CN103157913A - Integrated circuit (IC) line welding machine - Google Patents
Integrated circuit (IC) line welding machine Download PDFInfo
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- CN103157913A CN103157913A CN2011104163362A CN201110416336A CN103157913A CN 103157913 A CN103157913 A CN 103157913A CN 2011104163362 A CN2011104163362 A CN 2011104163362A CN 201110416336 A CN201110416336 A CN 201110416336A CN 103157913 A CN103157913 A CN 103157913A
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- soldering tip
- weldment
- heating
- bonding machine
- circuit bonding
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Abstract
The invention relates to an integrated circuit (IC) line welding machine which comprises a support, a base arranged in the support, a weld part holding device fixed on the base, and a weld head arranged above the weld part holding device. The weld head is used for welding a weld part clamped on the weld part holding device. The weld head is fixed on a weld head heating device which further comprises a heating plate used for fixing the weld head and conducting heat for the weld head. A plurality of heating holes are formed in the heating plate and used for inserting external heater strips to heat the heating plate. Due to the fact that the weld head is fixed on the weld head heating device, the plurality of heating holes are formed in the weld head heating device and used for being inserted by the external heater strips to heat the weld head, and the inserted number of the heater strips in the heating hole can be freely selected, temperature of the weld head is adjusted according to heating conditions of different weld parts.
Description
Technical field
The present invention relates to a kind of IC circuit bonding machine.
Background technology
Be welded as by pass through the common technology of metal alloy connection metal parts under the effect of heat.In this case, metal alloy (also referred to as scolder (solder)) reaches the fusingization temperature, and this fusion temperature is lower than the fusion temperature of the metal parts that will connect.In the process of welding, the scolder of fusing flows between two metal parts.Under favourable condition, obtain the connecting portion of firm, tight, corrosion-resistant and conduction, heat conduction between scolder and metal.
March toward the epoch of mechanization production when the epoch after, for the welding procedure aspect, in order to improve welding output, to reduce weld interval, bonding machine is assented and is given birth to.Present bonding machine generally comprises support, is arranged at the interior base of support, is fixed in the weldment clamping device that is used for the clamping weldment on base and the soldering tip that is used for weldment, when using bonding machine, because its soldering tip is fixed on bonding machine, therefore, its temperature is certain, can't regulate in welding process, thereby can't satisfy welding under different welding temperature conditions, its versatility is not strong.
Summary of the invention
The object of the present invention is to provide and a kind ofly can carry out according to the heating condition of different weldments thermoregulator IC circuit bonding machine.
for realizing aforementioned purpose, the present invention adopts following technical scheme: a kind of IC circuit bonding machine, comprise support, be arranged at the base in support, the soldering tip that is fixed in the weldment clamping device on base and is positioned at weldment clamping device top, described soldering tip is used for weld clip and is held in weldment on described weldment clamping device, described soldering tip is fixed on the soldering tip heater, the heating plate that described soldering tip heater also comprises fixing soldering tip and carries out heat conduction for soldering tip, have several on described heating plate and be used for inserting the bottoming hole that the external heat bar heats heating plate.
As a further improvement on the present invention, be thermally conductive materials between described heating plate and soldering tip.
As a further improvement on the present invention, described heating plate comprises two heating sides that are oppositely arranged that offer bottoming hole, and connecting two the first side, the second side, the 3rd side and the 4th sides of heating the side, described the 4th side is the opposite face of described weldment clamping device.
As a further improvement on the present invention, described bottoming hole is for being communicated with two through holes that heat the side.
As a further improvement on the present invention, described soldering tip is bolted on heating plate.
As a further improvement on the present invention, described heater also comprises the heat-insulation layer that is coated on described the first side, the second side, the 3rd side and heating side periphery, and described being positioned on the heat-insulation layer that heats on the outer rim of side offers the intercommunicating pore that is connected with described bottoming hole.
As a further improvement on the present invention, described IC circuit bonding machine also comprises track-type facilities, and described soldering tip heater is fixed on track-type facilities and by described track-type facilities and carries out upper and lower displacement.
As a further improvement on the present invention, described track-type facilities comprises track base, along the movable plate that described guide rail moves up and down, and described soldering tip heater is fixed on described movable plate.
As a further improvement on the present invention, the other observation part that is provided with of described track-type facilities.
The present invention is by being fixed in soldering tip the soldering tip heater, and offer several and be used for insert the bottoming hole that the external heat bar heats soldering tip on the soldering tip heater, can freely select the quantity inserted due to the welding rod in its bottoming hole, thereby can according to the heating condition of different weldments, carry out adjustment to soldering tip.
Description of drawings
Fig. 1 is IC circuit bonding machine structural representation in the specific embodiment of the invention.
Fig. 2 is the constitutional diagram of weldment clamping device in Fig. 1, weldment clamping device, weldment and holder.
Fig. 3 is the schematic diagram of another angle of Fig. 2.
Fig. 4 is the constitutional diagram between weldment clamping device and holder in Fig. 1.
Fig. 5 is the constitutional diagram of Fig. 1 track arrangements, soldering tip heater.
Fig. 6 is soldering tip heater part schematic diagram.
Fig. 7 is the flow chart of IC cable fixing means in the specific embodiment of the invention.
The specific embodiment
See also Fig. 1, a kind of IC circuit bonding machine comprises support 1, be arranged at base 2 in support 1, be fixed in weldment clamping device 4 and weldment clamping device 8 on base 2, be positioned at weldment clamping device 4 tops soldering tip heater 3, drive the track-type facilities 5 that soldering tip heater 3 moves up and down and observe part 6.weldment clamping device 4 is used for clamping weldment 10, weldment clamping device 8 is used for compressing weldment 10, guarantee in welding process, weldment 10 can not eject or displacement above weldment clamping device 4, affect welding effect and weld interval, realize that welding is smooth, guarantee the purpose of welding quality, soldering tip heater 3 is held in weldment 10 on weldment clamping device 4 by its soldering tip that arranges above 31 weld clips, described observation part 6 is arranged on the inboard of support, it is weldment clamping device 4, the side of weldment clamping device 8 and track-type facilities 5, can observe the welding situation of weldment 10 by this observation part 6.
Below by the accompanying drawing in conjunction with each parts, each parts in IC circuit bonding machine are elaborated.
see also Fig. 2, 3, 4, described weldment clamping device 4 comprises clamping part 41, fixed part 42 and the cylinder 43 that is provided with motion bar 431, clamping part 41 comprises bottom surface 411, extended upward the clamping limb 412 that is used for clamping weldment 10 that forms by bottom surface 411, and by bottom surface 411, clamping limb 412 forms clamping chamber 413, weldment 10 is arranged in this clamping chamber 413, the bottom surface of weldment 10 is butted on the bottom surface 411 of clamping part 41, clamping limb 412 is fixed in clamping chamber 413 by four weldments 10 of naming a person for a particular job, offer the hole 414 of removing stage makeup and costume on the bottom surface 411 of described clamping part 41, motion bar 431 is arranged at this 414 belows, hole of removing stage makeup and costume, do by the motion promotion motion bar 431 of cylinder 43 and move up and down, can run through the described hole 414 of removing stage makeup and costume after moving on motion bar 431, thereby push up to the bottom surface of the weldment 10 of weldment 10, weldment 10 is ejected in clamping part 41, realize unloading weldment 10, realize automated production.And for when 31 pairs of weldments 10 of soldering tip weld, guarantee the radiating effect of weldment 10, also offer a radiating groove 415 on bottom surface 411.Offer the wire wire casing 421 that is communicated with clamping chamber 413 on described fixed part 42, can be so that weldment 10 be when wearing IC circuit (not shown) by this wire wire casing 421, the IC circuit can be introduced in weldment 10 by this wire wire casing 421, can not produce the situation that the IC circuit is installed skew.
above-mentioned weldment clamping device 4 is fixed on base 1 by the first holder 71, this first holder 71 comprises front holder 711 and rear holder 712, be provided with accommodation space 713 between front holder 711 and rear holder 712, fixed part 42 is fixed on rear holder 712, clamping part 41 is fixed on front holder 711 with gas 43, control motion bar 431 is done the gas 43 that moves up and down and is arranged in accommodation space 713, the hole 414 of removing stage makeup and costume is positioned at accommodation space 713 tops, and radiating groove 415 major parts also are positioned at accommodation space 713 tops, other parts are covered by front holder 711.
See also Fig. 2,3, described weldment clamping device 8 comprises and compresses or unclamp the motion bar 81 of weldment 10 and control the rotation device 82 that this motion bar 81 rotates, and this rotation device 82 is fixed on base 2 by the second holder 72.one end of described motion bar 81 is for be used for compressing or unclamp the pressure head section 811 of weldment 10, the other end is location division 812, described motion bar 81 is the L-type structure, the thickness of described pressure head section 811 is thinner than the thickness of location division 812, this location division 812 is fixed in and is controlled on the rotation device 82 that motion bar 81 rotates, it is specially: offer an installing hole 813 on described fixed part 812, rotation device 82 is provided with a swingle 822, this swingle 822 is fixed in described installing hole 813, thereby the rotation by this swingle 822 drives motion bar 81 rotations.Be provided with two gauge taps 821 of controlling described motion bar 81 anglecs of rotation on this rotation device 82.
above-mentioned weldment clamping device 8 courses of work are: after having weldment 10 to be positioned on weldment clamping device 4, rotation device 82 starts, swingle 822 forwards, motion bar 81 rotates under the effect of rotation device 82, pressure head section 811 turns to weldment 10 places, compress weldment 10, make in welding process, weldment 10 can not eject or displacement from weldment clamp structure 4, after welding is completed, this rotation device 82 starts again, swingle 822 counter-rotatings, thereby driving motion bar 81 rotates, pressure head section 812 rotates and resets, be that pressure head section 812 removes from weldment 10, no longer compress weldment 10, after next weldment 10 is positioned on weldment clamping device 4 again, rotation device 82 starts again, thereby motion bar 81 also rotates again.
See also Fig. 5,6, described soldering tip heater 3 comprises soldering tip 31, the heating plate 32 that soldering tip is carried out heat conduction, described soldering tip 31 is fixed on heating plate 32 by bolt 33, be thermally conductive materials (as iron) between heating plate 32 and soldering tip 31, thereby be conducive to the heat transmission between heating plate 32 and soldering tip 31.offer several on described heating plate 32 two sides and be used for inserting the bottoming hole 321 that external heat bar (not shown) heats heating plate 32, this heating plate 32 comprises that two of offering bottoming hole 321 are oppositely arranged heating side 322, connect two the first sides (indicating) of heating side 322, the second side (not indicating), the 3rd side (not indicating) and the 4th side 323, the 4th side 323 is the opposite face of described weldment clamping device 4, this bottoming hole 321 is for being communicated with two through holes that heat side 322, fire-bar in described bottoming hole 321 interior settings can carry out free adjustment by the needed welding temperature of weldment 10, can be by control the temperature of soldering tip in the quantity of the fire-bar of bottoming hole 321 interior insertions.
Described heater 3 also comprises the heat-insulation layer 34 that is coated on the first side, the second side, the 3rd side and heating 322 peripheries, side, offers the intercommunicating pore 341 that is connected with bottoming hole 321 on the described heat-insulation layer 34 that is positioned on 322 outer rims of heating side.
Above-mentioned soldering tip heater 3 is fixed on track-type facilities 5, and carries out upper and lower displacement by described track-type facilities 5, and this track-type facilities 5 comprises track base 51, along the movable plate 52 that guide rail moves up and down, and soldering tip heater 3 is fixed on movable plate 52.
See also Fig. 7, a kind of IC cable fixing means, it specifically comprises the steps:
S1, weldment 10 is fixed on weldment clamping device 4;
S2, by weldment clamping device 8, cable is pressed in weldment clamping device 4, thereby prevents weldment 10 in welding process, eject or displacements from weldment clamping device 4, affect welding effect and weld interval;
S3, the welding hole of IC cable along weldment 10 inner settings penetrated, until the lug boss that IC cable head is headed into to the weldment is inner.Be held on due to weldment 10 in the clamping part 41 of weldment clamping device 4, and the clamping chamber 413 in the wire wire casing 421 on fixed part 42 and this clamping part 41 is UNICOMs, welding hole and wire wire casing 421 are in the same horizontal line, therefore the IC cable can guide to by this wire wire casing 421 inside of weldment 10, thereby can not produce the IC cable and produce shift phenomenon in wearing process, realize accurately location.
S4, weld by 31 pairs of lug bosses of soldering tip, melt described lug boss, namely stop welding after the soldering tip 31 IC cable shape that described lug boss is inner with it is merged into an organic whole, this soldering tip 31 can be by the welding temperature of bottoming hole 321 welding temperature free adjustment needed according to the lug boss soldering tip 31 above it.
S5: after welding was completed, weld clamp device 8 swing offsets no longer were pressed on weldment 10;
S6: weldment 10 is unloaded weldment by cylinder 43 from weldment clamping device 4.
Although be the example purpose, the preferred embodiment of the present invention is disclosed, but those of ordinary skill in the art will recognize, in the situation that do not break away from by the disclosed scope and spirit of the present invention of appending claims, various improvement, increase and replacement are possible.
Claims (9)
1. IC circuit bonding machine, comprise support (1), be arranged at the base (2) in support (1), be fixed in the weldment clamping device (4) on base (2), and the soldering tip (31) that is positioned at weldment clamping device (4) top, described soldering tip (31) is used for weld clip and is held in weldment (10) on described weldment clamping device (4), it is characterized in that: described soldering tip (31) is fixed on soldering tip heater (3), described soldering tip heater (3) also comprises fixing soldering tip (10) and the heating plate (32) that carries out heat conduction for soldering tip (31), have several on described heating plate (32) and be used for inserting the bottoming hole (321) that the external heat bar heats heating plate (32).
2. IC circuit bonding machine according to claim 1, is characterized in that: be thermally conductive materials between described heating plate (32) and soldering tip (31).
3. IC circuit bonding machine according to claim 1 and 2, it is characterized in that: described heating plate (32) comprises two heating sides (322) that are oppositely arranged that offer bottoming hole (321), and the first side, the second side, the 3rd side and the 4th side (323) that connect two heating sides (322), described the 4th side (323) is the opposite face of described weldment clamping device (4).
4. IC circuit bonding machine according to claim 3 is characterized in that: described bottoming hole (321) is for being communicated with the through holes of two heating sides (322).
5. IC circuit bonding machine according to claim 1, it is characterized in that: described soldering tip (31) is fixed on heating plate (32) by bolt (33).
6. IC circuit bonding machine according to claim 2, it is characterized in that: described heater (3) also comprises the heat-insulation layer (34) that is coated on described the first side, the second side, the 3rd side and periphery, heating side (322), and described being positioned on the heat-insulation layer that heats on the outer rim of side (322) offers the intercommunicating pore (341) that is connected with described bottoming hole.
7. according to claim 1 or 6 described IC circuit bonding machines, it is characterized in that: described IC circuit bonding machine also comprises track-type facilities (5), and described soldering tip heater (3) is fixed in track-type facilities (5) and goes up and carry out upper and lower displacement by described track-type facilities (5).
8. IC circuit bonding machine according to claim 7, it is characterized in that: described track-type facilities (5) comprises track base (51), along the movable plate (52) that described guide rail moves up and down, and described soldering tip heater (3) is fixed on described movable plate (52).
9. IC circuit bonding machine according to claim 7, is characterized in that: the other observation part (6) that is provided with of described track-type facilities (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104163362A CN103157913A (en) | 2011-12-14 | 2011-12-14 | Integrated circuit (IC) line welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104163362A CN103157913A (en) | 2011-12-14 | 2011-12-14 | Integrated circuit (IC) line welding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103157913A true CN103157913A (en) | 2013-06-19 |
Family
ID=48581730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104163362A Pending CN103157913A (en) | 2011-12-14 | 2011-12-14 | Integrated circuit (IC) line welding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103157913A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3900145A (en) * | 1972-10-13 | 1975-08-19 | John C Diepeveen | Apparatus for incremental movement of die frame |
| CN2813187Y (en) * | 2005-08-10 | 2006-09-06 | 唐文轩 | Micro-welder |
| CN201450672U (en) * | 2009-04-29 | 2010-05-05 | 常州市飞拓模塑有限公司 | Circuit board welding tool |
| CN201946866U (en) * | 2011-03-18 | 2011-08-24 | 常熟泓淋电子有限公司 | Wire welder |
| CN102198550A (en) * | 2010-03-22 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Welding device |
-
2011
- 2011-12-14 CN CN2011104163362A patent/CN103157913A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3900145A (en) * | 1972-10-13 | 1975-08-19 | John C Diepeveen | Apparatus for incremental movement of die frame |
| CN2813187Y (en) * | 2005-08-10 | 2006-09-06 | 唐文轩 | Micro-welder |
| CN201450672U (en) * | 2009-04-29 | 2010-05-05 | 常州市飞拓模塑有限公司 | Circuit board welding tool |
| CN102198550A (en) * | 2010-03-22 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Welding device |
| CN201946866U (en) * | 2011-03-18 | 2011-08-24 | 常熟泓淋电子有限公司 | Wire welder |
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Application publication date: 20130619 |