CN103188890A - Manufacturing method for printed circuit board (PCB) and PCB - Google Patents
Manufacturing method for printed circuit board (PCB) and PCB Download PDFInfo
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- CN103188890A CN103188890A CN2011104560899A CN201110456089A CN103188890A CN 103188890 A CN103188890 A CN 103188890A CN 2011104560899 A CN2011104560899 A CN 2011104560899A CN 201110456089 A CN201110456089 A CN 201110456089A CN 103188890 A CN103188890 A CN 103188890A
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Abstract
The invention discloses a manufacturing method for a printed circuit board (PCB) and the PCB. The method is used for manufacturing the PCB comprising a local mixed-pressing daughter plate and a heat dissipation copper block. The method comprises the steps that a first window is formed in first core plates and first resin plates, wherein the first core plates and the first resin plates form a lamination, and the shape and the size of the first window are matched with the shape and the size of the heat dissipation copper block; a second window is formed in second core plates and second resin plates between the second core plates and the lamination, wherein the daughter plate is to be inserted into the second core plates, the shape and the size of the second window are matched with the shape and the size of the daughter plate; sol dissolving is conducted on the lamination, the second core plates and the second resin plates; the heat dissipation copper block is embedded into the first window in the lamination; third resin plates which are matched with the second window in shape and size are embedded into the second window of the second resin plates; and the daughter plate is embedded into the second window of the second core plates.
Description
Technical field
The present invention relates to the printed circuit board manufacture field, relate in particular to a kind of manufacture method and a kind of pcb board of pcb board.
Background technology
High frequency development along with electronic equipment, especially relate to the development of wireless network, satellite communication device, the development trend of voice, video and data normalization that information products move towards at a high speed to move towards with high frequencyization and communication products big, the fireballing wireless transmission of capacity is inevitable.The needed substrate of a new generation's communication products also needs to cooperate its development, and obviously traditional FR-4 material can not satisfy existing demand.In the traditional PCB manufacturing process if use high-frequency signal, all be that whole layer uses high frequency material to make in the design, if just local (most less than whole plate 1/3 zone) need to use the high frequency model, adopt local (most less than whole plate 1/3 zone) pressing high frequency material, can reduce the use amount of expensive high-frequency sheet material, reduce the PCB cost greatly.The electric energy that while consumes during operation owing to electronic component, as the useful work, major part changes into heat except partly.These heats rise the element internal temperature rapidly, if untimely heat is distributed, electronic component can be persistently overheating, causes property of fine qualities decline, severe patient even cause electronic component to lose efficacy because of overheated.Therefore for the big electronic component of caloric value, it is not enough relying on self distributing of heat merely, can adopt to bury the blind technology of burying of copper and solve the high power device heat dissipation problem.Local mixed pressure adds the blind technology of burying of copper billet can effectively solve high-frequency signal transmission, high power device heat dissipation problem.Namely satisfy the requirement of the electric property of product, also reach the saving cost simultaneously.In order to realize that local mixed pressure adds the blind technology of burying of copper billet, usual way has following two kinds in the prior art:
Method one: Mas Lam process for pressing.It namely is the method for lamination behind the first colloidal sol.Colloidal sol: L1/2 central layer-resin plate-L3/4 central layer-resin plate-L5/6 central layer-resin plate-L7/8 central layer-resin plate-L9/10 central layer-resin plate-L11/12 central layer.Lamination: copper billet-release film-aluminium flake-steel plate-high frequency daughter board-release film-aluminium flake-steel plate overturns-buries for the plate that colloidal sol is good-bury.
Method two: Pin Lam process for pressing.It is the method for direct lamination.When the pressing working procedure lamination, lamination in the following order: (adding the blind buried plate of copper billet with 12 layers of (12L) local mixed pressure is example) steel plate-aluminium flake-release film L12/11 central layer-high frequency daughter board-resin plate-L10/9 central layer-resin plate-L8/7 central layer-resin plate-L6/5 central layer-resin plate-L4/3 central layer-resin plate-L2/1 central layer-bury copper billet-release film-aluminium flake.
The inventor finds that prior art has following shortcoming at least in realizing process of the present invention:
Method one: not only need after the first colloidal sol lamination again, and need to carry out turnover panel in the lamination process, production efficiency is low, and the manual labor amount is big, the product quality instability.
Method two: this kind method need not first colloidal sol, and reason is to have Pin Lam equipment to carry out the Pin location, but Pin Lam equipment investment is big, and efficient is low, the cost height.
Summary of the invention
Add the blind buried plate of the copper billet lamination that in the lamination process, overturns and cause that the lamination workload is big, lamination efficient is low, manufacturing schedule is slow, the problem of product quality difference in order to solve local mixed pressure, the invention provides a kind of manufacture method and a kind of pcb board of pcb board.
One aspect of the present invention provides a kind of manufacture method of pcb board, be used for making the pcb board that comprises local mixed pressure daughter board and heat radiation copper billet, described method comprises: first central layer and first resin plate that form lamination are opened first window, and shape and the size of the shape of described first window and size and described heat radiation copper billet are suitable; Second central layer that will embed described daughter board, and described second central layer and described lamination between second resin plate open second window, shape and the size of the shape of described second window and size and described daughter board are suitable; Described lamination, described second central layer and described second resin plate are carried out colloidal sol; Described heat radiation copper billet is imbedded in first window in the described lamination; With shape and size and described second window suitable the 3rd resin plate imbed in described second window of described second resin plate; And described daughter board is embedded in described second window of described second central layer.
Preferably, described daughter board is imbedded in described second window of described second central layer after, described method also comprises: open and the position of described heat radiation copper billet, the groove that shape and size adapt at described daughter board.
Preferably, the quantity of described heat radiation copper billet is a plurality of, and the quantity of described second window is corresponding consistent with the quantity of described heat radiation copper billet.
Preferably, the border of described first window all is no more than the border of described second window.
Preferably, the size of described first window is than the big 3～6mil of size of described heat radiation copper billet.
Preferably, the size of described second window is than the big 3～6mil of size of described daughter board.
The present invention provides a kind of pcb board on the other hand, comprising: lamination, and comprise at least two first central layers and be clipped in two first resin plates between described first central layer, and first window that runs through described at least two first central layers and described first resin plate; The heat radiation copper billet is embedded in described first window; Second central layer; Daughter board is embedded in second window in described second central layer, and is suitable with shape and the size of described second window; Second resin plate is between described lamination and described second central layer, on described second resin plate, the corresponding position of second window with described second central layer, second window with second resin plate in second window of described second resin plate, is dissolved with the 3rd resin plate; The shape of described the 3rd resin plate and size are corresponding to the shape and size of described second window.
Preferably, have on the described daughter board one with the position of described heat radiation copper billet, the fluting that shape and size adapt.
Preferably, the quantity of described heat radiation copper billet is a plurality of.
Preferably, suitable being specially of shape and size of described daughter board and described second window: the size of described second window is than the big 3～6mil of size of described daughter board.
Preferably, the size of described first window is than the big 3～6mil of size of described heat radiation copper billet.
Beneficial effect of the present invention is as follows:
The present invention compared with prior art adopts the resin plate windowing of the superiors is imbedded the method for lamination to copper billet by this window then, effectively solves the upset lamination and causes the lamination workload bigger, influences the problem of lamination efficient, manufacturing schedule.
Further, the process of the resin plate uplifting window mouth process of comparing the upset lamination will be easy to realize therein, thereby has effectively reduced the technological difficulties in the course of processing.
Description of drawings
Fig. 1 is the structural representation of one embodiment of the invention pcb board lamination;
Fig. 2 is the manufacture method flow chart of one embodiment of the invention pcb board;
Fig. 3 is the structural representation behind one embodiment of the invention pcb board colloidal sol;
Fig. 4 imbeds the structural representation of heat radiation behind the copper billet for one embodiment of the invention pcb board;
Fig. 5 imbeds structural representation behind the daughter board for one embodiment of the invention pcb board;
Fig. 6 is the vertical view of one embodiment of the invention pcb board.
Embodiment
One embodiment of the invention provides a kind of manufacture method of pcb board, be used for making the pcb board that comprises local mixed pressure daughter board and heat radiation copper billet, in the present embodiment, please refer to Fig. 1, pcb board is that example describes with 12 layers of blind buried plate of (being 12L) local mixed pressure copper billet, pcb board comprises lamination 20, and lamination 20 comprises that first sub-central layer 201, the first sub-central layers 201 comprise a layer insulating and two-sided copper wire L1, L2; The second sub-central layer 202 comprises a layer insulating and two-sided copper wire L3, L4; The 3rd sub-central layer 203 comprises a layer insulating and two-sided copper wire L5, L6; The 4th sub-central layer 204 comprises a layer insulating and two-sided copper wire L7, L8; The 5th sub-central layer 205 comprises a layer insulating and two-sided copper wire L9 and L10.
Next please refer to Fig. 2, Fig. 2 is the manufacture method flow chart of pcb board in the present embodiment.
As shown in Figure 2, this method comprises:
Step 101: first central layer and first resin plate that form lamination are opened first window, and shape and the size of the shape of first window and size and heat radiation copper billet are suitable;
Step 102: second central layer that will embed daughter board, and second central layer and lamination between second resin plate open second window, shape and the size of the shape of second window and size and daughter board are suitable;
Step 103: lamination, second central layer and second resin plate are carried out colloidal sol;
Step 104: the copper billet that will dispel the heat is imbedded in first window in the lamination;
Step 105: the 3rd resin plate that shape and size and second window is suitable is imbedded in second window of second resin plate; And
Step 106: daughter board is embedded in second window of second central layer.
For the manufacture method of clearer detailed explanation present embodiment, below will lift concrete example and further specify.
In step 101, as shown in Figure 2, the first sub-central layer 201 in the lamination 20, the second sub-central layer 202, the 3rd sub-central layer 203, the 4th sub-central layer 204, the 5th sub-central layer 205, and the first sub-resin plate 206, the second sub-resin plate 207, lumbang fat plate the 208, the 4th sub-resin plate 209 has and suitable first window 210 of heat radiation copper billet shape, size.Being convenient expression, in the present embodiment, is example to imbed a heat radiation copper billet in lamination 20, namely all has first window 210 corresponding with copper billet shape, size on the every straton central layer in lamination 20 and the every straton resin plate.
Next please refer to Fig. 3, step 102 is specially: continue to stack second resin plate 212 at lamination 20, stack second central layer 211 at second resin plate 212, and open shape and the size that second window 213, the second windows, 213 shapes and size adapt to the daughter board that will embed at second resin plate 212 and second central layer 211.In other embodiment, the quantity of second resin plate 212 also can be two even more, and its quantity and thickness requirement adapt.
Then, in step 103, lamination 20, second central layer 211 and second resin plate 212 are carried out colloidal sol, obtain structure as shown in Figure 3.
In step 104, the heat radiation copper billet is imbedded in first window 210 of lamination 20, please refer to Fig. 4, Fig. 4 is the structure chart of imbedding the pcb board of heat radiation behind the copper billet.Heat radiation copper billet 214 is embedded in first window 210.
In step 105, the 3rd resin plate 215 (seeing the part of overstriking among Fig. 5) that shape and size and second window 213 adapt is imbedded in second window 213 of second resin plate 212, further, in step 106, daughter board 216 is imbedded in second window 213 of second central layer 211, please refer to Fig. 5, wherein, daughter board 216 for example is the high frequency daughter board, in other embodiments, also can use the daughter board of other frequencies.
In another embodiment, after step 105 and step 106 are finished, then need the surface-coated mould release to whole pcb board, back to be dried forms release film.Will carry out back processing for the pcb board that forms release film and handle, reprocessing processing is included on second central layer 211 and covers aluminium flake and steel plate, and aluminium flake can prevent that gummosis is too much, can play the effect of gummosis buffering; And other the processing program that need carry out, for example outer figure, outer erosion etc., the present invention is not restricted this.
As shown in Figure 5, the position of heat radiation copper billet 214 is corresponding with the position of daughter board 216, second window 213 is used for embedding daughter board 216, and when imbedding lamination 20, copper billet 214 need pass through second window 213 because will dispel the heat, so in the present embodiment, the border of first window 210 all is no more than the border of second window 213.If in practice, need imbed the heat radiation copper billet 214 of lamination 20 for a plurality of, then the border of second window 213 need comprise the border of a plurality of first windows 210 corresponding with the copper billet 214 of dispelling the heat.
In above each embodiment, the size of first window 210 is more bigger than the size of heat radiation copper billet 214,3-6 Mill for example, and the size of second window 213 is more bigger than the size of daughter board 216, for example big 3-6 Mill.
In above each embodiment, daughter board 216 can a corresponding heat radiation copper billet 214, also can corresponding a plurality of heat radiation copper billets 214, and when heat radiation copper billet 214 when be a plurality of, the quantity of first window 210 is corresponding consistent with the quantity of the copper billet 214 that dispels the heat.For example, the position of the corresponding power tube of each copper billet in the heat radiation copper billet 214, when there was a plurality of power tube in daughter board 216, a plurality of heat radiation copper billets 214 can be a plurality of power tube heat radiations.
In order to allow heat radiation copper billet 214 directly touch power tube on the daughter board 216, better to dispel the heat, open position with the copper billet 214 that dispels the heat at daughter board 216, the groove that shape and size adapt, make heat radiation copper billet 214 can expose outside the daughter board 216, please refer to Fig. 6, among Fig. 6 with two the heat radiation copper billets 214 be that example describes, and be the vertical view of pcb board, outermost be second central layer 211, daughter board 216 is embedded in second central layer 211, has groove at daughter board 216, so heat radiation copper billet 214 can expose outside daughter board 216 by groove, can be directly be arranged on daughter board 216 on power tube contact, so can quick heat radiating.
Another embodiment of the present invention also provides a kind of pcb board, comprising: lamination, and comprise at least two first central layers and be clipped in first resin plate between two first central layers, and first window that runs through at least two first central layers and first resin plate; The heat radiation copper billet is embedded in first window; Second central layer; Daughter board is embedded in second window in second central layer, and is suitable with shape and the size of second window; Second resin plate between lamination and described second central layer, on second resin plate, with the corresponding position of second window of second central layer, has second window of second resin plate, in second window of second resin plate, is dissolved with the 3rd resin plate; The shape of the 3rd resin plate and size are corresponding to the shape and size of second window.
Further, have on the daughter board one with the position, the groove that shape and size adapt of heat radiation copper billet, and the quantity of heat radiation copper billet is a plurality of, so the quantity correspondence of the quantity of groove and heat radiation copper billet is consistent.
Further, pcb board also comprises aluminium flake, covers on second central layer.
Pcb board in the present embodiment can be made by the manufacture method among aforementioned the embodiment, and during the manufacture method in elaborating aforementioned each embodiment, the pcb board structure has been done in detail clearly and described, so those skilled in the art can clearly understand the structure of the pcb board in the present embodiment, aforementioned various variations all are applicable to the pcb board in the present embodiment.Succinct for specification do not repeat them here.
Above-mentioned method of in pcb board, burying copper billet and high frequency daughter board, resin plate is windowed in employing, then copper billet is imbedded the step of lamination by this window, effectively solve and effectively solve the upset lamination and cause the lamination workload bigger, influence the problem of lamination efficient, manufacturing schedule.
Further, the process of the resin plate uplifting window mouth process of comparing the upset lamination will be easy to realize therein, thereby has effectively reduced the technological difficulties in the course of processing.
In this specification, the present invention is described with reference to its certain embodiments, and still, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. the manufacture method of a pcb board is used for making the pcb board that comprises local mixed pressure daughter board and heat radiation copper billet, it is characterized in that described method comprises:
First central layer and first resin plate that form lamination are opened first window, and shape and the size of the shape of described first window and size and described heat radiation copper billet are suitable;
Second central layer that will embed described daughter board, and described second central layer and described lamination between second resin plate open second window, shape and the size of the shape of described second window and size and described daughter board are suitable;
Described lamination, described second central layer and described second resin plate are carried out colloidal sol;
Described heat radiation copper billet is imbedded in first window in the described lamination;
The 3rd resin plate that shape and size and described second window is suitable is imbedded in described second window of described second resin plate; And
Described daughter board is embedded in described second window of described second central layer.
2. the method for claim 1 is characterized in that, described daughter board is embedded in described second window of described second central layer after, described method also comprises: open and the position of described heat radiation copper billet, the groove that shape and size adapt at described daughter board.
3. the method for claim 1 is characterized in that, the border of described first window all is no more than the border of described second window.
4. the method for claim 1 is characterized in that, the size of described first window is than the big 3～6mil of size of described heat radiation copper billet.
5. as each described method of claim 1～4, it is characterized in that the size of described second window is than the big 3～6mil of size of described daughter board.
6. a pcb board is characterized in that, comprising:
Lamination comprises at least two first central layers and is clipped in two first resin plates between described first central layer, and first window that runs through described at least two first central layers and described first resin plate;
The heat radiation copper billet is embedded in described first window;
Second central layer;
Daughter board is embedded in second window in described second central layer, and is suitable with the shape and size of described second window;
Second resin plate is between described lamination and described second central layer, on described second resin plate, the corresponding position of second window with described second central layer, second window with second resin plate in second window of described second resin plate, is dissolved with the 3rd resin plate; The shape of described the 3rd resin plate and size are corresponding to the shape and size of described second window.
7. pcb board as claimed in claim 6 is characterized in that, has on the described daughter board and the position of described heat radiation copper billet, the fluting that shape and size adapt.
8. as claim 6 or 7 described pcb boards, it is characterized in that the quantity of described heat radiation copper billet is a plurality of.
9. as claim 6 or 7 described pcb boards, it is characterized in that suitable being specially of shape and size of described daughter board and described second window: the size of described second window is than the big 3～6mil of size of described daughter board.
10. as claim 6 or 7 described pcb boards, it is characterized in that the size of described first window is than the big 3～6mil of size of described heat radiation copper billet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110456089.9A CN103188890B (en) | 2011-12-30 | 2011-12-30 | A kind of manufacture method of pcb board and a kind of pcb board |
| US13/732,125 US9101084B2 (en) | 2011-12-30 | 2012-12-31 | Method of fabricating PCB board and PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110456089.9A CN103188890B (en) | 2011-12-30 | 2011-12-30 | A kind of manufacture method of pcb board and a kind of pcb board |
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| CN103188890A true CN103188890A (en) | 2013-07-03 |
| CN103188890B CN103188890B (en) | 2016-03-16 |
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| CN201110456089.9A Active CN103188890B (en) | 2011-12-30 | 2011-12-30 | A kind of manufacture method of pcb board and a kind of pcb board |
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| CN103987187A (en) * | 2014-05-19 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB inlaid with copper block and manufacturing method thereof |
| CN104780702A (en) * | 2015-04-21 | 2015-07-15 | 深圳市博敏电子有限公司 | High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof |
| CN107079582A (en) * | 2017-01-22 | 2017-08-18 | 乐健科技（珠海）有限公司 | Circuit substrate and its manufacture method, circuit board and its manufacture method |
| CN106098648B (en) * | 2016-07-07 | 2018-05-18 | 乐健科技（珠海）有限公司 | IGBT heat-radiating substrates and its manufacturing method, IGBT modules and its manufacturing method |
| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN111642112A (en) * | 2020-06-09 | 2020-09-08 | 江苏胜帆电子科技有限公司 | Composite LPC high-frequency high-speed double-sided copper foil substrate and preparation method thereof |
| CN112638032A (en) * | 2020-12-09 | 2021-04-09 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
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| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN108282969B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of PCB production method and PCB for realizing internal layer connection |
| CN108430174B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN111642112A (en) * | 2020-06-09 | 2020-09-08 | 江苏胜帆电子科技有限公司 | Composite LPC high-frequency high-speed double-sided copper foil substrate and preparation method thereof |
| CN112638032A (en) * | 2020-12-09 | 2021-04-09 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
| CN112638032B (en) * | 2020-12-09 | 2022-07-19 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
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| CN103188890B (en) | 2016-03-16 |
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