CN103091835B - Vertical large displacement micro-electromechanical system (MEMS) micromirror and processing technology - Google Patents
Vertical large displacement micro-electromechanical system (MEMS) micromirror and processing technology Download PDFInfo
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- CN103091835B CN103091835B CN201310044691.0A CN201310044691A CN103091835B CN 103091835 B CN103091835 B CN 103091835B CN 201310044691 A CN201310044691 A CN 201310044691A CN 103091835 B CN103091835 B CN 103091835B
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Abstract
The invention relates to a vertical large displacement micro-electromechanical system (MEMS) micromirror and the processing technology. The vertical large displacement MEMS micromirror comprises a micromirror frame (1), a micromirror body (2) and driving arms (3). The edge of the micromirror body (2) is connected with the micromirror frame (1) through the driving arms (3). Each driving arm (3) comprises two straight girders (4) and three double-membrane bimorph structure connection parts (5) corresponding to the two straight girders (4). A plurality of heating resistors (7) are arranged on each double-membrane bimorph structure connection part (5). First electric conduction wires are further arranged on the driving arms (3) and connected with the heating resistors (7). The vertical large displacement MEMS micromirror has the advantages of being capable of enabling the micromirror body (2) to be in the position of vertical large displacement opposite to the micromirror frame (1), enlarging movement path of the micromirror body (2) and improving working efficiency of the MEMS micromirror.
Description
Technical field
The present invention relates to a kind of vertical Large travel range MEMS micro mirror and processing technology.
Background technology
Microminiaturization, high-performance, low cost is pursuing a goal of current device manufacture in enormous quantities.Micro electro mechanical system (MEMS) technology now arises at the historic moment, by the widespread use of vast manufacture manufacturer.Use the device of micro electro mechanical system (MEMS) technology manufacture mainly can be divided into two large classes, one is exactly simple microminiaturized traditional devices, and as micro-optical platform, its advantage embodies a concentrated reflection of the usable range can expanding microminiaturized system; Its two uses innovation principle produces the device that classic method cannot make, as geomagnetic sensor.
MEMS micro mirror as the outstanding representative of MEMS (micro electro mechanical system) (MEMS), its abundant species, function admirable.Greatly developing of MEMS micro mirror also be unable to do without market certainly to the eager demand of MEMS micro mirror.Now, the application of MEMS micro mirror has micro projection to scan, the optical scanning probe in imaging of medical, the photoswitch in optical communication, Variable Optical Attenuator, micro spectrometer etc.
What wherein the drives structure of MEMS micro mirror was conventional has four large classes: electrostatic drives, Electromagnetic Drive, Piezoelectric Driving and electrothermal drive.Wherein each drives structure has the advantage of oneself, and driving voltage as driving in electrostatic is high, low in energy consumption, but corner is little, is relatively applicable to Variable Optical Attenuator; Electromagnetic drive type driving voltage is low, and sweep frequency is low, and the anglec of rotation is large, is applicable to micro projector; Piezoelectric driven is owing to making the limited capacity of material, and make the anglec of rotation of micro mirror little, usable range is limited; Electrothermal drive type research the most thorough, usable range is also the most extensive, and simultaneously because its driving voltage is low, the anglec of rotation of micro mirror is large, the feature that sweep frequency is low, is applicable to low frequency such as In vivo optical imaging on a large scale and scans.
But existing MEMS micro mirror, because the structure of its actuating arm is single, make the difference in height between MEMS micro-Manifold reflecting mirror body and micro mirror frame almost nil, like this in the middle of actual application, will greatly limit the movement locus of the micro-Manifold reflecting mirror body of MEMS, for MEMS micro mirror, the movement locus of mirror body diminishes, just directly mean the working effect of this type of MEMS micro mirror, and then have influence on the work efficiency of MEMS micro mirror.
Summary of the invention
Technical matters to be solved by this invention is to provide one makes mirror body relative to micro mirror frame, is in the position of vertical Large travel range, can the MEMS micro mirror of magnascope body movement locus.
Corresponding therewith, technical matters to be solved by this invention is to provide a kind of application MEMS technology technology, realizes batch production, for processing the processing technology of the vertical Large travel range MEMS micro mirror designed in the present invention.
The present invention is in order to solve the problems of the technologies described above by the following technical solutions: the present invention devises a kind of vertical Large travel range MEMS micro mirror, comprise micro mirror frame, mirror body and actuating arm, mirror body edge is connected with micro mirror frame by actuating arm, actuating arm is provided with the first electric conduction routing, three duplicature duplicature Bimorph structural connections that described actuating arm comprises two straight beams and corresponds, duplicature Bimorph structural connection arranges several heating resistor, and the first electric conduction routing is connected with heating resistor; All be connected by duplicature Bimorph structural connection between each straight beam, between straight beam with micro mirror frame, between straight beam with mirror body edge, make mirror body be in the position of vertical Large travel range relative to micro mirror frame.
As a preferred technical solution of the present invention: also comprise the thermistor being separately positioned on mirror surface and on duplicature Bimorph structural connection.
As a preferred technical solution of the present invention: described thermistor is Pt or polycrystalline silicon material.
As a preferred technical solution of the present invention: described in the thermistor be arranged on mirror surface adopt the mode of snakelike distribution to be arranged on mirror surface.
As a preferred technical solution of the present invention: described actuating arm is also arranged the second electric conduction routing be connected with described thermistor.
As a preferred technical solution of the present invention: described first electric conduction routing, the second electric conduction routing are Al material.
As a preferred technical solution of the present invention: described heating resistor is metal or polycrystalline silicon material.
As a preferred technical solution of the present invention: the several heating resistors on described duplicature Bimorph structural connection by series winding or and the mode connected be interconnected.
As a preferred technical solution of the present invention: described straight beam is Al or SiO
2material.
One of the present invention vertical Large travel range MEMS micro mirror adopts above technical scheme compared with prior art, has following technique effect:
(1), in the vertical Large travel range MEMS micro mirror of the present invention's design, mirror body, relative to micro mirror frame, is in the position of vertical Large travel range, can magnascope body movement locus, improves the service efficiency of MEMS micro mirror;
(2), in the vertical Large travel range MEMS micro mirror of the present invention's design, mirror surface arranges thermistor, can the temperature of Real-Time Monitoring mirror surface, contribute in the middle of actual application, the motion track of mirror body is controlled;
(3) in the vertical Large travel range MEMS micro mirror that the present invention designs, duplicature Bimorph structural connection arranges thermistor, can the temperature of Real-Time Monitoring duplicature Bimorph structural connection, contribute in the middle of actual application, the thermal power of heating resistor is controlled;
(4), in the vertical Large travel range MEMS micro mirror that the present invention designs, for heating resistor and thermistor, the first electric conduction routing is set and is connected respectively with the second electric conduction routing, more effectively can ensure the work efficiency of each electronic devices and components;
(5) in the vertical Large travel range MEMS micro mirror that the present invention designs, first electric conduction routing and the second electric conduction routing are Al material, heating resistor is metal or polycrystalline silicon material, thermistor is Pt or polycrystalline silicon material, effectively can ensure this device stability in use and degree of accuracy like this.
Corresponding therewith, the present invention is in order to solve the problems of the technologies described above by the following technical solutions: the present invention devises a kind of processing technology of vertical Large travel range MEMS micro mirror, and described micro mirror adopts soi wafer, and soi wafer comprises two-layer silicon, and be layer of silicon dioxide between two-layer silicon, comprise the steps:
Step 1. pair soi wafer carries out two-sided standard cleaning;
Step 2. adopts Al to carry out graphical treatment on a wherein surface of soi wafer;
Step 3. adopts silicon dioxide to proceed graphical treatment to the machined surface on soi wafer described in step 2;
The another side of step 4. pair soi wafer carries out silicon deep reaction ion etching;
The buried layer of silicon dioxide that the machined surface of the soi wafer described in step 5. pair step 4 is exposed carries out graphical treatment;
The machined surface of the soi wafer described in step 6. pair step 3 carries out silicon deep reaction ion etching;
The machined surface of the soi wafer described in step 7. pair step 6 carries out silicon isotropic etching, and cools
The processing technology of a kind of vertical Large travel range MEMS micro mirror of the present invention adopts above technical scheme compared with prior art, has following technique effect:
The processing technology of the vertical Large travel range MEMS micro mirror of the present invention's design, adopts MEMS processing technology, ensure that the yield rate of product, and achieve batch production.
Accompanying drawing explanation
Fig. 1 is the Half-edge Structure schematic diagram of a kind of vertical Large travel range MEMS micro mirror that the present invention designs.
Wherein, 1. micro mirror frame, 2. mirror body, 3. actuating arm, 4. straight beam, 5. duplicature Bimorph structural connection, 6. thermistor, 7. heating resistor.
Embodiment
Below in conjunction with Figure of description, the specific embodiment of the present invention is described in further detail.
As shown in Figure 1, the present invention devises a kind of vertical Large travel range MEMS micro mirror, comprise micro mirror frame 1, mirror body 2 and actuating arm 3, mirror body 2 edge is connected with micro mirror frame 1 by actuating arm 3, actuating arm 3 is provided with the first electric conduction routing, described actuating arm 3 comprises and two straight beams 4 and three duplicature Bimorph structural connections 5, duplicature Bimorph structural connection 5 of corresponding arrange several heating resistor 7, first electric conduction routing is connected with heating resistor 7; All be connected by duplicature Bimorph structural connection 5 between each straight beam 4, between straight beam 4 with micro mirror frame 1, between straight beam 4 with mirror body 2 edge, make mirror body 2 have vertical Large travel range relative to micro mirror frame 1.
In the vertical Large travel range MEMS micro mirror of the present invention's design, mirror body 2, relative to micro mirror frame 1, is in the position of vertical Large travel range, can magnascope body 2 movement locus, improves the service efficiency of MEMS micro mirror.
As a preferred technical solution of the present invention: also comprise be separately positioned on mirror body 2 on the surface with the thermistor 6 on duplicature Bimorph structural connection 5.
As a preferred technical solution of the present invention: described thermistor 6 is Pt or polycrystalline silicon material.
As a preferred technical solution of the present invention: described in the thermistor 6 be arranged on mirror body 2 surface adopt the mode of snakelike distribution to be arranged on mirror body 2 on the surface.
In the vertical Large travel range MEMS micro mirror of the present invention's design, thermistor 6 is set on the surface at mirror body 2, can the temperature on Real-Time Monitoring mirror body 2 surface, contribute in the middle of actual application, the motion track of mirror body 2 is controlled.
In the vertical Large travel range MEMS micro mirror of the present invention's design, duplicature Bimorph structural connection 5 arranges thermistor 6, can the temperature of Real-Time Monitoring duplicature Bimorph structural connection 5, contribute in the middle of actual application, the thermal power of heating resistor 7 is controlled.
As a preferred technical solution of the present invention: described actuating arm 3 is also arranged the second electric conduction routing be connected with described thermistor 6.
In the vertical Large travel range MEMS micro mirror of the present invention's design, for heating resistor 7 and thermistor 6, the first electric conduction routing is set and is connected respectively with the second electric conduction routing, more effectively can ensure the work efficiency of each electronic devices and components.
As a preferred technical solution of the present invention: described first electric conduction routing and the second electric conduction routing are Al material.
As a preferred technical solution of the present invention: described heating resistor 7 is metal or polycrystalline silicon material.
As a preferred technical solution of the present invention: the several heating resistors 7 on described duplicature Bimorph structural connection 5 are by go here and there and the mode that connects is interconnected.
As a preferred technical solution of the present invention: described straight beam 4 is Al or SiO
2material.
In the vertical Large travel range MEMS micro mirror of the present invention's design, first electric conduction routing and the second electric conduction routing are Al material, heating resistor 7 is metal or polycrystalline silicon material, thermistor 6 is Pt or polycrystalline silicon material, effectively can ensure this device stability in use and degree of accuracy like this.
The present invention have also been devised a kind of processing technology of vertical Large travel range MEMS micro mirror, and described micro mirror adopts soi wafer, and soi wafer comprises two-layer silicon, and is layer of silicon dioxide between two-layer silicon, comprises the steps:
Step 1. pair soi wafer carries out two-sided standard cleaning;
Step 2. adopts Al to carry out graphical treatment on a wherein surface of soi wafer;
Step 3. adopts silicon dioxide to proceed graphical treatment to the machined surface on soi wafer described in step 2;
The another side of step 4. pair soi wafer carries out silicon deep reaction ion etching (DRIE);
The buried layer of silicon dioxide that the machined surface of the soi wafer described in step 5. pair step 4 is exposed carries out graphical treatment;
The machined surface of the soi wafer described in step 6. pair step 3 carries out silicon deep reaction ion etching;
The machined surface of the soi wafer described in step 7. pair step 6 carries out silicon isotropic etching, and cools
The processing technology of the vertical Large travel range MEMS micro mirror of the present invention's design, adopts MEMS processing technology, ensure that the yield rate of product, and achieve batch production.
The vertical Large travel range MEMS micro mirror of the present invention's design is in the middle of actual application, three duplicature Bimorph structural connections 5 that actuating arm 3 comprises two straight beams 4 and corresponds, between each straight beam 4, between straight beam 4 and micro mirror frame 1, all be connected by duplicature Bimorph structural connection 5 between straight beam 4 with mirror body 2 edge, wherein, with the length of the duplicature Bimorph structural connection 5 that mirror body 2 edge is connected and equal with the length of the duplicature Bimorph structural connection 5 that micro mirror frame 1 is connected, the length being connected to the duplicature Bimorph structural connection 5 between two straight beams 4 is 2 times of all the other two duplicature Bimorph structural connection 5 length, duplicature Bimorph structural connection 5 is formed by stacking by the material of several different expansion coefficient, flat structures is made under the technique higher than room temperature makes temperature, after cool to room temperature release, duplicature Bimorph structural connection 5 shrinks to the side that coefficient of thermal expansion is high, whole mirror body 2 is up promoted, make mirror body 2 relative to micro mirror frame 1, be in the position of vertical Large travel range, the movement locus of mirror body 2 can be increased, improve the work efficiency of the MEMS micro mirror of the present invention's design, wherein after being cooled to room temperature, with the angle of bend of the duplicature Bimorph structural connection 5 that mirror body 2 edge is connected and equal with the angle of bend of the duplicature Bimorph structural connection 5 that micro mirror frame 1 is connected, the angle of bend being connected to the duplicature Bimorph structural connection 5 between two straight beams 4 is 2 times of all the other two duplicature Bimorph structural connection 5 angle of bend.
The vertical Large travel range MEMS micro mirror of the present invention's design is in the middle of actual application, the height of mirror body 2 determined by the length of duplicature Bimorph structural connection 5 and the length of straight beam 4, MEMS micro mirror of the present invention in use, drive the electric current flowing through heating resistor 7 on duplicature Bimorph structural connection 5, heating resistor 7 is made to produce Joule heat, the temperature of duplicature Bimorph structural connection 5 raises with the Joule heat of heating resistor 7, the shape of duplicature Bimorph structural connection 5 is changed, and then realizes the object controlling the motion of mirror body 2.
In actual applications, first electric conduction routing and the second electric conduction routing are Al material, heating resistor 7 is metal or polycrystalline silicon material, thermistor 6 is Pt or polycrystalline silicon material, due to the stability of Pt, and there is higher temperature coefficient, so Pt is comparatively suitable thermistor material, the thermistor 6 be made up of Pt is set on the surface at mirror body 2, and the second electric conduction routing connecting thermistor 6 adopts Al material, like this because the temperature coefficient of Pt is 3.9E-3, design resistance is 1K Ω (@0 DEG C), make the temperature test precision of thermistor 6 can reach 0.1 DEG C, effectively can ensure this device stability in use and degree of accuracy like this.
By reference to the accompanying drawings embodiments of the present invention are explained in detail above, but the present invention is not limited to above-mentioned embodiment, in the ken that those of ordinary skill in the art possess, can also makes a variety of changes under the prerequisite not departing from present inventive concept.
Claims (10)
1. a vertical Large travel range MEMS micro mirror, comprise micro mirror frame (1), mirror body (2) and actuating arm (3), mirror body (2) edge is connected with micro mirror frame (1) by actuating arm (3), (3) are provided with the first electric conduction routing to actuating arm, it is characterized in that: three duplicature Bimorph structural connections (5) that described actuating arm (3) comprises two straight beams (4) and corresponds, duplicature Bimorph structural connection (5) is arranged several heating resistor (7), the first electric conduction routing is connected with heating resistor (7); Between each straight beam (4), be all connected by duplicature Bimorph structural connection (5) between straight beam (4) with micro mirror frame (1), between straight beam (4) with mirror body (2) edge, make mirror body (2) be in the position of vertical Large travel range relative to micro mirror frame (1).
2. a kind of vertical Large travel range MEMS micro mirror according to claim 1, is characterized in that: also comprise be separately positioned on mirror body (2) on the surface with the thermistor (6) on duplicature Bimorph structural connection (5).
3. a kind of vertical Large travel range MEMS micro mirror according to claim 2, is characterized in that: described thermistor (6) is Pt or polycrystalline silicon material.
4. a kind of vertical Large travel range MEMS micro mirror according to claim 2, is characterized in that: described in the thermistor (6) be arranged on mirror body (2) surface adopt the mode of snakelike distribution to be arranged on mirror body (2) on the surface.
5. a kind of vertical Large travel range MEMS micro mirror according to claim 2, is characterized in that: described actuating arm (3) is also arranged the second electric conduction routing be connected with described thermistor (6).
6. a kind of vertical Large travel range MEMS micro mirror according to claim 5, is characterized in that: described first electric conduction routing, the second electric conduction routing are Al material.
7. a kind of vertical Large travel range MEMS micro mirror according to claim 1, is characterized in that: described heating resistor (7) is metal or polycrystalline silicon material.
8. a kind of vertical Large travel range MEMS micro mirror according to claim 1, is characterized in that: the several heating resistors (7) on described duplicature Bimorph structural connection (5) are by contact or the mode of parallel connection is interconnected.
9. a kind of vertical Large travel range MEMS micro mirror according to claim 1, is characterized in that: described straight beam (4) is Al or SiO
2material.
10. process the processing technology of a kind of vertical Large travel range MEMS micro mirror described in claim 1 for one kind, described vertical Large travel range MEMS micro mirror adopts soi wafer, soi wafer comprises two-layer silicon, and is layer of silicon dioxide between two-layer silicon, it is characterized in that: comprise the steps:
Step 1. pair soi wafer carries out two-sided standard cleaning;
Step 2. adopts Al to carry out graphical treatment on a wherein surface of soi wafer;
Step 3. adopts silicon dioxide to proceed graphical treatment to the machined surface on soi wafer described in step 2;
The another side of step 4. pair soi wafer carries out silicon deep reaction ion etching;
The buried layer of silicon dioxide that the machined surface of the soi wafer described in step 5. pair step 4 is exposed carries out graphical treatment;
The machined surface of the soi wafer described in step 6. pair step 3 carries out silicon deep reaction ion etching;
The machined surface of the soi wafer described in step 7. pair step 6 carries out silicon isotropic etching, and cools.
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104370272B (en) * | 2014-10-30 | 2016-07-06 | 无锡微奥科技有限公司 | A kind of MEMS autoregistration height comb and manufacture method thereof |
| CN105174197B (en) * | 2015-06-15 | 2016-12-07 | 无锡微奥科技有限公司 | A kind of MEMS structure and preparation method thereof |
| CN109844609B (en) * | 2016-10-19 | 2021-11-19 | 索尼半导体解决方案公司 | Semiconductor device, display device, and electronic apparatus |
| JP7035323B2 (en) * | 2017-03-15 | 2022-03-15 | 株式会社リコー | Movable diffractive element and spectroscopic device |
| CN107355730A (en) * | 2017-07-17 | 2017-11-17 | 上海小糸车灯有限公司 | Car light MEMS intelligent illuminating systems, vehicle lamp assembly and automobile |
| CN113120848B (en) * | 2019-12-31 | 2025-02-14 | 无锡微文半导体科技有限公司 | A method for manufacturing an electrothermal MEMS driving arm and an electrothermal MEMS driving arm |
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| CN1483660A (en) * | 2003-08-15 | 2004-03-24 | �廪��ѧ | A Micro Piezoelectric Actuator for MEMS |
| CN1858601A (en) * | 2006-06-09 | 2006-11-08 | 东南大学 | Capacitance microwave power sensor |
| CN203164512U (en) * | 2013-02-05 | 2013-08-28 | 无锡微奥科技有限公司 | Vertical large displacement MEMS micro-mirror |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1483660A (en) * | 2003-08-15 | 2004-03-24 | �廪��ѧ | A Micro Piezoelectric Actuator for MEMS |
| CN1858601A (en) * | 2006-06-09 | 2006-11-08 | 东南大学 | Capacitance microwave power sensor |
| CN203164512U (en) * | 2013-02-05 | 2013-08-28 | 无锡微奥科技有限公司 | Vertical large displacement MEMS micro-mirror |
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