducer in the present invention;
Fig. 2 is the section of structure of resonance type micromechanical pressure transducer in the present invention;
Fig. 3 is the structural representation of resonance type pressure sensor chip in the present invention;
Fig. 4 is the assemble method process flow diagram of resonance type micromechanical pressure sensor chip in the present invention;
Fig. 5 be according to the present invention propose assemble method and prior art assembling after resonance type pressure sensor temperature characteristics comparison diagram.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
The invention discloses the low stress assemble method of a kind of resonance type micromechanical pressure transducer and sensor chip.
Fig. 1 shows the structural representation of described resonance type micromechanical pressure transducer, and Fig. 2 shows the section of structure of described resonance type micromechanical pressure transducer.As illustrated in fig. 1 and 2, described resonance type pressure sensor comprises base 1, completes the sensor chip 2 of Vacuum Package or level Hermetic Package, fixes press strip 3 and pipe cap 4.
Preferably, described base 1 is the circular base of TO-18 type, is evenly distributed with the electrical connection of 18 bobbin 1c for sensor chip along base edge.The centre of base 1 has the square cavity 1a matched with described sensor chip 2, and the length of cavity and width dimensions are slightly larger than more than sensor chip 0.2mm, so that sensor chip is placed, but can not be excessive, in order to avoid any movement of sensor chip; Outside a jiao of square cavity, have screw hole 1b, fastening for fixing press strip 3, described cavity depth is greater than sensor chip more than thickness 0.1mm.Described base also can be the base of other shape, and the bobbin quantity on it also can be arranged as required, and the described cavity shape for placing sensor chip also can change according to the difference of the shape of sensor chip and size.
Fig. 3 shows the structural drawing of described resonance type pressure sensor chip.As shown in Figure 3, described resonance type pressure sensor chip 2 is the square shape sensor chip matched with the square cavity 1a on described base 1, its Differential Detection resonance beam composition placed along a diagonal line of sensor chip 2 primarily of two groups.Wherein, one group of differential resonance beam 2a is used for pressure detection, is placed in cornerwise one end for described sensor chip 2, and other one group of differential resonance beam 2b is used for for subsequent use, is placed in described cornerwise other end of described sensor chip 2; Each group of resonance beam is fixed and is connected to by anchor point 2d on sensor chip 2.The edge of described sensor chip 2 is also distributed with pad 2c, for the electrical connection of sensor chip 2 with bobbin 1c on base 1.
The cavity 1a place of described sensor chip 2 fixed placement on described base 1, described fixing press strip 3 is the soft rubber bar that two ends are installed with Screw 6 respectively, it is horizontal on the resonance beam 2b for subsequent use of described sensor chip 2, and is fixed on base 1 by sensor chip 2 by described Screw 6 and the mating reaction of screw hole 1b.
Pad 2c on described sensor chip is connected with the bobbin on base 1 by lead-in wire 7.
Described pipe cap 4 is the circular metal pipe cap matched with base 1 size, and it covers on described base 1, and the edge of its edge and described base 1 by glued joint or solder technology fixedly connected.
Described pipe cap 4 outside surface is also bonded with magnet 5, for the electric magnetization of sensor chip.
Wherein, described base 1 is made by kovar alloy material or with the material of silicon materials expansion coefficient similar; Described fixing press strip 3 is made for polytetrafluoro, organic glass or other insulating material; Described sensor chip 2 has one group of differential resonance beam at least for detecting; Described sensor chip, can when encapsulating without magnet if do not needed electric magnetization.
The invention also discloses a kind of assemble method of resonance type micromechanical pressure sensor chip.
Fig. 4 shows the assemble method of the pressure sensor chip of resonance type micromechanical described in the present invention, and it comprises the following steps:
Step 1), on metal base 1, process the square cavity 1a matched with sensor chip 2 size, and process screw hole 1b outside described square cavity 1a mono-jiao; Preferably, this cavity 1a degree of depth is greater than sensor chip more than thickness 0.1mm;
Step 2), be embedded into sensor chip 2 in described metal base 1 square cavity 1a, the height of the sensor chip 2 after described placement is lower than the upper surface of described metal base 1, and the resonance beam 2b for subsequent use of sensor chip 2 is positioned at the side that described metal base 1 has screw hole 1b;
Step 3), the fixing press strip 3 that two ends is installed with Screw contacts in sensor chip one corner gently, described fixing press strip is made to be horizontally placed on the resonance beam 2b for subsequent use of sensor chip 2, and described fixing press strip 3 is tightened on metal base 1, described sensor chip 2 is fixed in the cavity 1a of described metal base 1 by the interaction of the screw hole 1b on Screw and described metal base 1;
Step 4), by Wire Bonding Technology by equally distributed bobbin 1a lead-in wire 7 compact siro spinning technology on electrode pad 2c that sensor chip 2 edge distributes and metal base 1 edge;
Step 5), magnet 5 is bonded on metal pipe cap 4, then described metal pipe cap 4 is tightly covered on metal base 1, and by bonding or welding method link together.
Above-mentioned resonance type pressure sensor chip low stress assemble method disclosed by the invention, its ultimate principle is, is fixed in special base by sensor chip by the method for machinery, realizes sensor chip and base without hardwired assembling.Owing to not adopting the Hard link such as glue or welding method, though sensor chip is fixed on base ad-hoc location, but it and base do not become to be integrated by Hard link, therefore there is not chip Hard link and assemble the unrelieved stress caused, just avoid mechanical stress and the thermal stress of sensor chip yet.
By the above-mentioned assemble method that the present invention proposes, effectively can reduce the temperature drift of sensor chip, there is the advantages such as package assembly is simple, cost is low, good stability, be applicable to the low stress assembling of sensor.
Fig. 5 shows for same resonance type pressure sensor chip, adopts the sensor temperature performance curve comparison diagram that the above-mentioned assemble method that in prior art, semi-girder assemble method and the present invention propose records respectively.Very clearly can find out by figure, adopt the inventive method to carry out the assembling of resonance type pressure sensor chip, the temperature coefficient of sensor can be significantly reduced, improve device synthesis performance.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a resonance type pressure sensor, it comprises:
Base, have the cavity for placing sensor chip in the middle of it, its edge is distributed with many bobbins for being electrically connected with described sensor chip;
Sensor chip, it comprises the two groups of differential resonance beams placed along this sensor chip diagonal line, one group of differential resonance beam is used for pressure detection, be placed in cornerwise one end for described sensor chip, another group differential resonance beam is resonance beam for subsequent use, be placed in described cornerwise other end of described sensor chip, each group differential resonance beam is fixedly connected on sensor chip by anchor point; Described sensor chip fixed placement is in the cavity of described base;
Fixing press strip, it is the soft rubber bar that two ends are installed with screw respectively, it is horizontally placed in the resonance beam for subsequent use of described sensor chip, has screw hole outside described cavity, and described sensor chip is fixed on described base by the mating reaction of described screw and screw hole by described fixing press strip;
Pipe cap, it is placed on described base, and its edge is fixedly connected with the edge of described base.
2. resonance type pressure sensor as claimed in claim 1, it is characterized in that, described fixing press strip is made up of polytetrafluoro, organic glass or other insulating material.
3. resonance type pressure sensor as claimed in claim 1, it is characterized in that, described base is made by kovar alloy material or with the material of silicon materials expansion coefficient similar.
4. resonance type pressure sensor as claimed in claim 1, is characterized in that, described sensor chip edge is distributed with pad, and it is electrically connected with described bobbin by lead-in wire.
5. resonance type pressure sensor as claimed in claim 1, it is characterized in that, described resonance type pressure sensor also comprises the magnet be placed on pipe cap, and it is for sensor chip described in electric magnetization.
6. resonance type pressure sensor as claimed in claim 1, it is characterized in that, shape and the described cavity of described sensor chip match, and described cavity size is greater than the size of described sensor chip, and its degree of depth is greater than the thickness of described sensor chip.
7. a low stress assemble method for resonance type pressure sensor chip as claimed in claim 1, it comprises:
Step 1, on base, process the cavity matched with described sensor chip size, and described sensor chip is embedded in described cavity;
Step 2, by described sensor chip one jiao of fixing press strip contact, and by screw, described fixing press strip is fixed on described base, described sensor chip is fixed in the cavity of described base;
Step 3, by lead-in wire the bobbin that described base edge distributes is electrically connected with the electrode pad on described sensor chip edge;
Step 4, the pipe cap matched with described base to be covered on described base, and linked together by bonding or welding method.
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| CN201310092955.XA CN103196593B (en) | 2013-03-22 | 2013-03-22 | Resonance type micro-machinery pressure sensor and low-stress assembling method of resonance type micro-mechanical pressure sensor chip |
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| EP3290882A4 (en) * | 2015-06-02 | 2019-03-06 | Dongguan Tranesen Optoelectronics Co., Ltd | Pyroelectric sensor |
| CN109738093B (en) * | 2019-01-31 | 2020-02-14 | 清华大学 | On-chip resonant beam structure for detecting stress of micro-electromechanical device and detection method |
| CN111633589A (en) * | 2020-06-16 | 2020-09-08 | 南京沃天科技有限公司 | Sensor chip centre gripping fixed knot constructs |
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| CA2496777A1 (en) * | 2002-08-29 | 2004-05-06 | Bioscale, Inc. | Resonant sensor and sensing system |
| KR100688769B1 (en) * | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | Embedded chip print circuit board and method for fabricating the same by means of plating |
| CN102374909A (en) * | 2010-08-11 | 2012-03-14 | 中国科学院电子学研究所 | Micromachine-based electromagnetic excitation resonant pressure sensor |
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Effective date of registration: 20210319 Address after: Room 1818, 18 / F, building 3, future venture Plaza, north section of Gangxing Third Road, Jinan Comprehensive Bonded Zone, Jinan free trade Experimental Zone, Shandong Province Patentee after: Shandong zhongkesier Technology Co.,Ltd. Address before: 100190 No. 19 West North Fourth Ring Road, Haidian District, Beijing Patentee before: Aerospace Information Research Institute,Chinese Academy of Sciences Effective date of registration: 20210319 Address after: 100190 No. 19 West North Fourth Ring Road, Haidian District, Beijing Patentee after: Aerospace Information Research Institute,Chinese Academy of Sciences Address before: 100190 No. 19 West North Fourth Ring Road, Haidian District, Beijing Patentee before: Institute of Electronics, Chinese Academy of Sciences |
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